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FI20050646L - Kretskortskonstruktion och förfarande för tillverkning av kretskortskonstruktion - Google Patents

Kretskortskonstruktion och förfarande för tillverkning av kretskortskonstruktion Download PDF

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Publication number
FI20050646L
FI20050646L FI20050646A FI20050646A FI20050646L FI 20050646 L FI20050646 L FI 20050646L FI 20050646 A FI20050646 A FI 20050646A FI 20050646 A FI20050646 A FI 20050646A FI 20050646 L FI20050646 L FI 20050646L
Authority
FI
Finland
Prior art keywords
circuit board
board structure
manufacturing
manufacturing circuit
circuit
Prior art date
Application number
FI20050646A
Other languages
English (en)
Finnish (fi)
Other versions
FI20050646A0 (sv
FI119714B (sv
Inventor
Risto Tuominen
Antti Iihola
Petteri Palm
Original Assignee
Imbera Electronics Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imbera Electronics Oy filed Critical Imbera Electronics Oy
Publication of FI20050646A0 publication Critical patent/FI20050646A0/sv
Priority to FI20050646A priority Critical patent/FI119714B/sv
Priority to CN200680021055A priority patent/CN100596258C/zh
Priority to EP06764433.6A priority patent/EP1891845B1/en
Priority to JP2008516355A priority patent/JP5025644B2/ja
Priority to KR1020087000597A priority patent/KR101090423B1/ko
Priority to PCT/FI2006/000207 priority patent/WO2006134216A2/en
Priority to US11/917,737 priority patent/US8581109B2/en
Priority to GB0724097.1A priority patent/GB2441265B/en
Priority to PCT/FI2006/000211 priority patent/WO2006134220A1/en
Priority to DE112006001506T priority patent/DE112006001506T5/de
Priority to JP2008516357A priority patent/JP2008544512A/ja
Priority to CN2006800210573A priority patent/CN101199244B/zh
Priority to US11/917,724 priority patent/US8225499B2/en
Publication of FI20050646L publication Critical patent/FI20050646L/sv
Application granted granted Critical
Publication of FI119714B publication Critical patent/FI119714B/sv
Priority to US14/076,292 priority patent/US9622354B2/en
Priority to US15/355,096 priority patent/US11134572B2/en
Priority to US17/460,458 priority patent/US11792941B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H05K1/187—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H10W46/00—
    • H10W70/05—
    • H10W70/614—
    • H10W70/68—
    • H10W74/01—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H10W46/301—
    • H10W46/601—
    • H10W70/093—
    • H10W70/60—
    • H10W70/682—
    • H10W70/685—
    • H10W72/00—
    • H10W72/072—
    • H10W72/07223—
    • H10W72/07232—
    • H10W72/07233—
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/073—
    • H10W72/07323—
    • H10W72/07332—
    • H10W72/07333—
    • H10W72/074—
    • H10W72/20—
    • H10W72/241—
    • H10W72/325—
    • H10W72/352—
    • H10W72/354—
    • H10W72/9413—
    • H10W74/019—
    • H10W90/00—
    • H10W99/00—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Ceramic Engineering (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
FI20050646A 2005-06-16 2005-06-16 Kretskortskonstruktion och förfarande för tillverkning av kretskortskonstruktion FI119714B (sv)

Priority Applications (16)

Application Number Priority Date Filing Date Title
FI20050646A FI119714B (sv) 2005-06-16 2005-06-16 Kretskortskonstruktion och förfarande för tillverkning av kretskortskonstruktion
CN200680021055A CN100596258C (zh) 2005-06-16 2006-06-15 电路板结构的制造方法和电路板结构
EP06764433.6A EP1891845B1 (en) 2005-06-16 2006-06-15 Method for manufacturing a circuit board structure
JP2008516355A JP5025644B2 (ja) 2005-06-16 2006-06-15 回路基板構造および回路基板構造の製造方法
KR1020087000597A KR101090423B1 (ko) 2005-06-16 2006-06-15 회로 보드 구조체 및 회로 보드 구조체 제조 방법
PCT/FI2006/000207 WO2006134216A2 (en) 2005-06-16 2006-06-15 Circuit board structure and method for manufacturing a circuit board structure
US11/917,737 US8581109B2 (en) 2005-06-16 2006-06-15 Method for manufacturing a circuit board structure
PCT/FI2006/000211 WO2006134220A1 (en) 2005-06-16 2006-06-16 Method for manufacturing a circuit board structure, and a circuit board structure
GB0724097.1A GB2441265B (en) 2005-06-16 2006-06-16 Method for manufacturing a circuit board structure, and a circuit board structure
DE112006001506T DE112006001506T5 (de) 2005-06-16 2006-06-16 Platinenstruktur und Verfahren zu ihrer Herstellung
JP2008516357A JP2008544512A (ja) 2005-06-16 2006-06-16 回路基板構造体およびその製造方法
CN2006800210573A CN101199244B (zh) 2005-06-16 2006-06-16 电路板结构的制造方法和电路板结构
US11/917,724 US8225499B2 (en) 2005-06-16 2006-06-16 Method for manufacturing a circuit board structure, and a circuit board structure
US14/076,292 US9622354B2 (en) 2005-06-16 2013-11-11 Method for manufacturing a circuit board structure
US15/355,096 US11134572B2 (en) 2005-06-16 2016-11-18 Circuit board structure and method for manufacturing a circuit board structure
US17/460,458 US11792941B2 (en) 2005-06-16 2021-08-30 Circuit board structure and method for manufacturing a circuit board structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20050646 2005-06-15
FI20050646A FI119714B (sv) 2005-06-16 2005-06-16 Kretskortskonstruktion och förfarande för tillverkning av kretskortskonstruktion

