[go: up one dir, main page]

FI20041038L - Objektiivimoduuli ja sen kokoonpanomenetelmä - Google Patents

Objektiivimoduuli ja sen kokoonpanomenetelmä Download PDF

Info

Publication number
FI20041038L
FI20041038L FI20041038A FI20041038A FI20041038L FI 20041038 L FI20041038 L FI 20041038L FI 20041038 A FI20041038 A FI 20041038A FI 20041038 A FI20041038 A FI 20041038A FI 20041038 L FI20041038 L FI 20041038L
Authority
FI
Finland
Prior art keywords
lens module
assembly method
assembly
lens
module
Prior art date
Application number
FI20041038A
Other languages
English (en)
Swedish (sv)
Other versions
FI20041038A7 (fi
FI20041038A0 (fi
Inventor
Chien-Lih Lung
Original Assignee
Premier Image Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Premier Image Technology Corp filed Critical Premier Image Technology Corp
Publication of FI20041038A0 publication Critical patent/FI20041038A0/fi
Publication of FI20041038A7 publication Critical patent/FI20041038A7/fi
Publication of FI20041038L publication Critical patent/FI20041038L/fi

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Optical Couplings Of Light Guides (AREA)
FI20041038A 2004-04-23 2004-07-29 Objektiivimoduuli ja sen kokoonpanomenetelmä FI20041038L (fi)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093111513A TWI282873B (en) 2004-03-12 2004-04-23 Lens module and assembling method thereof

Publications (3)

Publication Number Publication Date
FI20041038A0 FI20041038A0 (fi) 2004-07-29
FI20041038A7 FI20041038A7 (fi) 2005-10-24
FI20041038L true FI20041038L (fi) 2005-10-24

Family

ID=32769570

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20041038A FI20041038L (fi) 2004-04-23 2004-07-29 Objektiivimoduuli ja sen kokoonpanomenetelmä

Country Status (7)

Country Link
US (1) US6977783B2 (fi)
JP (1) JP4567386B2 (fi)
DE (1) DE102004036143A1 (fi)
FI (1) FI20041038L (fi)
FR (1) FR2869460A1 (fi)
GB (1) GB2413435B (fi)
TW (1) TWI282873B (fi)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050052568A1 (en) * 2003-09-10 2005-03-10 Inventec Micro-Electronics Corporation Digital image capturing module assembly and method of fabricating the same
JP4446773B2 (ja) * 2004-03-26 2010-04-07 富士フイルム株式会社 撮影装置
CN2749141Y (zh) * 2004-10-25 2005-12-28 富士康(昆山)电脑接插件有限公司 电连接器
TWI242287B (en) * 2004-12-24 2005-10-21 Innolux Display Corp Portable camera device
US8085318B2 (en) * 2005-10-11 2011-12-27 Apple Inc. Real-time image capture and manipulation based on streaming data
KR101200573B1 (ko) * 2006-06-28 2012-11-13 삼성전자주식회사 촬상 소자 장착 구조 및 촬상 소자 장착 방법
JP2008104037A (ja) * 2006-10-20 2008-05-01 Fujifilm Corp 撮像装置
TWI407169B (zh) * 2006-12-22 2013-09-01 Hon Hai Prec Ind Co Ltd 鏡頭模組組裝裝置及組裝方法
JP4211874B2 (ja) * 2007-01-24 2009-01-21 コニカミノルタオプト株式会社 撮像装置、撮像装置の組立方法及び携帯端末
US7593636B2 (en) * 2007-02-01 2009-09-22 Tessera, Inc. Pin referenced image sensor to reduce tilt in a camera module
TWI395989B (zh) * 2007-02-12 2013-05-11 Hon Hai Prec Ind Co Ltd 相機模組組裝裝置
WO2009041794A2 (en) * 2007-09-27 2009-04-02 Lg Innotek Co., Ltd Camera module
KR20090033070A (ko) 2007-09-27 2009-04-01 엘지이노텍 주식회사 카메라 모듈
TWI363923B (en) * 2007-10-17 2012-05-11 Altek Corp Metal shell, lens module structure having the same and assembling method therefor
KR101428045B1 (ko) * 2007-11-12 2014-08-07 엘지이노텍 주식회사 카메라 모듈
CN101442061B (zh) * 2007-11-20 2011-11-09 鸿富锦精密工业(深圳)有限公司 相机组件
KR100928011B1 (ko) * 2007-12-20 2009-11-24 삼성전기주식회사 이미지센서 모듈과 그 제조방법, 그리고 이를 포함하는카메라 모듈
US7966041B2 (en) * 2008-01-30 2011-06-21 Sony Ericsson Mobile Communications Ab Pin mounting of camera module in a radio communication terminal
KR101060951B1 (ko) * 2009-10-23 2011-08-30 삼성전기주식회사 카메라 모듈 패키지
JP2012015995A (ja) * 2010-05-31 2012-01-19 Fujitsu Component Ltd カメラモジュール及びその製造方法
TWI484243B (zh) * 2010-06-10 2015-05-11 Hon Hai Prec Ind Co Ltd 鏡頭模組及相機裝置
CN102279453A (zh) * 2010-06-11 2011-12-14 鸿富锦精密工业(深圳)有限公司 镜头模组及相机装置
TWI426337B (zh) * 2010-12-29 2014-02-11 Hon Hai Prec Ind Co Ltd 取像鏡頭對位調整結構
JP2013130657A (ja) * 2011-12-20 2013-07-04 Fujitsu Component Ltd カメラモジュール及びその製造方法
TWI468839B (zh) * 2012-06-20 2015-01-11 Hon Hai Prec Ind Co Ltd 取像鏡頭固定結構
CN103685881B (zh) * 2012-09-19 2018-09-21 Lg伊诺特有限公司 照相机模块
KR101452078B1 (ko) * 2012-12-28 2014-10-16 삼성전기주식회사 쉴드캔 및 쉴드캔 제조용 지그
KR20150110249A (ko) * 2014-03-21 2015-10-02 타이코에이엠피 주식회사 케이블 어셈블리, 카메라 모듈 및 이를 구비하는 차량용 카메라 장치
CN206585642U (zh) 2016-04-08 2017-10-24 台湾东电化股份有限公司 摄像模块
CN107277309B (zh) * 2016-04-08 2020-06-05 台湾东电化股份有限公司 摄像模块
JP6847744B2 (ja) * 2016-04-08 2021-03-24 台湾東電化股▲ふん▼有限公司 カメラモジュール
CN107678120B (zh) * 2017-11-20 2024-03-19 浙江舜宇光学有限公司 用于摄像模组的镜筒以及镜头模组
CN110596909A (zh) * 2018-06-13 2019-12-20 三赢科技(深圳)有限公司 光学投射装置
CN113534575A (zh) * 2020-04-21 2021-10-22 晋城三赢精密电子有限公司 镜头模组及电子装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6483101B1 (en) * 1999-12-08 2002-11-19 Amkor Technology, Inc. Molded image sensor package having lens holder
JP2001188155A (ja) * 1999-12-28 2001-07-10 Kuurii Components Kk 撮像素子の固定手段
JP3725012B2 (ja) * 2000-08-17 2005-12-07 シャープ株式会社 レンズ一体型固体撮像装置の製造方法
TW528889B (en) * 2000-11-14 2003-04-21 Toshiba Corp Image pickup apparatus, manufacturing method thereof, and portable electric apparatus
US6683298B1 (en) * 2000-11-20 2004-01-27 Agilent Technologies Inc. Image sensor packaging with package cavity sealed by the imaging optics
US6900913B2 (en) * 2001-01-23 2005-05-31 Wen-Ching Chen Image pickup module
JP4373020B2 (ja) * 2001-02-14 2009-11-25 ローム株式会社 イメージセンサモジュール
US6654187B2 (en) * 2001-07-16 2003-11-25 Alex Ning Camera lens carrier for circuit board mounting
JP4033669B2 (ja) * 2001-12-04 2008-01-16 シャープ株式会社 カメラモジュール
JP2003198897A (ja) * 2001-12-27 2003-07-11 Seiko Epson Corp 光モジュール、回路基板及び電子機器
JP3755149B2 (ja) * 2002-07-29 2006-03-15 ミツミ電機株式会社 カメラモジュールの基板への実装方法
JP2004063425A (ja) * 2002-07-31 2004-02-26 Mitsumi Electric Co Ltd モジュール用コネクタ
US6741405B1 (en) * 2003-03-27 2004-05-25 Exquisite Optical Technology Co., Ltd Hood for a digital image collecting lens

