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USD658139S1 - High-density emitter package - Google Patents

High-density emitter package Download PDF

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Publication number
USD658139S1
USD658139S1 US29/384,360 US201129384360F USD658139S US D658139 S1 USD658139 S1 US D658139S1 US 201129384360 F US201129384360 F US 201129384360F US D658139 S USD658139 S US D658139S
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US
United States
Prior art keywords
emitter package
density emitter
view
density
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/384,360
Inventor
Peter Scott Andrews
Raymond Rosado
Michael P. Laughner
David T. Emerson
Amber C. Abare
Jeffrey C. Britt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CreeLED Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Priority to US29/384,360 priority Critical patent/USD658139S1/en
Assigned to CREE, INC. reassignment CREE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: EMERSON, DAVID T., ABARE, AMBER C., ANDREWS, PETER S., BRITT, JEFFREY C., LAUGHNER, MICHAEL P., ROSADO, RAYMOND
Priority to TW100303968F priority patent/TWD148537S/en
Application granted granted Critical
Publication of USD658139S1 publication Critical patent/USD658139S1/en
Assigned to CREE LED, INC. reassignment CREE LED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
Assigned to SMART MODULAR TECHNOLOGIES, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, CREELED, INC., SMART EMBEDDED COMPUTING, INC. reassignment SMART MODULAR TECHNOLOGIES, INC. RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Assignors: CITIZENS BANK, N.A.
Assigned to JPMORGAN CHASE BANK, N.A. reassignment JPMORGAN CHASE BANK, N.A. PATENT SECURITY AGREEMENT Assignors: CREELED, INC., PENGUIN COMPUTING, INC., PENGUIN SOLUTIONS CORPORATION (DE), SMART EMBEDDED COMPUTING, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, SMART MODULAR TECHNOLOGIES, INC.
Assigned to CREELED, INC. reassignment CREELED, INC. CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 56012 FRAME 200. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Assignors: CREE, INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top perspective view showing an embodiment of our design for a high-density emitter package.
FIG. 2 is a top view of the embodiment of our design shown in FIG. 1.
FIG. 3 is a side view of the embodiment of our design shown in FIG. 1.
FIG. 4 is another side view of the embodiment of our design as shown in FIG. 1.
FIG. 5 is a bottom perspective view of the embodiment of our design shown in FIG. 1.
FIG. 6 is another side view of the embodiment of our design as shown in FIG. 1.
FIG. 7 is another side view of the embodiment of our design as shown in FIG. 1.
FIG. 8 is a bottom view of the embodiment of our design as shown in FIG. 1.
FIG. 9 is a top perspective view showing an alternate environment thereof;
FIG. 10 is a top view thereof;
FIG. 11 is a side view thereof;
FIG. 12 is another side view thereof;
FIG. 13 is a bottom perspective view thereof;
FIG. 14 is another side view thereof;
FIG. 15 is another side view thereof; and,
FIG. 16 is a bottom view thereof.
The broken lines in the drawing views is for the purpose of illustrating environmental structure and forms no part of the claimed design.

Claims (1)

  1. We claim the ornamental design for a high-density emitter package, as shown and described.
US29/384,360 2011-01-31 2011-01-31 High-density emitter package Active USD658139S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/384,360 USD658139S1 (en) 2011-01-31 2011-01-31 High-density emitter package
TW100303968F TWD148537S (en) 2011-01-31 2011-08-01 Light-emitting diode package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/384,360 USD658139S1 (en) 2011-01-31 2011-01-31 High-density emitter package

Publications (1)

Publication Number Publication Date
USD658139S1 true USD658139S1 (en) 2012-04-24

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/384,360 Active USD658139S1 (en) 2011-01-31 2011-01-31 High-density emitter package

Country Status (2)

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US (1) USD658139S1 (en)
TW (1) TWD148537S (en)

