BRPI0812579A2 - Método de fabricação de placas de circuito - Google Patents

Método de fabricação de placas de circuito

Info

Publication number: BRPI0812579A2
Authority: BR; Brazil
Prior art keywords: circuit board; board manufacturing; manufacturing; circuit; board
Prior art date: 2007-06-07

Application number

BRPI0812579-1A2A

Other languages

English (en)

Inventor

Anti Salminen

Rauno Holappa

Original Assignee

Finnish Environment Technology Oy

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2007-06-07

Filing date

2008-05-29

Publication date

2015-02-18

2007-06-07 Priority claimed from FI20070453A external-priority patent/FI20070453A0/fi

2008-05-29 Application filed by Finnish Environment Technology Oy filed Critical Finnish Environment Technology Oy

2015-02-18 Publication of BRPI0812579A2 publication Critical patent/BRPI0812579A2/pt

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49163—Manufacturing circuit on or in base with sintering of base
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing Of Printed Wiring (AREA)
Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Parts Printed On Printed Circuit Boards (AREA)

BRPI0812579-1A2A 2007-06-07 2008-05-29 Método de fabricação de placas de circuito BRPI0812579A2 (pt)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
FI20070453A FI20070453A0 (fi)	2007-06-07	2007-06-07	Menetelmä piirilevyjen valmistuksessa
FI20070904A FI20070904A7 (fi)	2007-06-07	2007-11-26	Menetelmä piirilevyjen valmistuksessa
PCT/FI2008/050312 WO2008152193A1 (en)	2007-06-07	2008-05-29	Method in manufacturing of circuit boards

Publications (1)

Publication Number	Publication Date
BRPI0812579A2 true BRPI0812579A2 (pt)	2015-02-18

Family

ID=38786682

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BRPI0812579-1A2A BRPI0812579A2 (pt)	2007-06-07	2008-05-29	Método de fabricação de placas de circuito

Country Status (11)

Country	Link
US (1)	US20100146781A1 (pt)
EP (1)	EP2151150A4 (pt)
JP (1)	JP2010529667A (pt)
KR (1)	KR20100018041A (pt)
CN (1)	CN101711488A (pt)
AU (1)	AU2008263848A1 (pt)
BR (1)	BRPI0812579A2 (pt)
CA (1)	CA2690198A1 (pt)
FI (1)	FI20070904A7 (pt)
RU (1)	RU2009147684A (pt)
WO (1)	WO2008152193A1 (pt)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI613177B (zh) *	2011-11-16	2018-02-01	製陶技術股份有限公司	製造一基材的方法
CN103440074A (zh) *	2013-07-18	2013-12-11	苏州触动电子科技有限公司	一种投射式电容触控屏制作工艺
US9456507B2 (en) *	2013-10-07	2016-09-27	The Boeing Company	Ecological method for constructing circuit boards
JP2016039171A (ja) *	2014-08-05	2016-03-22	株式会社秀峰	導電配線の製造方法および導電配線
CN105393650B (zh) *	2014-03-28	2018-04-10	株式会社秀峰	导电布线的制造方法以及导电布线
JP2015195329A (ja) *	2014-03-28	2015-11-05	株式会社秀峰	導電配線の製造方法および導電配線
WO2016072011A1 (ja) *	2014-11-07	2016-05-12	富士機械製造株式会社	配線形成方法
DE102014116275A1 (de) *	2014-11-07	2016-05-12	Webasto SE	Verfahren zur Herstellung eines Kontaktbereichs für eine Schicht eines elektrischen Heizgeräts sowie Vorrichtung für ein elektrisches Heizgerät für ein Kraftfahrzeug
WO2016165747A1 (en) *	2015-04-14	2016-10-20	Hewlett-Packard Development Company L.P.	Marking build material
CN108735315B (zh) *	2018-06-04	2024-05-14	江苏核电有限公司	一种vver乏燃料组件贮存栅元及制造方法
DE102021107711A1 (de)	2021-03-26	2022-09-29	Gottfried Wilhelm Leibniz Universität Hannover, Körperschaft des öffentlichen Rechts	Elektrisches Bauteil und Verfahren zu dessen Herstellung

