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FI20041680L - Elektroniikkamoduuli ja menetelmä sen valmistamiseksi - Google Patents

Elektroniikkamoduuli ja menetelmä sen valmistamiseksi Download PDF

Info

Publication number
FI20041680L
FI20041680L FI20041680A FI20041680A FI20041680L FI 20041680 L FI20041680 L FI 20041680L FI 20041680 A FI20041680 A FI 20041680A FI 20041680 A FI20041680 A FI 20041680A FI 20041680 L FI20041680 L FI 20041680L
Authority
FI
Finland
Prior art keywords
manufacturing
same
electronic module
module
electronic
Prior art date
Application number
FI20041680A
Other languages
English (en)
Swedish (sv)
Other versions
FI20041680A7 (fi
FI20041680A0 (fi
Inventor
Risto Tuominen
Antti Iihola
Original Assignee
Imbera Electronics Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FI20040592A external-priority patent/FI20040592L/fi
Publication of FI20041680A0 publication Critical patent/FI20041680A0/fi
Priority to FI20041680A priority Critical patent/FI20041680L/fi
Application filed by Imbera Electronics Oy filed Critical Imbera Electronics Oy
Priority to JP2007510062A priority patent/JP5064210B2/ja
Priority to CN2005800133303A priority patent/CN101027948B/zh
Priority to GB0621918A priority patent/GB2429848B/en
Priority to DE112005000952T priority patent/DE112005000952T5/de
Priority to PCT/FI2005/000200 priority patent/WO2005104636A1/en
Priority to US11/587,586 priority patent/US7719851B2/en
Publication of FI20041680A7 publication Critical patent/FI20041680A7/fi
Publication of FI20041680L publication Critical patent/FI20041680L/fi
Priority to US12/773,628 priority patent/US8351214B2/en

Links

Classifications

    • H10W70/614—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H10W40/228—
    • H10W70/093—
    • H10W70/60—
    • H10W72/07251—
    • H10W72/073—
    • H10W72/07307—
    • H10W72/07323—
    • H10W72/20—
    • H10W72/9413—
    • H10W72/944—
    • H10W90/736—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Capacitors (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
FI20041680A 2004-04-27 2004-12-29 Elektroniikkamoduuli ja menetelmä sen valmistamiseksi FI20041680L (fi)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FI20041680A FI20041680L (fi) 2004-04-27 2004-12-29 Elektroniikkamoduuli ja menetelmä sen valmistamiseksi
US11/587,586 US7719851B2 (en) 2004-04-27 2005-04-27 Electronics module and method for manufacturing the same
JP2007510062A JP5064210B2 (ja) 2004-04-27 2005-04-27 電子モジュール及びその製造方法
PCT/FI2005/000200 WO2005104636A1 (en) 2004-04-27 2005-04-27 Electronics module and method for manufacturing the same
CN2005800133303A CN101027948B (zh) 2004-04-27 2005-04-27 电子模块及其制造方法
GB0621918A GB2429848B (en) 2004-04-27 2005-04-27 Electronics module and method for manufacturing the same
DE112005000952T DE112005000952T5 (de) 2004-04-27 2005-04-27 Elektronik-Modul und Verfahren zur Herstellung desselben
US12/773,628 US8351214B2 (en) 2004-04-27 2010-05-04 Electronics module comprising an embedded microcircuit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20040592A FI20040592L (fi) 2004-04-27 2004-04-27 Lämmön johtaminen upotetusta komponentista
FI20041680A FI20041680L (fi) 2004-04-27 2004-12-29 Elektroniikkamoduuli ja menetelmä sen valmistamiseksi

Publications (3)

Publication Number Publication Date
FI20041680A0 FI20041680A0 (fi) 2004-12-29
FI20041680A7 FI20041680A7 (fi) 2005-10-28
FI20041680L true FI20041680L (fi) 2005-10-28

Family

ID=33553923

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20041680A FI20041680L (fi) 2004-04-27 2004-12-29 Elektroniikkamoduuli ja menetelmä sen valmistamiseksi

Country Status (7)

Country Link
US (2) US7719851B2 (fi)
JP (1) JP5064210B2 (fi)
CN (1) CN101027948B (fi)
DE (1) DE112005000952T5 (fi)
FI (1) FI20041680L (fi)
GB (1) GB2429848B (fi)
WO (1) WO2005104636A1 (fi)

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* Cited by examiner, † Cited by third party
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FI20031341L (fi) 2003-09-18 2005-03-19 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
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Also Published As

Publication number Publication date
JP5064210B2 (ja) 2012-10-31
FI20041680A7 (fi) 2005-10-28
US7719851B2 (en) 2010-05-18
US20100214750A1 (en) 2010-08-26
US20080192450A1 (en) 2008-08-14
CN101027948A (zh) 2007-08-29
DE112005000952T5 (de) 2007-04-05
US8351214B2 (en) 2013-01-08
WO2005104636A1 (en) 2005-11-03
CN101027948B (zh) 2011-08-03
JP2007535157A (ja) 2007-11-29
GB2429848A (en) 2007-03-07
GB0621918D0 (en) 2006-12-27
GB2429848B (en) 2008-01-30
FI20041680A0 (fi) 2004-12-29

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