TWI860585B - Decontamination sheet - Google Patents

Abstract

A decontamination sheet including a release layer or composite plate, an adhesive layer, a substrate layer, a cleaning layer, and a polishing layer is provided. The adhesive layer is disposed on the release layer or composite plate. The substrate layer is disposed on the adhesive layer. The cleaning layer is disposed on the substrate layer. The material of the cleaning layer includes silicone resin having a high degree of crosslinking and organic particles. The polishing layer is disposed on the cleaning layer.

Description

Stain removal tablets

The present invention relates to a decontamination sheet, and in particular to a decontamination sheet that can be used for cleaning a probe.

In the testing of electronic components (such as final test (FT) or chip probing (CP), but not limited to the above), it is often necessary to use a probe pin to measure electrical properties. However, if there are impurities on the probe pin; and/or there are too many or too large scratches, it may affect the test results of the electronic component.

The present invention provides a decontamination sheet, which can be used for cleaning a probe or removing stains on the probe.

The decontamination sheet of the present invention comprises a release layer or a composite material, an adhesive layer, a substrate, a cleaning layer and an abrasive layer. The adhesive layer is located on the release layer or the composite material. The substrate is located on the adhesive layer. The cleaning layer is located on the substrate. The material of the cleaning layer comprises an organic silicone resin with a high cross-linking degree and organic particles. The abrasive layer is located on the cleaning layer.

In one embodiment of the present invention, a release layer or a composite material, an adhesive layer, a substrate, a cleaning layer, and a polishing layer are stacked in sequence.

In one embodiment of the present invention, two opposite surfaces of the cleaning layer directly contact the substrate and the polishing layer, and in the process of cleaning the object with the decontamination sheet, the polishing layer is the first film layer of the object to contact the decontamination sheet.

In one embodiment of the present invention, the porosity of the organic silicon resin having a high degree of crosslinking is less than 3%.

In one embodiment of the present invention, the Shore hardness of the cleaning layer is between 40A and 80A.

In one embodiment of the present invention, the Young's modulus of the cleaning layer is between 100 kg/cm ² and 250 kg/cm ² .

In one embodiment of the present invention, the Shore hardness of the cleaning layer is between 40A and 80A, and the Young's modulus of the cleaning layer is between 100 kg/cm ² and 250 kg/cm ² .

In one embodiment of the present invention, the organic particles have a Mohs hardness of less than 7.

In one embodiment of the present invention, the organic particles do not act as a catalyst in the formation of the organosilicon resin having a high degree of crosslinking.

In one embodiment of the present invention, the material of the grinding layer includes resin and inorganic particles.

In one embodiment of the present invention, the Mohs hardness of the inorganic particles is greater than or equal to 7.

In one embodiment of the present invention, the Young's modulus of the grinding layer is greater than the Young's modulus of the cleaning layer.

Based on the above, in the decontamination sheet of the present invention, since the cleaning layer can be suitable for adhering to and covering the material on the probe, the decontamination sheet can be suitable for cleaning the probe or removing the dirt on the probe, and can reduce the possibility of scratches on the probe or reduce the size of the scratches generated.

In the accompanying drawings, for the sake of clarity, the size of some components or film layers is enlarged or reduced. In addition, for the sake of clarity, some film layers or components may be omitted in the drawings.

Directional terms used herein (eg, up, down, right, left, front, back, top, bottom) are used only with reference to the drawings and are not intended to imply an absolute orientation.

The numerical values indicated in the specification may include the numerical values and deviation values within the deviation range acceptable to persons of ordinary skill in the art. The above deviation values may be one or more standard deviations in the manufacturing process or measurement process, or calculation errors caused by other factors such as the number of digits used, rounding, or error propagation in the calculation or conversion process.

FIG. 1 is a schematic cross-sectional view of a decontamination sheet according to a first embodiment of the present invention.

Referring to FIG. 1 , the decontamination sheet 100 may include a release layer 110, an adhesive layer 120, a substrate 130, a cleaning layer 140, and an abrasive layer 150. The release layer 110 is located below the adhesive layer 120 (at the bottom in FIG. 1 ). The adhesive layer 120 is located below the substrate 130 (at the bottom in FIG. 1 ). The cleaning layer 140 is located above the substrate 130 (at the top in FIG. 1 ). The abrasive layer 150 is located above the cleaning layer 140 (at the top in FIG. 1 ). In other words, the adhesive layer 120 and the cleaning layer 140 are located at two opposite sides of the substrate 130, respectively.

In this embodiment, the decontamination sheet 100 may include a release layer 110, an adhesive layer 120, a substrate 130, a cleaning layer 140, and an abrasive layer 150 that are stacked. For example, two opposite surfaces of the adhesive layer 120 may directly contact the release layer 110 and the substrate 130, two opposite surfaces of the substrate 130 may directly contact the adhesive layer 120 and the cleaning layer 140, and two opposite surfaces of the cleaning layer 140 may directly contact the substrate 130 and the abrasive layer 150.

In this embodiment, the release layer 110 may include a release film or a release paper, but the present invention is not limited thereto. In one embodiment, the material of the release film as the release layer 110 may include polyethylene terephthalate (PET). In one embodiment, the thickness of the release film may be 25 micrometers (µm) to 175 micrometers, but the present invention is not limited thereto. In one embodiment, the release force of the release film may be 2 gf/25mm to 200 gf/25mm, but the present invention is not limited thereto.

In this embodiment, the thickness of the adhesive layer 120 is greater than or equal to 10 micrometers and less than or equal to 50 micrometers. For example, the thickness of the adhesive layer 120 is substantially 25 micrometers.

If the thickness of the adhesive layer (eg, the same as or similar to the adhesive layer 120 but different in thickness) is less than 10 microns, the adhesive force of the adhesive layer may be reduced.

If the thickness of the adhesive layer (eg, the same or similar to the adhesive layer 120 but different in thickness) is greater than 50 microns, the adhesive layer may be too thick, which may increase the overall thickness of the decontamination sheet, thereby increasing the material cost or affecting the functions of other film layers.

In this embodiment, the thickness of the substrate 130 is greater than or equal to 12 micrometers and less than or equal to 200 micrometers. For example, the thickness of the substrate 130 is substantially 100 micrometers to 125 micrometers.

If the thickness of the substrate (e.g., the same or similar to substrate 130, but different in thickness) is less than 12 microns, the support is poor; and/or the cleaned object (e.g., probe 91 in FIG. 3C, FIG. 3F, FIG. 4A, or FIG. 4B) may pierce the substrate with a thickness less than 12 microns.

If the thickness of the substrate (e.g., the same or similar to substrate 130, but different in thickness) is greater than 200 microns, the overall thickness of the decontamination sheet including the substrate having a thickness greater than 200 microns may be increased, thereby increasing the material cost or affecting the functions of other film layers.

In the present embodiment, the material of the substrate 130 may include polyethylene terephthalate (PET), polyimide (PI), polyether ether ketone (PEEK), polyetherimide (PEI), polyamide (PA), polyethersulfone (PES), polyethylene naphthalate (PEN), a stack of the above, or a combination thereof.

In this embodiment, the material of the polishing layer 150 may include a plurality of inorganic particles 151 and a resin encapsulating the inorganic particles 151. In addition, for the sake of clarity, not all inorganic particles are indicated one by one in the corresponding figures (eg, FIG. 1 or FIG. 2).

In the present embodiment, the resin material of the polishing layer 150 may include silicone, polyurethane (PU), polymethyl methacrylate (PMMA; also referred to as acrylic), or a combination thereof.

The inorganic particles 151 may include spherical or polygonal aluminum oxide particles, spherical or polygonal silicon carbide particles, spherical or polygonal diamond particles, spherical or polygonal quartz particles, spherical or polygonal zirconia (ZrO ₂ ) particles, spherical or polygonal ceria (CeO ₂ ) particles, or a combination thereof. The particle size of the inorganic particles is about 0.02 microns to 20 microns, and the Moh's hardness of the inorganic particles is greater than or equal to 7.

In one embodiment, the particles included in the polishing layer 150 may not include organic particles.

In this embodiment, the thickness of the polishing layer 150 is greater than or equal to 5 micrometers and less than or equal to 200 micrometers.

