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USD703624S1 - LED-array package - Google Patents

LED-array package Download PDF

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Publication number
USD703624S1
USD703624S1 US29/417,704 US201229417704F USD703624S US D703624 S1 USD703624 S1 US D703624S1 US 201229417704 F US201229417704 F US 201229417704F US D703624 S USD703624 S US D703624S
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US
United States
Prior art keywords
led
array package
view
package
array
Prior art date
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Active
Application number
US29/417,704
Inventor
Peter Scott Andrews
Kurt S. Wilcox
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CreeLED Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Priority to US29/417,704 priority Critical patent/USD703624S1/en
Assigned to CREE, INC. reassignment CREE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ANDREWS, PETER S., WILCOX, KURT S.
Priority to US29/433,842 priority patent/USD704154S1/en
Application granted granted Critical
Publication of USD703624S1 publication Critical patent/USD703624S1/en
Assigned to CREELED, INC. reassignment CREELED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
Assigned to CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART MODULAR TECHNOLOGIES, INC., SMART HIGH RELIABILITY SOLUTIONS LLC reassignment CREELED, INC. RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Assignors: CITIZENS BANK, N.A.
Assigned to JPMORGAN CHASE BANK, N.A. reassignment JPMORGAN CHASE BANK, N.A. PATENT SECURITY AGREEMENT Assignors: CREELED, INC., PENGUIN COMPUTING, INC., PENGUIN SOLUTIONS CORPORATION (DE), SMART EMBEDDED COMPUTING, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, SMART MODULAR TECHNOLOGIES, INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of the LED-array package, a lens and light-emitting diodes (LEDs) being shown in phantom lines;
FIG. 2 is a front view of the LED-array package of FIG. 1;
FIG. 3 is a rear view of the LED-array package of FIG. 1;
FIG. 4 is a right-side elevation of the LED-array package of FIG. 1, the left-side elevation view being a mirror image thereof;
FIG. 5 is a top plan view of the LED-array package of FIG. 1;
FIG. 6 is a bottom plan view of the LED-array package of FIG. 1;
FIG. 7 is a perspective view of a submount portion of the LED-array package of FIG. 1;
FIG. 8 is a front view of the submount portion of the LED-array package of FIG. 1;
FIG. 9 is a rear view of the submount portion of the LED-array package of FIG. 1;
FIG. 10 is a right-side elevation of the submount portion of the LED-array package of FIG. 1, the left-side elevation view being a mirror image thereof; and,
FIG. 11 is a top plan view of the submount portion of the LED-array package of FIG. 1.

Claims (1)

    CLAIM
  1. The ornamental design for an LED-array package, as shown and described.
US29/417,704 2012-04-06 2012-04-06 LED-array package Active USD703624S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/417,704 USD703624S1 (en) 2012-04-06 2012-04-06 LED-array package
US29/433,842 USD704154S1 (en) 2012-04-06 2012-10-05 Light emitter package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/417,704 USD703624S1 (en) 2012-04-06 2012-04-06 LED-array package

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/433,842 Continuation USD704154S1 (en) 2012-04-06 2012-10-05 Light emitter package

Publications (1)

Publication Number Publication Date
USD703624S1 true USD703624S1 (en) 2014-04-29

Family

ID=50514610

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/417,704 Active USD703624S1 (en) 2012-04-06 2012-04-06 LED-array package
US29/433,842 Active USD704154S1 (en) 2012-04-06 2012-10-05 Light emitter package

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/433,842 Active USD704154S1 (en) 2012-04-06 2012-10-05 Light emitter package

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US (2) USD703624S1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9082921B2 (en) 2007-10-31 2015-07-14 Cree, Inc. Multi-die LED package
US9172012B2 (en) 2007-10-31 2015-10-27 Cree, Inc. Multi-chip light emitter packages and related methods
USD772181S1 (en) * 2015-04-02 2016-11-22 Genesis Photonics Inc. Light emitting diode package substrate
US9666762B2 (en) 2007-10-31 2017-05-30 Cree, Inc. Multi-chip light emitter packages and related methods

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD735683S1 (en) * 2013-05-03 2015-08-04 Cree, Inc. LED package
USD718725S1 (en) * 2013-08-01 2014-12-02 Cree, Inc. LED package with encapsulant
USD758976S1 (en) * 2013-08-08 2016-06-14 Cree, Inc. LED package
USD746240S1 (en) * 2013-12-30 2015-12-29 Cree, Inc. LED package
USD826871S1 (en) * 2014-12-11 2018-08-28 Cree, Inc. Light emitting diode device
USD996377S1 (en) 2022-02-17 2023-08-22 Creeled, Inc. Light-emitting diode package
USD996378S1 (en) * 2022-03-09 2023-08-22 Creeled, Inc. Light-emitting diode package
US12355013B2 (en) 2022-04-21 2025-07-08 Creeled, Inc. Emission height arrangements in light-emitting diode packages and related devices and methods

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US8379407B2 (en) 2009-10-07 2013-02-19 Cree, Inc. Apparatus for mounting and electrical connection of a connector between a package LED lamp and a PCB
US8421089B2 (en) * 2007-08-20 2013-04-16 Lg Innotek Co., Ltd. Light emitting device
US20130092960A1 (en) 2007-10-31 2013-04-18 Ruud Lighting, Inc. Multi-Die LED Package

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US9172012B2 (en) 2007-10-31 2015-10-27 Cree, Inc. Multi-chip light emitter packages and related methods
US9666762B2 (en) 2007-10-31 2017-05-30 Cree, Inc. Multi-chip light emitter packages and related methods

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US20080173884A1 (en) 2007-01-22 2008-07-24 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US20080258130A1 (en) 2007-04-23 2008-10-23 Bergmann Michael J Beveled LED Chip with Transparent Substrate
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US20120193649A1 (en) 2011-01-31 2012-08-02 Matthew Donofrio Light emitting diode (led) arrays including direct die attach and related assemblies
USD658139S1 (en) * 2011-01-31 2012-04-24 Cree, Inc. High-density emitter package
USD650343S1 (en) * 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9082921B2 (en) 2007-10-31 2015-07-14 Cree, Inc. Multi-die LED package
US9172012B2 (en) 2007-10-31 2015-10-27 Cree, Inc. Multi-chip light emitter packages and related methods
US9666762B2 (en) 2007-10-31 2017-05-30 Cree, Inc. Multi-chip light emitter packages and related methods
USD772181S1 (en) * 2015-04-02 2016-11-22 Genesis Photonics Inc. Light emitting diode package substrate
USD790487S1 (en) * 2015-04-02 2017-06-27 Genesis Photonics Inc. Light emitting diode package substrate

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