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WO2009044863A1 - モジュール、配線板、及びモジュールの製造方法 - Google Patents

モジュール、配線板、及びモジュールの製造方法 Download PDF

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Publication number
WO2009044863A1
WO2009044863A1 PCT/JP2008/068062 JP2008068062W WO2009044863A1 WO 2009044863 A1 WO2009044863 A1 WO 2009044863A1 JP 2008068062 W JP2008068062 W JP 2008068062W WO 2009044863 A1 WO2009044863 A1 WO 2009044863A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
wiring board
functional element
manufacturing
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/068062
Other languages
English (en)
French (fr)
Inventor
Shoji Ito
Yusuke Nakatani
Ryo Takami
Tadanori Ohminato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP2009508033A priority Critical patent/JPWO2009044863A1/ja
Priority to KR1020107003273A priority patent/KR101194713B1/ko
Priority to CN2008801024985A priority patent/CN101828254B/zh
Priority to US12/681,283 priority patent/US20100212939A1/en
Publication of WO2009044863A1 publication Critical patent/WO2009044863A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H10P72/0441—
    • H10W74/012—
    • H10W74/15—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H10W70/681—
    • H10W72/07125—
    • H10W72/072—
    • H10W72/07232—
    • H10W72/07233—
    • H10W72/07236—
    • H10W72/073—
    • H10W72/07354—
    • H10W72/251—
    • H10W72/252—
    • H10W72/347—
    • H10W90/724—
    • H10W90/734—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

　本発明のモジュールは、絶縁層上に導体パターンが形成された配線板と、前記導体パターン上に電極を介してフェイスダウンで実装された機能素子とを備え、前記配線板の機能素子実装位置の、機能素子の投影面よりも小さく、かつ、前記電極が接合される部位よりも内側の領域に、開口部が形成されており、前記機能素子及び前記配線板間の隙間と、前記開口部とが封止樹脂によって封止されている。
PCT/JP2008/068062 2007-10-03 2008-10-03 モジュール、配線板、及びモジュールの製造方法 Ceased WO2009044863A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009508033A JPWO2009044863A1 (ja) 2007-10-03 2008-10-03 モジュール、配線板、及びモジュールの製造方法
KR1020107003273A KR101194713B1 (ko) 2007-10-03 2008-10-03 모듈, 배선판 및 모듈의 제조 방법
CN2008801024985A CN101828254B (zh) 2007-10-03 2008-10-03 模块、配线板及模块的制造方法
US12/681,283 US20100212939A1 (en) 2007-10-03 2008-10-03 Module, circuit board, and module manufacturing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-259467 2007-10-03
JP2007259467 2007-10-03

Publications (1)

Publication Number Publication Date
WO2009044863A1 true WO2009044863A1 (ja) 2009-04-09

Family

ID=40526285

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068062 Ceased WO2009044863A1 (ja) 2007-10-03 2008-10-03 モジュール、配線板、及びモジュールの製造方法

Country Status (6)

Country Link
US (1) US20100212939A1 (ja)
JP (2) JPWO2009044863A1 (ja)
KR (1) KR101194713B1 (ja)
CN (1) CN101828254B (ja)
TW (1) TW200930190A (ja)
WO (1) WO2009044863A1 (ja)

