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FI20030293L - Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli - Google Patents

Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli Download PDF

Info

Publication number
FI20030293L
FI20030293L FI20030293A FI20030293A FI20030293L FI 20030293 L FI20030293 L FI 20030293L FI 20030293 A FI20030293 A FI 20030293A FI 20030293 A FI20030293 A FI 20030293A FI 20030293 L FI20030293 L FI 20030293L
Authority
FI
Finland
Prior art keywords
electronic module
manufacturing
module
electronic
Prior art date
Application number
FI20030293A
Other languages
English (en)
Swedish (sv)
Other versions
FI20030293A7 (fi
FI20030293A0 (fi
Inventor
Risto Tuominen
Petteri Palm
Original Assignee
Imbera Electronics Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imbera Electronics Oy filed Critical Imbera Electronics Oy
Priority to FI20030293A priority Critical patent/FI20030293L/fi
Publication of FI20030293A0 publication Critical patent/FI20030293A0/fi
Priority to PCT/FI2004/000102 priority patent/WO2004077903A1/en
Priority to US10/546,920 priority patent/US20060076686A1/en
Priority to JP2006502076A priority patent/JP4537995B2/ja
Priority to KR1020057015596A priority patent/KR101060856B1/ko
Priority to EP04714344A priority patent/EP1597946A1/en
Publication of FI20030293A7 publication Critical patent/FI20030293A7/fi
Publication of FI20030293L publication Critical patent/FI20030293L/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
    • H10W70/09—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H10W46/301—
    • H10W70/60—
    • H10W72/9413—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
FI20030293A 2003-02-26 2003-02-26 Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli FI20030293L (fi)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FI20030293A FI20030293L (fi) 2003-02-26 2003-02-26 Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli
PCT/FI2004/000102 WO2004077903A1 (en) 2003-02-26 2004-02-25 Method for manufacturing an electronic module, and an electronic module
US10/546,920 US20060076686A1 (en) 2003-02-26 2004-02-25 Method for manufacturing an electronic module, and an electronic module
JP2006502076A JP4537995B2 (ja) 2003-02-26 2004-02-25 電子モジュールを製造する方法
KR1020057015596A KR101060856B1 (ko) 2003-02-26 2004-02-25 전자 모듈 및 전자 모듈 제조 방법
EP04714344A EP1597946A1 (en) 2003-02-26 2004-02-25 Method for manufacturing an electronic module, and an electronic module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20030293A FI20030293L (fi) 2003-02-26 2003-02-26 Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli

Publications (3)

Publication Number Publication Date
FI20030293A0 FI20030293A0 (fi) 2003-02-26
FI20030293A7 FI20030293A7 (fi) 2004-08-27
FI20030293L true FI20030293L (fi) 2004-08-27

Family

ID=8565726

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20030293A FI20030293L (fi) 2003-02-26 2003-02-26 Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli

Country Status (6)

Country Link
US (1) US20060076686A1 (fi)
EP (1) EP1597946A1 (fi)
JP (1) JP4537995B2 (fi)
KR (1) KR101060856B1 (fi)
FI (1) FI20030293L (fi)
WO (1) WO2004077903A1 (fi)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI20031341A7 (fi) 2003-09-18 2005-03-19 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
FI117814B (fi) 2004-06-15 2007-02-28 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
AU2005296077B2 (en) * 2004-10-14 2010-12-23 Koppers Performance Chemicals Inc. Micronized wood preservative formulations in organic carriers
JP3914239B2 (ja) 2005-03-15 2007-05-16 新光電気工業株式会社 配線基板および配線基板の製造方法
FI122128B (fi) 2005-06-16 2011-08-31 Imbera Electronics Oy Menetelmä piirilevyrakenteen valmistamiseksi
FI119714B (fi) 2005-06-16 2009-02-13 Imbera Electronics Oy Piirilevyrakenne ja menetelmä piirilevyrakenteen valmistamiseksi
DE112006001506T5 (de) * 2005-06-16 2008-04-30 Imbera Electronics Oy Platinenstruktur und Verfahren zu ihrer Herstellung
US7327006B2 (en) 2005-06-23 2008-02-05 Nokia Corporation Semiconductor package
US7687860B2 (en) 2005-06-24 2010-03-30 Samsung Electronics Co., Ltd. Semiconductor device including impurity regions having different cross-sectional shapes
FI20060256A7 (fi) 2006-03-17 2006-03-20 Imbera Electronics Oy Piirilevyn valmistaminen ja komponentin sisältävä piirilevy
TWI354338B (en) * 2006-06-07 2011-12-11 Unimicron Technology Corp Carrier structure for semiconductor component and
US8049323B2 (en) * 2007-02-16 2011-11-01 Taiwan Semiconductor Manufacturing Co., Ltd. Chip holder with wafer level redistribution layer
US9610758B2 (en) 2007-06-21 2017-04-04 General Electric Company Method of making demountable interconnect structure
US9953910B2 (en) 2007-06-21 2018-04-24 General Electric Company Demountable interconnect structure
US8264085B2 (en) 2008-05-05 2012-09-11 Infineon Technologies Ag Semiconductor device package interconnections
KR101479506B1 (ko) 2008-06-30 2015-01-07 삼성전자주식회사 임베디드 배선 기판, 이를 포함하는 반도체 패키지 및 그제조 방법
KR101055471B1 (ko) * 2008-09-29 2011-08-08 삼성전기주식회사 전자소자 내장형 인쇄회로기판 및 그 제조방법
KR101048515B1 (ko) * 2008-10-15 2011-07-12 삼성전기주식회사 전자 소자 내장 인쇄회로기판 및 그 제조 방법
KR101047484B1 (ko) * 2008-11-07 2011-07-08 삼성전기주식회사 전자 소자 내장 인쇄회로기판 및 그 제조 방법
US8124449B2 (en) 2008-12-02 2012-02-28 Infineon Technologies Ag Device including a semiconductor chip and metal foils
KR101038482B1 (ko) * 2009-07-08 2011-06-02 삼성전기주식회사 전자소자 내장형 인쇄회로기판 및 그 제조방법
DE102010014579A1 (de) * 2010-04-09 2011-10-13 Würth Elektronik Rot am See GmbH & Co. KG Verfahren zum Herstellen einer elektronischen Baugruppe
WO2013038468A1 (ja) * 2011-09-12 2013-03-21 株式会社メイコー 部品内蔵基板の製造方法及びこれを用いた部品内蔵基板

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FI119583B (fi) * 2003-02-26 2008-12-31 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi

Also Published As

Publication number Publication date
WO2004077903A1 (en) 2004-09-10
FI20030293A7 (fi) 2004-08-27
EP1597946A1 (en) 2005-11-23
JP2006519486A (ja) 2006-08-24
FI20030293A0 (fi) 2003-02-26
KR20050108362A (ko) 2005-11-16
KR101060856B1 (ko) 2011-08-31
JP4537995B2 (ja) 2010-09-08
US20060076686A1 (en) 2006-04-13

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