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USD711841S1 - Light emitting diode (LED) package - Google Patents

Light emitting diode (LED) package Download PDF

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Publication number
USD711841S1
USD711841S1 US29/430,291 US201229430291F USD711841S US D711841 S1 USD711841 S1 US D711841S1 US 201229430291 F US201229430291 F US 201229430291F US D711841 S USD711841 S US D711841S
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US
United States
Prior art keywords
light emitting
emitting diode
package
led
led package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/430,291
Inventor
Jeffrey Carl Britt
Michael P. Laughner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CreeLED Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Priority to US29/430,291 priority Critical patent/USD711841S1/en
Assigned to CREE, INC. reassignment CREE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BRITT, JEFFREY CARL, LAUGHNER, MICHAEL P.
Application granted granted Critical
Publication of USD711841S1 publication Critical patent/USD711841S1/en
Assigned to CREELED, INC. reassignment CREELED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
Assigned to SMART HIGH RELIABILITY SOLUTIONS LLC, CREELED, INC., SMART MODULAR TECHNOLOGIES, INC., SMART EMBEDDED COMPUTING, INC. reassignment SMART HIGH RELIABILITY SOLUTIONS LLC RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Assignors: CITIZENS BANK, N.A.
Assigned to JPMORGAN CHASE BANK, N.A. reassignment JPMORGAN CHASE BANK, N.A. PATENT SECURITY AGREEMENT Assignors: CREELED, INC., PENGUIN COMPUTING, INC., PENGUIN SOLUTIONS CORPORATION (DE), SMART EMBEDDED COMPUTING, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, SMART MODULAR TECHNOLOGIES, INC.
Active legal-status Critical Current
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Description

FIG. 1 is a perspective view of the light emitting diode LED package;
FIG. 2 is a top plan view of the light emitting diode LED package of FIG. 1;
FIG. 3 is a bottom plan view of the light emitting diode LED package of FIGS. 1-2;
FIG. 4 is a front elevation view of the light emitting diode LED package of FIGS. 1-3;
FIG. 5 is a rear elevation view of the light emitting diode LED package of FIGS. 1-4;
FIG. 6 is a right side elevation view of the light emitting diode LED package of FIGS. 1-5; and,
FIG. 7 is a left side elevation view of the light emitting diode LED package of FIGS. 1-6.
The dot-dash broken lines represent boundaries of the claimed design, and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a light emitting diode (LED) package, as shown and described.
US29/430,291 2012-08-23 2012-08-23 Light emitting diode (LED) package Active USD711841S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/430,291 USD711841S1 (en) 2012-08-23 2012-08-23 Light emitting diode (LED) package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/430,291 USD711841S1 (en) 2012-08-23 2012-08-23 Light emitting diode (LED) package

Publications (1)

Publication Number Publication Date
USD711841S1 true USD711841S1 (en) 2014-08-26

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Family Applications (1)

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US29/430,291 Active USD711841S1 (en) 2012-08-23 2012-08-23 Light emitting diode (LED) package

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US (1) USD711841S1 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD749051S1 (en) 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
USD753612S1 (en) * 2012-09-07 2016-04-12 Cree, Inc. Light emitter device
US9349929B2 (en) 2012-05-31 2016-05-24 Cree, Inc. Light emitter packages, systems, and methods
USD764421S1 (en) * 2014-08-20 2016-08-23 Epistar Corporation Portions of light-emitting diode unit
USD772181S1 (en) * 2015-04-02 2016-11-22 Genesis Photonics Inc. Light emitting diode package substrate
USD790486S1 (en) * 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
US10439112B2 (en) 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
US10683971B2 (en) 2015-04-30 2020-06-16 Cree, Inc. Solid state lighting components
USD926714S1 (en) * 2019-10-30 2021-08-03 Creeled, Inc. Light emitting diode package
USD996377S1 (en) * 2022-02-17 2023-08-22 Creeled, Inc. Light-emitting diode package
USD1060278S1 (en) 2022-03-09 2025-02-04 Creeled, Inc. Light-emitting diode package
US12355013B2 (en) 2022-04-21 2025-07-08 Creeled, Inc. Emission height arrangements in light-emitting diode packages and related devices and methods

Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080054286A1 (en) * 2005-01-27 2008-03-06 Cree, Inc. Light emitting device packages, light emitting diode (LED) packages and related methods
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
USD615504S1 (en) * 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US20100252851A1 (en) * 2007-10-31 2010-10-07 Cree, Inc. Led package with increased feature sizes
USD628966S1 (en) * 2009-12-22 2010-12-14 Panasonic Corporation Light-emitting diode
USD631020S1 (en) * 2010-04-29 2011-01-18 Edison Opto Corporation LED package
US20110062482A1 (en) * 2010-01-20 2011-03-17 Bridgelux, Inc. Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces
US20110127912A1 (en) * 2009-11-30 2011-06-02 Young Jin Lee Led package, led package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof
USD643381S1 (en) 2010-04-07 2011-08-16 Everlight Electronics Co., Ltd. Light emitting diode
US20110220920A1 (en) * 2010-03-09 2011-09-15 Brian Thomas Collins Methods of forming warm white light emitting devices having high color rendering index values and related light emitting devices
USD650343S1 (en) * 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package
US20120069564A1 (en) 2010-09-20 2012-03-22 Cree, Inc. Multi-chip led devices
US20120086024A1 (en) 2010-10-07 2012-04-12 Andrews Peter S Multiple configuration light emitting devices and methods
USD658139S1 (en) * 2011-01-31 2012-04-24 Cree, Inc. High-density emitter package
USD660257S1 (en) * 2011-01-31 2012-05-22 Cree, Inc. Emitter package
US20120286304A1 (en) * 2011-05-10 2012-11-15 Letoquin Ronan P Recipient Luminophoric Mediums Having Narrow Spectrum Luminescent Materials and Related Semiconductor Light Emitting Devices and Methods
USD674758S1 (en) * 2011-10-31 2013-01-22 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
USD675169S1 (en) * 2011-12-13 2013-01-29 Lextar Electronics Corp. Multi-chip LED
US20130092960A1 (en) * 2007-10-31 2013-04-18 Ruud Lighting, Inc. Multi-Die LED Package
US20130105835A1 (en) * 2011-10-31 2013-05-02 Lite-On Technology Corp. Light-emitting diode device

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080054286A1 (en) * 2005-01-27 2008-03-06 Cree, Inc. Light emitting device packages, light emitting diode (LED) packages and related methods
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
USD615504S1 (en) * 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US20100252851A1 (en) * 2007-10-31 2010-10-07 Cree, Inc. Led package with increased feature sizes
US20130092960A1 (en) * 2007-10-31 2013-04-18 Ruud Lighting, Inc. Multi-Die LED Package
US20110127912A1 (en) * 2009-11-30 2011-06-02 Young Jin Lee Led package, led package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof
USD628966S1 (en) * 2009-12-22 2010-12-14 Panasonic Corporation Light-emitting diode
US20110062482A1 (en) * 2010-01-20 2011-03-17 Bridgelux, Inc. Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces
US20110220920A1 (en) * 2010-03-09 2011-09-15 Brian Thomas Collins Methods of forming warm white light emitting devices having high color rendering index values and related light emitting devices
USD643381S1 (en) 2010-04-07 2011-08-16 Everlight Electronics Co., Ltd. Light emitting diode
USD631020S1 (en) * 2010-04-29 2011-01-18 Edison Opto Corporation LED package
US20120069564A1 (en) 2010-09-20 2012-03-22 Cree, Inc. Multi-chip led devices
US20120086024A1 (en) 2010-10-07 2012-04-12 Andrews Peter S Multiple configuration light emitting devices and methods
USD650343S1 (en) * 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package
USD660257S1 (en) * 2011-01-31 2012-05-22 Cree, Inc. Emitter package
USD658139S1 (en) * 2011-01-31 2012-04-24 Cree, Inc. High-density emitter package
US20120286304A1 (en) * 2011-05-10 2012-11-15 Letoquin Ronan P Recipient Luminophoric Mediums Having Narrow Spectrum Luminescent Materials and Related Semiconductor Light Emitting Devices and Methods
USD674758S1 (en) * 2011-10-31 2013-01-22 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
US20130105835A1 (en) * 2011-10-31 2013-05-02 Lite-On Technology Corp. Light-emitting diode device
USD675169S1 (en) * 2011-12-13 2013-01-29 Lextar Electronics Corp. Multi-chip LED

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Unpublished Design U.S. Appl. No. 29/420,874, filed May 14, 2012.
Unpublished Design U.S. Appl. No. 29/420,876, filed May 14, 2012.
Unpublished U.S. Appl. No. 13/471,164, filed May 14, 2012.

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9349929B2 (en) 2012-05-31 2016-05-24 Cree, Inc. Light emitter packages, systems, and methods
USD749051S1 (en) 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
US10439112B2 (en) 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
USD753612S1 (en) * 2012-09-07 2016-04-12 Cree, Inc. Light emitter device
USD818974S1 (en) 2014-08-20 2018-05-29 Epistar Corporation Portions of light-emitting diode unit
USD764421S1 (en) * 2014-08-20 2016-08-23 Epistar Corporation Portions of light-emitting diode unit
USD790486S1 (en) * 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
USD772181S1 (en) * 2015-04-02 2016-11-22 Genesis Photonics Inc. Light emitting diode package substrate
USD790487S1 (en) * 2015-04-02 2017-06-27 Genesis Photonics Inc. Light emitting diode package substrate
US10683971B2 (en) 2015-04-30 2020-06-16 Cree, Inc. Solid state lighting components
US10962199B2 (en) 2015-04-30 2021-03-30 Cree, Inc. Solid state lighting components
USD926714S1 (en) * 2019-10-30 2021-08-03 Creeled, Inc. Light emitting diode package
USD996377S1 (en) * 2022-02-17 2023-08-22 Creeled, Inc. Light-emitting diode package
USD1036711S1 (en) 2022-02-17 2024-07-23 Creeled, Inc. Light-emitting diode package
USD1060278S1 (en) 2022-03-09 2025-02-04 Creeled, Inc. Light-emitting diode package
US12355013B2 (en) 2022-04-21 2025-07-08 Creeled, Inc. Emission height arrangements in light-emitting diode packages and related devices and methods

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