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WO2008136419A1 - 半導体装置及び製造方法並びにリペア方法 - Google Patents

半導体装置及び製造方法並びにリペア方法 Download PDF

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Publication number
WO2008136419A1
WO2008136419A1 PCT/JP2008/058091 JP2008058091W WO2008136419A1 WO 2008136419 A1 WO2008136419 A1 WO 2008136419A1 JP 2008058091 W JP2008058091 W JP 2008058091W WO 2008136419 A1 WO2008136419 A1 WO 2008136419A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor device
conductive resin
resin bump
bump
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/058091
Other languages
English (en)
French (fr)
Inventor
Akira Ouchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to US12/597,716 priority Critical patent/US20100052163A1/en
Priority to JP2009512984A priority patent/JPWO2008136419A1/ja
Publication of WO2008136419A1 publication Critical patent/WO2008136419A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H10W70/093—
    • H10W70/65—
    • H10W70/652—
    • H10W70/666—
    • H10W72/00—
    • H10W72/071—
    • H10W74/012—
    • H10W74/15—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
    • H10W70/685—
    • H10W72/072—
    • H10W72/073—
    • H10W72/07331—
    • H10W72/225—
    • H10W72/234—
    • H10W72/241—
    • H10W72/252—
    • H10W72/253—
    • H10W72/29—
    • H10W72/352—
    • H10W72/354—
    • H10W72/856—
    • H10W72/884—
    • H10W72/923—
    • H10W72/952—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

　対向する半導体部品（１）のパッド（５）と配線基板（２）のパッド（６）とがバンプを介して導通するように構成された半導体装置であって、半導体部品（１）のパッド（５）上に設けられた第１の導電性樹脂バンプ（３）と、配線基板（２）のパッド（６）上に設けられた第２の導電性樹脂バンプ（４）と、を備える。第２の導電性樹脂バンプ（４）は、第１の導電性樹脂バンプ（３）よりガラス転移温度が４０℃以上低く、半導体部品（１）の搭載時の加熱荷重により、半導体部品（１）側の第１の導電性樹脂バンプ（３）の表面形状に沿うように変形している。また同様の考え方で、第１の導電性樹脂バンプ（３）のガラス転移温度を第２の導電性樹脂バンプ（４）より低くして変形させることも可能である。
PCT/JP2008/058091 2007-04-27 2008-04-25 半導体装置及び製造方法並びにリペア方法 Ceased WO2008136419A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/597,716 US20100052163A1 (en) 2007-04-27 2008-04-25 Semiconductor device, method of manufacturing same and method of repairing same
JP2009512984A JPWO2008136419A1 (ja) 2007-04-27 2008-04-25 半導体装置及び製造方法並びにリペア方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007118913 2007-04-27
JP2007-118913 2007-04-27

Publications (1)

Publication Number Publication Date
WO2008136419A1 true WO2008136419A1 (ja) 2008-11-13

Family

ID=39943526

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058091 Ceased WO2008136419A1 (ja) 2007-04-27 2008-04-25 半導体装置及び製造方法並びにリペア方法

Country Status (3)

Country Link
US (1) US20100052163A1 (ja)
JP (1) JPWO2008136419A1 (ja)
WO (1) WO2008136419A1 (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101155709B1 (ko) * 2006-12-27 2012-06-12 파나소닉 주식회사 도전성 범프와 그 형성 방법 및 반도체 장치와 그 제조 방법
JP5572979B2 (ja) * 2009-03-30 2014-08-20 ソニー株式会社 半導体装置の製造方法
JP5532744B2 (ja) * 2009-08-20 2014-06-25 富士通株式会社 マルチチップモジュール及びマルチチップモジュールの製造方法
EP2563464B1 (en) * 2010-04-30 2018-06-06 Second Sight Medical Products, Inc. Improved biocompatible bonding method
CN104412724A (zh) * 2012-07-04 2015-03-11 松下知识产权经营株式会社 电子部件安装构造体、ic卡、cof封装
JP2016525792A (ja) * 2013-07-09 2016-08-25 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 印刷電子装置作製技術に基づいて印刷回路基板アセンブリを製造する方法及び印刷回路基板アセンブリ
DE102013107693B4 (de) * 2013-07-18 2021-05-06 Pictiva Displays International Limited Verfahren zum Ausbilden einer Leiterbahnstruktur auf einer Elektrodenfläche eines elektronischen Bauelementes
US20170110392A1 (en) * 2015-10-15 2017-04-20 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and method for manufacturing the same structure
CN109844935B (zh) * 2016-10-28 2023-01-06 株式会社村田制作所 电子部件装置
WO2019239909A1 (ja) * 2018-06-13 2019-12-19 国立研究開発法人産業技術総合研究所 電子回路の接続方法及び電子回路
EP3841850A4 (en) 2018-08-22 2022-10-26 Liquid Wire Inc. STRUCTURES WITH DEFORMABLE LADDERS
EP4191644A4 (en) * 2020-07-27 2024-02-07 Sony Semiconductor Solutions Corporation ELECTRONIC DEVICE
JP7811596B2 (ja) * 2021-12-22 2026-02-05 株式会社Fuji 電気回路形成方法、および電気回路形成装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283555A (ja) * 1996-04-16 1997-10-31 Toshiba Corp 半導体チップの実装構造および半導体パッケージの製造方法および半導体パッケージ
JP2001217281A (ja) * 2000-01-31 2001-08-10 Matsushita Electric Ind Co Ltd 半導体装置とその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4609617B2 (ja) * 2000-08-01 2011-01-12 日本電気株式会社 半導体装置の実装方法及び実装構造体
TW490823B (en) * 2001-01-20 2002-06-11 Advanced Semiconductor Eng Bump manufacture process of chip scale package
TWI240399B (en) * 2004-04-06 2005-09-21 Advanced Semiconductor Eng Chip package structure and process for fabricating the same
US8378504B2 (en) * 2008-06-30 2013-02-19 Intel Corporation Microelectronic package with self-heating interconnect

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283555A (ja) * 1996-04-16 1997-10-31 Toshiba Corp 半導体チップの実装構造および半導体パッケージの製造方法および半導体パッケージ
JP2001217281A (ja) * 2000-01-31 2001-08-10 Matsushita Electric Ind Co Ltd 半導体装置とその製造方法

Also Published As

Publication number Publication date
JPWO2008136419A1 (ja) 2010-07-29
US20100052163A1 (en) 2010-03-04

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