USD753612S1 - Light emitter device - Google Patents
Light emitter device Download PDFInfo
- Publication number
- USD753612S1 USD753612S1 US29/431,542 US201229431542F USD753612S US D753612 S1 USD753612 S1 US D753612S1 US 201229431542 F US201229431542 F US 201229431542F US D753612 S USD753612 S US D753612S
- Authority
- US
- United States
- Prior art keywords
- light emitter
- emitter device
- view
- design
- wire bond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The dashed broken lines are included for the purpose of illustrating environment of the design and form no part of the claimed design. The dot-dash broken lines represent boundaries of the claimed design. None of the broken lines form part of the claimed design.
Claims (1)
- The ornamental design for an improved wire bond for light emitter devices, as shown and described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/431,542 USD753612S1 (en) | 2012-09-07 | 2012-09-07 | Light emitter device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/431,542 USD753612S1 (en) | 2012-09-07 | 2012-09-07 | Light emitter device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD753612S1 true USD753612S1 (en) | 2016-04-12 |
Family
ID=55643560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/431,542 Active USD753612S1 (en) | 2012-09-07 | 2012-09-07 | Light emitter device |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD753612S1 (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018098041A1 (en) | 2016-11-22 | 2018-05-31 | Cree, Inc. | Light emitting diode (led) devices, components and methods |
| US10043960B2 (en) * | 2011-11-15 | 2018-08-07 | Cree, Inc. | Light emitting diode (LED) packages and related methods |
| USD826184S1 (en) * | 2016-03-24 | 2018-08-21 | Hamamatsu Photonics K.K. | Optical semiconductor element |
| USD831592S1 (en) * | 2016-03-24 | 2018-10-23 | Hamamatsu Photonics K.K. | Optical semiconductor element |
| USD831593S1 (en) * | 2016-03-24 | 2018-10-23 | Hamamatsu Photonics K.K | Optical semiconductor element |
| USD832802S1 (en) * | 2016-03-24 | 2018-11-06 | Hamamatsu Photonics K.K. | Optical semiconductor element |
| USD844183S1 (en) | 2016-08-19 | 2019-03-26 | Citizen Electronics Co., Ltd. | Light emitting diode |
| USD844576S1 (en) | 2017-07-25 | 2019-04-02 | Citizen Electronics Co., Ltd. | Light emitting diode |
| USD926714S1 (en) * | 2019-10-30 | 2021-08-03 | Creeled, Inc. | Light emitting diode package |
| USD1104971S1 (en) * | 2022-01-18 | 2025-12-09 | Creeled, Inc. | Light-emitting device package |
Citations (63)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4327860A (en) * | 1980-01-03 | 1982-05-04 | Kulicke And Soffa Ind. Inc. | Method of making slack free wire interconnections |
| US4437604A (en) | 1982-03-15 | 1984-03-20 | Kulicke & Soffa Industries, Inc. | Method of making fine wire interconnections |
| US4445633A (en) | 1982-02-11 | 1984-05-01 | Rockwell International Corporation | Automatic bonder for forming wire interconnections of automatically controlled configuration |
| USH445H (en) | 1985-11-29 | 1988-03-01 | American Telephone and Telegraph Company, AT&T Technologies, Incorporated | Method of forming light emitting device with direct contact lens |
| US4932584A (en) | 1986-08-08 | 1990-06-12 | Kabushiki Kaisha Shinkawa | Method of wire bonding |
| US5612549A (en) * | 1994-03-24 | 1997-03-18 | Motorola | Integrated electro-optical package |
