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WO2008099596A1 - キャリア材料付き層間絶縁膜およびこれを用いる多層プリント回路板 - Google Patents

キャリア材料付き層間絶縁膜およびこれを用いる多層プリント回路板 Download PDF

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Publication number
WO2008099596A1
WO2008099596A1 PCT/JP2008/000201 JP2008000201W WO2008099596A1 WO 2008099596 A1 WO2008099596 A1 WO 2008099596A1 JP 2008000201 W JP2008000201 W JP 2008000201W WO 2008099596 A1 WO2008099596 A1 WO 2008099596A1
Authority
WO
WIPO (PCT)
Prior art keywords
insulating film
interlayer insulating
carrier material
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/000201
Other languages
English (en)
French (fr)
Inventor
Toyoaki Kishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to US12/524,161 priority Critical patent/US8637151B2/en
Priority to CN2008800049171A priority patent/CN101611660B/zh
Priority to EP20080710355 priority patent/EP2129200A1/en
Priority to JP2008558005A priority patent/JPWO2008099596A1/ja
Priority to KR1020097017814A priority patent/KR20090109114A/ko
Publication of WO2008099596A1 publication Critical patent/WO2008099596A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
    • Y10T442/608—Including strand or fiber material which is of specific structural definition
    • Y10T442/614—Strand or fiber material specified as having microdimensions [i.e., microfiber]
    • Y10T442/623—Microfiber is glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

【課題】薄型の多層プリント回路板に対応した、剛性に優れた多層プリント回路板に用いるキャリア材料付き絶縁樹脂層を提供すること。 【解決手段】本発明によれば、金属箔または樹脂フィルムからなるキャリア材料と、前記キャリア材料の一方の面に設けられた層間絶縁膜と、を備えるキャリア材料付き層間絶縁膜であって、前記層間絶縁膜は、樹脂が含浸された基材からなり、前記基材の厚さは、８μｍ以上、２０μｍ以下であり、前記樹脂を１７０°Cで１時間、３０ｋｇｆ／ｃｍ２の圧力で硬化したとき、ＴＭＡ法を用いて測定した、前記層間絶縁膜の平面方向の伸び率が０．０５％以下である、キャリア材料付き層間絶縁膜が提供される。
PCT/JP2008/000201 2007-02-14 2008-02-12 キャリア材料付き層間絶縁膜およびこれを用いる多層プリント回路板 Ceased WO2008099596A1 (ja)

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US12/524,161 US8637151B2 (en) 2007-02-14 2008-02-12 Interlayer dielectric film with carrier material and multilayer printed circuit board therewith
CN2008800049171A CN101611660B (zh) 2007-02-14 2008-02-12 具有载体材料的层间绝缘膜和使用该层间绝缘膜的多层印刷电路板
EP20080710355 EP2129200A1 (en) 2007-02-14 2008-02-12 Interlayer insulating film having carrier material, and multilayer printed circuit board using the interlayer insulating film
JP2008558005A JPWO2008099596A1 (ja) 2007-02-14 2008-02-12 キャリア材料付き層間絶縁膜およびこれを用いる多層プリント回路板
KR1020097017814A KR20090109114A (ko) 2007-02-14 2008-02-12 캐리어 재료 부착 층간 절연막 및 이것을 이용하는 다층 프린트 회로판

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JP2007-033045 2007-02-14
JP2007033045 2007-02-14

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CN (1) CN101611660B (ja)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010194930A (ja) * 2009-02-26 2010-09-09 Sumitomo Bakelite Co Ltd 絶縁層付支持材料の製造方法、絶縁層付支持材料、プリント配線板および絶縁層付支持材料の製造装置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9569770B1 (en) 2009-01-13 2017-02-14 Amazon Technologies, Inc. Generating constructed phrases
US10007712B1 (en) 2009-08-20 2018-06-26 Amazon Technologies, Inc. Enforcing user-specified rules
US8799658B1 (en) 2010-03-02 2014-08-05 Amazon Technologies, Inc. Sharing media items with pass phrases
JP6343885B2 (ja) * 2013-08-02 2018-06-20 味の素株式会社 多層プリント配線板の製造方法
JP6354600B2 (ja) * 2015-01-16 2018-07-11 株式会社オートネットワーク技術研究所 回路構成体、電気接続箱及び回路構成体の製造方法
WO2023064573A1 (en) * 2021-10-15 2023-04-20 Schlumberger Technology Corporation Dielectric insulation film

