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DE602006006136D1 - Elektronisches Mikromodul und Herstellungsverfahren - Google Patents

Elektronisches Mikromodul und Herstellungsverfahren

Info

Publication number
DE602006006136D1
DE602006006136D1 DE200660006136 DE602006006136T DE602006006136D1 DE 602006006136 D1 DE602006006136 D1 DE 602006006136D1 DE 200660006136 DE200660006136 DE 200660006136 DE 602006006136 T DE602006006136 T DE 602006006136T DE 602006006136 D1 DE602006006136 D1 DE 602006006136D1
Authority
DE
Germany
Prior art keywords
manufacturing process
electronic micromodule
micromodule
electronic
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE200660006136
Other languages
English (en)
Inventor
Agnes Rogge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Publication of DE602006006136D1 publication Critical patent/DE602006006136D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07775—Antenna details the antenna being on-chip
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • H10W72/00—
    • H10W72/0198—
    • H10W72/20—
    • H10W90/00—
    • H10W90/293—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/40—Structural association with built-in electric component, e.g. fuse
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H10W44/248—
    • H10W72/073—
    • H10W72/251—
    • H10W72/9226—
    • H10W72/923—
    • H10W72/9415—
    • H10W72/9445—
    • H10W72/952—

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
DE200660006136 2005-11-21 2006-11-07 Elektronisches Mikromodul und Herstellungsverfahren Active DE602006006136D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0511750A FR2893734A1 (fr) 2005-11-21 2005-11-21 Micromodule electronique et procede de fabrication d'un tel micromodule

Publications (1)

Publication Number Publication Date
DE602006006136D1 true DE602006006136D1 (de) 2009-05-20

Family

ID=36940463

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200660006136 Active DE602006006136D1 (de) 2005-11-21 2006-11-07 Elektronisches Mikromodul und Herstellungsverfahren

Country Status (4)

Country Link
US (1) US7667329B2 (de)
EP (1) EP1788514B1 (de)
DE (1) DE602006006136D1 (de)
FR (1) FR2893734A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101111938B (zh) 2005-01-28 2010-08-11 株式会社半导体能源研究所 半导体器件和制造它的方法
JP2009093507A (ja) 2007-10-11 2009-04-30 Hitachi Ltd Ｒｆｉｄタグ
US9324700B2 (en) * 2008-09-05 2016-04-26 Stats Chippac, Ltd. Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels
FR2940486B1 (fr) * 2008-12-22 2011-02-11 Commissariat Energie Atomique Procede de fabrication d'un assemblage de puces a moyens d'emission-reception radiofrequence reliees mecaniquement au moyen d'un ruban et assemblage
CN102460484B (zh) * 2009-04-20 2015-02-25 弗莱克斯电子有限责任公司 微型射频识别标签
US11423278B1 (en) * 2010-06-11 2022-08-23 Impinj, Inc. RFID integrated circuits with large contact pads
US9312133B2 (en) 2011-08-25 2016-04-12 Aeroflex Colorado Springs Inc. Wafer structure for electronic integrated circuit manufacturing
US9378955B2 (en) 2011-08-25 2016-06-28 Aeroflex Colorado Springs Inc. Wafer structure for electronic integrated circuit manufacturing
US9378956B2 (en) 2011-08-25 2016-06-28 Aeroflex Colorado Springs Inc. Wafer structure for electronic integrated circuit manufacturing
US9396947B2 (en) 2011-08-25 2016-07-19 Aeroflex Colorado Springs Inc. Wafer structure for electronic integrated circuit manufacturing
US10909440B2 (en) 2013-08-22 2021-02-02 Texas Instruments Incorporated RFID tag with integrated antenna
JP6546711B1 (ja) 2019-04-10 2019-07-17 株式会社エスケーエレクトロニクス 非接触情報担体
CN112530928B (zh) * 2019-12-12 2024-01-19 友达光电股份有限公司 天线装置及其制造方法
EP4339833A1 (de) 2022-09-19 2024-03-20 Assa Abloy AB Rfid-anordnung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4306655C2 (de) * 1992-03-04 1997-04-30 Toshiba Kawasaki Kk Verfahren zum Herstellen eines planaren Induktionselements
US6268796B1 (en) * 1997-12-12 2001-07-31 Alfred Gnadinger Radio frequency identification transponder having integrated antenna
FR2795235B1 (fr) * 1999-06-15 2002-08-02 Gemplus Card Int Procede de realisation de dispositifs comprenant une puce associee a un element de circuit et dispositifs obtenus
JP2001024145A (ja) * 1999-07-13 2001-01-26 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
FR2802337A1 (fr) * 1999-12-14 2001-06-15 St Microelectronics Sa Procede d'interconnexion de circuits integres
US7051429B2 (en) * 2003-04-11 2006-05-30 Eastman Kodak Company Method for forming a medium having data storage and communication capabilities

Also Published As

Publication number Publication date
US7667329B2 (en) 2010-02-23
FR2893734A1 (fr) 2007-05-25
EP1788514B1 (de) 2009-04-08
EP1788514A1 (de) 2007-05-23
US20070148981A1 (en) 2007-06-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition