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JP2008091569A - 研磨用組成物及び研磨方法 - Google Patents

研磨用組成物及び研磨方法 Download PDF

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Publication number
JP2008091569A
JP2008091569A JP2006269911A JP2006269911A JP2008091569A JP 2008091569 A JP2008091569 A JP 2008091569A JP 2006269911 A JP2006269911 A JP 2006269911A JP 2006269911 A JP2006269911 A JP 2006269911A JP 2008091569 A JP2008091569 A JP 2008091569A
Authority
JP
Japan
Prior art keywords
polishing
group
polishing composition
insulating film
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2006269911A
Other languages
English (en)
Japanese (ja)
Inventor
Tetsuya Kamimura
上村　　哲也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to JP2006269911A priority Critical patent/JP2008091569A/ja
Priority to TW096130818A priority patent/TW200817498A/zh
Priority to KR1020070094434A priority patent/KR20080030479A/ko
Publication of JP2008091569A publication Critical patent/JP2008091569A/ja
Abandoned legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • H10P52/402—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2006269911A 2006-09-29 2006-09-29 研磨用組成物及び研磨方法 Abandoned JP2008091569A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006269911A JP2008091569A (ja) 2006-09-29 2006-09-29 研磨用組成物及び研磨方法
TW096130818A TW200817498A (en) 2006-09-29 2007-08-21 Polishing composition and polishing method
KR1020070094434A KR20080030479A (ko) 2006-09-29 2007-09-17 연마용 조성물 및 연마 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006269911A JP2008091569A (ja) 2006-09-29 2006-09-29 研磨用組成物及び研磨方法

Publications (1)

Publication Number Publication Date
JP2008091569A true JP2008091569A (ja) 2008-04-17

Family

ID=39375431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006269911A Abandoned JP2008091569A (ja) 2006-09-29 2006-09-29 研磨用組成物及び研磨方法

Country Status (3)

Country Link
JP (1) JP2008091569A (zh)
KR (1) KR20080030479A (zh)
TW (1) TW200817498A (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009260304A (ja) * 2008-03-19 2009-11-05 Fujifilm Corp 金属用研磨液、及び研磨方法
JP2009290139A (ja) * 2008-05-30 2009-12-10 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 スラリー供給装置及び同装置を用いる半導体ウェーハの研磨方法
KR101107520B1 (ko) * 2009-04-28 2012-01-31 솔브레인 주식회사 구리 다마신 공정용 화학 기계적 연마 슬러리 조성물
KR101186110B1 (ko) 2009-01-14 2012-09-27 솔브레인 주식회사 금속막의 화학 기계적 연마용 슬러리 조성물

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004030062A1 (ja) * 2002-09-25 2004-04-08 Seimi Chemical Co., Ltd. 研磨剤組成物、その製造方法及び研磨方法
JP2005014206A (ja) * 2003-05-30 2005-01-20 Sumitomo Chemical Co Ltd 金属研磨剤組成物
JP2005175437A (ja) * 2003-10-10 2005-06-30 Dupont Air Products Nanomaterials Llc Ｐｖｎｏを有する化学的機械的平坦化組成物および関連使用方法
JP2006093580A (ja) * 2004-09-27 2006-04-06 Fuji Photo Film Co Ltd 化学的機械的研磨方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004030062A1 (ja) * 2002-09-25 2004-04-08 Seimi Chemical Co., Ltd. 研磨剤組成物、その製造方法及び研磨方法
JP2005014206A (ja) * 2003-05-30 2005-01-20 Sumitomo Chemical Co Ltd 金属研磨剤組成物
JP2005175437A (ja) * 2003-10-10 2005-06-30 Dupont Air Products Nanomaterials Llc Ｐｖｎｏを有する化学的機械的平坦化組成物および関連使用方法
JP2006093580A (ja) * 2004-09-27 2006-04-06 Fuji Photo Film Co Ltd 化学的機械的研磨方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009260304A (ja) * 2008-03-19 2009-11-05 Fujifilm Corp 金属用研磨液、及び研磨方法
US9202709B2 (en) 2008-03-19 2015-12-01 Fujifilm Corporation Polishing liquid for metal and polishing method using the same
JP2009290139A (ja) * 2008-05-30 2009-12-10 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 スラリー供給装置及び同装置を用いる半導体ウェーハの研磨方法
KR101186110B1 (ko) 2009-01-14 2012-09-27 솔브레인 주식회사 금속막의 화학 기계적 연마용 슬러리 조성물
KR101107520B1 (ko) * 2009-04-28 2012-01-31 솔브레인 주식회사 구리 다마신 공정용 화학 기계적 연마 슬러리 조성물

Also Published As

Publication number Publication date
KR20080030479A (ko) 2008-04-04
TW200817498A (en) 2008-04-16

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