If the thickness of the polishing layer (e.g., having the same or similar material as the polishing layer 150 but a different thickness) is less than 5 microns, the cleaning ability of the decontamination sheet (including the polishing layer having a thickness of 5 microns) may be reduced; and/or, if the thickness of the polishing layer (e.g., having the same or similar material as the polishing layer 150 but a different thickness) is less than 5 microns, substances (e.g., solder used to form conductive terminals, or aluminum, zinc, copper, carbon, or eutectic materials forming connection pads) attached to an object (e.g., probe 91 shown in Figures 3C, 3F, 4A, or 4B) may be more difficult to separate from each other by the decontamination sheet.

If the polishing layer (e.g., having the same or similar material as polishing layer 150 but different thickness) has a thickness greater than 200 microns, it may be easily scratched, broken and/or deformed during the cleaning process of the object (e.g., probe 91 shown in Figures 3C, 3F, 4A or 4B).

In one embodiment, when cleaning an object (eg, the probe 91 shown in FIG. 3C , FIG. 3F , FIG. 4A , or FIG. 4B ) using the decontamination sheet 100 , the polishing layer 150 is the first film layer of the decontamination sheet 100 that contacts the object.

In this embodiment, the material of the cleaning layer 140 may include a plurality of organic particles 141 and a silicone resin encapsulating the organic particles 141. In addition, for the sake of clarity, not all organic particles are indicated one by one in the corresponding figures (eg, FIG. 1 or FIG. 2).

The organic particles 141 include spherical or polygonal particles formed by organic compounds having alkenyl groups, ether groups, amide groups, amine groups, carboxyl groups, ester groups, alcohol groups, silyl groups, alkoxy groups, alkoxysilyl groups, or combinations thereof. The particle size of the organic particles is about 0.05 microns to 30 microns.

The aforementioned silicone resin is, for example, an organic polymer formed by an organosiloxane having a highly cross-linked network structure. The aforementioned organosiloxane may include polydimethylsiloxane, polymethylphenylsiloxane, methylpolysiloxane, or a combination thereof. The glass-transition temperature (Tg) of the aforementioned silicone resin is lower than room temperature, such as: the glass-transition temperature of the aforementioned silicone resin is about -60°C to -20°C. The weight average molecular weight of the aforementioned organosiloxane is, for example, about 20,000 g/mol to 200,000 g/mol.

The cleaning layer 140 may be formed as follows. The chloro group of chlorosilane (e.g., methyltrichlorosilane, dimethyldichlorosilane, phenyltrichlorosilane, diphenyldichlorosilane, methylphenyldichlorosilane or a combination thereof) may be replaced by a hydroxyl group through a reaction (e.g., a hydrolysis reaction) to generate a corresponding acidic hydrolyzate (e.g., an acidic hydrolyzate). The initial product of the hydrolysis reaction (e.g., the acidic hydrolyzate described above) may be a mixture of cyclic, linear and cross-linked polymers containing a hydroxyl group. Then, the acidic hydrolyzate can be washed with water to remove the acid, thereby producing a substantially neutral (e.g., pH = 7±1) primary polycondensate. The polycondensate can be thermally oxidized in air and/or further condensed and polymerized under the action of a catalyst (which can be called dehydration polymerization reaction), and then, a silicone resin with a highly cross-linked network structure can be formed by dehydration polymerization under appropriate conditions (e.g., adjusting the reaction temperature or gas atmosphere). The morphology of the organic silicone resin with a high degree of cross-linking can be similar to a colloid, a gel or a paste. Then, the predetermined organic particles 141 can be added to the organic silicone resin with a high degree of cross-linking. By the stirring step accompanying the mixing process, the organic particles 141 can be more evenly distributed in the organic silicon resin with a highly cross-linked network structure. There is basically no chemical reaction between the organic silicon resin with a high degree of cross-linking and the above-mentioned organic particles. In other words, the above-mentioned organic particles 141 are not a catalyst during the dehydration polymerization reaction or any reaction period used to form the organic silicon resin. In other words, under the same or similar reaction conditions (such as: at the same or similar reaction temperature), whether or not the above-mentioned organic particles are added, the reaction rate constant for forming the organic silicon resin is basically the same.

In one embodiment, the cleaning layer 140 is a highly cross-linked organic silicon resin with low porosity (or even no pores). In one embodiment, the high density of the organic silicon resin may increase the possibility that a substance (such as the substance 99 described below) can easily contact or rub against the organic silicon resin and then be embedded or trapped therein.

