[go: up one dir, main page]

FI20050767L - Flerskiktig trådningsplatta och förfarande för framställning av denna - Google Patents

Flerskiktig trådningsplatta och förfarande för framställning av denna Download PDF

Info

Publication number
FI20050767L
FI20050767L FI20050767A FI20050767A FI20050767L FI 20050767 L FI20050767 L FI 20050767L FI 20050767 A FI20050767 A FI 20050767A FI 20050767 A FI20050767 A FI 20050767A FI 20050767 L FI20050767 L FI 20050767L
Authority
FI
Finland
Prior art keywords
manufacturing
same
wiring board
multilayer wiring
multilayer
Prior art date
Application number
FI20050767A
Other languages
English (en)
Finnish (fi)
Other versions
FI122414B (sv
Inventor
Shoji Ito
Ryoichi Kishihara
Osamu Nakao
Hiroki Hashiba
Masahiro Okamoto
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003011635A external-priority patent/JP4195619B2/ja
Priority claimed from JP2003294994A external-priority patent/JP2005064357A/ja
Priority claimed from JP2003309254A external-priority patent/JP2005079402A/ja
Priority claimed from JP2003342907A external-priority patent/JP2005109299A/ja
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Publication of FI20050767L publication Critical patent/FI20050767L/sv
Application granted granted Critical
Publication of FI122414B publication Critical patent/FI122414B/sv

Links

Classifications

    • H10W70/611—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H10W90/401—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density
    • H10W72/07251—
    • H10W72/20—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y10T29/4916—Simultaneous circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FI20050767A 2003-01-20 2005-07-19 Flerskiktsmönsterkort och förfarande för framställning av denna FI122414B (sv)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2003011635A JP4195619B2 (ja) 2003-01-20 2003-01-20 多層配線板およびその製造方法
JP2003011635 2003-01-20
JP2003294994 2003-08-19
JP2003294994A JP2005064357A (ja) 2003-08-19 2003-08-19 多層配線板およびその製造方法
JP2003309254A JP2005079402A (ja) 2003-09-01 2003-09-01 回路基板およびその製造方法
JP2003309254 2003-09-01
JP2003342907A JP2005109299A (ja) 2003-10-01 2003-10-01 多層配線板およびその製造方法
JP2003342907 2003-10-01
PCT/JP2003/016377 WO2004066697A1 (ja) 2003-01-20 2003-12-19 多層配線板およびその製造方法
JP0316377 2003-12-19

Publications (2)

Publication Number Publication Date
FI20050767L true FI20050767L (sv) 2005-09-16
FI122414B FI122414B (sv) 2012-01-13

Family

ID=32777145

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20050767A FI122414B (sv) 2003-01-20 2005-07-19 Flerskiktsmönsterkort och förfarande för framställning av denna

Country Status (3)