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD674357S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674360S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674359S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674362S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674363S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674358S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674757S1 (en) * 2011-10-31 2013-01-22 Silitek Electronics (Guangzhou) Co., Ltd. Package carrier of light emitting diode
USD674758S1 (en) * 2011-10-31 2013-01-22 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
USD703624S1 (en) * 2012-04-06 2014-04-29 Cree, Inc. LED-array package
USD709464S1 (en) * 2012-05-31 2014-07-22 Cree, Inc. Light emitting diode (LED) package
USD711841S1 (en) * 2012-08-23 2014-08-26 Cree, Inc. Light emitting diode (LED) package
USD712849S1 (en) * 2012-05-14 2014-09-09 Cree, Inc. Light emitting diode (LED) package with multiple anodes and cathodes
USD713804S1 (en) * 2012-05-14 2014-09-23 Cree, Inc. Light emitting diode (LED) package with multiple anodes and cathodes
US9082921B2 (en) 2007-10-31 2015-07-14 Cree, Inc. Multi-die LED package
US9172012B2 (en) 2007-10-31 2015-10-27 Cree, Inc. Multi-chip light emitter packages and related methods
USD741821S1 (en) * 2014-04-10 2015-10-27 Kingbright Electronics Co., Ltd. LED component
USD749051S1 (en) * 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
USD753612S1 (en) * 2012-09-07 2016-04-12 Cree, Inc. Light emitter device
US9349929B2 (en) 2012-05-31 2016-05-24 Cree, Inc. Light emitter packages, systems, and methods
US9397266B2 (en) 2007-11-14 2016-07-19 Cree, Inc. Lateral semiconductor light emitting diodes having large area contacts
US9484499B2 (en) 2007-04-20 2016-11-01 Cree, Inc. Transparent ohmic contacts on light emitting diodes with carrier substrates
USD772181S1 (en) * 2015-04-02 2016-11-22 Genesis Photonics Inc. Light emitting diode package substrate
US9515055B2 (en) 2012-05-14 2016-12-06 Cree, Inc. Light emitting devices including multiple anodes and cathodes
USD777122S1 (en) * 2015-02-27 2017-01-24 Cree, Inc. LED package
USD783547S1 (en) * 2015-06-04 2017-04-11 Cree, Inc. LED package
US9666762B2 (en) 2007-10-31 2017-05-30 Cree, Inc. Multi-chip light emitter packages and related methods
USD790486S1 (en) * 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
US9923132B2 (en) 2013-05-24 2018-03-20 Cree, Inc. Solid state lighting component package with conformal reflective coating
USD826871S1 (en) * 2014-12-11 2018-08-28 Cree, Inc. Light emitting diode device
US10439112B2 (en) 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
USD926714S1 (en) * 2019-10-30 2021-08-03 Creeled, Inc. Light emitting diode package

