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DE602006000104D1 - Schaltungsvorrichtung und Herstellungsverfahren dafür - Google Patents

Schaltungsvorrichtung und Herstellungsverfahren dafür

Info

Publication number
DE602006000104D1
DE602006000104D1 DE200660000104 DE602006000104T DE602006000104D1 DE 602006000104 D1 DE602006000104 D1 DE 602006000104D1 DE 200660000104 DE200660000104 DE 200660000104 DE 602006000104 T DE602006000104 T DE 602006000104T DE 602006000104 D1 DE602006000104 D1 DE 602006000104D1
Authority
DE
Germany
Prior art keywords
manufacturing
circuit device
method therefor
therefor
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE200660000104
Other languages
English (en)
Other versions
DE602006000104T2 (de
Inventor
Takahito Mizuno
Ren Yamamoto
Shigeru Wakita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Publication of DE602006000104D1 publication Critical patent/DE602006000104D1/de
Application granted granted Critical
Publication of DE602006000104T2 publication Critical patent/DE602006000104T2/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H10W70/611—
    • H10W90/00—
    • H10W90/401—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H10W72/5445—
    • H10W72/5473—
    • H10W72/5475—
    • H10W72/552—
    • H10W72/884—
    • H10W90/734—
    • H10W90/753—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
DE200660000104 2005-03-30 2006-03-02 Schaltungsvorrichtung und Herstellungsverfahren dafür Expired - Fee Related DE602006000104T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005098648 2005-03-30
JP2005098648A JP2006278913A (ja) 2005-03-30 2005-03-30 回路装置とその製造方法

Publications (2)

Publication Number Publication Date
DE602006000104D1 true DE602006000104D1 (de) 2007-10-25
DE602006000104T2 DE602006000104T2 (de) 2008-06-12

Family

ID=36617605

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200660000104 Expired - Fee Related DE602006000104T2 (de) 2005-03-30 2006-03-02 Schaltungsvorrichtung und Herstellungsverfahren dafür

Country Status (6)

Country Link
US (1) US7446406B2 (de)
EP (1) EP1711040B1 (de)
JP (1) JP2006278913A (de)
KR (1) KR100729249B1 (de)
CN (1) CN100390989C (de)
DE (1) DE602006000104T2 (de)

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US7799273B2 (en) 2004-05-06 2010-09-21 Smp Logic Systems Llc Manufacturing execution system for validation, quality and risk assessment and monitoring of pharmaceutical manufacturing processes
US7444197B2 (en) 2004-05-06 2008-10-28 Smp Logic Systems Llc Methods, systems, and software program for validation and monitoring of pharmaceutical manufacturing processes
WO2006086274A2 (en) * 2005-02-08 2006-08-17 Dyno Nobel Inc. Delay units and methods of making the same
JP4965242B2 (ja) * 2006-12-27 2012-07-04 株式会社ティラド アルミニューム製ヒートシンクの製造方法
JP5102497B2 (ja) * 2007-01-19 2012-12-19 Ｄｏｗａメタルテック株式会社 金属セラミックス接合回路基板の製造方法
JP2008277438A (ja) * 2007-04-26 2008-11-13 Ricoh Microelectronics Co Ltd 電子部品、基板、並びに、電子部品及び基板の製造方法
JP4935735B2 (ja) * 2008-03-26 2012-05-23 トヨタ自動車株式会社 バスバー及びその製造方法
DE102008018841A1 (de) * 2008-04-15 2009-10-22 Conti Temic Microelectronic Gmbh Verfahren zur Herstellung und Aufbau eines Leistungsmoduls
JP2010239033A (ja) * 2009-03-31 2010-10-21 Honda Motor Co Ltd 半導体装置及びその製造方法
KR20120073302A (ko) 2009-09-28 2012-07-04 에이비비 테크놀로지 아게 회로 장치 및 그의 제조 방법
US8794152B2 (en) 2010-03-09 2014-08-05 Dyno Nobel Inc. Sealer elements, detonators containing the same, and methods of making
JP2013539919A (ja) * 2010-10-13 2013-10-28 アーベーベー・リサーチ・リミテッド 半導体モジュールおよび半導体モジュールを製造する方法
US20130175704A1 (en) 2012-01-05 2013-07-11 Ixys Corporation Discrete power transistor package having solderless dbc to leadframe attach
JP2013235882A (ja) 2012-05-07 2013-11-21 Mitsubishi Electric Corp 半導体装置
US8716864B2 (en) 2012-06-07 2014-05-06 Ixys Corporation Solderless die attach to a direct bonded aluminum substrate
GB2509002B (en) * 2012-08-29 2014-09-10 Inco Innovation Power chain on a circuit board
SE537793C2 (sv) * 2012-08-29 2015-10-20 Jan Berglund Med Inco Innovation F Kraftledare monterad på ett mönsterkort
US9326409B2 (en) * 2012-09-26 2016-04-26 Toyota Jidosha Kabushiki Kaisha Electric component
US8987911B2 (en) * 2012-12-31 2015-03-24 Ixys Corporation Silver-to-silver bonded IC package having two ceramic substrates exposed on the outside of the package
DE102013221090A1 (de) * 2013-10-17 2015-04-23 Continental Teves Ag & Co. Ohg Elektronisches Steuergerät und Verfahren zur Anordnung und elektrischen Anbindung elektronischer Bauelemente auf einem Schaltungsträger
US9312231B2 (en) * 2013-10-31 2016-04-12 Freescale Semiconductor, Inc. Method and apparatus for high temperature semiconductor device packages and structures using a low temperature process
JP2015201505A (ja) * 2014-04-07 2015-11-12 三菱電機株式会社 半導体装置
JP6468984B2 (ja) * 2015-10-22 2019-02-13 三菱電機株式会社 半導体装置
JP6665664B2 (ja) * 2016-04-27 2020-03-13 富士電機株式会社 半導体装置及びその製造方法
KR102239209B1 (ko) * 2018-10-24 2021-04-12 대산전자(주) 도금방법 및 도금체
JP7528481B2 (ja) * 2020-03-18 2024-08-06 富士電機株式会社 半導体モジュール及びその製造方法
CN111751272B (zh) * 2020-07-03 2021-09-07 北京理工大学 一种粘接强度等级超声检测与拉伸标定试验方法
CN112583210A (zh) 2020-12-28 2021-03-30 上海大郡动力控制技术有限公司 用于功率模块的低杂散电感母排结构