| US5760422A (en) * | 1995-06-21 | 1998-06-02 | Rohm Co., Ltd. | Light-emitting diode chip and light-emitting diode using the same |
| US5938105A (en) | 1997-01-15 | 1999-08-17 | National Semiconductor Corporation | Encapsulated ball bonding apparatus and method |
| US6010057A (en) * | 1996-03-02 | 2000-01-04 | Esec Sa | Method for making a wire connections of predetermined shape |
| US6065667A (en) | 1997-01-15 | 2000-05-23 | National Semiconductor Corporation | Method and apparatus for fine pitch wire bonding |
| US6119926A (en) * | 1998-02-19 | 2000-09-19 | Esec Sa | Method for producing wire connections on semiconductor chips |
| US6180962B1 (en) * | 1998-10-23 | 2001-01-30 | Rohm Co., Ltd. | Chip type semiconductor light emitting device having a solder preventive portion |
| US6244499B1 (en) | 1999-12-13 | 2001-06-12 | Advanced Semiconductor Engineering, Inc. | Structure of a ball bump for wire bonding and the formation thereof |
| US6315190B1 (en) * | 1998-06-25 | 2001-11-13 | Kabushiki Kaisha Shinkawa | Wire bonding method |
| US6391759B1 (en) * | 2000-04-27 | 2002-05-21 | Advanced Semiconductor Engineering, Inc. | Bonding method which prevents wire sweep and the wire structure thereof |
| US6489637B1 (en) * | 1999-06-09 | 2002-12-03 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device |
| US6640436B1 (en) * | 1997-10-16 | 2003-11-04 | Nec Electronics Corporation | Method of fabricating a coated metallic wire, method of removing insulation from the coated metallic wire and method of fabricating a semiconductor device with the wire |
| US20040262738A1 (en) * | 2003-06-27 | 2004-12-30 | Lee Kong Weng | Packaging device for semiconductor die, semiconductor device incorporating same and method of making same |
| US6933223B1 (en) | 2004-04-15 | 2005-08-23 | National Semiconductor Corporation | Ultra-low loop wire bonding |
| US7086148B2 (en) * | 2004-02-25 | 2006-08-08 | Agere Systems Inc. | Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit |
| US7135034B2 (en) * | 2003-11-14 | 2006-11-14 | Lumerx, Inc. | Flexible array |
| US7445354B2 (en) * | 2005-09-27 | 2008-11-04 | Nichia Corporation | Light emitting apparatus |
| US20090090928A1 (en) * | 2007-09-25 | 2009-04-09 | Sanyo Electric Co., Ltd. | Light emitting module and method for manufacturing the same |
| US20090108281A1 (en) * | 2007-10-31 | 2009-04-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| US7547626B2 (en) * | 2006-10-27 | 2009-06-16 | Samsung Techwin Co., Ltd. | Semiconductor package and method of forming wire loop of semiconductor package |
| US20100090330A1 (en) | 2007-03-23 | 2010-04-15 | Sanyo Electric Co., Ltd. | Semiconductor device and method of manufacturing the same |
| USD615504S1 (en) * | 2007-10-31 | 2010-05-11 | Cree, Inc. | Emitter package |
| US7750361B2 (en) * | 2007-08-10 | 2010-07-06 | Stanley Electric Co., Ltd. | Surface mount light emitting apparatus |
| US20100176500A1 (en) | 2009-01-15 | 2010-07-15 | Hishioka Maiko | Semiconductor device |
| US20100224890A1 (en) * | 2006-09-18 | 2010-09-09 | Cree, Inc. | Light emitting diode chip with electrical insulation element |
| US20100244282A1 (en) | 2007-09-25 | 2010-09-30 | Silverbrook Research Pty Ltd | Assembly of electronic components |
| US7815343B2 (en) * | 2006-08-04 | 2010-10-19 | Nichia Corporation | Light emitting device |
