[go: up one dir, main page]

WO2008126642A1 - 金属箔張積層板及びプリント配線板 - Google Patents

金属箔張積層板及びプリント配線板 Download PDF

Info

Publication number
WO2008126642A1
WO2008126642A1 PCT/JP2008/054875 JP2008054875W WO2008126642A1 WO 2008126642 A1 WO2008126642 A1 WO 2008126642A1 JP 2008054875 W JP2008054875 W JP 2008054875W WO 2008126642 A1 WO2008126642 A1 WO 2008126642A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal foil
plated laminated
printed wiring
board
laminated board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/054875
Other languages
English (en)
French (fr)
Inventor
Kazumasa Takeuchi
Masaki Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of WO2008126642A1 publication Critical patent/WO2008126642A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

　５０μｍ以下の厚みを有するガラスクロスである繊維基材と、金属箔及び該金属箔上に形成された加熱により硬化する樹脂組成物からなる樹脂層を備える一組の樹脂付金属箔とを樹脂層が繊維基材に接するように配置し、加熱加圧により一体化してなる金属箔張積層板。
PCT/JP2008/054875 2007-04-10 2008-03-17 金属箔張積層板及びプリント配線板 Ceased WO2008126642A1 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-102726 2007-04-10
JP2007102726 2007-04-10
JP2008-034871 2008-02-15
JP2008034871 2008-02-15

Publications (1)

Publication Number Publication Date
WO2008126642A1 true WO2008126642A1 (ja) 2008-10-23

Family

ID=39863766

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054875 Ceased WO2008126642A1 (ja) 2007-04-10 2008-03-17 金属箔張積層板及びプリント配線板

Country Status (3)

Country Link
JP (1) JP5470725B2 (ja)
TW (1) TWI491320B (ja)
WO (1) WO2008126642A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102285168A (zh) * 2011-05-06 2011-12-21 广东生益科技股份有限公司 埋容材料及其制作方法
CN116674265A (zh) * 2023-07-04 2023-09-01 江苏生益特种材料有限公司 一种改善覆铜板表面抗氧化的工艺方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5577837B2 (ja) * 2010-05-12 2014-08-27 日立化成株式会社 金属箔張り積層板及びその製造方法、並びにこれを用いたプリント配線板
CN103379995B (zh) * 2011-02-21 2014-12-31 松下电器产业株式会社 覆金属层压板及印刷线路板
JP5821733B2 (ja) * 2011-03-31 2015-11-24 住友ベークライト株式会社 積層シート製造装置、積層シートの製造方法
JP2013123907A (ja) 2011-12-16 2013-06-24 Panasonic Corp 金属張積層板、及びプリント配線板
WO2014157468A1 (ja) * 2013-03-27 2014-10-02 日立化成株式会社 積層体、積層板、プリント配線板、及び積層体、積層板の製造方法
KR102810893B1 (ko) * 2016-05-25 2025-05-20 가부시끼가이샤 레조낙 금속장 적층판, 프린트 배선판 및 반도체 패키지
TWI896923B (zh) * 2023-01-04 2025-09-11 亞洲電材股份有限公司 複合膜及其製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04153230A (ja) * 1990-10-16 1992-05-26 Sumitomo Bakelite Co Ltd 積層板用プリプレグの製造方法
JPH04345844A (ja) * 1991-05-23 1992-12-01 Hitachi Chem Co Ltd 積層板の連続製造方法
JP2001334541A (ja) * 2000-05-26 2001-12-04 Sumitomo Bakelite Co Ltd 積層板の製造方法
JP2003276041A (ja) * 2002-03-22 2003-09-30 Sumitomo Bakelite Co Ltd 積層板の製造方法
WO2005085335A1 (ja) * 2004-03-04 2005-09-15 Hitachi Chemical Co., Ltd. プリプレグ、金属箔張積層板及びこれらを使用した印刷回路板
JP2005298713A (ja) * 2004-04-14 2005-10-27 Toray Ind Inc 繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08150683A (ja) * 1994-11-28 1996-06-11 Nitto Boseki Co Ltd 半硬化状金属箔張り積層板及びその製造方法
JP2000062092A (ja) * 1998-08-24 2000-02-29 Matsushita Electric Works Ltd 積層板の製造方法
DE60140576D1 (de) * 2000-03-31 2009-12-31 Hitachi Chemical Co Ltd Hitzehärtbare Silikonzusammensetzung, Harzfilm, Metallfolie, Isolationsfilm, Metall-Leiterplatte-Laminat, Multischicht-Leiterplatte, die Zusammensetzung enthaltend und Verwendung der Zusammensetzung
JP2002249552A (ja) * 2001-02-23 2002-09-06 Matsushita Electric Works Ltd リン含有エポキシ樹脂組成物、樹脂シート、樹脂付き金属箔、プリプレグ、積層板、多層板
JP4269746B2 (ja) * 2002-04-02 2009-05-27 凸版印刷株式会社 プリント配線板の製造方法、プリント配線板および半導体パッケージ
JP2004123870A (ja) * 2002-10-01 2004-04-22 Sumitomo Bakelite Co Ltd プリプレグの製造方法および転写シート
JP4590982B2 (ja) * 2004-04-21 2010-12-01 日立化成工業株式会社 樹脂付き金属箔