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5386576A (en) * 1977-01-10 1978-07-31 Nec Corp Package for semiconductor element
JPH0620998B2 (ja) * 1988-01-20 1994-03-23 株式会社豊田自動織機製作所 スプレッダの位置合わせ装置
JP2963289B2 (ja) * 1992-11-30 1999-10-18 ユニ・チャーム株式会社 体液吸収性物品の表面シート
JP3524360B2 (ja) 1997-12-26 2004-05-10 株式会社東芝 半導体装置およびその製造方法
JPH11346037A (ja) * 1998-05-29 1999-12-14 Kyocera Corp 放熱用基板
JPH11346480A (ja) * 1998-06-02 1999-12-14 Hitachi Ltd インバータ装置
JP2000232189A (ja) 1999-02-10 2000-08-22 Toshiba Corp 半導体装置
JP2002009190A (ja) * 2000-06-16 2002-01-11 Ngk Spark Plug Co Ltd セラミック基板及びその製造方法
JP4756200B2 (ja) * 2000-09-04 2011-08-24 Ｄｏｗａメタルテック株式会社 金属セラミックス回路基板
JP2002164461A (ja) 2000-11-24 2002-06-07 Kyocera Corp セラミック回路基板
JP2002231882A (ja) * 2001-02-06 2002-08-16 Mitsubishi Electric Corp 半導体装置
US6787706B2 (en) * 2001-02-21 2004-09-07 Kyocera Corporation Ceramic circuit board
JP4750325B2 (ja) * 2001-08-09 2011-08-17 電気化学工業株式会社 回路基板の部分メッキ方法
US6670216B2 (en) * 2001-10-31 2003-12-30 Ixys Corporation Method for manufacturing a power semiconductor device and direct bonded substrate thereof
DE10157362B4 (de) * 2001-11-23 2006-11-16 Infineon Technologies Ag Leistungsmodul und Verfahren zu seiner Herstellung
JP2003188310A (ja) 2001-12-18 2003-07-04 Denki Kagaku Kogyo Kk 電極端子付き回路基板の製造方法
JP3891838B2 (ja) * 2001-12-26 2007-03-14 株式会社ルネサステクノロジ 半導体装置およびその製造方法

Also Published As

Publication number Publication date
EP1711040A1 (de) 2006-10-11
EP1711040B1 (de) 2007-09-12
JP2006278913A (ja) 2006-10-12
US20060220216A1 (en) 2006-10-05
CN1841726A (zh) 2006-10-04
DE602006000104T2 (de) 2008-06-12
CN100390989C (zh) 2008-05-28
KR100729249B1 (ko) 2007-06-15
KR20060106743A (ko) 2006-10-12
US7446406B2 (en) 2008-11-04

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Legal Events

Date Code Title Description
8381 Inventor (new situation)

Inventor name: MIZUNO, TAKAHITO, AICHI-KEN, 471-8571, JP

Inventor name: YAMAMOTO, REN, AICHI-KEN, 471-8571, JP

Inventor name: WAKITA, SHIGERU, SAITAMA-KEN, 361-8551, JP

8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee