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USD709464S1 - Light emitting diode (LED) package - Google Patents

Light emitting diode (LED) package Download PDF

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Publication number
USD709464S1
USD709464S1 US29/423,422 US201229423422F USD709464S US D709464 S1 USD709464 S1 US D709464S1 US 201229423422 F US201229423422 F US 201229423422F US D709464 S USD709464 S US D709464S
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US
United States
Prior art keywords
view
led
package
light emitting
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/423,422
Inventor
Amber C. Abare
Jeffrey Carl Britt
Joseph G. Clark
Raymond Rosado
Harsh Sundani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CreeLED Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Priority to US29/423,422 priority Critical patent/USD709464S1/en
Priority to US13/554,776 priority patent/US10439112B2/en
Priority to US13/713,410 priority patent/US9349929B2/en
Priority to US29/439,629 priority patent/USD749051S1/en
Assigned to CREE, INC. reassignment CREE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SUNDANI, Harsh, BRITT, JEFFREY C., ROSADO, RAYMOND, ABARE, AMBER C., CLARK, Joseph G.
Publication of USD709464S1 publication Critical patent/USD709464S1/en
Application granted granted Critical
Assigned to CREELED, INC. reassignment CREELED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
Assigned to SMART MODULAR TECHNOLOGIES, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, CREELED, INC., SMART EMBEDDED COMPUTING, INC. reassignment SMART MODULAR TECHNOLOGIES, INC. RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Assignors: CITIZENS BANK, N.A.
Assigned to JPMORGAN CHASE BANK, N.A. reassignment JPMORGAN CHASE BANK, N.A. PATENT SECURITY AGREEMENT Assignors: CREELED, INC., PENGUIN COMPUTING, INC., PENGUIN SOLUTIONS CORPORATION (DE), SMART EMBEDDED COMPUTING, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, SMART MODULAR TECHNOLOGIES, INC.
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Description

FIG. 1 is a top perspective view of a LED package showing our design according to a first embodiment;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof, opposite the view of FIG. 2;
FIG. 4 is a first side view thereof;
FIG. 5 is a second side view thereof;
FIG. 6 is a third side view thereof, opposite the view of FIG. 4;
FIG. 7 is a fourth side view thereof, opposite the view of FIG. 5;
FIG. 8 is a top perspective view of a LED package showing our design according to a second embodiment;
FIG. 9 is a top plan view thereof;
FIG. 10 is a bottom plan view thereof, opposite the view of FIG. 9;
FIG. 11 is a first side view thereof;
FIG. 12 is a second side view thereof;
FIG. 13 is a third side view thereof, opposite the view of FIG. 11;
FIG. 14 is a fourth side view thereof, opposite the view of FIG. 12;
FIG. 15 is a top perspective view of a LED package showing our design according to a third embodiment;
FIG. 16 is a top plan view;
FIG. 17 is a bottom plan view;
FIG. 18 is first side view;
FIG. 19 is second side view;
FIG. 20 is third side view;
FIG. 21 is fourth side view;
FIG. 22 is a top perspective view of a LED package showing our design according to a fourth embodiment;
FIG. 23 is a top plan view;
FIG. 24 is a bottom plan view;
FIG. 25 is first side view;
FIG. 26 is second side view;
FIG. 27 is third side view; and,
FIG. 28 is fourth side view.
The broken lines are for illustrative purposes only and form no part of the claimed design. The stippled portion of the embodiment illustrated in FIGS. 8, 9, 11, and 13 represent that the stippled portion is a different material than other, adjacent portions. The more densely stippled portions illustrated in FIGS. 22, 23, and 25-28 represent a metallic surface.