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EP2774461B1 (de) * 2011-11-03 2018-09-12 CeramTec GmbH Leiterplatte aus ain mit kupferstrukturen
CN103391691B (zh) * 2012-05-10 2016-08-10 深南电路有限公司 电路板及其制造方法
JP2016157707A (ja) * 2013-07-09 2016-09-01 株式会社ダイセル 銀ナノ粒子を用いた半導体装置及びその製造方法
ES2670033T3 (es) * 2015-06-25 2018-05-29 The Gillette Company Llc Elemento de calentamiento para una máquina de afeitar
EP3109015B1 (en) * 2015-06-25 2018-03-07 The Gillette Company LLC Method of assembling a personal care product
US10652956B2 (en) 2016-06-22 2020-05-12 The Gillette Company Llc Personal consumer product with thermal control circuitry and methods thereof
KR102555408B1 (ko) * 2016-06-30 2023-07-13 엘지디스플레이 주식회사 비표시 영역으로 연장하는 신호 배선들을 포함하는 디스플레이 장치
EP3351358B1 (en) 2017-01-20 2019-11-20 The Gillette Company LLC Heating delivery element for a shaving razor
TWI653919B (zh) 2017-08-10 2019-03-11 晶巧股份有限公司 高散熱等線距堆疊晶片封裝結構和方法
US11691307B2 (en) 2018-03-30 2023-07-04 The Gillette Company Llc Razor handle with a pivoting portion
US11607820B2 (en) 2018-03-30 2023-03-21 The Gillette Company Llc Razor handle with movable members
US11123888B2 (en) 2018-03-30 2021-09-21 The Gillette Company Llc Razor handle with a pivoting portion
JP2021516102A (ja) 2018-03-30 2021-07-01 ザ ジレット カンパニー リミテッド ライアビリティ カンパニーＴｈｅ Ｇｉｌｌｅｔｔｅ Ｃｏｍｐａｎｙ Ｌｌｃ 枢動部分を有するかみそりハンドル
CA3091285A1 (en) 2018-03-30 2019-10-03 The Gillette Company Llc Shaving razor cartridge
CA3091276A1 (en) 2018-03-30 2019-10-03 The Gillette Company Llc Razor handle with a pivoting portion
WO2019191160A1 (en) 2018-03-30 2019-10-03 The Gillette Company Llc Razor handle with a pivoting portion
USD874061S1 (en) 2018-03-30 2020-01-28 The Gillette Company Llc Shaving razor cartridge
EP3774230A1 (en) 2018-03-30 2021-02-17 The Gillette Company LLC Razor handle with a pivoting portion
CN111819047B (zh) 2018-03-30 2022-11-08 吉列有限责任公司 具有可移动构件的剃刀柄部
US11577417B2 (en) 2018-03-30 2023-02-14 The Gillette Company Llc Razor handle with a pivoting portion
JP2021517045A (ja) 2018-03-30 2021-07-15 ザ ジレット カンパニー リミテッド ライアビリティ カンパニーＴｈｅ Ｇｉｌｌｅｔｔｅ Ｃｏｍｐａｎｙ Ｌｌｃ 可動部材を有するかみそりハンドル
JP2021515672A (ja) 2018-03-30 2021-06-24 ザ ジレット カンパニー リミテッド ライアビリティ カンパニーＴｈｅ Ｇｉｌｌｅｔｔｅ Ｃｏｍｐａｎｙ Ｌｌｃ 剃毛用かみそりシステム
JP2021516136A (ja) 2018-03-30 2021-07-01 ザ ジレット カンパニー リミテッド ライアビリティ カンパニーＴｈｅ Ｇｉｌｌｅｔｔｅ Ｃｏｍｐａｎｙ Ｌｌｃ 可動部材を有するかみそりハンドル
CN119785837A (zh) * 2021-08-26 2025-04-08 株式会社东芝 盘装置

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JP2001501381A (ja) * 1997-07-08 2001-01-30 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 電子素子と支持基板との間の接着結合を形成するための方法
JP2004273541A (ja) * 2003-03-05 2004-09-30 Seiko Epson Corp 樹脂塗布装置、アンダーフィル材の充填方法、半導体チップの実装方法、半導体実装基板および電子機器
JP2004363289A (ja) * 2003-06-04 2004-12-24 Renesas Technology Corp 半導体装置の製造方法
JP2006019452A (ja) * 2004-06-30 2006-01-19 Olympus Corp 電子部品固定構造および電子部品製造方法

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Patent Citations (4)

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JP2001501381A (ja) * 1997-07-08 2001-01-30 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 電子素子と支持基板との間の接着結合を形成するための方法
JP2004273541A (ja) * 2003-03-05 2004-09-30 Seiko Epson Corp 樹脂塗布装置、アンダーフィル材の充填方法、半導体チップの実装方法、半導体実装基板および電子機器
JP2004363289A (ja) * 2003-06-04 2004-12-24 Renesas Technology Corp 半導体装置の製造方法
JP2006019452A (ja) * 2004-06-30 2006-01-19 Olympus Corp 電子部品固定構造および電子部品製造方法

Also Published As

Publication number Publication date
TW200930190A (en) 2009-07-01
JPWO2009044863A1 (ja) 2011-02-10
CN101828254B (zh) 2012-06-06
CN101828254A (zh) 2010-09-08
KR20100057606A (ko) 2010-05-31
JP2011244016A (ja) 2011-12-01
US20100212939A1 (en) 2010-08-26
KR101194713B1 (ko) 2012-10-25

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