[go: up one dir, main page]

WO2008093414A1 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

Info

Publication number
WO2008093414A1
WO2008093414A1 PCT/JP2007/051601 JP2007051601W WO2008093414A1 WO 2008093414 A1 WO2008093414 A1 WO 2008093414A1 JP 2007051601 W JP2007051601 W JP 2007051601W WO 2008093414 A1 WO2008093414 A1 WO 2008093414A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor device
manufacturing
same
sealing resin
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/051601
Other languages
English (en)
French (fr)
Inventor
Susumu Moriya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Fujitsu Semiconductor Ltd
Original Assignee
Fujitsu Ltd
Fujitsu Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd, Fujitsu Semiconductor Ltd filed Critical Fujitsu Ltd
Priority to KR1020097012746A priority Critical patent/KR101057368B1/ko
Priority to JP2008555983A priority patent/JP5120266B6/ja
Priority to CN200780049019A priority patent/CN101617400A/zh
Priority to PCT/JP2007/051601 priority patent/WO2008093414A1/ja
Publication of WO2008093414A1 publication Critical patent/WO2008093414A1/ja
Priority to US12/479,915 priority patent/US8018033B2/en
Anticipated expiration legal-status Critical
Priority to US13/198,986 priority patent/US8497156B2/en
Ceased legal-status Critical Current

Links

Classifications

    • H10W74/117—
    • H10W42/20—
    • H10W70/60—
    • H10W74/014—
    • H10W74/016—
    • H10W74/40—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W70/657—
    • H10W72/0198—
    • H10W72/073—
    • H10W72/07331—
    • H10W72/07552—
    • H10W72/07553—
    • H10W72/354—
    • H10W72/527—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/537—
    • H10W72/5445—
    • H10W72/5522—
    • H10W72/5525—
    • H10W72/884—
    • H10W74/00—
    • H10W90/701—
    • H10W90/724—
    • H10W90/734—
    • H10W90/754—
    • H10W99/00—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

半導体装置（３０）は、配線基板（３２）と、当該配線基板（３２）上に搭載された半導体素子（３３）と、前記半導体素子（３３）を被覆する封止用樹脂（３６）と、一端が前記配線基板の配線層（３２）に接続され、且つその一部が前記封止用樹脂（３６）の表面に露出された接地用電極（３８）と、前記封止用樹脂（３６）を被覆し、且つ前記接地用電極（３８）に接続されたシールド部材（３９）とを有する。
PCT/JP2007/051601 2007-01-31 2007-01-31 半導体装置及びその製造方法 Ceased WO2008093414A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020097012746A KR101057368B1 (ko) 2007-01-31 2007-01-31 반도체 장치 및 그 제조 방법
JP2008555983A JP5120266B6 (ja) 2007-01-31 2007-01-31 半導体装置及びその製造方法
CN200780049019A CN101617400A (zh) 2007-01-31 2007-01-31 半导体器件及其制造方法
PCT/JP2007/051601 WO2008093414A1 (ja) 2007-01-31 2007-01-31 半導体装置及びその製造方法
US12/479,915 US8018033B2 (en) 2007-01-31 2009-06-08 Semiconductor device and manufacturing method of the same
US13/198,986 US8497156B2 (en) 2007-01-31 2011-08-05 Semiconductor device and manufacturing method of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/051601 WO2008093414A1 (ja) 2007-01-31 2007-01-31 半導体装置及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/479,915 Continuation US8018033B2 (en) 2007-01-31 2009-06-08 Semiconductor device and manufacturing method of the same

Publications (1)

Publication Number Publication Date
WO2008093414A1 true WO2008093414A1 (ja) 2008-08-07

Family

ID=39673734

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/051601 Ceased WO2008093414A1 (ja) 2007-01-31 2007-01-31 半導体装置及びその製造方法

Country Status (5)

Country Link
US (2) US8018033B2 (ja)
JP (1) JP5120266B6 (ja)
KR (1) KR101057368B1 (ja)
CN (1) CN101617400A (ja)
WO (1) WO2008093414A1 (ja)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010010441A (ja) * 2008-06-27 2010-01-14 Murata Mfg Co Ltd 回路モジュールの製造方法および回路モジュール
JP2011003749A (ja) * 2009-06-19 2011-01-06 Shinko Electric Ind Co Ltd 電子装置および電子装置の製造方法
JP2011035058A (ja) * 2009-07-30 2011-02-17 Sharp Corp 高周波モジュールおよび高周波モジュールが実装されたプリント配線基板
WO2017200103A1 (ja) * 2016-05-20 2017-11-23 日立化成株式会社 離型フィルム
CN107535081A (zh) * 2015-05-11 2018-01-02 株式会社村田制作所 高频模块
WO2018164158A1 (ja) * 2017-03-08 2018-09-13 株式会社村田製作所 高周波モジュール
WO2018164159A1 (ja) * 2017-03-08 2018-09-13 株式会社村田製作所 モジュール
WO2019230705A1 (ja) * 2018-06-01 2019-12-05 株式会社村田製作所 高周波モジュール
WO2020110578A1 (ja) * 2018-11-30 2020-06-04 株式会社村田製作所 モジュール
JP2020109844A (ja) * 2019-01-01 2020-07-16 蔡 憲 聰 パッケージ内コンパートメントシールドを備える半導体パッケージ及びその製造方法
JP2021002610A (ja) * 2019-06-24 2021-01-07 富士電機株式会社 半導体モジュール、車両、および半導体モジュールの製造方法
US10896880B2 (en) 2018-11-28 2021-01-19 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and fabrication method thereof
US10923435B2 (en) 2018-11-28 2021-02-16 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and improved heat-dissipation performance
US11211340B2 (en) 2018-11-28 2021-12-28 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding
US11239179B2 (en) 2018-11-28 2022-02-01 Shiann-Tsong Tsai Semiconductor package and fabrication method thereof
JP2023088277A (ja) * 2021-12-14 2023-06-26 ▲き▼邦科技股▲分▼有限公司 半導体パッケージとその製造方法
WO2025037538A1 (ja) * 2023-08-15 2025-02-20 Fdk株式会社 電子部品及び電子部品の製造方法
US12538805B2 (en) 2021-12-14 2026-01-27 Chipbond Technology Corporation Semiconductor package and method of manufacturing the same

