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FI20031341L - Förfarande för tillverkning av en elektronikmodul - Google Patents

Förfarande för tillverkning av en elektronikmodul Download PDF

Info

Publication number
FI20031341L
FI20031341L FI20031341A FI20031341A FI20031341L FI 20031341 L FI20031341 L FI 20031341L FI 20031341 A FI20031341 A FI 20031341A FI 20031341 A FI20031341 A FI 20031341A FI 20031341 L FI20031341 L FI 20031341L
Authority
FI
Finland
Prior art keywords
manufacturing
electronic module
module
electronic
Prior art date
Application number
FI20031341A
Other languages
English (en)
Finnish (fi)
Other versions
FI20031341A7 (sv
FI20031341A0 (sv
Inventor
Antti Iihola
Timo Jokela
Original Assignee
Imbera Electronics Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27839004&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=FI20031341(L) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Imbera Electronics Oy filed Critical Imbera Electronics Oy
Priority to FI20031341A priority Critical patent/FI20031341L/sv
Publication of FI20031341A0 publication Critical patent/FI20031341A0/sv
Priority to PCT/FI2004/000538 priority patent/WO2005027602A1/en
Priority to GB0605377A priority patent/GB2422054B/en
Priority to KR1020067005383A priority patent/KR20060066115A/ko
Priority to US10/572,340 priority patent/US7696005B2/en
Priority to CN2004800267977A priority patent/CN1853451B/zh
Priority to JP2006526649A priority patent/JP4977464B2/ja
Priority to DE112004001727.0T priority patent/DE112004001727B4/de
Publication of FI20031341A7 publication Critical patent/FI20031341A7/sv
Publication of FI20031341L publication Critical patent/FI20031341L/sv
Priority to US12/753,329 priority patent/US9232658B2/en
Priority to US14/580,257 priority patent/US10798823B2/en
Priority to US16/788,701 priority patent/US20200187358A1/en
Priority to US17/364,593 priority patent/US11716816B2/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H10W70/05—
    • H10W70/09—
    • H10W70/611—
    • H10W70/614—
    • H10W70/685—
    • H10W90/00—
    • H10W90/401—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H10W70/093—
    • H10W72/073—
    • H10W72/9413—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Ceramic Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Casings For Electric Apparatus (AREA)
  • Adjustable Resistors (AREA)
  • Structure Of Printed Boards (AREA)
FI20031341A 2003-09-18 2003-09-18 Förfarande för tillverkning av en elektronikmodul FI20031341L (sv)

Priority Applications (12)

Application Number Priority Date Filing Date Title
FI20031341A FI20031341L (sv) 2003-09-18 2003-09-18 Förfarande för tillverkning av en elektronikmodul
DE112004001727.0T DE112004001727B4 (de) 2003-09-18 2004-09-15 Verfahren zur Herstellung eines elektronischen Moduls
JP2006526649A JP4977464B2 (ja) 2003-09-18 2004-09-15 電子モジュールの製造方法及び電子モジュール
CN2004800267977A CN1853451B (zh) 2003-09-18 2004-09-15 用于制造电子模块的方法
GB0605377A GB2422054B (en) 2003-09-18 2004-09-15 Method for manufacturing an electronic module
KR1020067005383A KR20060066115A (ko) 2003-09-18 2004-09-15 전자 모듈 제조 방법
US10/572,340 US7696005B2 (en) 2003-09-18 2004-09-15 Method for manufacturing an electronic module in an installation base
PCT/FI2004/000538 WO2005027602A1 (en) 2003-09-18 2004-09-15 Method for manufacturing an electronic module
US12/753,329 US9232658B2 (en) 2003-09-18 2010-04-02 Method for manufacturing an electronic module
US14/580,257 US10798823B2 (en) 2003-09-18 2014-12-23 Method for manufacturing an electronic module and electronic module
US16/788,701 US20200187358A1 (en) 2003-09-18 2020-02-12 Method for manufacturing an electronic module and electronic module
US17/364,593 US11716816B2 (en) 2003-09-18 2021-06-30 Method for manufacturing an electronic module and electronic module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20031341A FI20031341L (sv) 2003-09-18 2003-09-18 Förfarande för tillverkning av en elektronikmodul

Publications (3)

Publication Number Publication Date
FI20031341A0 FI20031341A0 (sv) 2003-09-18
FI20031341A7 FI20031341A7 (sv) 2005-03-19
FI20031341L true FI20031341L (sv) 2005-03-19

Family

ID=27839004

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20031341A FI20031341L (sv) 2003-09-18 2003-09-18 Förfarande för tillverkning av en elektronikmodul

Country Status (8)

Country Link
US (5) US7696005B2 (sv)
JP (1) JP4977464B2 (sv)
KR (1) KR20060066115A (sv)
CN (1) CN1853451B (sv)
DE (1) DE112004001727B4 (sv)
FI (1) FI20031341L (sv)
GB (1) GB2422054B (sv)
WO (1) WO2005027602A1 (sv)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10743422B2 (en) 2016-09-27 2020-08-11 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Embedding a component in a core on conductive foil

Families Citing this family (47)

