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WO2008146793A1 - Electric device, connecting method and adhesive film - Google Patents

Electric device, connecting method and adhesive film Download PDF

Info

Publication number
WO2008146793A1
WO2008146793A1 PCT/JP2008/059666 JP2008059666W WO2008146793A1 WO 2008146793 A1 WO2008146793 A1 WO 2008146793A1 JP 2008059666 W JP2008059666 W JP 2008059666W WO 2008146793 A1 WO2008146793 A1 WO 2008146793A1
Authority
WO
WIPO (PCT)
Prior art keywords
curing
curing region
electric device
region
adhesive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/059666
Other languages
French (fr)
Japanese (ja)
Inventor
Misao Konishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemical and Information Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical and Information Device Corp filed Critical Sony Chemical and Information Device Corp
Priority to CN2008800173145A priority Critical patent/CN101681855B/en
Priority to KR1020097000461A priority patent/KR101203017B1/en
Priority to HK10105445.8A priority patent/HK1139506B/en
Publication of WO2008146793A1 publication Critical patent/WO2008146793A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H10W72/20—
    • H10W72/30—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H10W72/01304—
    • H10W72/073—
    • H10W72/07331—
    • H10W72/07355—
    • H10W72/074—
    • H10W72/227—
    • H10W72/248—
    • H10W72/252—
    • H10W72/29—
    • H10W72/324—
    • H10W72/325—
    • H10W72/351—
    • H10W72/352—
    • H10W72/354—
    • H10W72/355—
    • H10W72/926—
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

In an electric device (1), a wiring board (20) and an electric component (25), which has a connecting terminal (27) arranged at least on one surface, are fixed by a curing adhesive layer (12a). The curing adhesive layer (12a) is provided with a first curing region (15a), and a second curing region (18a) having a glass transition temperature lower than that of the first curing region (15a). The first curing region (15a) and the second curing region (18a) are arranged at different positions on the wiring board (20). Especially, in the case of connecting a thin and long electric component (25), the both end portions of the component are connected by the first curing region (12a), and a portion between the both end portions is connected by the second curing region.
PCT/JP2008/059666 2007-05-24 2008-05-26 Electric device, connecting method and adhesive film Ceased WO2008146793A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008800173145A CN101681855B (en) 2007-05-24 2008-05-26 Electric device, connection method and adhesive film
KR1020097000461A KR101203017B1 (en) 2007-05-24 2008-05-26 Electric device, connecting method and adhesive film
HK10105445.8A HK1139506B (en) 2007-05-24 2008-05-26 Electric device, connecting method and adhesive film

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-137921 2007-05-24
JP2007137921 2007-05-24

Publications (1)

Publication Number Publication Date
WO2008146793A1 true WO2008146793A1 (en) 2008-12-04

Family

ID=40032036

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2008/059666 Ceased WO2008146793A1 (en) 2007-05-24 2008-05-26 Electric device, connecting method and adhesive film
PCT/JP2008/059667 Ceased WO2008143358A1 (en) 2007-05-24 2008-05-26 Electric device, connecting method and adhesive film

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059667 Ceased WO2008143358A1 (en) 2007-05-24 2008-05-26 Electric device, connecting method and adhesive film

Country Status (5)

Country Link
JP (2) JP5013114B2 (en)
KR (1) KR101203017B1 (en)
CN (1) CN101681855B (en)
TW (2) TWI387412B (en)
WO (2) WO2008146793A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015133221A1 (en) * 2014-03-07 2015-09-11 デクセリアルズ株式会社 Anisotropic conductive film and method for producing same

