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WO2009038950A3 - Flexible circuit board, manufacturing method thereof, and electronic device using the same - Google Patents

Flexible circuit board, manufacturing method thereof, and electronic device using the same Download PDF

Info

Publication number
WO2009038950A3
WO2009038950A3 PCT/US2008/074798 US2008074798W WO2009038950A3 WO 2009038950 A3 WO2009038950 A3 WO 2009038950A3 US 2008074798 W US2008074798 W US 2008074798W WO 2009038950 A3 WO2009038950 A3 WO 2009038950A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
flexible circuit
manufacturing
electronic device
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2008/074798
Other languages
French (fr)
Other versions
WO2009038950A2 (en
Inventor
Yoshiyuki Ohkura
Tatsunori Koyanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of WO2009038950A2 publication Critical patent/WO2009038950A2/en
Publication of WO2009038950A3 publication Critical patent/WO2009038950A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

An aspect of the invention provides a flexible circuit board, comprising: a substrate having two portions separated by a bendable portion, said substrate having a plurality of thin sections on one surface of said bendable portion, and said thin sections extending in a direction that intersects with the direction of bending, and having a supporting section between said plurality of mutually adjacent thin sections, and the width of said thin section in the bending direction is larger than the width of said supporting section in said bending direction; a circuit comprising a conductive material formed and adhered onto a said substrate; and a cover layer on said first surface covering at least a portion of the surface of said circuit.
PCT/US2008/074798 2007-09-20 2008-08-29 Flexible circuit board, manufacturing method thereof, and electronic device using the same Ceased WO2009038950A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007244012A JP2009076663A (en) 2007-09-20 2007-09-20 Flexible circuit board, method for manufacturing same, and electronic apparatus using same
JP2007-244012 2007-09-20

Publications (2)

Publication Number Publication Date
WO2009038950A2 WO2009038950A2 (en) 2009-03-26
WO2009038950A3 true WO2009038950A3 (en) 2009-06-04

Family

ID=40468719

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/074798 Ceased WO2009038950A2 (en) 2007-09-20 2008-08-29 Flexible circuit board, manufacturing method thereof, and electronic device using the same

Country Status (2)

Country Link
JP (1) JP2009076663A (en)
WO (1) WO2009038950A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6067782B2 (en) * 2010-06-28 2017-01-25 住友化学株式会社 LAMINATED SUBSTRATE MANUFACTURING METHOD, LAMINATED SUBSTRATE AND PRINTED WIRING BOARD
DE102010027149A1 (en) * 2010-07-14 2012-01-19 Fela Hilzinger Gmbh Bendable metal core board
KR102049985B1 (en) * 2012-12-19 2019-11-28 엘지디스플레이 주식회사 Back light unit and display device comprising the same
CN103152977B (en) * 2013-03-27 2016-03-02 深圳索瑞德电子有限公司 Integrated circuit board and preparation method thereof
JP6259813B2 (en) * 2013-07-11 2018-01-10 株式会社村田製作所 Resin multilayer substrate and method for producing resin multilayer substrate
KR102136392B1 (en) * 2013-09-05 2020-07-22 삼성디스플레이 주식회사 Manufacturing mehod of flexible display device and touch screen panel
JP2020140220A (en) * 2017-06-22 2020-09-03 パナソニックＩｐマネジメント株式会社 Touch sensor
KR102535784B1 (en) 2018-02-02 2023-05-24 삼성디스플레이 주식회사 Display apparatus and fabrication method thereof
JP2019179178A (en) 2018-03-30 2019-10-17 株式会社ジャパンディスプレイ Display and method for manufacturing display
JP7094837B2 (en) * 2018-08-29 2022-07-04 株式会社ジャパンディスプレイ Display device, flexible wiring board, and manufacturing method of display device
JP2020088331A (en) 2018-11-30 2020-06-04 株式会社ジャパンディスプレイ Flexible board
CN113766769B (en) * 2021-11-09 2022-02-01 四川英创力电子科技股份有限公司 Manufacturing method of multilayer trapezoidal blind slot printed board
KR20230130203A (en) * 2022-03-02 2023-09-12 삼성디스플레이 주식회사 Display device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03157984A (en) * 1989-11-15 1991-07-05 Matsushita Electric Ind Co Ltd Metal board for mounting parts
JPH03157985A (en) * 1989-11-15 1991-07-05 Matsushita Electric Ind Co Ltd Metal board for mounting parts
JPH0575218A (en) * 1991-06-19 1993-03-26 Hitachi Ltd Molded substrate
JP2003243779A (en) * 2002-02-18 2003-08-29 Matsushita Electric Ind Co Ltd Flexible wiring board
US6927344B1 (en) * 2004-02-27 2005-08-09 Motorola, Inc. Flexible circuit board assembly

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03157984A (en) * 1989-11-15 1991-07-05 Matsushita Electric Ind Co Ltd Metal board for mounting parts
JPH03157985A (en) * 1989-11-15 1991-07-05 Matsushita Electric Ind Co Ltd Metal board for mounting parts
JPH0575218A (en) * 1991-06-19 1993-03-26 Hitachi Ltd Molded substrate
JP2003243779A (en) * 2002-02-18 2003-08-29 Matsushita Electric Ind Co Ltd Flexible wiring board
US6927344B1 (en) * 2004-02-27 2005-08-09 Motorola, Inc. Flexible circuit board assembly

Also Published As

Publication number Publication date
JP2009076663A (en) 2009-04-09
WO2009038950A2 (en) 2009-03-26

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