Claims (1)

    CLAIM
  1. The ornamental design for a light emitting diode (LED) package, as shown and described.
US29/423,422 2012-05-31 2012-05-31 Light emitting diode (LED) package Active USD709464S1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US29/423,422 USD709464S1 (en) 2012-05-31 2012-05-31 Light emitting diode (LED) package
US13/554,776 US10439112B2 (en) 2012-05-31 2012-07-20 Light emitter packages, systems, and methods having improved performance
US13/713,410 US9349929B2 (en) 2012-05-31 2012-12-13 Light emitter packages, systems, and methods
US29/439,629 USD749051S1 (en) 2012-05-31 2012-12-13 Light emitting diode (LED) package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/423,422 USD709464S1 (en) 2012-05-31 2012-05-31 Light emitting diode (LED) package

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US13/554,776 Continuation-In-Part US10439112B2 (en) 2012-05-31 2012-07-20 Light emitter packages, systems, and methods having improved performance

Related Child Applications (3)

Application Number Title Priority Date Filing Date
US13/554,776 Continuation US10439112B2 (en) 2012-05-31 2012-07-20 Light emitter packages, systems, and methods having improved performance
US29/439,629 Continuation-In-Part USD749051S1 (en) 2012-05-31 2012-12-13 Light emitting diode (LED) package
US13/713,410 Continuation-In-Part US9349929B2 (en) 2012-05-31 2012-12-13 Light emitter packages, systems, and methods

Publications (1)

Publication Number Publication Date
USD709464S1 true USD709464S1 (en) 2014-07-22

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US29/423,422 Active USD709464S1 (en) 2012-05-31 2012-05-31 Light emitting diode (LED) package

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Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100237775A1 (en) * 2009-03-20 2010-09-23 Everlight Electronics Co., Ltd. Light emitting diode package structure and manufacturing method thereof
USD718725S1 (en) * 2013-08-01 2014-12-02 Cree, Inc. LED package with encapsulant
USD735683S1 (en) * 2013-05-03 2015-08-04 Cree, Inc. LED package
USD746240S1 (en) * 2013-12-30 2015-12-29 Cree, Inc. LED package
USD749051S1 (en) 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
USD753612S1 (en) * 2012-09-07 2016-04-12 Cree, Inc. Light emitter device
US9349929B2 (en) 2012-05-31 2016-05-24 Cree, Inc. Light emitter packages, systems, and methods
USD758976S1 (en) * 2013-08-08 2016-06-14 Cree, Inc. LED package
US9397266B2 (en) 2007-11-14 2016-07-19 Cree, Inc. Lateral semiconductor light emitting diodes having large area contacts
US9484499B2 (en) 2007-04-20 2016-11-01 Cree, Inc. Transparent ohmic contacts on light emitting diodes with carrier substrates
USD790486S1 (en) * 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
USD826871S1 (en) * 2014-12-11 2018-08-28 Cree, Inc. Light emitting diode device
USD844183S1 (en) 2016-08-19 2019-03-26 Citizen Electronics Co., Ltd. Light emitting diode
USD844576S1 (en) 2017-07-25 2019-04-02 Citizen Electronics Co., Ltd. Light emitting diode
US10439112B2 (en) 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
US10683971B2 (en) 2015-04-30 2020-06-16 Cree, Inc. Solid state lighting components
USD926714S1 (en) 2019-10-30 2021-08-03 Creeled, Inc. Light emitting diode package
USD1000400S1 (en) 2021-04-16 2023-10-03 Creeled, Inc. Light emitting diode package
USD1086507S1 (en) * 2022-06-01 2025-07-29 Ligitek Electronics Co., Ltd. Light emitting diode package

Citations (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4946547A (en) 1989-10-13 1990-08-07 Cree Research, Inc. Method of preparing silicon carbide surfaces for crystal growth
US5200022A (en) 1990-10-03 1993-04-06 Cree Research, Inc. Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product
USRE34861E (en) 1987-10-26 1995-02-14 North Carolina State University Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide
JP2002057374A (en) 2000-08-08 2002-02-22 Matsushita Electric Ind Co Ltd Semiconductor light emitting device
JP2003258310A (en) 2002-03-01 2003-09-12 Citizen Electronics Co Ltd Surface mount type light emitting diode and method of manufacturing the same
US20040262738A1 (en) 2003-06-27 2004-12-30 Lee Kong Weng Packaging device for semiconductor die, semiconductor device incorporating same and method of making same
US7213940B1 (en) 2005-12-21 2007-05-08 Led Lighting Fixtures, Inc. Lighting device and lighting method
US20070158668A1 (en) 2005-08-25 2007-07-12 Cree, Inc. Close loop electrophoretic deposition of semiconductor devices
JP2008034513A (en) 2006-07-27 2008-02-14 Sumitomo Metal Electronics Devices Inc Light emitting element mounting substrate and manufacturing method thereof
US20080054286A1 (en) * 2005-01-27 2008-03-06 Cree, Inc. Light emitting device packages, light emitting diode (LED) packages and related methods
US20080173884A1 (en) 2007-01-22 2008-07-24 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US20080179611A1 (en) 2007-01-22 2008-07-31 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US20080258130A1 (en) 2007-04-23 2008-10-23 Bergmann Michael J Beveled LED Chip with Transparent Substrate
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
USD615504S1 (en) * 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US20100155763A1 (en) 2008-01-15 2010-06-24 Cree, Inc. Systems and methods for application of optical materials to optical elements
US20100207534A1 (en) 2007-10-09 2010-08-19 Philips Solid-State Lighting Solutions, Inc. Integrated led-based luminare for general lighting
US7791061B2 (en) 2004-05-18 2010-09-07 Cree, Inc. External extraction light emitting diode based upon crystallographic faceted surfaces
US20100237775A1 (en) 2009-03-20 2010-09-23 Everlight Electronics Co., Ltd. Light emitting diode package structure and manufacturing method thereof
US20100252851A1 (en) * 2007-10-31 2010-10-07 Cree, Inc. Led package with increased feature sizes
US20100277919A1 (en) 2007-07-13 2010-11-04 Rohm Co., Ltd. Led module and led dot matrix display
USD628966S1 (en) * 2009-12-22 2010-12-14 Panasonic Corporation Light-emitting diode
USD631020S1 (en) * 2010-04-29 2011-01-18 Edison Opto Corporation LED package
US20110012143A1 (en) 2005-01-10 2011-01-20 Cree, Inc. Solid state lighting component
US20110062482A1 (en) * 2010-01-20 2011-03-17 Bridgelux, Inc. Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces
US20110127912A1 (en) * 2009-11-30 2011-06-02 Young Jin Lee Led package, led package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof
US20110220920A1 (en) * 2010-03-09 2011-09-15 Brian Thomas Collins Methods of forming warm white light emitting devices having high color rendering index values and related light emitting devices
US8058088B2 (en) 2008-01-15 2011-11-15 Cree, Inc. Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating
USD650343S1 (en) * 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package
USD658139S1 (en) * 2011-01-31 2012-04-24 Cree, Inc. High-density emitter package
USD660257S1 (en) * 2011-01-31 2012-05-22 Cree, Inc. Emitter package
US20120286304A1 (en) * 2011-05-10 2012-11-15 Letoquin Ronan P Recipient Luminophoric Mediums Having Narrow Spectrum Luminescent Materials and Related Semiconductor Light Emitting Devices and Methods
US20120305949A1 (en) 2011-01-31 2012-12-06 Matthew Donofrio Light Emitting Diode (LED) Arrays Including Direct Die Attach And Related Assemblies
US20120326159A1 (en) 2011-06-24 2012-12-27 Cree, Inc. Led structure with enhanced mirror reflectivity
USD674758S1 (en) * 2011-10-31 2013-01-22 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
USD675169S1 (en) * 2011-12-13 2013-01-29 Lextar Electronics Corp. Multi-chip LED
US20130092960A1 (en) * 2007-10-31 2013-04-18 Ruud Lighting, Inc. Multi-Die LED Package
US20130105835A1 (en) * 2011-10-31 2013-05-02 Lite-On Technology Corp. Light-emitting diode device

Patent Citations (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE34861E (en) 1987-10-26 1995-02-14 North Carolina State University Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide
US4946547A (en) 1989-10-13 1990-08-07 Cree Research, Inc. Method of preparing silicon carbide surfaces for crystal growth
US5200022A (en) 1990-10-03 1993-04-06 Cree Research, Inc. Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product
JP2002057374A (en) 2000-08-08 2002-02-22 Matsushita Electric Ind Co Ltd Semiconductor light emitting device
JP2003258310A (en) 2002-03-01 2003-09-12 Citizen Electronics Co Ltd Surface mount type light emitting diode and method of manufacturing the same
US20040262738A1 (en) 2003-06-27 2004-12-30 Lee Kong Weng Packaging device for semiconductor die, semiconductor device incorporating same and method of making same
US7791061B2 (en) 2004-05-18 2010-09-07 Cree, Inc. External extraction light emitting diode based upon crystallographic faceted surfaces
US20110012143A1 (en) 2005-01-10 2011-01-20 Cree, Inc. Solid state lighting component
US20080054286A1 (en) * 2005-01-27 2008-03-06 Cree, Inc. Light emitting device packages, light emitting diode (LED) packages and related methods
US20070158668A1 (en) 2005-08-25 2007-07-12 Cree, Inc. Close loop electrophoretic deposition of semiconductor devices
US7213940B1 (en) 2005-12-21 2007-05-08 Led Lighting Fixtures, Inc. Lighting device and lighting method
JP2008034513A (en) 2006-07-27 2008-02-14 Sumitomo Metal Electronics Devices Inc Light emitting element mounting substrate and manufacturing method thereof
US20080173884A1 (en) 2007-01-22 2008-07-24 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US20080179611A1 (en) 2007-01-22 2008-07-31 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US20080258130A1 (en) 2007-04-23 2008-10-23 Bergmann Michael J Beveled LED Chip with Transparent Substrate
US20100277919A1 (en) 2007-07-13 2010-11-04 Rohm Co., Ltd. Led module and led dot matrix display
US20100207534A1 (en) 2007-10-09 2010-08-19 Philips Solid-State Lighting Solutions, Inc. Integrated led-based luminare for general lighting
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
USD615504S1 (en) * 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US20130092960A1 (en) * 2007-10-31 2013-04-18 Ruud Lighting, Inc. Multi-Die LED Package
US20100252851A1 (en) * 2007-10-31 2010-10-07 Cree, Inc. Led package with increased feature sizes
US8058088B2 (en) 2008-01-15 2011-11-15 Cree, Inc. Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating
US20100155763A1 (en) 2008-01-15 2010-06-24 Cree, Inc. Systems and methods for application of optical materials to optical elements
US20100237775A1 (en) 2009-03-20 2010-09-23 Everlight Electronics Co., Ltd. Light emitting diode package structure and manufacturing method thereof
US20110127912A1 (en) * 2009-11-30 2011-06-02 Young Jin Lee Led package, led package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof
USD628966S1 (en) * 2009-12-22 2010-12-14 Panasonic Corporation Light-emitting diode
US20110062482A1 (en) * 2010-01-20 2011-03-17 Bridgelux, Inc. Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces
US20110220920A1 (en) * 2010-03-09 2011-09-15 Brian Thomas Collins Methods of forming warm white light emitting devices having high color rendering index values and related light emitting devices
USD631020S1 (en) * 2010-04-29 2011-01-18 Edison Opto Corporation LED package
USD660257S1 (en) * 2011-01-31 2012-05-22 Cree, Inc. Emitter package
USD658139S1 (en) * 2011-01-31 2012-04-24 Cree, Inc. High-density emitter package
US20120305949A1 (en) 2011-01-31 2012-12-06 Matthew Donofrio Light Emitting Diode (LED) Arrays Including Direct Die Attach And Related Assemblies
USD650343S1 (en) * 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package
US20120286304A1 (en) * 2011-05-10 2012-11-15 Letoquin Ronan P Recipient Luminophoric Mediums Having Narrow Spectrum Luminescent Materials and Related Semiconductor Light Emitting Devices and Methods
US20120326159A1 (en) 2011-06-24 2012-12-27 Cree, Inc. Led structure with enhanced mirror reflectivity
USD674758S1 (en) * 2011-10-31 2013-01-22 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
US20130105835A1 (en) * 2011-10-31 2013-05-02 Lite-On Technology Corp. Light-emitting diode device
USD675169S1 (en) * 2011-12-13 2013-01-29 Lextar Electronics Corp. Multi-chip LED

