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USD631020S1 - LED package - Google Patents

LED package Download PDF

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Publication number
USD631020S1
USD631020S1 US29/360,641 US36064110F USD631020S US D631020 S1 USD631020 S1 US D631020S1 US 36064110 F US36064110 F US 36064110F US D631020 S USD631020 S US D631020S
Authority
US
United States
Prior art keywords
led package
view
led
package
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/360,641
Inventor
Shih-Tai Chuang
Hsiao-Lun Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Edison Opto Corp
Original Assignee
Edison Opto Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Edison Opto Corp filed Critical Edison Opto Corp
Priority to US29/360,641 priority Critical patent/USD631020S1/en
Assigned to EDISON OPTO CORPORATION reassignment EDISON OPTO CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHUANG, SHIH-TAI, LIN, HSIAO-LUN
Application granted granted Critical
Publication of USD631020S1 publication Critical patent/USD631020S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of an LED package showing our new design.
FIG. 2 is a front elevational view thereof
FIG. 3 is a rear elevational view thereof
FIG. 4 is a left side elevational view thereof
FIG. 5 is a right side elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.

Claims (1)

  1. The ornamental design for an LED package, as shown and described.
US29/360,641 2010-04-29 2010-04-29 LED package Expired - Lifetime USD631020S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/360,641 USD631020S1 (en) 2010-04-29 2010-04-29 LED package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/360,641 USD631020S1 (en) 2010-04-29 2010-04-29 LED package

Publications (1)

Publication Number Publication Date
USD631020S1 true USD631020S1 (en) 2011-01-18

Family

ID=43478937

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/360,641 Expired - Lifetime USD631020S1 (en) 2010-04-29 2010-04-29 LED package

Country Status (1)

Country Link
US (1) USD631020S1 (en)

