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TWI800977B - 半導體封裝以及其製造方法 - Google Patents

半導體封裝以及其製造方法 Download PDF

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Publication number
TWI800977B
TWI800977B TW110142018A TW110142018A TWI800977B TW I800977 B TWI800977 B TW I800977B TW 110142018 A TW110142018 A TW 110142018A TW 110142018 A TW110142018 A TW 110142018A TW I800977 B TWI800977 B TW I800977B
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TW
Taiwan
Prior art keywords
manufacturing
same
semiconductor package
package
semiconductor
Prior art date
Application number
TW110142018A
Other languages
English (en)
Other versions
TW202230549A (zh
Inventor
金秉喆
權容台
趙孝基
吳東勳
李載天
申亨鎭
瑪麗 梅耶 梅爾戈 加林巴
里茲 瓦倫西亞 加卓
Original Assignee
南韓商Ｎｅｐｅｓ股份有限公司
南韓商Ｎｅｐｅｓ Ｌａｗｅｈ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020210150899A external-priority patent/KR102610247B1/ko
Application filed by 南韓商Ｎｅｐｅｓ股份有限公司, 南韓商Ｎｅｐｅｓ Ｌａｗｅｈ股份有限公司 filed Critical 南韓商Ｎｅｐｅｓ股份有限公司
Publication of TW202230549A publication Critical patent/TW202230549A/zh
Application granted granted Critical
Publication of TWI800977B publication Critical patent/TWI800977B/zh

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Classifications

    • H10W70/614—
    • H10P72/74—
    • H10W40/22—
    • H10W42/121—
    • H10W70/05—
    • H10W70/611—
    • H10W70/685—
    • H10W74/01—
    • H10W74/117—
    • H10W90/401—
    • H10P72/7424—
    • H10P72/743—
    • H10P72/7436—
    • H10P72/744—
    • H10W72/877—
    • H10W74/019—
    • H10W90/701—
    • H10W90/724—
TW110142018A 2020-11-11 2021-11-11 半導體封裝以及其製造方法 TWI800977B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR20200150517 2020-11-11
KR10-2020-0150517 2020-11-11
KR20200158060 2020-11-23
KR10-2020-0158060 2020-11-23
KR10-2021-0150899 2021-11-04
KR1020210150899A KR102610247B1 (ko) 2020-11-11 2021-11-04 반도체 패키지 및 이의 제조 방법

Publications (2)

Publication Number Publication Date
TW202230549A TW202230549A (zh) 2022-08-01
TWI800977B true TWI800977B (zh) 2023-05-01

Family

ID=81658598

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110142018A TWI800977B (zh) 2020-11-11 2021-11-11 半導體封裝以及其製造方法

Country Status (2)

Country Link
US (1) US12125775B2 (zh)
TW (1) TWI800977B (zh)

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* Cited by examiner, † Cited by third party
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US20230290714A1 (en) * 2022-03-14 2023-09-14 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and manufacturing method thereof
US20250285982A1 (en) * 2024-03-11 2025-09-11 Nanya Technology Corporation Package structure including inactive element, assembly structure and method of manufacturing the same
CN118888451B (zh) * 2024-03-26 2025-02-11 芯爱科技(南京)有限公司 封装基板的制法
CN118099107B (zh) * 2024-04-24 2024-08-23 甬矽半导体(宁波)有限公司 半导体封装结构及其制备方法

Citations (4)

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TW201413882A (zh) * 2012-09-20 2014-04-01 台灣積體電路製造股份有限公司 半導體裝置及成型一半導體裝置之方法
TW201618274A (zh) * 2014-08-12 2016-05-16 英凡薩斯公司 用於整合式超高密度裝置的方法及裝置
TW201715670A (zh) * 2015-05-05 2017-05-01 聯發科技股份有限公司 半導體封裝結構
TW201907531A (zh) * 2017-07-04 2019-02-16 南韓商三星電子股份有限公司 扇出型半導體封裝

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US10050004B2 (en) 2015-11-20 2018-08-14 Deca Technologies Inc. Fully molded peripheral package on package device
US9613857B2 (en) * 2014-10-30 2017-04-04 Taiwan Semiconductor Manufacturing Company, Ltd. Electrostatic discharge protection structure and method
US9589936B2 (en) 2014-11-20 2017-03-07 Apple Inc. 3D integration of fanout wafer level packages
US10032704B2 (en) 2015-02-13 2018-07-24 Taiwan Semiconductor Manufacturing Company, Ltd. Reducing cracking by adjusting opening size in pop packages
US9589903B2 (en) 2015-03-16 2017-03-07 Taiwan Semiconductor Manufacturing Company, Ltd. Eliminate sawing-induced peeling through forming trenches
US9601471B2 (en) 2015-04-23 2017-03-21 Apple Inc. Three layer stack structure
US10032756B2 (en) * 2015-05-21 2018-07-24 Mediatek Inc. Semiconductor package assembly with facing active surfaces of first and second semiconductor die and method for forming the same
US10141276B2 (en) * 2016-09-09 2018-11-27 Powertech Technology Inc. Semiconductor package structure and manufacturing method thereof
KR102566996B1 (ko) * 2016-09-09 2023-08-14 삼성전자주식회사 FOWLP 형태의 반도체 패키지 및 이를 가지는 PoP 형태의 반도체 패키지
DE102018122228B4 (de) * 2017-11-15 2023-01-26 Taiwan Semiconductor Manufacturing Company, Ltd. Integriertes Multichip-Fan-Out-Package sowie Verfahren zu dessen Herstellung
US11177142B2 (en) 2017-11-30 2021-11-16 Taiwan Semiconductor Manufacturing Company, Ltd. Method for dicing integrated fan-out packages without seal rings
US10468355B2 (en) 2017-12-08 2019-11-05 Taiwan Semiconductor Manufacturing Company, Ltd. EMI Shielding structure in InFO package
JP7211803B2 (ja) 2018-12-21 2023-01-24 日東電工株式会社 半導体背面密着フィルム
US10510686B2 (en) * 2018-04-27 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package and manufacturing method thereof
US10950554B2 (en) * 2018-07-16 2021-03-16 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor packages with electromagnetic interference shielding layer and methods of forming the same
KR20200051212A (ko) * 2018-11-05 2020-05-13 삼성전자주식회사 반도체 패키지

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201413882A (zh) * 2012-09-20 2014-04-01 台灣積體電路製造股份有限公司 半導體裝置及成型一半導體裝置之方法
TW201618274A (zh) * 2014-08-12 2016-05-16 英凡薩斯公司 用於整合式超高密度裝置的方法及裝置
TW201715670A (zh) * 2015-05-05 2017-05-01 聯發科技股份有限公司 半導體封裝結構
TW201907531A (zh) * 2017-07-04 2019-02-16 南韓商三星電子股份有限公司 扇出型半導體封裝

Also Published As

Publication number Publication date
US12125775B2 (en) 2024-10-22
TW202230549A (zh) 2022-08-01
US20220165648A1 (en) 2022-05-26

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