Non-Patent Citations (11)

* Cited by examiner, † Cited by third party
Title
"High Flux Density and Efficacy," Luxeon M Datasheet DSI03, 2012, pp. 1-22, Philips Lumileds Company, United States.
Chinese Notice of Grant for Application No. 201230586339.6 dated Apr. 15, 2013.
Chinese Office Action for Application No. 201330248426.5 dated Aug. 19, 2013.
Chinese Office Action for Application No. 201330525231.0 dated Jan. 13, 2014.
International Search Report and Written Opinion for Application No. PCT/US2013/043618 dated Sep. 25, 2013.
International Search Report and Written Opinion for Application No. PCT/US2013/043619 dated Sep. 26, 2013.
Notice of Allowance for Design U.S. Appl. No. 29/439,629 dated Nov. 27, 2013.
Notice of Issurance for Application No. 201330248426.5 dated Nov. 19, 2013.
Restriction Requirement for Design U.S. Appl. No. 29/439,629 dated Sep. 30, 2013.
Restriction Requirement for U.S. Appl. No. 13/554,776 dated Jun. 14, 2013.
Shchekin, Oleg et al., "Evolutionary new chip design targets lighting systems," Compound Semiconductor, Mar. 2007, vol. 13 No. 2, Institute of Physics Publishing and IOP Publishing Ltd.

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9484499B2 (en) 2007-04-20 2016-11-01 Cree, Inc. Transparent ohmic contacts on light emitting diodes with carrier substrates
US9397266B2 (en) 2007-11-14 2016-07-19 Cree, Inc. Lateral semiconductor light emitting diodes having large area contacts
US20100237775A1 (en) * 2009-03-20 2010-09-23 Everlight Electronics Co., Ltd. Light emitting diode package structure and manufacturing method thereof
US10439112B2 (en) 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
USD749051S1 (en) 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
US9349929B2 (en) 2012-05-31 2016-05-24 Cree, Inc. Light emitter packages, systems, and methods
USD753612S1 (en) * 2012-09-07 2016-04-12 Cree, Inc. Light emitter device
USD735683S1 (en) * 2013-05-03 2015-08-04 Cree, Inc. LED package
USD718725S1 (en) * 2013-08-01 2014-12-02 Cree, Inc. LED package with encapsulant
USD758976S1 (en) * 2013-08-08 2016-06-14 Cree, Inc. LED package
USD746240S1 (en) * 2013-12-30 2015-12-29 Cree, Inc. LED package
USD790486S1 (en) * 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
USD826871S1 (en) * 2014-12-11 2018-08-28 Cree, Inc. Light emitting diode device
US10683971B2 (en) 2015-04-30 2020-06-16 Cree, Inc. Solid state lighting components
US10962199B2 (en) 2015-04-30 2021-03-30 Cree, Inc. Solid state lighting components
USD844183S1 (en) 2016-08-19 2019-03-26 Citizen Electronics Co., Ltd. Light emitting diode
USD844576S1 (en) 2017-07-25 2019-04-02 Citizen Electronics Co., Ltd. Light emitting diode
USD926714S1 (en) 2019-10-30 2021-08-03 Creeled, Inc. Light emitting diode package
USD1000400S1 (en) 2021-04-16 2023-10-03 Creeled, Inc. Light emitting diode package
USD1086507S1 (en) * 2022-06-01 2025-07-29 Ligitek Electronics Co., Ltd. Light emitting diode package

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