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WO2008146793A1 - 電気装置、接続方法及び接着フィルム - Google Patents

電気装置、接続方法及び接着フィルム Download PDF

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Publication number
WO2008146793A1
WO2008146793A1 PCT/JP2008/059666 JP2008059666W WO2008146793A1 WO 2008146793 A1 WO2008146793 A1 WO 2008146793A1 JP 2008059666 W JP2008059666 W JP 2008059666W WO 2008146793 A1 WO2008146793 A1 WO 2008146793A1
Authority
WO
WIPO (PCT)
Prior art keywords
curing
curing region
electric device
region
adhesive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/059666
Other languages
English (en)
French (fr)
Inventor
Misao Konishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemical and Information Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical and Information Device Corp filed Critical Sony Chemical and Information Device Corp
Priority to HK10105445.8A priority Critical patent/HK1139506B/xx
Priority to CN2008800173145A priority patent/CN101681855B/zh
Priority to KR1020097000461A priority patent/KR101203017B1/ko
Publication of WO2008146793A1 publication Critical patent/WO2008146793A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H10W72/20—
    • H10W72/30—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H10W72/01304—
    • H10W72/073—
    • H10W72/07331—
    • H10W72/07355—
    • H10W72/074—
    • H10W72/227—
    • H10W72/248—
    • H10W72/252—
    • H10W72/29—
    • H10W72/324—
    • H10W72/325—
    • H10W72/351—
    • H10W72/352—
    • H10W72/354—
    • H10W72/355—
    • H10W72/926—
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Combinations Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

　配線基板２０と、少なくとも片面に接続端子２７が配置された電気部品２５とが硬化接着剤層１２ａにより固定されている電気装置１において、硬化接着剤層１２ａは、第一の硬化領域１５ａと、第一の硬化領域１５ａよりもガラス転移温度が低い第二の硬化領域１８ａを有する。第一の硬化領域１ａと第二の硬化領域１８ａを配線基板２０上の異なる位置に配置する。特に、細長い電機部品２５を接続する場合には、その両端部を第一の硬化領域１２ａで接続し、その両端部の間を第二の硬化領域で接続する。    
PCT/JP2008/059666 2007-05-24 2008-05-26 電気装置、接続方法及び接着フィルム Ceased WO2008146793A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
HK10105445.8A HK1139506B (en) 2007-05-24 2008-05-26 Electric device, connecting method and adhesive film
CN2008800173145A CN101681855B (zh) 2007-05-24 2008-05-26 电气装置、连接方法及粘接膜
KR1020097000461A KR101203017B1 (ko) 2007-05-24 2008-05-26 전기 장치, 접속 방법 및 접착 필름

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-137921 2007-05-24
JP2007137921 2007-05-24

Publications (1)

Publication Number Publication Date
WO2008146793A1 true WO2008146793A1 (ja) 2008-12-04

Family

ID=40032036

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2008/059667 Ceased WO2008143358A1 (ja) 2007-05-24 2008-05-26 電気装置、接続方法及び接着フィルム
PCT/JP2008/059666 Ceased WO2008146793A1 (ja) 2007-05-24 2008-05-26 電気装置、接続方法及び接着フィルム

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059667 Ceased WO2008143358A1 (ja) 2007-05-24 2008-05-26 電気装置、接続方法及び接着フィルム

Country Status (5)