Families Citing this family (133)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006052616A1 (en) 2004-11-03 2006-05-18 Tessera, Inc. Stacked packaging improvements
US8058101B2 (en) 2005-12-23 2011-11-15 Tessera, Inc. Microelectronic packages and methods therefor
US8350367B2 (en) 2008-02-05 2013-01-08 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US7989928B2 (en) 2008-02-05 2011-08-02 Advanced Semiconductor Engineering Inc. Semiconductor device packages with electromagnetic interference shielding
US8022511B2 (en) * 2008-02-05 2011-09-20 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US8212339B2 (en) 2008-02-05 2012-07-03 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
WO2009144960A1 (ja) * 2008-05-30 2009-12-03 三洋電機株式会社 半導体モジュール、半導体モジュールの製造方法および携帯機器
US8410584B2 (en) 2008-08-08 2013-04-02 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US20100110656A1 (en) 2008-10-31 2010-05-06 Advanced Semiconductor Engineering, Inc. Chip package and manufacturing method thereof
US20100207257A1 (en) * 2009-02-17 2010-08-19 Advanced Semiconductor Engineering, Inc. Semiconductor package and manufacturing method thereof
US8110902B2 (en) 2009-02-19 2012-02-07 Advanced Semiconductor Engineering, Inc. Chip package and manufacturing method thereof
JP5106460B2 (ja) * 2009-03-26 2012-12-26 新光電気工業株式会社 半導体装置及びその製造方法、並びに電子装置
US8212340B2 (en) 2009-07-13 2012-07-03 Advanced Semiconductor Engineering, Inc. Chip package and manufacturing method thereof
KR101678256B1 (ko) * 2009-10-09 2016-11-21 스미토모 베이클리트 컴퍼니 리미티드 반도체 장치
US8378466B2 (en) 2009-11-19 2013-02-19 Advanced Semiconductor Engineering, Inc. Wafer-level semiconductor device packages with electromagnetic interference shielding
US8030750B2 (en) 2009-11-19 2011-10-04 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US8368185B2 (en) * 2009-11-19 2013-02-05 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US8569894B2 (en) 2010-01-13 2013-10-29 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
TWI411075B (zh) 2010-03-22 2013-10-01 日月光半導體製造股份有限公司 半導體封裝件及其製造方法
US8482111B2 (en) 2010-07-19 2013-07-09 Tessera, Inc. Stackable molded microelectronic packages
US9159708B2 (en) 2010-07-19 2015-10-13 Tessera, Inc. Stackable molded microelectronic packages with area array unit connectors
TWI540698B (zh) 2010-08-02 2016-07-01 日月光半導體製造股份有限公司 半導體封裝件與其製造方法
US9007273B2 (en) 2010-09-09 2015-04-14 Advances Semiconductor Engineering, Inc. Semiconductor package integrated with conformal shield and antenna
TWI523158B (zh) * 2010-10-11 2016-02-21 日月光半導體製造股份有限公司 雙面封裝結構及應用其之無線通訊系統
US8553420B2 (en) 2010-10-19 2013-10-08 Tessera, Inc. Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
KR101075241B1 (ko) 2010-11-15 2011-11-01 테세라, 인코포레이티드 유전체 부재에 단자를 구비하는 마이크로전자 패키지
US8654537B2 (en) * 2010-12-01 2014-02-18 Apple Inc. Printed circuit board with integral radio-frequency shields
US20120146206A1 (en) 2010-12-13 2012-06-14 Tessera Research Llc Pin attachment
US9406658B2 (en) 2010-12-17 2016-08-02 Advanced Semiconductor Engineering, Inc. Embedded component device and manufacturing methods thereof
US20120162930A1 (en) * 2010-12-23 2012-06-28 Azurewave Technologies, Inc. Module ic package structure with electrical shield function and method for making the same
TWI525782B (zh) * 2011-01-05 2016-03-11 矽品精密工業股份有限公司 半導體封裝件及其製法
US20130277818A1 (en) * 2011-01-20 2013-10-24 Chi Hock Goh Chip carrier support systems
US9721872B1 (en) 2011-02-18 2017-08-01 Amkor Technology, Inc. Methods and structures for increasing the allowable die size in TMV packages
US8970028B2 (en) 2011-12-29 2015-03-03 Invensas Corporation Embedded heat spreader for package with multiple microelectronic elements and face-down connection
US8304881B1 (en) 2011-04-21 2012-11-06 Tessera, Inc. Flip-chip, face-up and face-down wirebond combination package