Country Link
US (2) US20060180344A1 (sv)
FI (1) FI122414B (sv)
WO (1) WO2004066697A1 (sv)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4536430B2 (ja) * 2004-06-10 2010-09-01 イビデン株式会社 フレックスリジッド配線板
US7246434B1 (en) * 2004-10-11 2007-07-24 Pericom Semiconductor Corp. Method of making a surface mountable PCB module
TWI277381B (en) * 2005-04-12 2007-03-21 Au Optronics Corp Double-sided flexible printed circuit board
JP2007059184A (ja) * 2005-08-24 2007-03-08 Citizen Electronics Co Ltd キーシートモジュール
JP2007067244A (ja) * 2005-08-31 2007-03-15 Sony Corp 回路基板
MY148019A (en) * 2005-09-30 2013-02-28 Sumitomo Bakelite Co Manufacturing process for a prepreg with a carrier, prepreg with a carrier, manufacturing process for a thin double-sided plate, thin double-sided plate and manufacturing process for a multilayer-printed circuit board
CN101356641B (zh) * 2006-01-06 2011-05-18 日本电气株式会社 半导体搭载用布线基板、其制造方法及布线基板组件
JP5168838B2 (ja) * 2006-07-28 2013-03-27 大日本印刷株式会社 多層プリント配線板及びその製造方法
TW200906263A (en) * 2007-05-29 2009-02-01 Matsushita Electric Industrial Co Ltd Circuit board and method for manufacturing the same
US8035983B2 (en) * 2007-07-17 2011-10-11 Ibiden Co., Ltd. Wiring board and method of manufacturing wiring board
US8178789B2 (en) * 2007-07-17 2012-05-15 Ibiden Co., Ltd. Wiring board and method of manufacturing wiring board
TWI358981B (en) * 2007-08-08 2012-02-21 Unimicron Technology Corp Method for fabricating circuit board
DE102007044602A1 (de) * 2007-09-19 2009-04-23 Continental Automotive Gmbh Multilayer-Leiterplatte und Verwendung einer Multilayer-Leiterplatte
JP5145896B2 (ja) * 2007-11-21 2013-02-20 富士通株式会社 電子装置および電子装置製造方法
JP5306634B2 (ja) * 2007-11-22 2013-10-02 新光電気工業株式会社 配線基板及び半導体装置及び配線基板の製造方法
WO2009141927A1 (ja) * 2008-05-23 2009-11-26 イビデン株式会社 プリント配線板及びその製造方法
WO2010007704A1 (ja) * 2008-07-16 2010-01-21 イビデン株式会社 フレックスリジッド配線板及び電子デバイス
JP4730426B2 (ja) * 2008-11-19 2011-07-20 ソニー株式会社 実装基板及び半導体モジュール
DE102009006757B3 (de) * 2009-01-30 2010-08-19 Continental Automotive Gmbh Lötstopplack-Beschichtung für starrbiegsame Leiterplatten
JPWO2010113448A1 (ja) * 2009-04-02 2012-10-04 パナソニック株式会社 回路基板の製造方法および回路基板
KR101051491B1 (ko) 2009-10-28 2011-07-22 삼성전기주식회사 다층 경연성 인쇄회로기판 및 다층 경연성 인쇄회로기판의 제조방법
JP2011119616A (ja) * 2009-12-07 2011-06-16 Fujitsu Ltd プリント配線基板の製造方法、プリント配線基板、および電子装置
US8493747B2 (en) * 2010-02-05 2013-07-23 Ibiden Co., Ltd. Flex-rigid wiring board and method for manufacturing the same
US10433414B2 (en) * 2010-12-24 2019-10-01 Rayben Technologies (HK) Limited Manufacturing method of printing circuit board with micro-radiators
JP2012142226A (ja) * 2011-01-05 2012-07-26 Fujitsu Component Ltd 伝送コネクタ用の中継基板
KR101803100B1 (ko) * 2011-01-21 2017-11-30 삼성전자주식회사 전자 기기의 다층 연성회로기판
CN103857209A (zh) * 2012-11-28 2014-06-11 宏启胜精密电子(秦皇岛)有限公司 多层电路板及其制作方法
JP5408754B1 (ja) * 2012-12-10 2014-02-05 株式会社フジクラ 多層配線基板及びその製造方法
JP5900664B2 (ja) * 2013-07-30 2016-04-06 株式会社村田製作所 多層基板および多層基板の製造方法
CN205213161U (zh) * 2013-09-06 2016-05-04 株式会社村田制作所 多层基板
KR20150125424A (ko) * 2014-04-30 2015-11-09 삼성전기주식회사 강연성 인쇄회로기판 및 강연성 인쇄회로기판의 제조 방법
US9633883B2 (en) 2015-03-20 2017-04-25 Rohinni, LLC Apparatus for transfer of semiconductor devices
KR102425753B1 (ko) * 2015-06-01 2022-07-28 삼성전기주식회사 인쇄회로기판, 인쇄회로기판의 제조 방법 및 이를 포함하는 반도체 패키지
WO2017167875A1 (en) 2016-03-30 2017-10-05 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Laminated component carrier with a thermoplastic structure
WO2018034161A1 (ja) * 2016-08-18 2018-02-22 株式会社村田製作所 積層コイルおよびその製造方法
KR102565119B1 (ko) * 2016-08-25 2023-08-08 삼성전기주식회사 전자 소자 내장 기판과 그 제조 방법 및 전자 소자 모듈
US10141215B2 (en) 2016-11-03 2018-11-27 Rohinni, LLC Compliant needle for direct transfer of semiconductor devices
US10471545B2 (en) 2016-11-23 2019-11-12 Rohinni, LLC Top-side laser for direct transfer of semiconductor devices
US10504767B2 (en) 2016-11-23 2019-12-10 Rohinni, LLC Direct transfer apparatus for a pattern array of semiconductor device die
US10062588B2 (en) 2017-01-18 2018-08-28 Rohinni, LLC Flexible support substrate for transfer of semiconductor devices
JP6637479B2 (ja) * 2017-11-16 2020-01-29 矢崎総業株式会社 電子回路基板
CN110278659B (zh) * 2018-03-16 2021-09-28 宏启胜精密电子(秦皇岛)有限公司 复合电路板及其制造方法
US10410905B1 (en) 2018-05-12 2019-09-10 Rohinni, LLC Method and apparatus for direct transfer of multiple semiconductor devices
JP7066528B2 (ja) * 2018-05-31 2022-05-13 日東電工株式会社 配線回路基板、その製造方法および配線回路シート
KR102173615B1 (ko) 2018-07-19 2020-11-03 스템코 주식회사 다층 회로 기판 및 그 제조 방법
US11094571B2 (en) 2018-09-28 2021-08-17 Rohinni, LLC Apparatus to increase transferspeed of semiconductor devices with micro-adjustment
CN110337177A (zh) * 2019-06-21 2019-10-15 广州金鹏源康精密电路股份有限公司 一种具有可承受高推力的焊盘的电路板及其制作方法
CN113365412B (zh) * 2020-03-05 2022-06-24 宏启胜精密电子(秦皇岛)有限公司 复合电路板及其制作方法
CN213662046U (zh) * 2020-09-30 2021-07-09 华为技术有限公司 电路板组件和电子设备
WO2022266811A1 (zh) * 2021-06-21 2022-12-29 鹏鼎控股(深圳)股份有限公司 感压电路板及感压电路板的制作方法
CN113692118B (zh) * 2021-08-30 2023-06-06 大连亚太电子有限公司 一种多层印刷电路板

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2034127B (en) 1978-10-13 1983-05-18 Matsushita Electric Industrial Co Ltd Printed circuits and methods their manufacture
JPS55160452A (en) * 1979-06-01 1980-12-13 Nec Corp Hybrid integrated circuit
US5081563A (en) * 1990-04-27 1992-01-14 International Business Machines Corporation Multi-layer package incorporating a recessed cavity for a semiconductor chip
JPH0435092A (ja) * 1990-05-31 1992-02-05 Toshiba Corp 多層配線基板およびその製造方法
JP2857237B2 (ja) * 1990-08-10 1999-02-17 古河電気工業株式会社 多層回路基板の製造方法
JPH06283836A (ja) 1993-03-29 1994-10-07 Canon Inc プリント基板の接続構造および接続方法
JPH07106728A (ja) * 1993-10-04 1995-04-21 Mitsui Toatsu Chem Inc リジッドフレックスプリント配線板およびその製造方法
JPH07135375A (ja) * 1993-11-10 1995-05-23 Mitsui Toatsu Chem Inc リジッドフレックス配線板およびその製造方法
JP3540396B2 (ja) * 1994-11-11 2004-07-07 株式会社東芝 プリント配線板の製造方法
JP3445678B2 (ja) 1995-02-27 2003-09-08 シャープ株式会社 多層フレキシブルプリント配線板及びその製造方法
JPH1041635A (ja) 1996-07-23 1998-02-13 Ibiden Co Ltd 多層プリント配線板用片面回路基板とその製造方法、および多層プリント配線板
JPH10135595A (ja) * 1996-10-31 1998-05-22 Kyocera Corp 回路基板及びその製造方法
US6281446B1 (en) * 1998-02-16 2001-08-28 Matsushita Electric Industrial Co., Ltd. Multi-layered circuit board and method of manufacturing the same
US6163957A (en) * 1998-11-13 2000-12-26 Fujitsu Limited Multilayer laminated substrates with high density interconnects and methods of making the same
JP2000156564A (ja) * 1998-11-20 2000-06-06 Nec Corp プリント配線板及びその製造方法
JP2000183526A (ja) * 1998-12-11 2000-06-30 Matsushita Electric Ind Co Ltd 多層配線基板およびその製造方法
JP2000208667A (ja) 1999-01-14 2000-07-28 Toshiba Corp 積層基板製造方法、積層基板製造装置及び半導体装置の製造方法
JP2001024292A (ja) * 1999-07-05 2001-01-26 Nippon Mektron Ltd 可撓性回路基板の支持構造
US6583364B1 (en) * 1999-08-26 2003-06-24 Sony Chemicals Corp. Ultrasonic manufacturing apparatuses, multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards
JP4486196B2 (ja) 1999-12-08 2010-06-23 イビデン株式会社 多層プリント配線板用片面回路基板およびその製造方法
JP3744383B2 (ja) 2000-06-09 2006-02-08 松下電器産業株式会社 複合配線基板及びその製造方法
JP3653452B2 (ja) 2000-07-31 2005-05-25 株式会社ノース 配線回路基板とその製造方法と半導体集積回路装置とその製造方法
JP3951091B2 (ja) * 2000-08-04 2007-08-01 セイコーエプソン株式会社 半導体装置の製造方法
JP2002158445A (ja) 2000-11-22 2002-05-31 Cmk Corp リジッドフレックスプリント配線板及びその製造方法
JP2002171063A (ja) 2000-12-01 2002-06-14 Sony Chem Corp 多層フレキシブル配線板
JP2001298274A (ja) 2001-03-13 2001-10-26 Matsushita Electric Ind Co Ltd 電子回路構成体
JP2003092473A (ja) 2001-07-10 2003-03-28 Fujikura Ltd 多層配線板、多層配線用基材及びその製造方法
JP2003229665A (ja) * 2002-01-31 2003-08-15 Sumitomo Bakelite Co Ltd 多層フレキシブル配線板及びその製造方法
JP2003294994A (ja) 2002-04-03 2003-10-15 Hitachi Hybrid Network Co Ltd 双方向通信光モジュール
JP4195619B2 (ja) 2003-01-20 2008-12-10 株式会社フジクラ 多層配線板およびその製造方法

Also Published As

Publication number Publication date
US20060180344A1 (en) 2006-08-17
WO2004066697A1 (ja) 2004-08-05
US7886438B2 (en) 2011-02-15
FI122414B (sv) 2012-01-13
US20090217522A1 (en) 2009-09-03

Similar Documents

Publication Publication Date Title
FI20050767L (sv) Flerskiktig trådningsplatta och förfarande för framställning av denna
FI20115084L (sv) Flerskiktsskiva samt förfarande för tillverkning av detsamma
TWI368933B (en) Capacitor-mounted wiring board and method of manufacturing the same
FI20041680L (sv) Elektronikmodul och förfarande för tillverkning därav
GB2420912B (en) Multilayer wiring board and manufacture method thereof
DE60135963D1 (de) Mehrschichtelektronikbauteil
TWI371997B (en) Printed wiring board and method for manufacturing the same
EP1768473A4 (en) MULTILAYER PCB AND MANUFACTURING METHOD THEREFOR
FI20030493L (sv) Förfarande för tillverkning av en elektronikmodul och en elektronikmodul
FI20030292L (sv) Förfarande för tillverkning av en elektronikmodul och en elektronikmodul
EP1768470A4 (en) RIGID SOFT CONNECTION CARD AND METHOD FOR MANUFACTURING THE SAME
FI20050646L (sv) Kretskortskonstruktion och förfarande för tillverkning av kretskortskonstruktion
EP1945013A4 (en) MULTILAYER PCB AND MANUFACTURING METHOD THEREFOR
FI20050645L (sv) Förfarande för tillverkning av kretskortskonstruktion och kretskortskonstruktion
FI20045495L (sv) Flerskiktsstruktur och förfarande för dess framställning
DE60314074D1 (de) Gasundurchlässige Mehrschichtstruktur
FI20030293L (sv) Förfarande för tillverkning av en elektronikmodul och en elektronikmodul
DE602004024259D1 (de) Mehrschichtiges Piezobauelement
FI20030580A7 (sv) Keramiskt flerskiktssubstrat och förfarande för dess framställning
FI20030893L (sv) Knappsats och metod för att tillverka densamma
FI20030579A7 (sv) Keramiskt flerskiktssubstrat och förfarande för dess framställning
FI20030491L (sv) Multilayer-produkt och förfarande för framställning därav
TWI372009B (en) Multilayer printed wiring board and method of manufacturing the same
DE602004023665D1 (de) Laminiertes elektronisches Bauelement
FI20020280L (sv) Rörsystemelement och förfarande och anordning för framställning därav

Legal Events

Date Code Title Description
FG Patent granted

Ref document number: 122414

Country of ref document: FI

MM Patent lapsed