Generally speaking, for polymer materials, the higher the degree of crosslinking or the more highly crosslinked the structure of the material, the lower the corresponding porosity (such as Porosity); or, the higher the degree of crosslinking or the more highly crosslinked the structure of the material, the lower the elasticity, the greater the mechanical strength, and/or the greater the hardness.

Generally speaking, the porosity of the organic silicon resin can be measured by a common method (such as, but not limited to, an immersion method or a gas expansion method). In one embodiment, the porosity of the organic silicon resin of the cleaning layer 140 can be less than 3%; preferably, less than or equal to 1%. If the porosity is greater than 3% (i.e., a resin with a low cross-linking degree is used as the cleaning layer), it may be due to the larger pores that when the object to be cleaned (such as the probe 91 in FIG. 3C, FIG. 3F, or FIG. 4A to FIG. 4D) is inserted into the cleaning layer, the material on it (such as the material 99 described later) will not easily contact or rub against the organic silicon resin, thereby reducing its cleaning effect.

In one embodiment, the Shore Hardness of the cleaning layer 140 is between 40A and 80A. If the Shore Hardness of the cleaning layer (e.g., having the same or similar thickness as the cleaning layer 140 but different hardness) is greater than 80A, the possibility of excessive, large or deep scratches on the object to be cleaned (e.g., the probe 91 in FIG. 3C , FIG. 3F , or FIG. 4A to FIG. 4D ) can be increased. If the Shore hardness of the cleaning layer (e.g., having the same or similar thickness as the cleaning layer 140 but different hardness) is less than 40A, then when the object to be cleaned (e.g., probe 91 in FIG. 3C , FIG. 3F , or FIG. 4A to FIG. 4D ) is inserted into the cleaning layer, the material thereon (e.g., material 99 described later) is difficult to be effectively separated from the object even if it contacts or rubs against the organic silicone resin, thereby reducing its cleaning effect.

In one embodiment, the Shore hardness can be tested by a commonly used standard method. For example, the Shore hardness can be tested by the standard test method/specification of ASTM D2240 or ISO 868, and converted or estimated.

In the present embodiment, the Young's modulus of the cleaning layer 140 is between 100 kg/cm ² and 250 kg/cm ² . If the Young's modulus of the cleaning layer (e.g., having the same or similar thickness as the cleaning layer 140 but a different modulus of elasticity in tension or compression) is greater than 250 kg/cm ² , when the object to be cleaned (e.g., the probe 91 in FIG. 3C , FIG. 3F , or FIG. 4A to FIG. 4D ) is repeatedly brought into contact with the decontamination sheet, the cleaning layer may recover to a state close to that before deformation at a slower speed, thereby reducing the cleaning ability of the cleaning layer. If the Young's modulus of the cleaning layer (e.g., having the same or similar thickness as the cleaning layer 140 but a different tensile or compressive elastic modulus) is less than 100 kg/ ^cm2 , when the object to be cleaned (e.g., the probe 91 in FIG. 3C, FIG. 3F, or FIG. 4A to FIG. 4D) is repeatedly brought into contact with the decontamination sheet, the cleaning layer may be too soft and the cleaning ability of the cleaning layer may be reduced.

In one embodiment, the Young's modulus of the cleaning layer 140 may be greater than or equal to 130 kg/cm ² and/or may be less than or equal to 200 kg/cm ² .

In one embodiment, the Young's modulus of the cleaning layer 140 may be greater than or equal to 130 kg/cm ² and less than or equal to 200 kg/cm ² . When the object to be cleaned (such as the probe 91 in FIG. 3C , FIG. 3F , or FIG. 4A to FIG. 4D ) is in contact with the decontamination sheet 100 (or when it is used multiple times in a short period of time), the cleaning ability, cleaning efficiency and number of uses of the cleaning layer 140 may be further improved.

In one embodiment, the Shore hardness of the cleaning layer 140 may be between 40A and 80A, and the Young's modulus of the cleaning layer 140 may be less than or equal to 250 kg/cm ² ; or less than or equal to 200 kg/cm ² .

In one embodiment, the Shore hardness of the cleaning layer 140 may be between 40A and 80A, and the Young's modulus of the cleaning layer 140 may be greater than or equal to 100 kg/cm ² ; or greater than or equal to 130 kg/cm ² .