US8633576B2 (en) 2011-04-21 2014-01-21 Tessera, Inc. Stacked chip-on-board module with edge connector
US8928153B2 (en) 2011-04-21 2015-01-06 Tessera, Inc. Flip-chip, face-up and face-down centerbond memory wirebond assemblies
US8952516B2 (en) 2011-04-21 2015-02-10 Tessera, Inc. Multiple die stacking for two or more die
US9013033B2 (en) 2011-04-21 2015-04-21 Tessera, Inc. Multiple die face-down stacking for two or more die
US8618659B2 (en) 2011-05-03 2013-12-31 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US11830845B2 (en) 2011-05-03 2023-11-28 Tessera Llc Package-on-package assembly with wire bonds to encapsulation surface
KR101128063B1 (ko) 2011-05-03 2012-04-23 테세라, 인코포레이티드 캡슐화 층의 표면에 와이어 본드를 구비하는 패키지 적층형 어셈블리
JP5668627B2 (ja) * 2011-07-19 2015-02-12 株式会社村田製作所 回路モジュール
US8836136B2 (en) 2011-10-17 2014-09-16 Invensas Corporation Package-on-package assembly with wire bond vias
US8541883B2 (en) 2011-11-29 2013-09-24 Advanced Semiconductor Engineering, Inc. Semiconductor device having shielded conductive vias
TWI474462B (zh) * 2011-12-16 2015-02-21 矽品精密工業股份有限公司 半導體封裝件及其製法
US8946757B2 (en) 2012-02-17 2015-02-03 Invensas Corporation Heat spreading substrate with embedded interconnects
US9030841B2 (en) * 2012-02-23 2015-05-12 Apple Inc. Low profile, space efficient circuit shields
US9349706B2 (en) 2012-02-24 2016-05-24 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US8372741B1 (en) * 2012-02-24 2013-02-12 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
JP2013197209A (ja) * 2012-03-16 2013-09-30 Toshiba Corp 半導体装置及びその製造方法
US8937376B2 (en) 2012-04-16 2015-01-20 Advanced Semiconductor Engineering, Inc. Semiconductor packages with heat dissipation structures and related methods
US8786060B2 (en) 2012-05-04 2014-07-22 Advanced Semiconductor Engineering, Inc. Semiconductor package integrated with conformal shield and antenna
US8704341B2 (en) 2012-05-15 2014-04-22 Advanced Semiconductor Engineering, Inc. Semiconductor packages with thermal dissipation structures and EMI shielding
US8835228B2 (en) 2012-05-22 2014-09-16 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US8653634B2 (en) 2012-06-11 2014-02-18 Advanced Semiconductor Engineering, Inc. EMI-shielded semiconductor devices and methods of making
US9391008B2 (en) 2012-07-31 2016-07-12 Invensas Corporation Reconstituted wafer-level package DRAM
US9153542B2 (en) 2012-08-01 2015-10-06 Advanced Semiconductor Engineering, Inc. Semiconductor package having an antenna and manufacturing method thereof
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US8975738B2 (en) 2012-11-12 2015-03-10 Invensas Corporation Structure for microelectronic packaging with terminals on dielectric mass
US8878353B2 (en) 2012-12-20 2014-11-04 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
US8940630B2 (en) 2013-02-01 2015-01-27 Invensas Corporation Method of making wire bond vias and microelectronic package having wire bond vias
US9136254B2 (en) 2013-02-01 2015-09-15 Invensas Corporation Microelectronic package having wire bond vias and stiffening layer
TWI570864B (zh) * 2013-02-01 2017-02-11 英帆薩斯公司 具有焊線通孔的微電子封裝、其之製造方法以及用於其之硬化層
US9978688B2 (en) 2013-02-28 2018-05-22 Advanced Semiconductor Engineering, Inc. Semiconductor package having a waveguide antenna and manufacturing method thereof
US9837701B2 (en) 2013-03-04 2017-12-05 Advanced Semiconductor Engineering, Inc. Semiconductor package including antenna substrate and manufacturing method thereof
US9129954B2 (en) 2013-03-07 2015-09-08 Advanced Semiconductor Engineering, Inc. Semiconductor package including antenna layer and manufacturing method thereof
US9172131B2 (en) 2013-03-15 2015-10-27 Advanced Semiconductor Engineering, Inc. Semiconductor structure having aperture antenna