| US20110062482A1 (en) * | 2010-01-20 | 2011-03-17 | Bridgelux, Inc. | Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces |
| US20110079904A1 (en) | 2008-10-21 | 2011-04-07 | Kabushiki Kaisha Shinkawa | Semiconductor device |
| US20110089443A1 (en) * | 2009-10-15 | 2011-04-21 | Forward Electronics Co., Ltd. | Packaging Structure of AC light-emitting diodes |
| US20110220920A1 (en) * | 2010-03-09 | 2011-09-15 | Brian Thomas Collins | Methods of forming warm white light emitting devices having high color rendering index values and related light emitting devices |
| US8022431B2 (en) * | 2004-11-04 | 2011-09-20 | Hitachi Displays, Ltd. | Illuminating apparatus, method for fabricating the using the same and display apparatus using the same |
| US20110248289A1 (en) * | 2010-04-09 | 2011-10-13 | Everlight Electronics Co., Ltd. | Light emitting diode package, lighting device and light emitting diode package substrate |
| US20110291154A1 (en) * | 2009-02-10 | 2011-12-01 | Nichia Corporation | Semiconductor light emitting device |
| USD650343S1 (en) * | 2011-01-31 | 2011-12-13 | Cree, Inc. | Multiple configuration light emitting device package |
| US8084777B2 (en) | 2009-03-24 | 2011-12-27 | Bridgelux, Inc. | Light emitting diode source with protective barrier |
| US20120091489A1 (en) | 2010-10-15 | 2012-04-19 | Nippon Carbide Industries Co., Inc. | Substrate for mounting light-emitting elements, light-emitting device, and method for manufacturing same |
| USD658139S1 (en) * | 2011-01-31 | 2012-04-24 | Cree, Inc. | High-density emitter package |
| USD660257S1 (en) * | 2011-01-31 | 2012-05-22 | Cree, Inc. | Emitter package |
| USD660258S1 (en) * | 2011-05-04 | 2012-05-22 | Epistar Corporation | Light emitting diode |
| US20120305949A1 (en) * | 2011-01-31 | 2012-12-06 | Matthew Donofrio | Light Emitting Diode (LED) Arrays Including Direct Die Attach And Related Assemblies |
| USD675169S1 (en) * | 2011-12-13 | 2013-01-29 | Lextar Electronics Corp. | Multi-chip LED |
| US20130092960A1 (en) * | 2007-10-31 | 2013-04-18 | Ruud Lighting, Inc. | Multi-Die LED Package |
| US20130105835A1 (en) * | 2011-10-31 | 2013-05-02 | Lite-On Technology Corp. | Light-emitting diode device |
| US8519426B2 (en) * | 2010-08-09 | 2013-08-27 | Lg Innotek Co., Ltd. | Light emitting device and lighting system having the same |
| USD689209S1 (en) * | 2011-01-31 | 2013-09-03 | Cree, Inc. | Lamp packages |
| USD689210S1 (en) * | 2011-01-31 | 2013-09-03 | Cree, Inc. | Lamp packages |
| USD691973S1 (en) * | 2011-07-08 | 2013-10-22 | Cree, Inc. | Lamp packages |
| US8648356B2 (en) * | 2007-03-08 | 2014-02-11 | Senseonics, Incorporated | Light emitting diode for harsh environments |
| USD703348S1 (en) * | 2012-07-09 | 2014-04-22 | Cree, Inc. | Lamp package |
| US8779567B2 (en) * | 2012-05-24 | 2014-07-15 | Nichia Corporation | Semiconductor device |
| USD709464S1 (en) * | 2012-05-31 | 2014-07-22 | Cree, Inc. | Light emitting diode (LED) package |
| USD711841S1 (en) * | 2012-08-23 | 2014-08-26 | Cree, Inc. | Light emitting diode (LED) package |
| USD713804S1 (en) * | 2012-05-14 | 2014-09-23 | Cree, Inc. | Light emitting diode (LED) package with multiple anodes and cathodes |
| US8912555B2 (en) * | 2012-08-22 | 2014-12-16 | Phostek, Inc. | Semiconductor light-emitting device |
| US9112126B2 (en) * | 2011-10-28 | 2015-08-18 | Lg Innotek Co., Ltd. | Light emitting device package, lighting device including the same, and image display device |