Publications (3)

Publication Number Publication Date
FI20050646A0 FI20050646A0 (sv) 2005-06-16
FI20050646L true FI20050646L (sv) 2006-12-17
FI119714B FI119714B (sv) 2009-02-13

Family

ID=34778365

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20050646A FI119714B (sv) 2005-06-16 2005-06-16 Kretskortskonstruktion och förfarande för tillverkning av kretskortskonstruktion

Country Status (7)

Country Link
US (4) US8581109B2 (sv)
EP (1) EP1891845B1 (sv)
JP (1) JP5025644B2 (sv)
KR (1) KR101090423B1 (sv)
CN (1) CN100596258C (sv)
FI (1) FI119714B (sv)
WO (1) WO2006134216A2 (sv)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
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FI20031341A7 (sv) 2003-09-18 2005-03-19 Imbera Electronics Oy Förfarande för tillverkning av en elektronikmodul
FI117814B (sv) * 2004-06-15 2007-02-28 Imbera Electronics Oy Förfarande för tillverkning av en elektronikmodul
FI119714B (sv) * 2005-06-16 2009-02-13 Imbera Electronics Oy Kretskortskonstruktion och förfarande för tillverkning av kretskortskonstruktion
DE112006001506T5 (de) * 2005-06-16 2008-04-30 Imbera Electronics Oy Platinenstruktur und Verfahren zu ihrer Herstellung
FI122128B (sv) * 2005-06-16 2011-08-31 Imbera Electronics Oy Förfarande för tillverkning av kretskortskonstruktion
KR100802393B1 (ko) * 2007-02-15 2008-02-13 삼성전기주식회사 패키지 기판 및 그 제조방법
GB2451908B (en) * 2007-08-17 2009-12-02 Wolfson Microelectronics Plc Mems package
GB2451921A (en) * 2007-08-17 2009-02-18 Wolfson Microelectronics Plc MEMS package
DE102008009220A1 (de) * 2008-02-06 2009-08-13 Robert Bosch Gmbh Verfahren zum Herstellen einer Leiterplatte
JP2009239247A (ja) * 2008-03-27 2009-10-15 Ibiden Co Ltd 多層プリント配線板の製造方法
EP2259668A4 (en) 2008-03-27 2011-12-14 Ibiden Co Ltd METHOD FOR PRODUCING A MULTILAYER CONDUCTOR PLATE
US8264085B2 (en) 2008-05-05 2012-09-11 Infineon Technologies Ag Semiconductor device package interconnections
US20100025848A1 (en) * 2008-08-04 2010-02-04 Infineon Technologies Ag Method of fabricating a semiconductor device and semiconductor device
WO2010048653A2 (de) 2008-10-30 2010-05-06 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Verfahren zur integration eines elektronischen bauteils in eine leiterplatte
TWI437674B (zh) * 2008-11-17 2014-05-11 先進封裝技術私人有限公司 半導體導線元件、半導體封裝元件與半導體裝置
US8124449B2 (en) 2008-12-02 2012-02-28 Infineon Technologies Ag Device including a semiconductor chip and metal foils
TWI456715B (zh) * 2009-06-19 2014-10-11 日月光半導體製造股份有限公司 晶片封裝結構及其製造方法
US8390083B2 (en) * 2009-09-04 2013-03-05 Analog Devices, Inc. System with recessed sensing or processing elements
US8735735B2 (en) 2010-07-23 2014-05-27 Ge Embedded Electronics Oy Electronic module with embedded jumper conductor
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