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DE60040507D1 - Verfahren zur Verringerung der Oxidation an einer Zwischenschicht einer Halbleiteranordnung - Google Patents

Verfahren zur Verringerung der Oxidation an einer Zwischenschicht einer Halbleiteranordnung

Info

Publication number
DE60040507D1
DE60040507D1 DE60040507T DE60040507T DE60040507D1 DE 60040507 D1 DE60040507 D1 DE 60040507D1 DE 60040507 T DE60040507 T DE 60040507T DE 60040507 T DE60040507 T DE 60040507T DE 60040507 D1 DE60040507 D1 DE 60040507D1
Authority
DE
Germany
Prior art keywords
oxidation
reducing
semiconductor device
intermediate layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60040507T
Other languages
English (en)
Inventor
Judy H Huang
Christopher Dennis Bencher
Sudha Rathi
Christopher S Ngai
Bok Hoen Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23437585&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60040507(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE60040507D1 publication Critical patent/DE60040507D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10P14/6336—
    • H10P14/60—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
    • C23C16/0245—Pretreatment of the material to be coated by cleaning or etching by etching with a plasma
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • H10P14/6532—
    • H10P14/6682—
    • H10P14/69433—
    • H10P50/267—
    • H10P50/283—
    • H10P70/234—
    • H10P70/27—
    • H10P70/277—
    • H10W20/056—
    • H10W20/077—
    • H10W20/425—
    • H10P14/6902—
    • H10P14/6905—
    • H10P14/69215—
    • H10P70/273—
    • H10W20/084—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Element Separation (AREA)
  • Drying Of Semiconductors (AREA)
DE60040507T 1999-07-30 2000-05-08 Verfahren zur Verringerung der Oxidation an einer Zwischenschicht einer Halbleiteranordnung Expired - Fee Related DE60040507D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/365,129 US6355571B1 (en) 1998-11-17 1999-07-30 Method and apparatus for reducing copper oxidation and contamination in a semiconductor device

Publications (1)

Publication Number Publication Date
DE60040507D1 true DE60040507D1 (de) 2008-11-27

Family

ID=23437585

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60040507T Expired - Fee Related DE60040507D1 (de) 1999-07-30 2000-05-08 Verfahren zur Verringerung der Oxidation an einer Zwischenschicht einer Halbleiteranordnung

Country Status (6)

Country Link
US (5) US6355571B1 (de)
EP (1) EP1073106B1 (de)
JP (1) JP2001093902A (de)
KR (1) KR100773188B1 (de)
DE (1) DE60040507D1 (de)
TW (1) TW459304B (de)

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US6946401B2 (en) 2005-09-20
US20050263900A1 (en) 2005-12-01
US20020081856A1 (en) 2002-06-27
US6355571B1 (en) 2002-03-12
EP1073106A3 (de) 2005-08-24
US20090050902A1 (en) 2009-02-26
JP2001093902A (ja) 2001-04-06
US20040046260A1 (en) 2004-03-11
US8183150B2 (en) 2012-05-22
KR100773188B1 (ko) 2007-11-02
TW459304B (en) 2001-10-11
EP1073106A2 (de) 2001-01-31
EP1073106B1 (de) 2008-10-15
KR20010039772A (ko) 2001-05-15

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