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7213940B1 (en) 2005-12-21 2007-05-08 Led Lighting Fixtures, Inc. Lighting device and lighting method
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
US20090283787A1 (en) 2007-11-14 2009-11-19 Matthew Donofrio Semiconductor light emitting diodes having reflective structures and methods of fabricating same
USD615504S1 (en) 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US20100140634A1 (en) * 2009-11-09 2010-06-10 Cree Led Lighting Solutions, Inc. Solid state emitter package including red and blue emitters
US20100140633A1 (en) 2009-02-19 2010-06-10 David Todd Emerson Methods for Combining Light Emitting Devices in a Package and Packages Including Combined Light Emitting Devices
US20100252851A1 (en) * 2007-10-31 2010-10-07 Cree, Inc. Led package with increased feature sizes
USD631020S1 (en) * 2010-04-29 2011-01-18 Edison Opto Corporation LED package
US20110062482A1 (en) * 2010-01-20 2011-03-17 Bridgelux, Inc. Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces
US20110127912A1 (en) * 2009-11-30 2011-06-02 Young Jin Lee Led package, led package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof
US20110248289A1 (en) * 2010-04-09 2011-10-13 Everlight Electronics Co., Ltd. Light emitting diode package, lighting device and light emitting diode package substrate
USD650343S1 (en) * 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7213940B1 (en) 2005-12-21 2007-05-08 Led Lighting Fixtures, Inc. Lighting device and lighting method
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
USD615504S1 (en) 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US20100252851A1 (en) * 2007-10-31 2010-10-07 Cree, Inc. Led package with increased feature sizes
US20090283787A1 (en) 2007-11-14 2009-11-19 Matthew Donofrio Semiconductor light emitting diodes having reflective structures and methods of fabricating same
US20100140633A1 (en) 2009-02-19 2010-06-10 David Todd Emerson Methods for Combining Light Emitting Devices in a Package and Packages Including Combined Light Emitting Devices
US20100140634A1 (en) * 2009-11-09 2010-06-10 Cree Led Lighting Solutions, Inc. Solid state emitter package including red and blue emitters
US20110127912A1 (en) * 2009-11-30 2011-06-02 Young Jin Lee Led package, led package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof
US20110062482A1 (en) * 2010-01-20 2011-03-17 Bridgelux, Inc. Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces
US20110248289A1 (en) * 2010-04-09 2011-10-13 Everlight Electronics Co., Ltd. Light emitting diode package, lighting device and light emitting diode package substrate
USD631020S1 (en) * 2010-04-29 2011-01-18 Edison Opto Corporation LED package
USD650343S1 (en) * 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9484499B2 (en) 2007-04-20 2016-11-01 Cree, Inc. Transparent ohmic contacts on light emitting diodes with carrier substrates
US9082921B2 (en) 2007-10-31 2015-07-14 Cree, Inc. Multi-die LED package
US9666762B2 (en) 2007-10-31 2017-05-30 Cree, Inc. Multi-chip light emitter packages and related methods
US9172012B2 (en) 2007-10-31 2015-10-27 Cree, Inc. Multi-chip light emitter packages and related methods
US9397266B2 (en) 2007-11-14 2016-07-19 Cree, Inc. Lateral semiconductor light emitting diodes having large area contacts
USD674758S1 (en) * 2011-10-31 2013-01-22 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
USD674757S1 (en) * 2011-10-31 2013-01-22 Silitek Electronics (Guangzhou) Co., Ltd. Package carrier of light emitting diode
USD674362S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674358S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674363S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674359S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674357S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674360S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD703624S1 (en) * 2012-04-06 2014-04-29 Cree, Inc. LED-array package
USD704154S1 (en) * 2012-04-06 2014-05-06 Cree, Inc. Light emitter package
USD712849S1 (en) * 2012-05-14 2014-09-09 Cree, Inc. Light emitting diode (LED) package with multiple anodes and cathodes
USD713804S1 (en) * 2012-05-14 2014-09-23 Cree, Inc. Light emitting diode (LED) package with multiple anodes and cathodes
US9515055B2 (en) 2012-05-14 2016-12-06 Cree, Inc. Light emitting devices including multiple anodes and cathodes
USD749051S1 (en) * 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
US9349929B2 (en) 2012-05-31 2016-05-24 Cree, Inc. Light emitter packages, systems, and methods
USD709464S1 (en) * 2012-05-31 2014-07-22 Cree, Inc. Light emitting diode (LED) package
US10439112B2 (en) 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
USD711841S1 (en) * 2012-08-23 2014-08-26 Cree, Inc. Light emitting diode (LED) package
USD753612S1 (en) * 2012-09-07 2016-04-12 Cree, Inc. Light emitter device
US10944031B2 (en) 2013-05-24 2021-03-09 Cree, Inc. Solid state lighting component package with conformal reflective coating
US9923132B2 (en) 2013-05-24 2018-03-20 Cree, Inc. Solid state lighting component package with conformal reflective coating
USD741821S1 (en) * 2014-04-10 2015-10-27 Kingbright Electronics Co., Ltd. LED component
USD790486S1 (en) * 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
USD826871S1 (en) * 2014-12-11 2018-08-28 Cree, Inc. Light emitting diode device
USD777122S1 (en) * 2015-02-27 2017-01-24 Cree, Inc. LED package
USD790487S1 (en) * 2015-04-02 2017-06-27 Genesis Photonics Inc. Light emitting diode package substrate
USD772181S1 (en) * 2015-04-02 2016-11-22 Genesis Photonics Inc. Light emitting diode package substrate
USD783547S1 (en) * 2015-06-04 2017-04-11 Cree, Inc. LED package
USD926714S1 (en) * 2019-10-30 2021-08-03 Creeled, Inc. Light emitting diode package

Also Published As

Publication number Publication date
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