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000244114A (ja) 1999-02-23 2000-09-08 Matsushita Electric Works Ltd ビルドアップ多層配線板の製造方法
WO2003018675A1 (en) * 2001-08-31 2003-03-06 Sumitomo Bakelite Company Limited Resin composition, prepreg, laminated sheet and semiconductor package
JP2004050755A (ja) * 2002-07-23 2004-02-19 Asahi Schwebel Co Ltd 積層板及びその製造方法
JP2004284192A (ja) * 2003-03-24 2004-10-14 Matsushita Electric Works Ltd 金属箔付き絶縁シート及びその製造方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0325996A (ja) * 1989-06-23 1991-02-04 Nitto Boseki Co Ltd 射出成形プリント配線板用転写シート及びその製造方法
JP2601128B2 (ja) * 1992-05-06 1997-04-16 松下電器産業株式会社 回路形成用基板の製造方法および回路形成用基板
JPH06128461A (ja) * 1992-10-19 1994-05-10 Matsushita Electric Works Ltd 積層板用樹脂組成物
US5508328A (en) * 1994-11-17 1996-04-16 Alliedsignal Inc. Curing epoxy resins using dicy, imidazole and acid
US5670250A (en) * 1995-02-24 1997-09-23 Polyclad Laminates, Inc. Circuit board prepreg with reduced dielectric constant
JP3862770B2 (ja) * 1995-09-07 2006-12-27 日立化成工業株式会社 金属張積層板の製造方法
TW389780B (en) * 1995-09-13 2000-05-11 Hitachi Chemical Co Ltd Prepreg for printed circuit board
JP3197213B2 (ja) * 1996-05-29 2001-08-13 松下電器産業株式会社 プリント配線板およびその製造方法
JPH10212364A (ja) * 1996-11-26 1998-08-11 Ajinomoto Co Inc 積層板用プリプレグ及びこれを用いたプリント配線板の製造方法
US6565954B2 (en) * 1998-05-14 2003-05-20 Matsushita Electric Industrial Co., Ltd. Circuit board and method of manufacturing the same
KR100635897B1 (ko) * 1998-12-22 2006-10-18 히다찌 가세이 고오교 가부시끼가이샤 접착제 코팅된 구리 호일, 구리-클래딩된 적층물 및 이를사용한 인쇄 배선판
KR100567714B1 (ko) * 1999-02-19 2006-04-05 히다치 가세고교 가부시끼가이샤 프리프레그, 금속장 적층판 및 이들을 이용한 인쇄 배선판
US6245696B1 (en) * 1999-06-25 2001-06-12 Honeywell International Inc. Lasable bond-ply materials for high density printed wiring boards
JP4423779B2 (ja) * 1999-10-13 2010-03-03 味の素株式会社 エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法
JP4337204B2 (ja) * 2000-01-31 2009-09-30 住友ベークライト株式会社 多層プリント配線板用層間絶縁接着剤
JP2002124763A (ja) * 2000-10-16 2002-04-26 Matsushita Electric Ind Co Ltd 回路形成基板の製造方法、回路形成基板および回路形成基板用材料
JP2002226816A (ja) * 2001-01-30 2002-08-14 Nippon Chem Ind Co Ltd 難燃性接着剤組成物、及びそれを用いる難燃性接着剤フィルム、難燃性接着剤付金属箔並びにプリント配線板
JP2003082066A (ja) * 2001-09-12 2003-03-19 Sumitomo Bakelite Co Ltd 積層板用エポキシ樹脂組成物、プリプレグ及び積層板
JP2003283142A (ja) * 2002-03-27 2003-10-03 Sumitomo Bakelite Co Ltd 樹脂組成物および樹脂組成物の製造方法
JP2003340952A (ja) * 2002-05-28 2003-12-02 Mitsubishi Gas Chem Co Inc アディティブ用繊維布基材入りｂステージ樹脂組成物シートの製造方法。
WO2007040125A1 (ja) * 2005-09-30 2007-04-12 Sumitomo Bakelite Co., Ltd. キャリア付きプリプレグの製造方法、キャリア付きプリプレグ、薄型両面板の製造方法、薄型両面板、及び多層プリント配線板の製造方法
MY146044A (en) * 2005-12-01 2012-06-15 Sumitomo Bakelite Co Prepreg, method for manufacturing prepreg, substrate, and semiconductor device
JP2006176795A (ja) * 2006-02-16 2006-07-06 Sumitomo Bakelite Co Ltd 多層プリント配線板用層間絶縁樹脂組成物
WO2008087972A1 (ja) * 2007-01-16 2008-07-24 Sumitomo Bakelite Co., Ltd. 絶縁樹脂シート積層体、該絶縁樹脂シート積層体を積層してなる多層プリント配線板
CN101683005B (zh) * 2007-04-11 2012-12-05 环球产权公司 电路材料、多层电路及其制造方法
WO2009119046A1 (ja) * 2008-03-26 2009-10-01 住友ベークライト株式会社 銅箔付き樹脂シート、多層プリント配線板、多層プリント配線の板製造方法および半導体装置
TWI499690B (zh) * 2009-03-13 2015-09-11 Ajinomoto Kk Paste metal laminates

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000244114A (ja) 1999-02-23 2000-09-08 Matsushita Electric Works Ltd ビルドアップ多層配線板の製造方法
WO2003018675A1 (en) * 2001-08-31 2003-03-06 Sumitomo Bakelite Company Limited Resin composition, prepreg, laminated sheet and semiconductor package
JP2004050755A (ja) * 2002-07-23 2004-02-19 Asahi Schwebel Co Ltd 積層板及びその製造方法
JP2004284192A (ja) * 2003-03-24 2004-10-14 Matsushita Electric Works Ltd 金属箔付き絶縁シート及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010194930A (ja) * 2009-02-26 2010-09-09 Sumitomo Bakelite Co Ltd 絶縁層付支持材料の製造方法、絶縁層付支持材料、プリント配線板および絶縁層付支持材料の製造装置

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CN101611660A (zh) 2009-12-23
JP2013239701A (ja) 2013-11-28
US20100032192A1 (en) 2010-02-11
TWI496805B (zh) 2015-08-21
EP2129200A1 (en) 2009-12-02
US8637151B2 (en) 2014-01-28
JPWO2008099596A1 (ja) 2010-05-27
TW200842137A (en) 2008-11-01
CN101611660B (zh) 2012-01-25

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