US9419667B2 (en) 2013-04-16 2016-08-16 Skyworks Solutions, Inc. Apparatus and methods related to conformal coating implemented with surface mount devices
US9023691B2 (en) 2013-07-15 2015-05-05 Invensas Corporation Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation
US9034696B2 (en) 2013-07-15 2015-05-19 Invensas Corporation Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation
US8883563B1 (en) 2013-07-15 2014-11-11 Invensas Corporation Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation
CN103400825B (zh) 2013-07-31 2016-05-18 日月光半导体制造股份有限公司 半导体封装件及其制造方法
US9167710B2 (en) 2013-08-07 2015-10-20 Invensas Corporation Embedded packaging with preformed vias
US9685365B2 (en) 2013-08-08 2017-06-20 Invensas Corporation Method of forming a wire bond having a free end
US20150076714A1 (en) 2013-09-16 2015-03-19 Invensas Corporation Microelectronic element with bond elements to encapsulation surface
US9087815B2 (en) 2013-11-12 2015-07-21 Invensas Corporation Off substrate kinking of bond wire
US9082753B2 (en) 2013-11-12 2015-07-14 Invensas Corporation Severing bond wire by kinking and twisting
US9583456B2 (en) 2013-11-22 2017-02-28 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9263394B2 (en) 2013-11-22 2016-02-16 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9379074B2 (en) 2013-11-22 2016-06-28 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
JP6199724B2 (ja) * 2013-12-13 2017-09-20 東芝メモリ株式会社 半導体装置の製造方法
JP6163421B2 (ja) 2013-12-13 2017-07-12 株式会社東芝 半導体装置、および、半導体装置の製造方法
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
JP2015170770A (ja) * 2014-03-07 2015-09-28 イビデン株式会社 プリント配線板
US9214454B2 (en) 2014-03-31 2015-12-15 Invensas Corporation Batch process fabrication of package-on-package microelectronic assemblies
US10381326B2 (en) 2014-05-28 2019-08-13 Invensas Corporation Structure and method for integrated circuits packaging with increased density
US9646917B2 (en) 2014-05-29 2017-05-09 Invensas Corporation Low CTE component with wire bond interconnects
US9412714B2 (en) 2014-05-30 2016-08-09 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
US10026701B1 (en) * 2014-07-28 2018-07-17 National Technology & Engineering Solutions Of Sandia, Llc Electromagnetic isolation structure
KR101616625B1 (ko) * 2014-07-30 2016-04-28 삼성전기주식회사 반도체 패키지 및 그 제조방법
CN105321933B (zh) * 2014-08-01 2019-08-09 乾坤科技股份有限公司 具有顺形电磁屏蔽结构的半导体封装件及其制造方法
CN104409446A (zh) * 2014-10-24 2015-03-11 苏州日月新半导体有限公司 采用引线键合的仿形屏蔽结构及其制作工艺
JP6444707B2 (ja) * 2014-11-28 2018-12-26 Ｔｏｗａ株式会社 電子部品、その製造方法及び製造装置
US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
US10665568B2 (en) * 2014-12-12 2020-05-26 Meiko Electronics Co., Ltd. Encapsulated circuit module, and production method therefor
US9673150B2 (en) * 2014-12-16 2017-06-06 Nxp Usa, Inc. EMI/RFI shielding for semiconductor device packages
CN105990317A (zh) * 2015-02-25 2016-10-05 晟碟信息科技（上海）有限公司 具有电磁干扰屏蔽层和半导体装置和其制造方法
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
US9530749B2 (en) 2015-04-28 2016-12-27 Invensas Corporation Coupling of side surface contacts to a circuit platform
KR102354370B1 (ko) * 2015-04-29 2022-01-21 삼성전자주식회사 쉴딩 구조물을 포함하는 자기 저항 칩 패키지
US9502372B1 (en) 2015-04-30 2016-11-22 Invensas Corporation Wafer-level packaging using wire bond wires in place of a redistribution layer
US9761554B2 (en) 2015-05-07 2017-09-12 Invensas Corporation Ball bonding metal wire bond wires to metal pads
US9490222B1 (en) 2015-10-12 2016-11-08 Invensas Corporation Wire bond wires for interference shielding
US10490528B2 (en) 2015-10-12 2019-11-26 Invensas Corporation Embedded wire bond wires
US10332854B2 (en) 2015-10-23 2019-06-25 Invensas Corporation Anchoring structure of fine pitch bva
US10181457B2 (en) 2015-10-26 2019-01-15 Invensas Corporation Microelectronic package for wafer-level chip scale packaging with fan-out
US20170141278A1 (en) * 2015-11-17 2017-05-18 Toshiba Corporation Led assembly for led package with sidewall electrodes
US9911718B2 (en) 2015-11-17 2018-03-06 Invensas Corporation ‘RDL-First’ packaged microelectronic device for a package-on-package device
US9659848B1 (en) 2015-11-18 2017-05-23 Invensas Corporation Stiffened wires for offset BVA
US9824979B2 (en) * 2015-12-29 2017-11-21 Stmicroelectronics, Inc. Electronic package having electromagnetic interference shielding and associated method
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
US9831155B2 (en) * 2016-03-11 2017-11-28 Nanya Technology Corporation Chip package having tilted through silicon via
JP6524003B2 (ja) 2016-03-17 2019-06-05 東芝メモリ株式会社 半導体装置
US9953929B2 (en) * 2016-03-18 2018-04-24 Intel Corporation Systems and methods for electromagnetic interference shielding
US9793222B1 (en) * 2016-04-21 2017-10-17 Apple Inc. Substrate designed to provide EMI shielding
US10373916B2 (en) * 2016-07-28 2019-08-06 Universal Scientific Industrial (Shanghai) Co., Ltd. Semiconductor device packages
US9935075B2 (en) 2016-07-29 2018-04-03 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding
US10546819B2 (en) 2016-09-15 2020-01-28 Toshiba Memory Corporation Semiconductor device and method of manufacturing the same
KR20190067839A (ko) 2016-10-04 2019-06-17 스카이워크스 솔루션즈, 인코포레이티드 오버몰드 구조를 갖는 양면 라디오-주파수 패키지
JP7039224B2 (ja) * 2016-10-13 2022-03-22 芝浦メカトロニクス株式会社 電子部品の製造装置及び電子部品の製造方法
US9953930B1 (en) 2016-10-20 2018-04-24 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and method for manufacturing the same
US10299368B2 (en) 2016-12-21 2019-05-21 Invensas Corporation Surface integrated waveguides and circuit structures therefor
WO2019051710A1 (zh) * 2017-09-14 2019-03-21 深圳市汇顶科技股份有限公司 芯片封装结构及方法、电子设备
CN109509736A (zh) * 2017-09-14 2019-03-22 晨星半导体股份有限公司 电路板及芯片封装体
US10157834B1 (en) * 2017-09-18 2018-12-18 Taiwan Semiconductor Manufacturing Co., Ltd. Electronic apparatus
JP6635605B2 (ja) * 2017-10-11 2020-01-29 国立研究開発法人理化学研究所 電流導入端子並びにそれを備えた圧力保持装置及びｘ線撮像装置
US11764161B2 (en) * 2019-12-06 2023-09-19 Micron Technology, Inc. Ground connection for semiconductor device assembly
CN114256163A (zh) * 2020-09-23 2022-03-29 日月光半导体制造股份有限公司 半导体封装结构及其形成方法
CN114334912B (zh) * 2020-09-29 2025-08-19 欣兴电子股份有限公司 封装结构及其制造方法
JP2023130249A (ja) * 2022-03-07 2023-09-20 キオクシア株式会社 半導体装置及び半導体装置の製造方法
TWI841992B (zh) * 2022-06-24 2024-05-11 瑞昱半導體股份有限公司 半導體封裝電磁屏蔽結構及其製造方法
TWI826091B (zh) * 2022-11-01 2023-12-11 矽品精密工業股份有限公司 電子封裝件及其製法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000200859A (ja) * 1998-12-31 2000-07-18 Anam Semiconductor Inc チップサイズ半導体パッケ―ジ及びその集合体並びにその製造方法
JP2003174122A (ja) * 2001-12-04 2003-06-20 Toshiba Corp 半導体装置
JP2003249607A (ja) * 2002-02-26 2003-09-05 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03120740A (ja) 1989-10-04 1991-05-22 Hitachi Ltd 半導体チップのためのパッケージ、パッケージの着脱方法および検査方法、並びに、治具
US6541872B1 (en) * 1999-01-11 2003-04-01 Micron Technology, Inc. Multi-layered adhesive for attaching a semiconductor die to a substrate
JP2001007252A (ja) 1999-06-25 2001-01-12 Matsushita Electronics Industry Corp 半導体装置およびその製造方法
JP2001244688A (ja) 2000-02-28 2001-09-07 Kyocera Corp 高周波モジュール部品及びその製造方法
JP2004111656A (ja) * 2002-09-18 2004-04-08 Nec Electronics Corp 半導体装置及び半導体装置の製造方法
US7187060B2 (en) * 2003-03-13 2007-03-06 Sanyo Electric Co., Ltd. Semiconductor device with shield
US7030469B2 (en) * 2003-09-25 2006-04-18 Freescale Semiconductor, Inc. Method of forming a semiconductor package and structure thereof
JP4761524B2 (ja) * 2004-09-28 2011-08-31 キヤノン株式会社 プリント配線板及びプリント回路板
JP4489575B2 (ja) * 2004-12-17 2010-06-23 新光電気工業株式会社 半導体装置及びその製造方法
US7671468B2 (en) * 2005-09-30 2010-03-02 Tdk Corporation Light emitting apparatus
US7928538B2 (en) * 2006-10-04 2011-04-19 Texas Instruments Incorporated Package-level electromagnetic interference shielding

