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DE60030949D1 - Verfahren zur herstellung einer karte - Google Patents

Verfahren zur herstellung einer karte

Info

Publication number
DE60030949D1
DE60030949D1 DE60030949T DE60030949T DE60030949D1 DE 60030949 D1 DE60030949 D1 DE 60030949D1 DE 60030949 T DE60030949 T DE 60030949T DE 60030949 T DE60030949 T DE 60030949T DE 60030949 D1 DE60030949 D1 DE 60030949D1
Authority
DE
Germany
Prior art keywords
card
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60030949T
Other languages
English (en)
Other versions
DE60030949T2 (de
Inventor
Akira Ichikawa
Kenichi Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of DE60030949D1 publication Critical patent/DE60030949D1/de
Application granted granted Critical
Publication of DE60030949T2 publication Critical patent/DE60030949T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Credit Cards Or The Like (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
DE60030949T 1999-08-31 2000-06-30 Verfahren zur herstellung einer karte Expired - Fee Related DE60030949T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP24416199A JP4588139B2 (ja) 1999-08-31 1999-08-31 Ｉｃカードの製造方法
JP24416199 1999-08-31
PCT/JP2000/004335 WO2001016878A1 (en) 1999-08-31 2000-06-30 Method of manufacturing card

Publications (2)

Publication Number Publication Date
DE60030949D1 true DE60030949D1 (de) 2006-11-09
DE60030949T2 DE60030949T2 (de) 2007-06-14

Family

ID=17114686

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60030949T Expired - Fee Related DE60030949T2 (de) 1999-08-31 2000-06-30 Verfahren zur herstellung einer karte

Country Status (7)

Country Link
US (1) US6736918B1 (de)
EP (1) EP1130542B1 (de)
JP (1) JP4588139B2 (de)
KR (1) KR100605054B1 (de)
CN (1) CN1321283A (de)
DE (1) DE60030949T2 (de)
WO (1) WO2001016878A1 (de)

Families Citing this family (39)