* Cited by examiner, † Cited by third party
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FI115601B (sv) * 2003-04-01 2005-05-31 Imbera Electronics Oy Förfarande för tillverkning av en elektronikmodul och en elektronikmodul
US8704359B2 (en) 2003-04-01 2014-04-22 Ge Embedded Electronics Oy Method for manufacturing an electronic module and an electronic module
FI20031201A7 (sv) * 2003-08-26 2005-02-27 Imbera Electronics Oy Förfarande för tillverkning av en elektronikmodul och en elektronikmodul
FI20031341L (sv) 2003-09-18 2005-03-19 Imbera Electronics Oy Förfarande för tillverkning av en elektronikmodul
FI117814B (sv) 2004-06-15 2007-02-28 Imbera Electronics Oy Förfarande för tillverkning av en elektronikmodul
JP4545022B2 (ja) * 2005-03-10 2010-09-15 三洋電機株式会社 回路装置およびその製造方法
FI119714B (sv) 2005-06-16 2009-02-13 Imbera Electronics Oy Kretskortskonstruktion och förfarande för tillverkning av kretskortskonstruktion
FI122128B (sv) * 2005-06-16 2011-08-31 Imbera Electronics Oy Förfarande för tillverkning av kretskortskonstruktion
GB2441265B (en) * 2005-06-16 2012-01-11 Imbera Electronics Oy Method for manufacturing a circuit board structure, and a circuit board structure
US7327006B2 (en) 2005-06-23 2008-02-05 Nokia Corporation Semiconductor package
DE102007010731A1 (de) * 2007-02-26 2008-08-28 Würth Elektronik GmbH & Co. KG Verfahren zum Einbetten von Chips und Leiterplatte
US9953910B2 (en) 2007-06-21 2018-04-24 General Electric Company Demountable interconnect structure
US9610758B2 (en) 2007-06-21 2017-04-04 General Electric Company Method of making demountable interconnect structure
US8259454B2 (en) 2008-04-14 2012-09-04 General Electric Company Interconnect structure including hybrid frame panel
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KR101013994B1 (ko) * 2008-10-15 2011-02-14 삼성전기주식회사 전자 소자 내장 인쇄회로기판 및 그 제조 방법
KR101048515B1 (ko) * 2008-10-15 2011-07-12 삼성전기주식회사 전자 소자 내장 인쇄회로기판 및 그 제조 방법
KR100972050B1 (ko) * 2008-11-07 2010-07-23 삼성전기주식회사 전자 소자 내장 인쇄회로기판 및 그 제조 방법
KR100972051B1 (ko) * 2008-11-07 2010-07-23 삼성전기주식회사 전자 소자 내장 인쇄회로기판 및 그 제조 방법
KR101047484B1 (ko) * 2008-11-07 2011-07-08 삼성전기주식회사 전자 소자 내장 인쇄회로기판 및 그 제조 방법
KR100986831B1 (ko) * 2008-11-07 2010-10-12 삼성전기주식회사 전자 소자 내장 인쇄회로기판 및 그 제조 방법
US8124449B2 (en) 2008-12-02 2012-02-28 Infineon Technologies Ag Device including a semiconductor chip and metal foils
KR101015651B1 (ko) 2008-12-05 2011-02-22 삼성전기주식회사 칩 내장 인쇄회로기판 및 그 제조방법
TWI415044B (zh) * 2008-12-15 2013-11-11 Ind Tech Res Inst 基板、製造方法、及使用該基板的顯示器
FI122216B (sv) 2009-01-05 2011-10-14 Imbera Electronics Oy Rigid-flex modul
FI20095110A0 (sv) * 2009-02-06 2009-02-06 Imbera Electronics Oy Elektronisk modul med EMI-skydd
KR101055509B1 (ko) 2009-03-19 2011-08-08 삼성전기주식회사 전자부품 내장형 인쇄회로기판
FI20095557A0 (sv) 2009-05-19 2009-05-19 Imbera Electronics Oy Framställningsförfarande och elektronikmodul med nya leddragningsmöjligheter
KR101170878B1 (ko) * 2009-06-29 2012-08-02 삼성전기주식회사 반도체 칩 패키지 및 그의 제조방법
US8198547B2 (en) 2009-07-23 2012-06-12 Lexmark International, Inc. Z-directed pass-through components for printed circuit boards
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US8735735B2 (en) 2010-07-23 2014-05-27 Ge Embedded Electronics Oy Electronic module with embedded jumper conductor
WO2012099599A1 (en) * 2011-01-21 2012-07-26 Lexmark International, Inc. Z-directed filter components for printed circuit boards
CN103563498B (zh) * 2011-05-13 2016-07-06 揖斐电株式会社 电路板及其制造方法
US20130341078A1 (en) 2012-06-20 2013-12-26 Keith Bryan Hardin Z-directed printed circuit board components having a removable end portion and methods therefor
US8943684B2 (en) 2011-08-31 2015-02-03 Lexmark International, Inc. Continuous extrusion process for manufacturing a Z-directed component for a printed circuit board
KR101388840B1 (ko) * 2012-08-28 2014-04-23 삼성전기주식회사 전자 부품이 내장된 기판
WO2015077808A1 (de) 2013-11-27 2015-06-04 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Leiterplattenstruktur
AT515101B1 (de) 2013-12-12 2015-06-15 Austria Tech & System Tech Verfahren zum Einbetten einer Komponente in eine Leiterplatte
US11523520B2 (en) * 2014-02-27 2022-12-06 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Method for making contact with a component embedded in a printed circuit board
CN107295746B (zh) * 2016-03-31 2021-06-15 奥特斯(中国)有限公司 器件载体及其制造方法
CN106255345B (zh) * 2016-08-20 2020-07-24 龙南骏亚精密电路有限公司 一种双层电路板结构的制作方法
CN109346415B (zh) * 2018-09-20 2020-04-28 江苏长电科技股份有限公司 封装结构选择性包封的封装方法及封装设备
TWI671572B (zh) * 2018-10-22 2019-09-11 友達光電股份有限公司 顯示面板及其製造方法
JP7352377B2 (ja) 2019-05-15 2023-09-28 株式会社小糸製作所 電子部品実装基板およびその製造方法
CN112908943A (zh) * 2021-01-12 2021-06-04 华为技术有限公司 一种埋入式封装结构及其制备方法、终端设备
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US7696005B2 (en) 2010-04-13

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