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000200859A (ja) * 1998-12-31 2000-07-18 Anam Semiconductor Inc チップサイズ半導体パッケ―ジ及びその集合体並びにその製造方法
JP2003174122A (ja) * 2001-12-04 2003-06-20 Toshiba Corp 半導体装置
JP2003249607A (ja) * 2002-02-26 2003-09-05 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器

Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010010441A (ja) * 2008-06-27 2010-01-14 Murata Mfg Co Ltd 回路モジュールの製造方法および回路モジュール
JP2011003749A (ja) * 2009-06-19 2011-01-06 Shinko Electric Ind Co Ltd 電子装置および電子装置の製造方法
JP2011035058A (ja) * 2009-07-30 2011-02-17 Sharp Corp 高周波モジュールおよび高周波モジュールが実装されたプリント配線基板
JP7120295B2 (ja) 2015-05-11 2022-08-17 株式会社村田製作所 高周波モジュール
CN107535081A (zh) * 2015-05-11 2018-01-02 株式会社村田制作所 高频模块
JPWO2016181954A1 (ja) * 2015-05-11 2018-02-15 株式会社村田製作所 高周波モジュール
JP2021061412A (ja) * 2015-05-11 2021-04-15 株式会社村田製作所 高周波モジュール
US10772244B2 (en) 2015-05-11 2020-09-08 Murata Manufacturing Co., Ltd. High-frequency module
JPWO2017200103A1 (ja) * 2016-05-20 2019-04-18 日立化成株式会社 離型フィルム
WO2017200103A1 (ja) * 2016-05-20 2017-11-23 日立化成株式会社 離型フィルム
WO2018164158A1 (ja) * 2017-03-08 2018-09-13 株式会社村田製作所 高周波モジュール
WO2018164159A1 (ja) * 2017-03-08 2018-09-13 株式会社村田製作所 モジュール
CN110392923A (zh) * 2017-03-08 2019-10-29 株式会社村田制作所 高频模块
US10999956B2 (en) 2017-03-08 2021-05-04 Murata Manufacturing Co., Ltd. Module
JPWO2018164158A1 (ja) * 2017-03-08 2019-12-19 株式会社村田製作所 高周波モジュール
US11183465B2 (en) 2017-03-08 2021-11-23 Murata Manufacturing Co., Ltd. Radio-frequency module
WO2019230705A1 (ja) * 2018-06-01 2019-12-05 株式会社村田製作所 高周波モジュール
JP7010372B2 (ja) 2018-06-01 2022-01-26 株式会社村田製作所 高周波モジュール
JPWO2019230705A1 (ja) * 2018-06-01 2021-04-08 株式会社村田製作所 高周波モジュール
US11348894B2 (en) 2018-06-01 2022-05-31 Murata Manufacturing Co., Ltd. High-frequency module
US10896880B2 (en) 2018-11-28 2021-01-19 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and fabrication method thereof
US10923435B2 (en) 2018-11-28 2021-02-16 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and improved heat-dissipation performance
US11211340B2 (en) 2018-11-28 2021-12-28 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding
US11239179B2 (en) 2018-11-28 2022-02-01 Shiann-Tsong Tsai Semiconductor package and fabrication method thereof
WO2020110578A1 (ja) * 2018-11-30 2020-06-04 株式会社村田製作所 モジュール
US11749589B2 (en) 2018-11-30 2023-09-05 Murata Manufacturing Co., Ltd. Module
JP2020109844A (ja) * 2019-01-01 2020-07-16 蔡 憲 聰 パッケージ内コンパートメントシールドを備える半導体パッケージ及びその製造方法
JP2021002610A (ja) * 2019-06-24 2021-01-07 富士電機株式会社 半導体モジュール、車両、および半導体モジュールの製造方法
JP7367352B2 (ja) 2019-06-24 2023-10-24 富士電機株式会社 半導体モジュール、車両、および半導体モジュールの製造方法
JP2023088277A (ja) * 2021-12-14 2023-06-26 ▲き▼邦科技股▲分▼有限公司 半導体パッケージとその製造方法
JP7569365B2 (ja) 2021-12-14 2024-10-17 ▲き▼邦科技股▲分▼有限公司 半導体パッケージとその製造方法
US12538805B2 (en) 2021-12-14 2026-01-27 Chipbond Technology Corporation Semiconductor package and method of manufacturing the same
WO2025037538A1 (ja) * 2023-08-15 2025-02-20 Fdk株式会社 電子部品及び電子部品の製造方法