Country Link
JP (2) JP5152499B2 (ja)
KR (1) KR101203017B1 (ja)
CN (1) CN101681855B (ja)
TW (2) TWI387412B (ja)
WO (2) WO2008143358A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015133221A1 (ja) * 2014-03-07 2015-09-11 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5608504B2 (ja) * 2010-10-06 2014-10-15 デクセリアルズ株式会社 接続方法及び接続構造体
KR101712043B1 (ko) * 2010-10-14 2017-03-03 삼성전자주식회사 적층 반도체 패키지, 상기 적층 반도체 패키지를 포함하는 반도체 장치 및 상기 적층 반도체 패키지의 제조 방법
KR20140060517A (ko) * 2011-09-12 2014-05-20 메이코 일렉트로닉스 컴파니 리미티드 부품 내장 기판의 제조 방법 및 이를 이용한 부품 내장 기판
JP5926590B2 (ja) * 2012-03-23 2016-05-25 デクセリアルズ株式会社 接続体の製造方法、及び電子部品の接続方法
US9740067B2 (en) * 2012-09-03 2017-08-22 Sharp Kabushiki Kaisha Display device and method for producing same
JP6307308B2 (ja) * 2014-03-06 2018-04-04 デクセリアルズ株式会社 接続構造体の製造方法、及び回路接続材料
JP2016001574A (ja) * 2014-06-12 2016-01-07 株式会社デンソー ラミネート外装電池
JP6759578B2 (ja) 2014-12-22 2020-09-23 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体
WO2018066411A1 (ja) * 2016-10-03 2018-04-12 日立化成株式会社 導電性フィルム、巻回体、接続構造体、及び接続構造体の製造方法
TWI763750B (zh) * 2016-12-01 2022-05-11 日商迪睿合股份有限公司 異向性導電膜
KR102267650B1 (ko) 2016-12-01 2021-06-21 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름
KR102066934B1 (ko) * 2018-07-11 2020-01-16 주식회사 비에이치 Pen fpcb를 이용한 접합 방법 및 이를 이용해 제조된 대면적 pen fpcb 조립체
TWI724911B (zh) * 2020-05-26 2021-04-11 友達光電股份有限公司 發光裝置及其製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06260533A (ja) * 1993-03-08 1994-09-16 Sony Chem Corp Ｉｃチップ実装方法
JPH09330950A (ja) * 1996-06-13 1997-12-22 Nec Corp 半導体装置及びその製造方法
JPH11354582A (ja) * 1998-04-07 1999-12-24 Shinko Electric Ind Co Ltd 半導体チップの実装構造
JP2004071857A (ja) * 2002-08-07 2004-03-04 Sharp Corp 基板接続部の構造、並びに該構造を有する電子部品及び液晶表示装置

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Publication number Priority date Publication date Assignee Title
JP3225800B2 (ja) * 1995-08-09 2001-11-05 三菱電機株式会社 半導体装置
JP3506003B2 (ja) * 1998-05-19 2004-03-15 ソニーケミカル株式会社 異方性導電接着材
MY124944A (en) * 2000-02-09 2006-07-31 Hitachi Chemical Co Ltd Resin composition, adhesives prepared therewith for bonding circuit members,and circuits boards
JP2003086633A (ja) * 2001-09-13 2003-03-20 Canon Inc 配線基板及びこれを備えた表示装置
JP5076292B2 (ja) * 2005-08-08 2012-11-21 パナソニック株式会社 異方導電膜貼付装置及び方法
KR100780956B1 (ko) 2006-08-17 2007-12-03 삼성전자주식회사 이종 언더필 반도체 패키지 및 그의 제조 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06260533A (ja) * 1993-03-08 1994-09-16 Sony Chem Corp Ｉｃチップ実装方法
JPH09330950A (ja) * 1996-06-13 1997-12-22 Nec Corp 半導体装置及びその製造方法
JPH11354582A (ja) * 1998-04-07 1999-12-24 Shinko Electric Ind Co Ltd 半導体チップの実装構造
JP2004071857A (ja) * 2002-08-07 2004-03-04 Sharp Corp 基板接続部の構造、並びに該構造を有する電子部品及び液晶表示装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015133221A1 (ja) * 2014-03-07 2015-09-11 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
JP2015170529A (ja) * 2014-03-07 2015-09-28 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法

Also Published As

Publication number Publication date
JP5152499B2 (ja) 2013-02-27
WO2008143358A1 (ja) 2008-11-27
CN101681855A (zh) 2010-03-24
TW200847866A (en) 2008-12-01
CN101681855B (zh) 2013-03-13
TWI422294B (zh) 2014-01-01
TWI387412B (zh) 2013-02-21
HK1139506A1 (en) 2010-09-17
KR101203017B1 (ko) 2012-11-20
TW200850094A (en) 2008-12-16
JP5013114B2 (ja) 2012-08-29
KR20090085017A (ko) 2009-08-06
JP2009004768A (ja) 2009-01-08
JP2009004767A (ja) 2009-01-08

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