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FI112288B (fi) * 2000-01-17 2003-11-14 Rafsec Oy Menetelmä älytarrasyöttörainan valmistamiseksi
US6451154B1 (en) * 2000-02-18 2002-09-17 Moore North America, Inc. RFID manufacturing concepts
FI112287B (fi) 2000-03-31 2003-11-14 Rafsec Oy Menetelmä tuoteanturin muodostamiseksi ja tuoteanturi
FI112121B (fi) 2000-12-11 2003-10-31 Rafsec Oy Älytarraraina, menetelmä sen valmistamiseksi, menetelmä kantorainan valmistamiseksi ja älytarrarainan älytarran rakenneosa
FR2824018B1 (fr) 2001-04-26 2003-07-04 Arjo Wiggins Sa Couverture incorporant un dispositif d'identification radiofrequence
JP4743367B2 (ja) * 2001-05-15 2011-08-10 大日本印刷株式会社 Ｒｆｉｄタグ付きタックラベル、ｒｆｉｄタグ付きタックラベルの製造方法およびｒｆｉｄタグ付きタックラベルの製造装置
KR20020087319A (ko) * 2001-05-15 2002-11-22 주식회사 쓰리비 시스템 아이씨칩 내장 카드의 제조방법, 이에 사용되는 파레트 및클램핑테이블
JP2002342728A (ja) * 2001-05-16 2002-11-29 Dainippon Printing Co Ltd ラベル加工用ｉｃタグインレットと製造方法
FI112550B (fi) 2001-05-31 2003-12-15 Rafsec Oy Älytarra ja älytarraraina
FI117331B (fi) * 2001-07-04 2006-09-15 Rafsec Oy Menetelmä ruiskuvaletun tuotteen valmistamiseksi
FI119401B (fi) * 2001-12-21 2008-10-31 Upm Raflatac Oy Älytarraraina ja menetelmä sen valmistamiseksi
EP1376462A1 (de) * 2002-06-19 2004-01-02 SCHLUMBERGER Systèmes Verfahren zur Herstellung eines Bandes
JP4513052B2 (ja) * 2003-10-24 2010-07-28 ブラザー工業株式会社 無線タグ情報通信装置
JP2005157661A (ja) 2003-11-25 2005-06-16 Brother Ind Ltd 無線タグ作成装置及びカートリッジ
EP1544786B1 (de) * 2003-12-17 2007-10-03 ASSA ABLOY Identification Technologies Austria GmbH Datenträger und Verfahren zur Herstellung desselben
US9254213B2 (en) * 2004-01-09 2016-02-09 Rubicon Medical, Inc. Stent delivery device
DE202004003701U1 (de) * 2004-03-12 2004-08-12 Cubit Electronics Gmbh Flacher Transponder
FR2868987B1 (fr) 2004-04-14 2007-02-16 Arjo Wiggins Secutity Sas Soc Structure comportant un dispositif electronique, notamment pour la fabrication d'un document de securite ou de valeur
US7286053B1 (en) * 2004-07-31 2007-10-23 Kovio, Inc. Electronic article surveillance (EAS) tag/device with coplanar and/or multiple coil circuits, an EAS tag/device with two or more memory bits, and methods for tuning the resonant frequency of an RLC EAS tag/device
ITMO20050018A1 (it) * 2005-01-28 2006-07-29 Windinglab S R L Documento cartaceo con incorporato un dispositivo di identificazione a radiofrequenza.
JP2006221389A (ja) * 2005-02-10 2006-08-24 Nippon Tsushinki Kk Ｉｃラベルと、ｉｃラベルの製造装置
WO2006104019A1 (en) * 2005-03-28 2006-10-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method thereof, and measuring method thereof
JP4616719B2 (ja) * 2005-07-20 2011-01-19 富士通株式会社 Ｉｃチップ実装方法
JP5127176B2 (ja) * 2005-07-29 2013-01-23 株式会社半導体エネルギー研究所 半導体装置の作製方法
US7776656B2 (en) 2005-07-29 2010-08-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
EP2397975B1 (de) 2005-08-22 2017-07-12 Avery Dennison Corporation Verfahren zur Herstellung von RFID-Geräten
US20080028718A1 (en) * 2006-08-02 2008-02-07 Erickson John A Stackable rebar support chair
JP4906446B2 (ja) * 2006-09-04 2012-03-28 ニスカ株式会社 製本装置及びこれを備えた画像形成装置
DE102008037817B4 (de) 2008-08-14 2019-09-05 Infineon Technologies Ag Transponderinlay für ein Dokument zur Personenidentifikation und ein Verfahren zur Herstellung eines Transponderinlays
US20100259589A1 (en) * 2009-04-14 2010-10-14 Jonathan Barry Inert uv inkjet printing
DE102010011517A1 (de) * 2010-03-15 2011-09-15 Smartrac Ip B.V. Laminataufbau für eine Chipkarte und Verfahren zu dessen Herstellung
US8567936B2 (en) 2010-11-10 2013-10-29 Electronics For Imaging, Inc. LED roll to roll drum printer systems, structures and methods
US9527307B2 (en) 2010-12-15 2016-12-27 Electronics For Imaging, Inc. Oxygen inhibition for print-head reliability
US9487010B2 (en) 2010-12-15 2016-11-08 Electronics For Imaging, Inc. InkJet printer with controlled oxygen levels
DE102018004914B4 (de) * 2018-06-20 2024-06-06 Mühlbauer Gmbh & Co. Kg Fertigungsanlage für die Herstellung von Sicherheits- oder Buchdokumenten
CN110147866A (zh) * 2019-04-17 2019-08-20 东信和平科技股份有限公司 一种具有凸起触感的智能卡及其制作方法
JP7501192B2 (ja) * 2020-07-21 2024-06-18 Dic株式会社 剛性積層体の製造方法
CN114013112A (zh) * 2021-10-21 2022-02-08 上海晶路电子科技有限公司 一种卷对卷电子吊牌的生产工艺
JP7605092B2 (ja) 2021-11-22 2024-12-24 株式会社豊田自動織機 溶着装置、及び樹脂溶着ワークの製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5387306A (en) * 1988-06-21 1995-02-07 Gec Avery Limited Manufacturing integrated circuit cards
JPH06122297A (ja) * 1992-08-31 1994-05-06 Sony Chem Corp Ｉｃカード及びその製造方法
DE19504194C1 (de) * 1995-02-09 1996-04-04 Interlock Ag Verfahren zur Herstellung von Ausweiskarten und danach hergestellte Ausweiskarte
DE19602821C1 (de) * 1996-01-26 1997-06-26 Siemens Ag Verfahren zur Herstellung einer Datenkarte
JPH10208003A (ja) * 1997-01-22 1998-08-07 Sony Corp カセットラベル、および、ビデオカセットテープ
JPH10302040A (ja) * 1997-04-30 1998-11-13 Toshiba Corp 薄型電子機器の製法および薄型電子機器
US5841350A (en) * 1997-06-27 1998-11-24 Checkpoint Systems, Inc. Electronic security tag useful in electronic article indentification and surveillance system
JPH11122297A (ja) 1997-10-13 1999-04-30 Sony Corp ネットワーク制御方法及びネットワーク制御装置並びに記録媒体
JPH11161760A (ja) * 1997-11-26 1999-06-18 Hitachi Ltd 薄型電子回路部品及びその製造方法及びその製造装置
JPH11221986A (ja) * 1998-02-09 1999-08-17 Konica Corp Ｉｃカードの製造方法
JPH11221985A (ja) 1998-02-09 1999-08-17 Toshiba Corp カード作成システム用の撮像装置及び撮像処理方法

Also Published As

Publication number Publication date
EP1130542A4 (de) 2004-04-28
KR100605054B1 (ko) 2006-07-26
US6736918B1 (en) 2004-05-18
EP1130542B1 (de) 2006-09-27
KR20010089351A (ko) 2001-10-06
JP2001063256A (ja) 2001-03-13
JP4588139B2 (ja) 2010-11-24
EP1130542A1 (de) 2001-09-05
CN1321283A (zh) 2001-11-07
WO2001016878A1 (en) 2001-03-08
DE60030949T2 (de) 2007-06-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee