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FI20030292L - Förfarande för tillverkning av en elektronikmodul och en elektronikmodul - Google Patents

Förfarande för tillverkning av en elektronikmodul och en elektronikmodul Download PDF

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Publication number
FI20030292L
FI20030292L FI20030292A FI20030292A FI20030292L FI 20030292 L FI20030292 L FI 20030292L FI 20030292 A FI20030292 A FI 20030292A FI 20030292 A FI20030292 A FI 20030292A FI 20030292 L FI20030292 L FI 20030292L
Authority
FI
Finland
Prior art keywords
electronic module
manufacturing
module
electronic
Prior art date
Application number
FI20030292A
Other languages
English (en)
Finnish (fi)
Other versions
FI119583B (sv
FI20030292A0 (sv
Inventor
Risto Tuominen
Petteri Palm
Original Assignee
Imbera Electronics Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=8565725&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=FI20030292(L) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Publication of FI20030292A0 publication Critical patent/FI20030292A0/sv
Priority to FI20030292A priority Critical patent/FI119583B/sv
Application filed by Imbera Electronics Oy filed Critical Imbera Electronics Oy
Priority to KR1020057015597A priority patent/KR20050109944A/ko
Priority to JP2006502075A priority patent/JP2006520093A/ja
Priority to PCT/FI2004/000101 priority patent/WO2004077902A1/en
Priority to AT04714345T priority patent/ATE524955T1/de
Priority to US10/546,820 priority patent/US7299546B2/en
Priority to EP04714345A priority patent/EP1597947B1/en
Publication of FI20030292L publication Critical patent/FI20030292L/sv
Priority to US11/907,795 priority patent/US7609527B2/en
Application granted granted Critical
Publication of FI119583B publication Critical patent/FI119583B/sv
Priority to US12/603,324 priority patent/US8817485B2/en
Priority to US14/467,079 priority patent/US10085345B2/en
Priority to US16/104,979 priority patent/US10765006B2/en
Priority to US17/005,527 priority patent/US11071207B2/en
Priority to US17/357,399 priority patent/US20210321520A1/en
Priority to US18/184,837 priority patent/US20230225055A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H10W42/20—
    • H10W42/276—
    • H10W70/05—
    • H10W70/095—
    • H10W70/611—
    • H10W70/614—
    • H10W70/688—
    • H10W74/01—
    • H10W74/114—
    • H10W90/00—
    • H10W90/401—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H10W46/00—
    • H10W46/301—
    • H10W70/09—
    • H10W70/093—
    • H10W70/60—
    • H10W70/68—
    • H10W70/682—
    • H10W72/0198—
    • H10W72/072—
    • H10W72/07232—
    • H10W72/07233—
    • H10W72/241—
    • H10W72/252—
    • H10W72/874—
    • H10W72/9413—
    • H10W72/952—
    • H10W74/019—
    • H10W74/473—
    • H10W80/334—
    • H10W80/335—
    • H10W90/10—
    • H10W90/722—
    • H10W90/724—
    • H10W90/732—
    • H10W90/794—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Ceramic Engineering (AREA)
  • Wire Bonding (AREA)
  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Credit Cards Or The Like (AREA)
  • Combinations Of Printed Boards (AREA)
FI20030292A 2003-02-26 2003-02-26 Förfarande för tillverkning av en elektronikmodul FI119583B (sv)

Priority Applications (14)

Application Number Priority Date Filing Date Title
FI20030292A FI119583B (sv) 2003-02-26 2003-02-26 Förfarande för tillverkning av en elektronikmodul
EP04714345A EP1597947B1 (en) 2003-02-26 2004-02-25 Method for manufacturing an electronic module
PCT/FI2004/000101 WO2004077902A1 (en) 2003-02-26 2004-02-25 Method for manufacturing an electronic module
JP2006502075A JP2006520093A (ja) 2003-02-26 2004-02-25 電子モジュールの製造方法
KR1020057015597A KR20050109944A (ko) 2003-02-26 2004-02-25 전자 모듈 제조 방법
AT04714345T ATE524955T1 (de) 2003-02-26 2004-02-25 Verfahren zur herstellung eines elektronischen moduls
US10/546,820 US7299546B2 (en) 2003-02-26 2004-02-25 Method for manufacturing an electronic module
US11/907,795 US7609527B2 (en) 2003-02-26 2007-10-17 Electronic module
US12/603,324 US8817485B2 (en) 2003-02-26 2009-10-21 Single-layer component package
US14/467,079 US10085345B2 (en) 2003-02-26 2014-08-25 Electronic module
US16/104,979 US10765006B2 (en) 2003-02-26 2018-08-20 Electronic module
US17/005,527 US11071207B2 (en) 2003-02-26 2020-08-28 Electronic module
US17/357,399 US20210321520A1 (en) 2003-02-26 2021-06-24 Electronic module
US18/184,837 US20230225055A1 (en) 2003-02-26 2023-03-16 Electronic module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20030292A FI119583B (sv) 2003-02-26 2003-02-26 Förfarande för tillverkning av en elektronikmodul
FI20030292 2003-02-26

Publications (3)

Publication Number Publication Date
FI20030292A0 FI20030292A0 (sv) 2003-02-26
FI20030292L true FI20030292L (sv) 2004-08-27
FI119583B FI119583B (sv) 2008-12-31

Family

ID=8565725

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20030292A FI119583B (sv) 2003-02-26 2003-02-26 Förfarande för tillverkning av en elektronikmodul

Country Status (7)

Country Link
US (8) US7299546B2 (sv)
EP (1) EP1597947B1 (sv)
JP (1) JP2006520093A (sv)
KR (1) KR20050109944A (sv)
AT (1) ATE524955T1 (sv)
FI (1) FI119583B (sv)
WO (1) WO2004077902A1 (sv)

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI20030293A7 (sv) * 2003-02-26 2004-08-27 Imbera Electronics Oy Förfarande för tillverkning av en elektronikmodul och en elektronikmodul
US8222723B2 (en) * 2003-04-01 2012-07-17 Imbera Electronics Oy Electric module having a conductive pattern layer
US8704359B2 (en) * 2003-04-01 2014-04-22 Ge Embedded Electronics Oy Method for manufacturing an electronic module and an electronic module
DE10330448A1 (de) * 2003-07-05 2005-01-27 Daimlerchrysler Ag Verfahren zum platzsparenden Anbringen elektrischer Leitungen
FI20031341L (sv) 2003-09-18 2005-03-19 Imbera Electronics Oy Förfarande för tillverkning av en elektronikmodul
FI117814B (sv) 2004-06-15 2007-02-28 Imbera Electronics Oy Förfarande för tillverkning av en elektronikmodul
JP2008515236A (ja) * 2004-09-28 2008-05-08 アジライト・インコーポレーテッド Ｌｅｄを微細実装するための方法及びマイクロパッケージ
FI119714B (sv) 2005-06-16 2009-02-13 Imbera Electronics Oy Kretskortskonstruktion och förfarande för tillverkning av kretskortskonstruktion
FI122128B (sv) 2005-06-16 2011-08-31 Imbera Electronics Oy Förfarande för tillverkning av kretskortskonstruktion
GB2441265B (en) * 2005-06-16 2012-01-11 Imbera Electronics Oy Method for manufacturing a circuit board structure, and a circuit board structure
US7687860B2 (en) 2005-06-24 2010-03-30 Samsung Electronics Co., Ltd. Semiconductor device including impurity regions having different cross-sectional shapes
TWI284402B (en) * 2005-12-30 2007-07-21 Advanced Semiconductor Eng Build-up package and method of an optoelectronic chip
FI20060256A7 (sv) 2006-03-17 2006-03-20 Imbera Electronics Oy Tillverkning av ett kretskort och ett kretskort innehållande en komponent
US7836588B2 (en) * 2006-07-06 2010-11-23 Ideon Llc Method for fabricating an electronic device
TWI306729B (en) * 2006-11-17 2009-02-21 Advanced Semiconductor Eng Method for making circuit board and multi-layer substrate with plated through hole structure
DE102007010731A1 (de) * 2007-02-26 2008-08-28 Würth Elektronik GmbH & Co. KG Verfahren zum Einbetten von Chips und Leiterplatte
CN101315925A (zh) * 2007-05-28 2008-12-03 松下电器产业株式会社 电子器件内置模块及其制造方法
US9610758B2 (en) 2007-06-21 2017-04-04 General Electric Company Method of making demountable interconnect structure
US9953910B2 (en) 2007-06-21 2018-04-24 General Electric Company Demountable interconnect structure
JP5012896B2 (ja) * 2007-06-26 2012-08-29 株式会社村田製作所 部品内蔵基板の製造方法
US8178789B2 (en) 2007-07-17 2012-05-15 Ibiden Co., Ltd. Wiring board and method of manufacturing wiring board
US8035983B2 (en) * 2007-07-17 2011-10-11 Ibiden Co., Ltd. Wiring board and method of manufacturing wiring board
KR100945285B1 (ko) * 2007-09-18 2010-03-03 삼성전기주식회사 전자소자 내장 인쇄회로기판 및 그 제조 방법
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US20180376597A1 (en) 2018-12-27
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US20080043441A1 (en) 2008-02-21
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US20150043177A1 (en) 2015-02-12
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