| USD741821S1 (en) * | 2014-04-10 | 2015-10-27 | Kingbright Electronics Co., Ltd. | LED component |
| US9172012B2 (en) * | 2007-10-31 | 2015-10-27 | Cree, Inc. | Multi-chip light emitter packages and related methods |
-
2012
- 2012-09-07 US US29/431,542 patent/USD753612S1/en active Active
Patent Citations (64)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4327860A (en) * | 1980-01-03 | 1982-05-04 | Kulicke And Soffa Ind. Inc. | Method of making slack free wire interconnections |
| US4445633A (en) | 1982-02-11 | 1984-05-01 | Rockwell International Corporation | Automatic bonder for forming wire interconnections of automatically controlled configuration |
| US4437604A (en) | 1982-03-15 | 1984-03-20 | Kulicke & Soffa Industries, Inc. | Method of making fine wire interconnections |
| USH445H (en) | 1985-11-29 | 1988-03-01 | American Telephone and Telegraph Company, AT&T Technologies, Incorporated | Method of forming light emitting device with direct contact lens |
| US4932584A (en) | 1986-08-08 | 1990-06-12 | Kabushiki Kaisha Shinkawa | Method of wire bonding |
| US5612549A (en) * | 1994-03-24 | 1997-03-18 | Motorola | Integrated electro-optical package |
| US5760422A (en) * | 1995-06-21 | 1998-06-02 | Rohm Co., Ltd. | Light-emitting diode chip and light-emitting diode using the same |
| US6010057A (en) * | 1996-03-02 | 2000-01-04 | Esec Sa | Method for making a wire connections of predetermined shape |
| US6065667A (en) | 1997-01-15 | 2000-05-23 | National Semiconductor Corporation | Method and apparatus for fine pitch wire bonding |
| US5938105A (en) | 1997-01-15 | 1999-08-17 | National Semiconductor Corporation | Encapsulated ball bonding apparatus and method |
| US6640436B1 (en) * | 1997-10-16 | 2003-11-04 | Nec Electronics Corporation | Method of fabricating a coated metallic wire, method of removing insulation from the coated metallic wire and method of fabricating a semiconductor device with the wire |
| US6119926A (en) * | 1998-02-19 | 2000-09-19 | Esec Sa | Method for producing wire connections on semiconductor chips |
| US6315190B1 (en) * | 1998-06-25 | 2001-11-13 | Kabushiki Kaisha Shinkawa | Wire bonding method |
| US6180962B1 (en) * | 1998-10-23 | 2001-01-30 | Rohm Co., Ltd. | Chip type semiconductor light emitting device having a solder preventive portion |
| US6489637B1 (en) * | 1999-06-09 | 2002-12-03 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device |
| US6244499B1 (en) | 1999-12-13 | 2001-06-12 | Advanced Semiconductor Engineering, Inc. | Structure of a ball bump for wire bonding and the formation thereof |
| US6391759B1 (en) * | 2000-04-27 | 2002-05-21 | Advanced Semiconductor Engineering, Inc. | Bonding method which prevents wire sweep and the wire structure thereof |
| US20040262738A1 (en) * | 2003-06-27 | 2004-12-30 | Lee Kong Weng | Packaging device for semiconductor die, semiconductor device incorporating same and method of making same |
| US7135034B2 (en) * | 2003-11-14 | 2006-11-14 | Lumerx, Inc. | Flexible array |
| US7086148B2 (en) * | 2004-02-25 | 2006-08-08 | Agere Systems Inc. | Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit |
| US7443042B2 (en) * | 2004-02-25 | 2008-10-28 | Agere Systems Inc. | Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit |
| US6933223B1 (en) | 2004-04-15 | 2005-08-23 | National Semiconductor Corporation | Ultra-low loop wire bonding |
| US8022431B2 (en) * | 2004-11-04 | 2011-09-20 | Hitachi Displays, Ltd. | Illuminating apparatus, method for fabricating the using the same and display apparatus using the same |
| US7445354B2 (en) * | 2005-09-27 | 2008-11-04 | Nichia Corporation | Light emitting apparatus |
| US7815343B2 (en) * | 2006-08-04 | 2010-10-19 | Nichia Corporation | Light emitting device |
| US20100224890A1 (en) * | 2006-09-18 | 2010-09-09 | Cree, Inc. | Light emitting diode chip with electrical insulation element |
| US7547626B2 (en) * | 2006-10-27 | 2009-06-16 | Samsung Techwin Co., Ltd. | Semiconductor package and method of forming wire loop of semiconductor package |
| US8648356B2 (en) * | 2007-03-08 | 2014-02-11 | Senseonics, Incorporated | Light emitting diode for harsh environments |
| US20100090330A1 (en) | 2007-03-23 | 2010-04-15 | Sanyo Electric Co., Ltd. | Semiconductor device and method of manufacturing the same |
| US7750361B2 (en) * | 2007-08-10 | 2010-07-06 | Stanley Electric Co., Ltd. | Surface mount light emitting apparatus |
| US20100244282A1 (en) | 2007-09-25 | 2010-09-30 | Silverbrook Research Pty Ltd | Assembly of electronic components |
| US20090090928A1 (en) * | 2007-09-25 | 2009-04-09 | Sanyo Electric Co., Ltd. | Light emitting module and method for manufacturing the same |
| US9172012B2 (en) * | 2007-10-31 | 2015-10-27 | Cree, Inc. | Multi-chip light emitter packages and related methods |
| USD615504S1 (en) * | 2007-10-31 | 2010-05-11 | Cree, Inc. | Emitter package |
| US20090108281A1 (en) * | 2007-10-31 | 2009-04-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| US20130092960A1 (en) * | 2007-10-31 | 2013-04-18 | Ruud Lighting, Inc. | Multi-Die LED Package |
| US20110079904A1 (en) | 2008-10-21 | 2011-04-07 | Kabushiki Kaisha Shinkawa | Semiconductor device |
| US20100176500A1 (en) | 2009-01-15 | 2010-07-15 | Hishioka Maiko | Semiconductor device |
| US20110291154A1 (en) * | 2009-02-10 | 2011-12-01 | Nichia Corporation | Semiconductor light emitting device |
| US8084777B2 (en) | 2009-03-24 | 2011-12-27 | Bridgelux, Inc. | Light emitting diode source with protective barrier |
| US20110089443A1 (en) * | 2009-10-15 | 2011-04-21 | Forward Electronics Co., Ltd. | Packaging Structure of AC light-emitting diodes |
| US20110062482A1 (en) * | 2010-01-20 | 2011-03-17 | Bridgelux, Inc. | Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces |
| US20110220920A1 (en) * | 2010-03-09 | 2011-09-15 | Brian Thomas Collins | Methods of forming warm white light emitting devices having high color rendering index values and related light emitting devices |
| US20110248289A1 (en) * | 2010-04-09 | 2011-10-13 | Everlight Electronics Co., Ltd. | Light emitting diode package, lighting device and light emitting diode package substrate |
| US8519426B2 (en) * | 2010-08-09 | 2013-08-27 | Lg Innotek Co., Ltd. | Light emitting device and lighting system having the same |
| US20120091489A1 (en) | 2010-10-15 | 2012-04-19 | Nippon Carbide Industries Co., Inc. | Substrate for mounting light-emitting elements, light-emitting device, and method for manufacturing same |
| USD658139S1 (en) * | 2011-01-31 | 2012-04-24 | Cree, Inc. | High-density emitter package |
| US20120305949A1 (en) * | 2011-01-31 | 2012-12-06 | Matthew Donofrio | Light Emitting Diode (LED) Arrays Including Direct Die Attach And Related Assemblies |
| USD660257S1 (en) * | 2011-01-31 | 2012-05-22 | Cree, Inc. | Emitter package |
