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FI20040592L - Lämmön johtaminen upotetusta komponentista - Google Patents

Lämmön johtaminen upotetusta komponentista Download PDF

Info

Publication number
FI20040592L
FI20040592L FI20040592A FI20040592A FI20040592L FI 20040592 L FI20040592 L FI 20040592L FI 20040592 A FI20040592 A FI 20040592A FI 20040592 A FI20040592 A FI 20040592A FI 20040592 L FI20040592 L FI 20040592L
Authority
FI
Finland
Prior art keywords
component
heat conduction
embedded component
insulating
material layer
Prior art date
Application number
FI20040592A
Other languages
English (en)
Swedish (sv)
Other versions
FI20040592A7 (fi
FI20040592A0 (fi
Inventor
Risto Tuominen
Petteri Palm
Original Assignee
Imbera Electronics Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imbera Electronics Oy filed Critical Imbera Electronics Oy
Priority to FI20040592A priority Critical patent/FI20040592L/fi
Publication of FI20040592A0 publication Critical patent/FI20040592A0/fi
Priority to FI20041680A priority patent/FI20041680L/fi
Priority to PCT/FI2005/000199 priority patent/WO2005104635A1/en
Priority to JP2007510062A priority patent/JP5064210B2/ja
Priority to PCT/FI2005/000200 priority patent/WO2005104636A1/en
Priority to US11/587,694 priority patent/US8076586B2/en
Priority to JP2007510061A priority patent/JP2007535156A/ja
Priority to CN2005800133303A priority patent/CN101027948B/zh
Priority to GB0621918A priority patent/GB2429848B/en
Priority to DE112005000952T priority patent/DE112005000952T5/de
Priority to US11/587,586 priority patent/US7719851B2/en
Publication of FI20040592A7 publication Critical patent/FI20040592A7/fi
Publication of FI20040592L publication Critical patent/FI20040592L/fi
Priority to US12/773,628 priority patent/US8351214B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
    • H10W70/09—
    • H10W70/614—
    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H10W40/228—
    • H10W70/093—
    • H10W70/60—
    • H10W72/073—
    • H10W72/07307—
    • H10W72/07323—
    • H10W72/9413—
    • H10W74/019—
    • H10W90/736—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
FI20040592A 2004-04-27 2004-04-27 Lämmön johtaminen upotetusta komponentista FI20040592L (fi)

Priority Applications (12)

Application Number Priority Date Filing Date Title
FI20040592A FI20040592L (fi) 2004-04-27 2004-04-27 Lämmön johtaminen upotetusta komponentista
FI20041680A FI20041680L (fi) 2004-04-27 2004-12-29 Elektroniikkamoduuli ja menetelmä sen valmistamiseksi
US11/587,586 US7719851B2 (en) 2004-04-27 2005-04-27 Electronics module and method for manufacturing the same
JP2007510061A JP2007535156A (ja) 2004-04-27 2005-04-27 埋込み構成要素からの熱伝導
JP2007510062A JP5064210B2 (ja) 2004-04-27 2005-04-27 電子モジュール及びその製造方法
PCT/FI2005/000200 WO2005104636A1 (en) 2004-04-27 2005-04-27 Electronics module and method for manufacturing the same
US11/587,694 US8076586B2 (en) 2004-04-27 2005-04-27 Heat conduction from an embedded component
PCT/FI2005/000199 WO2005104635A1 (en) 2004-04-27 2005-04-27 Heat conduction from an embedded component
CN2005800133303A CN101027948B (zh) 2004-04-27 2005-04-27 电子模块及其制造方法
GB0621918A GB2429848B (en) 2004-04-27 2005-04-27 Electronics module and method for manufacturing the same
DE112005000952T DE112005000952T5 (de) 2004-04-27 2005-04-27 Elektronik-Modul und Verfahren zur Herstellung desselben
US12/773,628 US8351214B2 (en) 2004-04-27 2010-05-04 Electronics module comprising an embedded microcircuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20040592A FI20040592L (fi) 2004-04-27 2004-04-27 Lämmön johtaminen upotetusta komponentista

Publications (3)

Publication Number Publication Date
FI20040592A0 FI20040592A0 (fi) 2004-04-27
FI20040592A7 FI20040592A7 (fi) 2005-10-28
FI20040592L true FI20040592L (fi) 2005-10-28

Family

ID=32104228

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20040592A FI20040592L (fi) 2004-04-27 2004-04-27 Lämmön johtaminen upotetusta komponentista

Country Status (4)

Country Link
US (1) US8076586B2 (fi)
JP (1) JP2007535156A (fi)
FI (1) FI20040592L (fi)
WO (1) WO2005104635A1 (fi)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105210462A (zh) * 2013-05-14 2015-12-30 名幸电子有限公司 元器件内置基板的制造方法及元器件内置基板
CN105555067A (zh) * 2016-02-19 2016-05-04 周跃 一种线路板的制作方法

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GB2441265B (en) * 2005-06-16 2012-01-11 Imbera Electronics Oy Method for manufacturing a circuit board structure, and a circuit board structure
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105210462A (zh) * 2013-05-14 2015-12-30 名幸电子有限公司 元器件内置基板的制造方法及元器件内置基板
CN105555067A (zh) * 2016-02-19 2016-05-04 周跃 一种线路板的制作方法

Also Published As

Publication number Publication date
FI20040592A7 (fi) 2005-10-28
US20070227761A1 (en) 2007-10-04
FI20040592A0 (fi) 2004-04-27
US8076586B2 (en) 2011-12-13
JP2007535156A (ja) 2007-11-29
WO2005104635A1 (en) 2005-11-03

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