Cited By (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD637565S1 (en) * 2010-11-02 2011-05-10 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
USD645421S1 (en) * 2010-07-16 2011-09-20 Harvatek Corporation LED base
USD646643S1 (en) * 2010-11-02 2011-10-11 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
USD650343S1 (en) * 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package
USD658139S1 (en) * 2011-01-31 2012-04-24 Cree, Inc. High-density emitter package
USD660257S1 (en) * 2011-01-31 2012-05-22 Cree, Inc. Emitter package
USD673126S1 (en) * 2011-07-08 2012-12-25 Cree, Inc. LED chip
USD674758S1 (en) * 2011-10-31 2013-01-22 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
USD674757S1 (en) * 2011-10-31 2013-01-22 Silitek Electronics (Guangzhou) Co., Ltd. Package carrier of light emitting diode
USD675169S1 (en) * 2011-12-13 2013-01-29 Lextar Electronics Corp. Multi-chip LED
USD680504S1 (en) * 2010-07-30 2013-04-23 Nichia Corporation Light emitting diode
USD681573S1 (en) * 2006-08-09 2013-05-07 Cree, Inc. Lamp package
USD691973S1 (en) * 2011-07-08 2013-10-22 Cree, Inc. Lamp packages
USD693317S1 (en) * 2012-05-29 2013-11-12 Kabushiki Kaisha Toshiba Light-emitting diode
USD698741S1 (en) * 2012-05-29 2014-02-04 Kabushiki Kaisha Toshiba Light-emitting diode
USD703348S1 (en) 2012-07-09 2014-04-22 Cree, Inc. Lamp package
USD709464S1 (en) * 2012-05-31 2014-07-22 Cree, Inc. Light emitting diode (LED) package
USD711841S1 (en) * 2012-08-23 2014-08-26 Cree, Inc. Light emitting diode (LED) package
USD711840S1 (en) 2012-06-11 2014-08-26 Cree, Inc. LED package
USD712849S1 (en) * 2012-05-14 2014-09-09 Cree, Inc. Light emitting diode (LED) package with multiple anodes and cathodes
USD713804S1 (en) * 2012-05-14 2014-09-23 Cree, Inc. Light emitting diode (LED) package with multiple anodes and cathodes
USD718258S1 (en) 2012-09-02 2014-11-25 Cree, Inc. LED package
USD718725S1 (en) 2013-08-01 2014-12-02 Cree, Inc. LED package with encapsulant
USD725613S1 (en) 2012-06-15 2015-03-31 Cree, Inc. LED package
USD735683S1 (en) 2013-05-03 2015-08-04 Cree, Inc. LED package
USD738832S1 (en) * 2006-04-04 2015-09-15 Cree, Inc. Light emitting diode (LED) package
USD741821S1 (en) * 2014-04-10 2015-10-27 Kingbright Electronics Co., Ltd. LED component
USD746240S1 (en) * 2013-12-30 2015-12-29 Cree, Inc. LED package
USD749051S1 (en) * 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
US9349929B2 (en) 2012-05-31 2016-05-24 Cree, Inc. Light emitter packages, systems, and methods
USD758976S1 (en) 2013-08-08 2016-06-14 Cree, Inc. LED package
US9397266B2 (en) 2007-11-14 2016-07-19 Cree, Inc. Lateral semiconductor light emitting diodes having large area contacts
US9461024B2 (en) 2013-08-01 2016-10-04 Cree, Inc. Light emitter devices and methods for light emitting diode (LED) chips
US9484499B2 (en) 2007-04-20 2016-11-01 Cree, Inc. Transparent ohmic contacts on light emitting diodes with carrier substrates
US9515055B2 (en) 2012-05-14 2016-12-06 Cree, Inc. Light emitting devices including multiple anodes and cathodes
USD777122S1 (en) 2015-02-27 2017-01-24 Cree, Inc. LED package
USD783547S1 (en) 2015-06-04 2017-04-11 Cree, Inc. LED package
US9627361B2 (en) 2010-10-07 2017-04-18 Cree, Inc. Multiple configuration light emitting devices and methods
USD790486S1 (en) 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
US9780268B2 (en) 2006-04-04 2017-10-03 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
USD800679S1 (en) * 2016-04-28 2017-10-24 Citizen Electronics Co., Ltd. Light emitting diode
USD826871S1 (en) * 2014-12-11 2018-08-28 Cree, Inc. Light emitting diode device
USD833989S1 (en) * 2017-03-15 2018-11-20 Citizen Electronics Co., Ltd. Light emitting diode
US10134961B2 (en) 2012-03-30 2018-11-20 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US10222032B2 (en) 2012-03-30 2019-03-05 Cree, Inc. Light emitter components and methods having improved electrical contacts
US10439112B2 (en) 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
USD879787S1 (en) * 2017-11-21 2020-03-31 Hangzhou Chipjet Technology Co., Ltd. Data processing equipment
USD880484S1 (en) * 2018-04-26 2020-04-07 Hangzhou Chipjet Technology Co., Ltd. Data processing equipment
USD926714S1 (en) * 2019-10-30 2021-08-03 Creeled, Inc. Light emitting diode package
USD1051444S1 (en) * 2024-08-14 2024-11-12 Xingcheng Wu Light fixture

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5722760A (en) * 1995-02-03 1998-03-03 Chien; Tseng Lu Electro-luminescent light assembly
US6921926B2 (en) * 2002-06-26 2005-07-26 Lingsen Precision Industries, Ltd. LED package and the process making the same
US7224000B2 (en) * 2002-08-30 2007-05-29 Lumination, Llc Light emitting diode component
US20070205419A1 (en) * 2006-03-02 2007-09-06 Masato Ono Semiconductor device and its manufacturing method
US20080054286A1 (en) * 2005-01-27 2008-03-06 Cree, Inc. Light emitting device packages, light emitting diode (LED) packages and related methods
US20080054280A1 (en) * 2006-09-06 2008-03-06 Gelcore Llc Light emitting packages and methods of making same
USD572670S1 (en) * 2006-03-30 2008-07-08 Nichia Corporation Light emitting diode
USD578226S1 (en) * 2006-07-20 2008-10-07 Philips Lumileds Lighting Company, Llc LED package
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
US20090122514A1 (en) * 2006-03-17 2009-05-14 Dae Shin Led Co., Ltd. Led module for illumination
US20090166655A1 (en) * 2007-12-31 2009-07-02 Chien-Feng Lin Light-emitting diode structure
USD598871S1 (en) * 2006-11-06 2009-08-25 Koninklijke Philips Electronics N.V. Et Al. LED package
US20090283779A1 (en) * 2007-06-14 2009-11-19 Cree, Inc. Light source with near field mixing
US7626250B2 (en) * 2005-06-03 2009-12-01 Samsung Electro-Mechanics Co., Ltd. High power LED package and fabrication method thereof
US7631986B2 (en) * 2006-10-31 2009-12-15 Koninklijke Philips Electronics, N.V. Lighting device package
USD615504S1 (en) * 2007-10-31 2010-05-11 Cree, Inc. Emitter package
USD618636S1 (en) * 2009-09-25 2010-06-29 Everlight Electronics Co., Ltd. Light emitting diode lamp