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5608504B2 (en) * 2010-10-06 2014-10-15 デクセリアルズ株式会社 Connection method and connection structure
KR101712043B1 (en) 2010-10-14 2017-03-03 삼성전자주식회사 Stacked semiconductor package, Semiconductor device including the stacked semiconductor package and Method of manufacturing the stacked semiconductor package
KR20140060517A (en) * 2011-09-12 2014-05-20 메이코 일렉트로닉스 컴파니 리미티드 Method for manufacturing substrate with built-in component and substrate with built-in component using same
JP5926590B2 (en) * 2012-03-23 2016-05-25 デクセリアルズ株式会社 Manufacturing method of connecting body and connecting method of electronic component
US9740067B2 (en) * 2012-09-03 2017-08-22 Sharp Kabushiki Kaisha Display device and method for producing same
JP6307308B2 (en) * 2014-03-06 2018-04-04 デクセリアルズ株式会社 Manufacturing method of connection structure and circuit connection material
JP2016001574A (en) * 2014-06-12 2016-01-07 株式会社デンソー Laminate armored battery
JP6759578B2 (en) * 2014-12-22 2020-09-23 デクセリアルズ株式会社 Heteroconductive film and connecting structures
KR102522541B1 (en) * 2016-10-03 2023-04-17 가부시끼가이샤 레조낙 Method for manufacturing a conductive film, a wound body, a bonded structure, and a bonded structure
US10957462B2 (en) 2016-12-01 2021-03-23 Dexerials Corporation Anisotropic conductive film
TWI763750B (en) * 2016-12-01 2022-05-11 日商迪睿合股份有限公司 Anisotropic conductive film
KR102066934B1 (en) * 2018-07-11 2020-01-16 주식회사 비에이치 Bonding Method Using Polyethylenenaphthalate Flexible Printed Circuit Board and Large Polyethylenenaphthalate Flexible Printed Circuit Board Assembly Manufactured from the Same
TWI724911B (en) * 2020-05-26 2021-04-11 友達光電股份有限公司 Light-emitting device and manufacturing metho thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06260533A (en) * 1993-03-08 1994-09-16 Sony Chem Corp Mounting of ic chip
JPH09330950A (en) * 1996-06-13 1997-12-22 Nec Corp Semiconductor device and its manufacture
JPH11354582A (en) * 1998-04-07 1999-12-24 Shinko Electric Ind Co Ltd Semiconductor chip mounting structure
JP2004071857A (en) * 2002-08-07 2004-03-04 Sharp Corp Structure of substrate connection part, electronic component and liquid crystal display device having the structure

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3225800B2 (en) * 1995-08-09 2001-11-05 三菱電機株式会社 Semiconductor device
JP3506003B2 (en) * 1998-05-19 2004-03-15 ソニーケミカル株式会社 Anisotropic conductive adhesive
MY124944A (en) * 2000-02-09 2006-07-31 Hitachi Chemical Co Ltd Resin composition, adhesives prepared therewith for bonding circuit members,and circuits boards
JP2003086633A (en) * 2001-09-13 2003-03-20 Canon Inc Wiring board and display device having the same
JP5076292B2 (en) * 2005-08-08 2012-11-21 パナソニック株式会社 Anisotropic conductive film pasting apparatus and method
KR100780956B1 (en) 2006-08-17 2007-12-03 삼성전자주식회사 Heterogeneous underfill semiconductor package and manufacturing method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06260533A (en) * 1993-03-08 1994-09-16 Sony Chem Corp Mounting of ic chip
JPH09330950A (en) * 1996-06-13 1997-12-22 Nec Corp Semiconductor device and its manufacture
JPH11354582A (en) * 1998-04-07 1999-12-24 Shinko Electric Ind Co Ltd Semiconductor chip mounting structure
JP2004071857A (en) * 2002-08-07 2004-03-04 Sharp Corp Structure of substrate connection part, electronic component and liquid crystal display device having the structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015133221A1 (en) * 2014-03-07 2015-09-11 デクセリアルズ株式会社 Anisotropic conductive film and method for producing same
JP2015170529A (en) * 2014-03-07 2015-09-28 デクセリアルズ株式会社 Anisotropic conductive film and manufacturing method thereof

Also Published As

Publication number Publication date
CN101681855A (en) 2010-03-24
TWI422294B (en) 2014-01-01
JP5013114B2 (en) 2012-08-29
TW200850094A (en) 2008-12-16
CN101681855B (en) 2013-03-13
HK1139506A1 (en) 2010-09-17
JP2009004768A (en) 2009-01-08
WO2008143358A1 (en) 2008-11-27
JP5152499B2 (en) 2013-02-27
KR20090085017A (en) 2009-08-06
KR101203017B1 (en) 2012-11-20
TWI387412B (en) 2013-02-21
TW200847866A (en) 2008-12-01
JP2009004767A (en) 2009-01-08

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