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TWI800591B - 半導體封裝以及其製造方法 - Google Patents

半導體封裝以及其製造方法 Download PDF

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Publication number
TWI800591B
TWI800591B TW108101396A TW108101396A TWI800591B TW I800591 B TWI800591 B TW I800591B TW 108101396 A TW108101396 A TW 108101396A TW 108101396 A TW108101396 A TW 108101396A TW I800591 B TWI800591 B TW I800591B
Authority
TW
Taiwan
Prior art keywords
manufacturing
semiconductor package
package
semiconductor
Prior art date
Application number
TW108101396A
Other languages
English (en)
Other versions
TW201933498A (zh
Inventor
金錦雄
愛德文 Ｊ 艾登
路多維科 Ｅ 班寇德
金即瓊
羅伯特 蘭左訥
李傑恩
李英宇
崔美京
Original Assignee
美商艾馬克科技公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/871,617 external-priority patent/US10163867B2/en
Priority claimed from US16/037,686 external-priority patent/US10872879B2/en
Application filed by 美商艾馬克科技公司 filed Critical 美商艾馬克科技公司
Publication of TW201933498A publication Critical patent/TW201933498A/zh
Application granted granted Critical
Publication of TWI800591B publication Critical patent/TWI800591B/zh

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Classifications

    • H10W74/01—
    • H10W42/276—
    • H10W42/20—
    • H10W90/00—
    • H10W95/00—
    • H10W72/0198—
    • H10W72/877—
    • H10W72/884—
    • H10W74/142—
    • H10W90/724—
    • H10W90/732—
    • H10W90/754—
TW108101396A 2018-01-15 2019-01-14 半導體封裝以及其製造方法 TWI800591B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US15/871,617 2018-01-15
US15/871,617 US10163867B2 (en) 2015-11-12 2018-01-15 Semiconductor package and manufacturing method thereof
US16/037,686 2018-07-17
US16/037,686 US10872879B2 (en) 2015-11-12 2018-07-17 Semiconductor package and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW201933498A TW201933498A (zh) 2019-08-16
TWI800591B true TWI800591B (zh) 2023-05-01

Family

ID=67274129

Family Applications (3)

Application Number Title Priority Date Filing Date
TW112113598A TWI839179B (zh) 2018-01-15 2019-01-14 半導體封裝以及其製造方法
TW108101396A TWI800591B (zh) 2018-01-15 2019-01-14 半導體封裝以及其製造方法
TW113111420A TW202433621A (zh) 2018-01-15 2019-01-14 半導體封裝以及其製造方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW112113598A TWI839179B (zh) 2018-01-15 2019-01-14 半導體封裝以及其製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW113111420A TW202433621A (zh) 2018-01-15 2019-01-14 半導體封裝以及其製造方法

Country Status (2)

Country Link
CN (1) CN110047826A (zh)
TW (3) TWI839179B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11362041B2 (en) 2019-12-19 2022-06-14 Amkor Technology Japan, Inc. Semiconductor devices including shielding layer and methods of manufacturing semiconductor devices
CN111816629B (zh) * 2020-09-14 2020-12-15 甬矽电子(宁波)股份有限公司 电磁屏蔽封装结构和电磁屏蔽封装结构制作方法
PH12022050172A1 (en) 2021-05-31 2023-02-20 Inari Tech Sdn Bhd A system, process and a jig for forming conformal emi shield on package-level electronics or a portion thereof
US12183687B2 (en) * 2022-04-06 2024-12-31 STATS ChipPAC Pte. Ltd. Semiconductor device and method using an EMI-absorbing metal bar
TWI887581B (zh) * 2022-11-22 2025-06-21 矽品精密工業股份有限公司 電子封裝件及其製法
CN115632046B (zh) * 2022-12-07 2023-03-10 江苏长晶浦联功率半导体有限公司 一种芯片封装结构及其制作方法
CN118099004A (zh) * 2024-03-07 2024-05-28 环旭(深圳)电子科创有限公司 系统级封装模块及其制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090236686A1 (en) * 2006-04-19 2009-09-24 Stats Chippac, Ltd. Semiconductor Device and Method of Forming UBM Fixed Relative to Interconnect Structure for Alignment of Semiconductor Die
US20130037950A1 (en) * 2011-08-10 2013-02-14 Taiwan Semiconductor Manufacturing Company, Ltd. Multi-Chip Wafer Level Package
US8420437B1 (en) * 2011-12-05 2013-04-16 Powertech Technology Inc. Method for forming an EMI shielding layer on all surfaces of a semiconductor package
TW201611203A (zh) * 2014-09-12 2016-03-16 矽品精密工業股份有限公司 半導體封裝件及其製法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI499024B (zh) * 2009-01-07 2015-09-01 日月光半導體製造股份有限公司 堆疊式多封裝構造裝置、半導體封裝構造及其製造方法
CN201788967U (zh) * 2010-09-06 2011-04-06 群登科技股份有限公司 电子元件封装结构
US8461676B2 (en) * 2011-09-09 2013-06-11 Qualcomm Incorporated Soldering relief method and semiconductor device employing same
KR101953396B1 (ko) * 2013-10-23 2019-03-04 앰코테크놀로지코리아(주) 반도체 패키지 및 그 제작 방법
US9826630B2 (en) * 2014-09-04 2017-11-21 Nxp Usa, Inc. Fan-out wafer level packages having preformed embedded ground plane connections and methods for the fabrication thereof
KR101780541B1 (ko) * 2015-03-24 2017-09-21 앰코 테크놀로지 코리아 주식회사 반도체 디바이스 및 그 제조 방법
CN204720447U (zh) * 2015-06-19 2015-10-21 江苏长电科技股份有限公司 一种凹槽基板的电磁屏蔽模组封装结构
KR101712288B1 (ko) * 2015-11-12 2017-03-03 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조 방법
US9859229B2 (en) * 2016-04-28 2018-01-02 Taiwan Semiconductor Manufacturing Co., Ltd. Package structure and method for forming the same
CN107248509A (zh) * 2017-07-14 2017-10-13 中芯长电半导体（江阴）有限公司 Emi防护的芯片封装结构及封装方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090236686A1 (en) * 2006-04-19 2009-09-24 Stats Chippac, Ltd. Semiconductor Device and Method of Forming UBM Fixed Relative to Interconnect Structure for Alignment of Semiconductor Die
US20130037950A1 (en) * 2011-08-10 2013-02-14 Taiwan Semiconductor Manufacturing Company, Ltd. Multi-Chip Wafer Level Package
US8420437B1 (en) * 2011-12-05 2013-04-16 Powertech Technology Inc. Method for forming an EMI shielding layer on all surfaces of a semiconductor package
TW201611203A (zh) * 2014-09-12 2016-03-16 矽品精密工業股份有限公司 半導體封裝件及其製法

Also Published As

Publication number Publication date
TW201933498A (zh) 2019-08-16
TWI839179B (zh) 2024-04-11
TW202433621A (zh) 2024-08-16
TW202333248A (zh) 2023-08-16
CN110047826A (zh) 2019-07-23

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