In one embodiment, the Shore hardness of the cleaning layer 140 may be between 40A and 80A. Also, the Young's modulus of the cleaning layer 140 may be greater than or equal to 100 kg/cm ² and less than or equal to 250 kg/cm ² .

In one embodiment, the Shore hardness of the cleaning layer 140 may be between 40A and 80A. Also, the Young's modulus of the cleaning layer 140 may be greater than or equal to 100 kg/cm ² and less than or equal to 200 kg/cm ² .

In one embodiment, the Shore hardness of the cleaning layer 140 may be between 40A and 80A. Also, the Young's modulus of the cleaning layer 140 may be greater than or equal to 130 kg/cm ² and less than or equal to 250 kg/cm ² .

In one embodiment, the Shore hardness of the cleaning layer 140 may be between 40A and 80A, the Young's modulus may be greater than or equal to 130 kg/cm ² and less than or equal to 200 kg/cm ² , and the porosity of the organic silicon resin forming the cleaning layer 140 may be less than 3% (preferably, less than or equal to 1%; even, less than or equal to 0.7%). In this way, a cleaning layer 140 having an appropriate hardness and elastic modulus range can be formed by the aforementioned high-crosslinked organic silicone resin with low porosity. When the object to be cleaned (such as the probe 91 in Figure 3C, Figure 3F, Figure 4A, or Figure 4B) is in contact with the decontamination sheet 100 (or when it is used multiple times in a short period of time), the cleaning ability, cleaning efficiency and usage of the cleaning layer 140 can be further improved, and the obvious wear of the object to be cleaned (such as the probe 91 in Figure 3C, Figure 3F, or Figures 4A to 4D) can be reduced (such as the generation of more, larger or deeper scratches).

In one embodiment, the organic particles may be suitable for bonding or connecting with metal materials (eg, solder) and/or metal oxide materials.

In one embodiment, the organic particles may be suitable for bonding or connecting with an organic silicon resin having a high degree of crosslinking (e.g., by Van der Waals bonding). For example, the functional groups (e.g., alkenyl, ether, amide, amino, carboxyl, ester, alcohol, silane, alkoxy, alkoxysilane) contained in the organic compound forming the organic particles 141 may be suitable for bonding or connecting with an organic silicon resin having a high degree of crosslinking.

In one embodiment, the organic particles 141 may include spherical or polygonal polymethyl methacrylate (PMMA) particles having been surface treated, spherical or polygonal polystyrene (PS) particles having been surface treated, spherical or polygonal polysiloxane particles having been surface treated, or a combination thereof. The above treatment may include: hydrogen on the surface of the polymer particles (such as: polymethyl methacrylate particles, polystyrene particles or polysiloxane particles) has been replaced by a functional group (such as: alkenyl, ether, amide, amino, carboxyl, ester, alcohol, silane, alkoxy or alkoxysilane) by performing an appropriate reaction.

In one embodiment, the Mohs hardness of the organic particles 141 is less than 7. In this way, the possibility of scratching the object to be cleaned (eg, the probe 91 in FIG. 3C , FIG. 3F , or FIG. 4A to FIG. 4D ) can be reduced.

In one embodiment, the particle size of the organic particles 141 is larger than the particle size of the inorganic particles 151 .

In one embodiment, in a unit volume, the number of organic particles 141 in the cleaning layer 140 is greater than the number of inorganic particles 151 in the polishing layer 150.

In one embodiment, the material of the cleaning layer 140 may not include inorganic materials.

In this embodiment, the thickness of the cleaning layer 140 is greater than or equal to 150 microns and less than or equal to 500 microns. If the thickness of the cleaning layer (e.g., the same or similar material as the cleaning layer 140, but different thickness) is less than 150 microns, the cleaning ability of the decontamination sheet 100 may be reduced. If the thickness of the cleaning layer (e.g., the same or similar material as the cleaning layer 140, but different thickness) is greater than 500 microns, there is a possibility of increasing the possibility of mixed damage (debonding, residual glue, self-fracture).

In one embodiment, the thickness of the cleaning layer 140 is greater than or equal to 230 micrometers and less than or equal to 300 micrometers. For example, in this embodiment, the thickness of the cleaning layer 140 can be substantially 265 micrometers.

In this embodiment, the decontamination sheet 100 may be used as a probe card clean pad, but the present invention is not limited thereto.