Also Published As

Publication number Publication date
JP5120266B2 (ja) 2013-01-16
KR20090087076A (ko) 2009-08-14
US20090236700A1 (en) 2009-09-24
US8497156B2 (en) 2013-07-30
CN101617400A (zh) 2009-12-30
KR101057368B1 (ko) 2011-08-18
US20110294261A1 (en) 2011-12-01
JPWO2008093414A1 (ja) 2010-05-20
US8018033B2 (en) 2011-09-13
JP5120266B6 (ja) 2018-06-27

Similar Documents

Publication Publication Date Title
WO2008093414A1 (ja) 半導体装置及びその製造方法
WO2008146243A3 (en) An electronic device comprising a convertible structure, and a method of manufacturing an electronic device
TW200739972A (en) Light-emitting device and method for manufacturing the same
WO2008105496A1 (ja) キャパシタ搭載インターポーザ及びその製造方法
TW200644297A (en) Semiconductor apparatus and manufacturing method thereof
WO2009069476A1 (ja) 電子デバイス、表示装置および電子デバイスの製造方法
EP2191506A4 (en) IMPRESENTATION FOR AN ELECTRONIC ASSEMBLY
WO2007050287A3 (en) Semiconductor structure and method of assembly
WO2007130790A3 (en) Process condition measuring device with shielding
WO2009002381A3 (en) Mold compound circuit structure for enhanced electrical and thermal performance
WO2008057671A3 (en) Electronic device including a conductive structure extending through a buried insulating layer
WO2008112101A3 (en) Packaging methods for imager devices
TW200745568A (en) Probe structures with electronic components
WO2008146793A1 (ja) 電気装置、接続方法及び接着フィルム
WO2009050891A1 (ja) 実装構造体
WO2009004875A1 (ja) 電装品ユニット
WO2009037523A3 (en) An antenna arrangement, a method for manufacturing an antenna arrangement and a printed wiring board for use in an antenna arrangement
WO2009069551A1 (ja) 光電変換素子用電極基板
WO2009054098A1 (ja) 部品内蔵配線基板および部品内蔵配線基板の製造方法
TW200802743A (en) High frequency device module and method for manufacturing the same
WO2009048154A1 (ja) 半導体装置及びその設計方法
WO2009028807A3 (en) Light emitting device package and method for fabricating the same
WO2009005041A1 (ja) 耐フレッティング性コネクタおよびその製造方法
WO2007005617A3 (en) Electrically conducting polymer glue, devices made therewith and methods of manufacture
TW200741970A (en) Method for manufacturing semiconductor device and semiconductor device

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200780049019.3

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07707787

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2008555983

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 1020097012746

Country of ref document: KR

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 07707787

Country of ref document: EP

Kind code of ref document: A1