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04153230A (ja) * 1990-10-16 1992-05-26 Sumitomo Bakelite Co Ltd 積層板用プリプレグの製造方法
JPH04345844A (ja) * 1991-05-23 1992-12-01 Hitachi Chem Co Ltd 積層板の連続製造方法
JP2001334541A (ja) * 2000-05-26 2001-12-04 Sumitomo Bakelite Co Ltd 積層板の製造方法
JP2003276041A (ja) * 2002-03-22 2003-09-30 Sumitomo Bakelite Co Ltd 積層板の製造方法
WO2005085335A1 (ja) * 2004-03-04 2005-09-15 Hitachi Chemical Co., Ltd. プリプレグ、金属箔張積層板及びこれらを使用した印刷回路板
JP2005298713A (ja) * 2004-04-14 2005-10-27 Toray Ind Inc 繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102285168A (zh) * 2011-05-06 2011-12-21 广东生益科技股份有限公司 埋容材料及其制作方法
CN116674265A (zh) * 2023-07-04 2023-09-01 江苏生益特种材料有限公司 一种改善覆铜板表面抗氧化的工艺方法

Also Published As

Publication number Publication date
JP2009214525A (ja) 2009-09-24
TW200904268A (en) 2009-01-16
TWI491320B (zh) 2015-07-01
JP5470725B2 (ja) 2014-04-16

Similar Documents

Publication Publication Date Title
WO2008126642A1 (ja) 金属箔張積層板及びプリント配線板
TW200724583A (en) Method of manufacturing prepreg with carrier, prepreg with carrier, method of manufacturing thin double-faced board, thin double-faced board, and method of manufacturing multilayer printed wiring board
WO2008146487A1 (ja) 回路基板およびその製造方法
MY150055A (en) Insulating resin sheet laminate and multi-layer printed circuit board including insulating resin sheet laminate
WO2009120311A3 (en) Biolaminate composite assembly and related methods
TW200735730A (en) Resin composite copper foil, printed wiring board, and production process thereof
WO2008126426A1 (ja) 導電性物質吸着性樹脂フイルム、導電性物質吸着性樹脂フイルムの製造方法、それを用いた金属層付き樹脂フイルム、及び、金属層付き樹脂フイルムの製造方法
JP2012515671A5 (ja)
WO2009064121A3 (en) Prepreg having uniform permittivity, and metal clad laminates and print wiring board using the same
EP1422055A4 (en) A COATER-COATED LAMINATED FILM-FORMING CAPACITOR LAYER AND METHOD OF MANUFACTURING THEREOF
TWI367908B (en) Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate
MY155884A (en) Two-layered laminate having metal foil cladded on its one surface, method for production of the laminate, single-sided printed wiring board, and method for production of the wiring board
TW200709751A (en) Polyimide copper foil laminate and method of producing the same
WO2008117711A1 (ja) 金属張り積層板と多層積層板並びにその製造方法
WO2010050759A3 (en) Flexible metal-clad laminate and a method of manufacturing the same
WO2008099596A1 (ja) キャリア材料付き層間絶縁膜およびこれを用いる多層プリント回路板
WO2005070844A3 (en) Multiple layer glass panels with patterned light transmission
WO2008126817A1 (ja) 金属箔張り積層板およびプリント配線板
WO2006112474A3 (ja) 繊維－樹脂複合体、積層体、およびプリント配線板、並びにプリント配線板の製造方法
WO2009017051A1 (ja) 多層回路基板用複合体
EP1764214A3 (en) Laminated polyester film, flame-retardant polyester film thereof copper-clad laminated plate and circuit substrate
TWI457062B (zh) 多層印刷電路板之製造方法
TW200640663A (en) Polyimide-copper composite laminate
WO2009054523A1 (ja) フレキシブルプリント配線板、それを用いたインレットシート、ｒｆｉｄメディア及びその製造方法
WO2006074276A3 (en) Foil or film laminated enhanced natural fiber/polymer composite

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08722270

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08722270

Country of ref document: EP

Kind code of ref document: A1