FIG. 2 is a schematic cross-sectional view of a decontamination sheet according to a second embodiment of the present invention.

2 , a decontamination sheet 200 may include a composite material 210, an adhesive layer 220, a substrate 230, a cleaning layer 240, and an abrasive layer 250. The adhesive layer 220 is located below the composite material 210 (at the bottom in FIG. 2 ). The substrate 230 is located below the adhesive layer 220 (at the bottom in FIG. 2 ). The cleaning layer 240 is located below the substrate 230 (at the bottom in FIG. 2 ). The abrasive layer 250 is located below the cleaning layer 240 (at the bottom in FIG. 2 ).

In this embodiment, the decontamination sheet 200 may include a laminated composite material 210, an adhesive layer 220, a substrate 230, a cleaning layer 240, and an abrasive layer 250. For example, two opposite surfaces of the adhesive layer 220 may directly contact the composite material 210 and the substrate 230, two opposite surfaces of the substrate 230 may directly contact the adhesive layer 220 and the cleaning layer 240, and two opposite surfaces of the cleaning layer 240 may directly contact the substrate 230 and the abrasive layer 250.

In this embodiment, the composite material 210 may include a hard plate-like body, but the present invention is not limited thereto. In one embodiment, the material of the hard plate-like body of the composite material 210 may include a silicon substrate, a glass fiber board (such as an FR4 board), a hard plastic substrate (such as an acrylic board) or the above-mentioned composite plate. In one embodiment, the thickness of the above-mentioned composite plate may be 100 microns to 2000 microns, but the present invention is not limited thereto. For example, the thickness of the above-mentioned composite plate is substantially 750 microns.

In this embodiment, the material of the adhesive layer 220 of the decontamination sheet 200 may be the same or similar to the material of the adhesive layer 120 of the aforementioned embodiment, and have the same or similar uses or properties, so they are not described in detail here.

In this embodiment, the material of the substrate 230 of the decontamination sheet 200 may be the same or similar to the material of the substrate 130 of the aforementioned embodiment, and has the same or similar uses or properties, so it will not be described in detail here.

In this embodiment, the material of the cleaning layer 240 of the decontamination sheet 200 may be the same or similar to the material of the cleaning layer 140 of the above-mentioned embodiment, and has the same or similar uses or properties, so it is not described in detail here. For example, the material of the cleaning layer 240 may include a plurality of organic particles (e.g., organic particles that are the same or similar to the organic particles 141) and a silicone resin that encapsulates the organic particles.

In this embodiment, the material of the abrasive layer 250 of the decontamination sheet 200 may be the same or similar to the material of the abrasive layer 150 of the aforementioned embodiment, and have the same or similar uses or properties, so it is not described in detail here. For example, the material of the abrasive layer 250 may include a plurality of inorganic particles (e.g., inorganic particles that are the same or similar to the inorganic particles 151) and a resin that encapsulates the inorganic particles.

In one embodiment, similarly, the hardness of the organic particles in the cleaning layer 240 may be less than the hardness of the inorganic particles in the polishing layer 250 .

In one embodiment, similarly, the particle size of the organic particles in the cleaning layer 240 may be larger than the particle size of the inorganic particles in the polishing layer 250 .

In one embodiment, similarly, in a unit volume, the number of organic particles in the cleaning layer 240 is greater than the number of inorganic particles in the polishing layer 250.

In this embodiment, the thickness of the cleaning layer 240 may be substantially 150 microns.

In this embodiment, the decontamination sheet 200 may be used as a test socket clean pad, but the present invention is not limited thereto.

In the present invention, the probe pin can be cleaned by using the decontamination sheet 100, 200 of any of the aforementioned embodiments. However, it should be noted that the present invention does not limit the use of the decontamination sheet 100, 200 of any of the aforementioned embodiments.

The method for cleaning the probe may include the following steps: Step 1: Testing the electronic component with the probe. Step 2: After the aforementioned step 1, cleaning the probe with the decontamination sheet 100, 200 of any of the aforementioned embodiments.

The cleaning method of the probe is exemplified as follows: Please refer to Figures 3A to 4D, wherein Figures 3A to 3F are schematic diagrams of a cleaning method of a probe according to an embodiment of the present invention, and Figures 4A to 4D are partial cross-sectional enlarged schematic diagrams of a cleaning method of a probe according to an embodiment of the present invention.