Also Published As

Publication number Publication date
FI20041038A7 (fi) 2005-10-24
GB2413435B (en) 2006-10-25
FR2869460A1 (fr) 2005-10-28
FI20041038A0 (fi) 2004-07-29
US6977783B2 (en) 2005-12-20
JP2005312002A (ja) 2005-11-04
TWI282873B (en) 2007-06-21
GB0416294D0 (en) 2004-08-25
JP4567386B2 (ja) 2010-10-20
TW200530651A (en) 2005-09-16
GB2413435A (en) 2005-10-26
US20050237637A1 (en) 2005-10-27
DE102004036143A1 (de) 2005-11-17

Similar Documents

Publication Publication Date Title
FI20041038L (fi) Objektiivimoduuli ja sen kokoonpanomenetelmä
FI20041680L (fi) Elektroniikkamoduuli ja menetelmä sen valmistamiseksi
PL1927272T3 (pl) Urządzenie uruchamiające oświetlenie oraz sposób
EP1760895A4 (en) TRANSMITTER / RECEIVER MODULE
DE602004030335D1 (de) Optisches element
DE602005010006D1 (de) Optisches Modul
DE602005023878D1 (de) Optischer verbinder
GB0501493D0 (en) An optical assembly and method
DE60318905D1 (de) Optisches Element
DE102005033349B8 (de) Optischer Sensor
FI20031143A0 (fi) Optinen fokusointimenetelmä ja -järjestely
DK1766588T3 (da) Sikkerhedsmodulkomponent
DE602005002771D1 (de) Kopfmodulanordnung und -struktur
DE502005007018D1 (de) Sensorleuchte
DE502005007322D1 (de) Einpresskontakt
DE50311591D1 (de) Optischer sensor
DE602005017210D1 (de) Optisches Element und dessen Herstellungsverfahren
EP1806604A4 (en) OPTICAL ELEMENT
DE60336077D1 (de) Optischer sensor
EP1577955A4 (en) Optical sensor
DE60217410D1 (de) Optisches element
DE602005024080D1 (de) Optischer Isolator mit geneigtem optischem Isolatorelement
DE112004002115D2 (de) Windlicht
DE502005010769D1 (de) Optisches sensormodul
DE602005026377D1 (de) Optisches Empfangsmodul und optisches Empfangsmodulsystem

Legal Events

Date Code Title Description
MA Patent expired