| USD689209S1 (en) * | 2011-01-31 | 2013-09-03 | Cree, Inc. | Lamp packages |
| USD689210S1 (en) * | 2011-01-31 | 2013-09-03 | Cree, Inc. | Lamp packages |
| USD650343S1 (en) * | 2011-01-31 | 2011-12-13 | Cree, Inc. | Multiple configuration light emitting device package |
| USD660258S1 (en) * | 2011-05-04 | 2012-05-22 | Epistar Corporation | Light emitting diode |
| USD691973S1 (en) * | 2011-07-08 | 2013-10-22 | Cree, Inc. | Lamp packages |
| US9112126B2 (en) * | 2011-10-28 | 2015-08-18 | Lg Innotek Co., Ltd. | Light emitting device package, lighting device including the same, and image display device |
| US20130105835A1 (en) * | 2011-10-31 | 2013-05-02 | Lite-On Technology Corp. | Light-emitting diode device |
| USD675169S1 (en) * | 2011-12-13 | 2013-01-29 | Lextar Electronics Corp. | Multi-chip LED |
| USD713804S1 (en) * | 2012-05-14 | 2014-09-23 | Cree, Inc. | Light emitting diode (LED) package with multiple anodes and cathodes |
| US8779567B2 (en) * | 2012-05-24 | 2014-07-15 | Nichia Corporation | Semiconductor device |
| USD709464S1 (en) * | 2012-05-31 | 2014-07-22 | Cree, Inc. | Light emitting diode (LED) package |
| USD703348S1 (en) * | 2012-07-09 | 2014-04-22 | Cree, Inc. | Lamp package |
| US8912555B2 (en) * | 2012-08-22 | 2014-12-16 | Phostek, Inc. | Semiconductor light-emitting device |
| USD711841S1 (en) * | 2012-08-23 | 2014-08-26 | Cree, Inc. | Light emitting diode (LED) package |
| USD741821S1 (en) * | 2014-04-10 | 2015-10-27 | Kingbright Electronics Co., Ltd. | LED component |
Non-Patent Citations (6)
| Title |
|---|
| Advisory Action for U.S. Appl. No. 13/607,217 dated Jul. 28, 2015. |
| Final Office Action for U.S. Appl. No. 13/607,217 dated May 13, 2015. |
| Final Office Action in U.S. Appl. No. 13/607,217 dated Aug. 6, 2014. |
| Non-Final Office Action for U.S. Appl. No. 13/607,217 dated Dec. 5, 2014. |
| Non-Final Office Action for U.S. Appl. No. 13/607,217 dated Sep. 18, 2015. |
| Non-Final Office Action in U.S. Appl. No. 13/607,217 dated Feb. 24, 2014. |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10043960B2 (en) * | 2011-11-15 | 2018-08-07 | Cree, Inc. | Light emitting diode (LED) packages and related methods |
| USD826184S1 (en) * | 2016-03-24 | 2018-08-21 | Hamamatsu Photonics K.K. | Optical semiconductor element |
| USD831592S1 (en) * | 2016-03-24 | 2018-10-23 | Hamamatsu Photonics K.K. | Optical semiconductor element |
| USD831593S1 (en) * | 2016-03-24 | 2018-10-23 | Hamamatsu Photonics K.K | Optical semiconductor element |
| USD832802S1 (en) * | 2016-03-24 | 2018-11-06 | Hamamatsu Photonics K.K. | Optical semiconductor element |
| USD846512S1 (en) * | 2016-03-24 | 2019-04-23 | Hamamatsu Photonics K.K. | Optical semiconductor element |
| USD846511S1 (en) * | 2016-03-24 | 2019-04-23 | Hamamatsu Photonics K.K. | Optical semiconductor element |
| USD844183S1 (en) | 2016-08-19 | 2019-03-26 | Citizen Electronics Co., Ltd. | Light emitting diode |
| WO2018098041A1 (en) | 2016-11-22 | 2018-05-31 | Cree, Inc. | Light emitting diode (led) devices, components and methods |
| USD844576S1 (en) | 2017-07-25 | 2019-04-02 | Citizen Electronics Co., Ltd. | Light emitting diode |
| USD926714S1 (en) * | 2019-10-30 | 2021-08-03 | Creeled, Inc. | Light emitting diode package |
| USD1104971S1 (en) * | 2022-01-18 | 2025-12-09 | Creeled, Inc. | Light-emitting device package |
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