3A to 3C , the electrical properties of the electronic component 70 can be tested by a probe 91 in a commonly used testing manner.

Taking FIG. 3A as an example, an electronic component 70 and a decontamination sheet 300 are provided.

In this embodiment, the electronic component 70 is, for example, a bare die or a chip package, but the present invention is not limited thereto.

In this embodiment, the decontamination sheet 300 may be the same as or similar to the decontamination sheet 200 of the aforementioned embodiment. That is, the material of the substrate 330 of the decontamination sheet 300 may be the same as or similar to the material of the substrate 230 of the aforementioned embodiment, and have the same or similar uses or properties, so it is not described in detail here. Or; in this embodiment, the material of the cleaning layer 340 of the decontamination sheet 300 may be the same as or similar to the material of the cleaning layer 240 of the aforementioned embodiment, and have the same or similar uses or properties (such as Shore hardness). In addition, for clarity, the organic particles in the cleaning layer 340 (such as the same as or similar to the organic particles 141) are omitted from drawing and description. Alternatively, the material of the polishing layer 350 of the decontamination sheet 300 may be the same or similar to the material of the polishing layer 150 of the aforementioned embodiment, and have the same or similar uses or properties. In addition, for the sake of clarity, the inorganic particles in the polishing layer 350 (e.g., the same or similar to the inorganic particles 151) are omitted from depiction, and the description is omitted. In addition, in the figure, the adhesive layer (e.g., the same or similar to the aforementioned adhesive layer 120 or 220) and the composite material (e.g., the same or similar to the aforementioned composite material 210) of the decontamination sheet 300 are omitted from depiction.

In an embodiment not shown, the stain removal sheet 300 may be the same as or similar to the stain removal sheet 100 of the aforementioned embodiment.

Then, as shown in FIG. 3B , the electronic component 70 to be tested may be picked up by a pick-up and place head 81 of a pick-up and place device 80 .

Then, as shown in FIG. 3C , the electronic component 70 to be tested can be placed on the testing device 90 by using the pick-and-place device 80 .

The testing device 90, for example, has a plurality of probe pins 91. The probe pins 91 can contact conductive terminals (such as solder balls) (not shown) or contact pads (not shown) on the test surface 71 of the electronic component 70 to test the electronic component 70. For example, pressure can be applied to the electronic component 70 to be tested and/or the probe pins 91 so that the conductive terminals or contact pads on the test surface 71 of the electronic component 70 to be tested are in contact with the probe pins 91.

In this embodiment, the testing method is, for example, a final test (FT), but the present invention is not limited thereto. In one embodiment, the testing method may be a chip probing (CP).

After the exemplary test in FIG. 3A to FIG. 3C , the probe 91 may be cleaned by the decontamination sheet 300 in a similar manner.

Taking FIG. 3C to FIG. 3D as an example, after the electronic component 70 is tested, the electronic component 70 can be separated from the probe 91 and the electronic component 70 can be placed by the pick-and-place device 80 .

In one embodiment, during the process of contact and/or separation between the electronic component 70 and the probe 91, some materials on the electronic component 70 (such as solder forming the conductive terminal or aluminum, zinc or copper forming the contact pad) may be peeled off and adhered to the probe 91.

Then, as shown in FIG. 3E , the cleaning sheet 300 may be picked up by the pick-and-place head 81 of the pick-and-place device 80 .

Then, as shown in FIG. 3F , the cleaning sheet 300 can be placed on the testing device 90 by the pick-and-place device 80 , so as to clean the probe 91 by the cleaning sheet 300 .

For example, pressure may be applied to the decontamination sheet 300 and/or the probe 91 to bring the decontamination sheet 300 into contact with the probe 91, so that the substance 99 (e.g., solder, aluminum, zinc, copper, or possible contaminants; as indicated or depicted in FIGS. 4A to 4D ) adhering to the probe 91 is adhered by the cleaning layer 340 of the decontamination sheet 300. Thereafter, the decontamination sheet 300 may be separated from the probe 91, and the substance 99 adhering to the probe 91 may be reduced by the decontamination sheet 300.

For details, please refer to FIG. 4A to FIG. 4D .