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5922385B2 (ja) *	1980-04-25	1984-05-26	日産自動車株式会社	セラミツク基板のスル−ホ−ル充填用導電体ペ−スト
JPS60502282A (ja) *	1983-09-21	1985-12-26	アライド　コ−ポレイシヨン	プリント回路基板の製造方法
US4781495A (en) *	1986-10-14	1988-11-01	Lubra Sheet Corp.	Dry lubricant drilling of thru-holes in printed circuit boards
US4929370A (en) *	1986-10-14	1990-05-29	Lubra Sheet Corporation	Dry lubricant drilling of thru-holes in printed circuit boards
US5296062A (en) *	1986-10-17	1994-03-22	The Board Of Regents, The University Of Texas System	Multiple material systems for selective beam sintering
US5011725A (en) *	1987-05-22	1991-04-30	Ceramics Process Systems Corp.	Substrates with dense metal vias produced as co-sintered and porous back-filled vias
US5176772A (en) *	1989-10-05	1993-01-05	Asahi Glass Company Ltd.	Process for fabricating a multilayer ceramic circuit board
US5229549A (en) *	1989-11-13	1993-07-20	Sumitomo Electric Industries, Ltd.	Ceramic circuit board and a method of manufacturing the ceramic circuit board
US5011655A (en) *	1989-12-22	1991-04-30	Inco Alloys International, Inc.	Process of forming a composite structure
US5724727A (en) *	1996-08-12	1998-03-10	Motorola, Inc.	Method of forming electronic component
TW369672B (en) *	1997-07-28	1999-09-11	Hitachi Ltd	Wiring board and its manufacturing process, and electrolysis-free electroplating method
TW512653B (en) *	1999-11-26	2002-12-01	Ibiden Co Ltd	Multilayer circuit board and semiconductor device
JP4030285B2 (ja) *	2001-10-10	2008-01-09	株式会社トクヤマ	基板及びその製造方法
US20060044083A1 (en) *	2004-08-27	2006-03-02	Maksim Kuzmenka	Circuit board and method for producing a circuit board
US7342183B2 (en) *	2005-07-11	2008-03-11	Endicott Interconnect Technologies, Inc.	Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same

2007
- 2007-11-26 FI FI20070904A patent/FI20070904A7/fi unknown
2008
- 2008-05-29 RU RU2009147684/07A patent/RU2009147684A/ru not_active Application Discontinuation
- 2008-05-29 WO PCT/FI2008/050312 patent/WO2008152193A1/en not_active Ceased
- 2008-05-29 CN CN200880019046.0A patent/CN101711488A/zh active Pending
- 2008-05-29 KR KR1020107000203A patent/KR20100018041A/ko not_active Withdrawn
- 2008-05-29 AU AU2008263848A patent/AU2008263848A1/en not_active Abandoned
- 2008-05-29 EP EP08761708A patent/EP2151150A4/en not_active Withdrawn
- 2008-05-29 CA CA2690198A patent/CA2690198A1/en not_active Abandoned
- 2008-05-29 BR BRPI0812579-1A2A patent/BRPI0812579A2/pt not_active Application Discontinuation
- 2008-05-29 JP JP2010510837A patent/JP2010529667A/ja active Pending
- 2008-05-29 US US12/601,142 patent/US20100146781A1/en not_active Abandoned

Also Published As

Publication number	Publication date
JP2010529667A (ja)	2010-08-26
KR20100018041A (ko)	2010-02-16
US20100146781A1 (en)	2010-06-17
FI20070904A0 (fi)	2007-11-26
FI20070904A7 (fi)	2009-03-30
CA2690198A1 (en)	2008-12-18
RU2009147684A (ru)	2011-07-20
EP2151150A1 (en)	2010-02-10
EP2151150A4 (en)	2011-07-06
WO2008152193A1 (en)	2008-12-18
AU2008263848A1 (en)	2008-12-18
CN101711488A (zh)	2010-05-19

Publication	Publication Date	Title
DE602007009217D1 (de)	2010-10-28	Schaltung
DK2130417T3 (da)	2019-05-27	Printplader
BRPI0812579A2 (pt)	2015-02-18	Método de fabricação de placas de circuito
DE602007011692D1 (de)	2011-02-17	Leiterplatte
DE602007000582D1 (de)	2009-04-09	Leiterplatte
DE502007002763D1 (de)	2010-03-18	Schaltungsmodul
EP2259921A4 (en)	2012-12-26	METHOD FOR PRODUCING A COATED PCB
EP2071907A4 (en)	2009-12-09	FLEX RIGID PCB AND METHOD FOR PRODUCING THE FLEX RIGID PCB
DE602008003280D1 (de)	2010-12-16	Elektronische Kamera
DE602007001847D1 (de)	2009-09-17	Flexible Leiterplatte
BRPI0903903A2 (pt)	2015-06-30	Circuito de interface
EP2256670A4 (en)	2014-07-30	Ic card
DE602007004020D1 (de)	2010-02-11	Niveauverschiebungsschaltkreis
DE502006009008D1 (de)	2011-04-14	Kühlmittelkreislauf
DK2345107T3 (da)	2012-09-03	Printkortterminal
DE602006005220D1 (de)	2009-04-02	Schaltungssicherheit
EP2184960A4 (en)	2010-09-22	CONDUCTOR PLATE AND METHOD FOR PRODUCING A CONDUCTOR PLATE
DE112009002460A5 (de)	2011-07-14	Flexible Leiterplatte
DE602007004373D1 (de)	2010-03-11	Leiterplatte
DE502006009152D1 (de)	2011-05-05	Leiterplatte
DE502007000674D1 (de)	2009-06-10	Platinenanordnung
EP2120334A4 (en)	2012-11-07	demodulation circuit
DE502007006389D1 (de)	2011-03-10	Elektronisches Gerät
DE602008002359D1 (de)	2010-10-14	Empfangsschaltung
ATE556194T1 (de)	2012-05-15	Kreiskolbenmotor

Legal Events

Date	Code	Title	Description
2015-06-09	B11A	Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
2015-09-01	B11Y	Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]