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WO2008126817A1 - 金属箔張り積層板およびプリント配線板 - Google Patents

金属箔張り積層板およびプリント配線板 Download PDF

Info

Publication number
WO2008126817A1
WO2008126817A1 PCT/JP2008/056852 JP2008056852W WO2008126817A1 WO 2008126817 A1 WO2008126817 A1 WO 2008126817A1 JP 2008056852 W JP2008056852 W JP 2008056852W WO 2008126817 A1 WO2008126817 A1 WO 2008126817A1
Authority
WO
WIPO (PCT)
Prior art keywords
metallic foil
clad laminate
laminate plate
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/056852
Other languages
English (en)
French (fr)
Inventor
Kazumasa Takeuchi
Masaki Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of WO2008126817A1 publication Critical patent/WO2008126817A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

　繊維基材及びこれに樹脂組成物を含浸した複合樹脂層を二層以上積層してなる基板と、該基板に接して設けられた金属箔とを備える金属箔張り積層板において、対向する少なくとも二層の複合樹脂層が樹脂組成物からなる接着層により互いに接着され、複合樹脂層及び接着層中の樹脂組成物が硬化されている金属箔張り積層板を提供する。本発明によれば、金属箔張り積層板中の樹脂の量を多く保ったまま、高温での表面硬度をワイヤボンディングが可能な程度に高く保つことができる金属箔張り積層板及びプリント配線板が提供される。
PCT/JP2008/056852 2007-04-11 2008-04-07 金属箔張り積層板およびプリント配線板 Ceased WO2008126817A1 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007103784 2007-04-11
JP2007-103784 2007-04-11
JP2008006101 2008-01-15
JP2008-006101 2008-01-15

Publications (1)

Publication Number Publication Date
WO2008126817A1 true WO2008126817A1 (ja) 2008-10-23

Family

ID=39863914

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056852 Ceased WO2008126817A1 (ja) 2007-04-11 2008-04-07 金属箔張り積層板およびプリント配線板

Country Status (3)

Country Link
JP (1) JP5056553B2 (ja)
TW (1) TW200908821A (ja)
WO (1) WO2008126817A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018041800A (ja) * 2016-09-06 2018-03-15 パナソニックＩｐマネジメント株式会社 プリント配線板、プリント回路板、プリプレグ
CN114845874A (zh) * 2019-12-17 2022-08-02 三菱瓦斯化学株式会社 树脂片和印刷电路板
CN116080157A (zh) * 2022-11-16 2023-05-09 广东威世新材料有限公司 一种印制电路用覆铜箔环氧玻纤布层压板

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI568587B (zh) * 2011-04-14 2017-02-01 住友電木股份有限公司 積層板，電路基板，半導體封裝及積層板之製造方法
KR20150093730A (ko) * 2012-12-05 2015-08-18 스미또모 베이크라이트 가부시키가이샤 수지층이 형성된 금속층, 적층체, 회로 기판 및 반도체 장치
JP6269506B2 (ja) * 2012-12-18 2018-01-31 日立化成株式会社 積層体、積層板、プリント配線板、積層体の製造方法、及び積層板の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06507758A (ja) * 1991-06-04 1994-09-01 アンプ―アクゾ　リンラム　ブイオーエフ プリント配線板およびその製造方法
JPH06344500A (ja) * 1993-06-03 1994-12-20 Nippon Pillar Packing Co Ltd 積層板の製造方法および積層板用混合フィルム
JP2003055486A (ja) * 2001-05-24 2003-02-26 Hitachi Chem Co Ltd プリプレグ及び積層板
JP2005281661A (ja) * 2004-03-05 2005-10-13 Hitachi Chem Co Ltd プリプレグ、並びにこれを用いて得られる金属箔張積層板及び印刷回路板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60190347A (ja) * 1984-03-10 1985-09-27 松下電工株式会社 電気用積層板
JP4517749B2 (ja) * 2004-04-12 2010-08-04 日立化成工業株式会社 プリプレグ並びにこれを用いた金属張積層板及び印刷回路板
JP4590982B2 (ja) * 2004-04-21 2010-12-01 日立化成工業株式会社 樹脂付き金属箔

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06507758A (ja) * 1991-06-04 1994-09-01 アンプ―アクゾ　リンラム　ブイオーエフ プリント配線板およびその製造方法
JPH06344500A (ja) * 1993-06-03 1994-12-20 Nippon Pillar Packing Co Ltd 積層板の製造方法および積層板用混合フィルム
JP2003055486A (ja) * 2001-05-24 2003-02-26 Hitachi Chem Co Ltd プリプレグ及び積層板
JP2005281661A (ja) * 2004-03-05 2005-10-13 Hitachi Chem Co Ltd プリプレグ、並びにこれを用いて得られる金属箔張積層板及び印刷回路板

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018041800A (ja) * 2016-09-06 2018-03-15 パナソニックＩｐマネジメント株式会社 プリント配線板、プリント回路板、プリプレグ
WO2018047613A1 (ja) * 2016-09-06 2018-03-15 パナソニックＩｐマネジメント株式会社 プリント配線板、プリント回路板、プリプレグ
US11114354B2 (en) 2016-09-06 2021-09-07 Panasonic Intellectual Property Management Co., Ltd. Printed wiring board, printed circuit board, prepreg
TWI770047B (zh) * 2016-09-06 2022-07-11 日商松下知識產權經營股份有限公司 印刷配線板、印刷電路板、預浸體
CN114845874A (zh) * 2019-12-17 2022-08-02 三菱瓦斯化学株式会社 树脂片和印刷电路板
CN116080157A (zh) * 2022-11-16 2023-05-09 广东威世新材料有限公司 一种印制电路用覆铜箔环氧玻纤布层压板
CN116080157B (zh) * 2022-11-16 2023-08-04 广东威世新材料有限公司 一种印制电路用覆铜箔环氧玻纤布层压板

Also Published As

Publication number Publication date
JP5056553B2 (ja) 2012-10-24
TW200908821A (en) 2009-02-16
JP2009190387A (ja) 2009-08-27

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