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5722760A (en) * 1995-02-03 1998-03-03 Chien; Tseng Lu Electro-luminescent light assembly
US6921926B2 (en) * 2002-06-26 2005-07-26 Lingsen Precision Industries, Ltd. LED package and the process making the same
US7224000B2 (en) * 2002-08-30 2007-05-29 Lumination, Llc Light emitting diode component
US20080054286A1 (en) * 2005-01-27 2008-03-06 Cree, Inc. Light emitting device packages, light emitting diode (LED) packages and related methods
US7626250B2 (en) * 2005-06-03 2009-12-01 Samsung Electro-Mechanics Co., Ltd. High power LED package and fabrication method thereof
US20070205419A1 (en) * 2006-03-02 2007-09-06 Masato Ono Semiconductor device and its manufacturing method
US20090122514A1 (en) * 2006-03-17 2009-05-14 Dae Shin Led Co., Ltd. Led module for illumination
USD572670S1 (en) * 2006-03-30 2008-07-08 Nichia Corporation Light emitting diode
USD578226S1 (en) * 2006-07-20 2008-10-07 Philips Lumileds Lighting Company, Llc LED package
US20080054280A1 (en) * 2006-09-06 2008-03-06 Gelcore Llc Light emitting packages and methods of making same
US7631986B2 (en) * 2006-10-31 2009-12-15 Koninklijke Philips Electronics, N.V. Lighting device package
USD598871S1 (en) * 2006-11-06 2009-08-25 Koninklijke Philips Electronics N.V. Et Al. LED package
US20090283779A1 (en) * 2007-06-14 2009-11-19 Cree, Inc. Light source with near field mixing
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
USD615504S1 (en) * 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US20090166655A1 (en) * 2007-12-31 2009-07-02 Chien-Feng Lin Light-emitting diode structure
USD618636S1 (en) * 2009-09-25 2010-06-29 Everlight Electronics Co., Ltd. Light emitting diode lamp

Cited By (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD738832S1 (en) * 2006-04-04 2015-09-15 Cree, Inc. Light emitting diode (LED) package
US9780268B2 (en) 2006-04-04 2017-10-03 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
USD681573S1 (en) * 2006-08-09 2013-05-07 Cree, Inc. Lamp package
US9484499B2 (en) 2007-04-20 2016-11-01 Cree, Inc. Transparent ohmic contacts on light emitting diodes with carrier substrates
US9397266B2 (en) 2007-11-14 2016-07-19 Cree, Inc. Lateral semiconductor light emitting diodes having large area contacts
USD645421S1 (en) * 2010-07-16 2011-09-20 Harvatek Corporation LED base
USD698323S1 (en) 2010-07-30 2014-01-28 Nichia Corporation Light emitting diode
USD680504S1 (en) * 2010-07-30 2013-04-23 Nichia Corporation Light emitting diode
USD710810S1 (en) 2010-07-30 2014-08-12 Nichia Corporation Light emitting diode
US9627361B2 (en) 2010-10-07 2017-04-18 Cree, Inc. Multiple configuration light emitting devices and methods
USD637565S1 (en) * 2010-11-02 2011-05-10 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
USD646643S1 (en) * 2010-11-02 2011-10-11 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
USD660257S1 (en) * 2011-01-31 2012-05-22 Cree, Inc. Emitter package
USD658139S1 (en) * 2011-01-31 2012-04-24 Cree, Inc. High-density emitter package
USD650343S1 (en) * 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package
USD673126S1 (en) * 2011-07-08 2012-12-25 Cree, Inc. LED chip
USD689031S1 (en) 2011-07-08 2013-09-03 Cree, Inc. LED chip
USD691973S1 (en) * 2011-07-08 2013-10-22 Cree, Inc. Lamp packages
USD674758S1 (en) * 2011-10-31 2013-01-22 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
USD674757S1 (en) * 2011-10-31 2013-01-22 Silitek Electronics (Guangzhou) Co., Ltd. Package carrier of light emitting diode
USD675169S1 (en) * 2011-12-13 2013-01-29 Lextar Electronics Corp. Multi-chip LED
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
US10222032B2 (en) 2012-03-30 2019-03-05 Cree, Inc. Light emitter components and methods having improved electrical contacts
US10134961B2 (en) 2012-03-30 2018-11-20 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US11004890B2 (en) 2012-03-30 2021-05-11 Creeled, Inc. Substrate based light emitter devices, components, and related methods
USD713804S1 (en) * 2012-05-14 2014-09-23 Cree, Inc. Light emitting diode (LED) package with multiple anodes and cathodes
US9515055B2 (en) 2012-05-14 2016-12-06 Cree, Inc. Light emitting devices including multiple anodes and cathodes
USD712849S1 (en) * 2012-05-14 2014-09-09 Cree, Inc. Light emitting diode (LED) package with multiple anodes and cathodes
USD693317S1 (en) * 2012-05-29 2013-11-12 Kabushiki Kaisha Toshiba Light-emitting diode
USD698741S1 (en) * 2012-05-29 2014-02-04 Kabushiki Kaisha Toshiba Light-emitting diode
USD749051S1 (en) * 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
USD709464S1 (en) * 2012-05-31 2014-07-22 Cree, Inc. Light emitting diode (LED) package
US9349929B2 (en) 2012-05-31 2016-05-24 Cree, Inc. Light emitter packages, systems, and methods
US10439112B2 (en) 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
USD711840S1 (en) 2012-06-11 2014-08-26 Cree, Inc. LED package
USD725613S1 (en) 2012-06-15 2015-03-31 Cree, Inc. LED package
USD703348S1 (en) 2012-07-09 2014-04-22 Cree, Inc. Lamp package
USD711841S1 (en) * 2012-08-23 2014-08-26 Cree, Inc. Light emitting diode (LED) package
USD718258S1 (en) 2012-09-02 2014-11-25 Cree, Inc. LED package
USD735683S1 (en) 2013-05-03 2015-08-04 Cree, Inc. LED package
US9461024B2 (en) 2013-08-01 2016-10-04 Cree, Inc. Light emitter devices and methods for light emitting diode (LED) chips
USD718725S1 (en) 2013-08-01 2014-12-02 Cree, Inc. LED package with encapsulant
USD758976S1 (en) 2013-08-08 2016-06-14 Cree, Inc. LED package
USD746240S1 (en) * 2013-12-30 2015-12-29 Cree, Inc. LED package
USD741821S1 (en) * 2014-04-10 2015-10-27 Kingbright Electronics Co., Ltd. LED component
USD790486S1 (en) 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
USD892066S1 (en) * 2014-12-11 2020-08-04 Cree, Inc. LED package
USD826871S1 (en) * 2014-12-11 2018-08-28 Cree, Inc. Light emitting diode device
USD777122S1 (en) 2015-02-27 2017-01-24 Cree, Inc. LED package
USD783547S1 (en) 2015-06-04 2017-04-11 Cree, Inc. LED package
USD800679S1 (en) * 2016-04-28 2017-10-24 Citizen Electronics Co., Ltd. Light emitting diode
USD833989S1 (en) * 2017-03-15 2018-11-20 Citizen Electronics Co., Ltd. Light emitting diode
USD879787S1 (en) * 2017-11-21 2020-03-31 Hangzhou Chipjet Technology Co., Ltd. Data processing equipment
USD880484S1 (en) * 2018-04-26 2020-04-07 Hangzhou Chipjet Technology Co., Ltd. Data processing equipment
USD926714S1 (en) * 2019-10-30 2021-08-03 Creeled, Inc. Light emitting diode package
USD1051444S1 (en) * 2024-08-14 2024-11-12 Xingcheng Wu Light fixture

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