As shown in FIGS. 4A and 4B , the end of the probe 91 for testing (i.e., the end for contacting the electronic component 70) can penetrate the polishing layer 350 of the decontamination sheet 300. The substance 99 attached to the probe 91 may be loosened from the probe 91 by the inorganic particles in the polishing layer 350. For example, during the process of the probe 91 penetrating the polishing layer 350, the substance 99 on the probe 91 may rub against the inorganic particles in the polishing layer 350.

As shown in FIG. 4B to FIG. 4C , during the process of the probe 91 penetrating the polishing layer 350 , the end of the probe 91 may further penetrate the cleaning layer 340 of the decontamination sheet 300 .

As shown in FIG. 4C , since the substance 99 attached to the probe 91 may have been loosened from the probe 91 during the process of the probe 91 penetrating the polishing layer 350 , when the probe 91 penetrates the cleaning layer 340 , the organic particles of the cleaning layer 340 can more easily remove the substance 99 from the probe 91 .

As shown in FIG. 4C to FIG. 4D , during the separation of the probe 91 from the polishing layer 350, a large portion of the material 99 removed from the probe 91 may be embedded or trapped in the silicone resin. In addition, since the Young's modulus of the cleaning layer 340 is smaller than the Young's modulus of the polishing layer 350, a large portion of the material 99 removed from the probe 91 may be retained and embedded or trapped in the silicone resin. As a result, during the above separation process, the possibility of the material 99 reattaching and re-adhering to the probe 91 can be reduced. It is worth noting that the Young's modulus of the aforementioned layer is determined by standardized measurement (e.g., ASTM D882) and corresponding calculation of the entire layer (e.g., the entire cleaning layer 340 may include an organic silicone resin with a cross-linked network structure and organic particles, and/or the entire polishing layer 350 may include a resin and inorganic particles).

In one embodiment, in a unit volume, since the number of organic particles in the cleaning layer 340 is greater than the number of inorganic particles in the polishing layer 350, a large portion of the substance 99 removed from the probe 91 can be more easily embedded or trapped in the silicone resin by the organic particles, and/or the possibility of the removed substance 99 being separated from the decontamination sheet 300 due to the withdrawal of the probe 91 during the separation process of the probe 91 from the decontamination sheet 300 into which it penetrates can be reduced. Therefore, the decontamination sheet 300 can have a longer effective use number.

In one embodiment, even though inorganic particles may (but the possibility of “not”) produce corresponding scratches on the probe 91 during the process of contact and/or separation between the probe 91 and the polishing layer 350, the particle size of the inorganic particles is approximately 0.02 microns to 20 microns, so the size and/or trace of the scratches (if any) can be reduced, thereby reducing the possibility of reduced performance of the probe 91 in subsequent use due to the scratches (if any).

As shown in FIG. 4D , after the decontamination sheet 300 is separated from the probe 91 , the amount of the substance 99 adhering to and/or coating the probe 91 can be reduced.

In the manner or steps of cleaning the probe 91 by using the decontamination sheet 100, 200, 300 of any of the aforementioned embodiments of the present invention, the probe 91 may not be disassembled or separated from the test device 90. Furthermore, the cleaning of the probe 91 may be performed by the same or similar operating parameters (recipe) as those for testing the electronic component 70. In other words, the steps of the cleaning method of the probe 91 may be performed in-situ or on-line.

It is worth noting that FIG. 3A to FIG. 4D only exemplarily introduce a method for cleaning a probe pin 91, and the present invention does not limit the type of the probe pin 91. For example, in FIG. 3A to FIG. 4D, the probe pin 91 shown is a vertical probe pin, but the present invention is not limited thereto. In an embodiment not shown, the decontamination sheet 100, 200, 300 of any of the above embodiments of the present invention can also be used to clean a cantilever probe pin by a method similar to a general test method.

FIG5A is an enlarged partial cross-sectional view of a cleaning layer according to a comparative example of the present invention. FIG5B is an enlarged partial cross-sectional view of a cleaning layer according to an experimental example of the present invention. Specifically, FIG5A and FIG5B are respectively enlarged views of the partial cross-sectional view of the cleaning layer corresponding to the comparative example and the experimental example observed by a scanning electron microscope (SEM) at 200 times.

When the cleaning layer shown in FIG. 5B is actually used on the decontamination sheet 100, 200 or 300 having the same or similar structure as the above-mentioned embodiments, the cleaning layer can be suitable for sticking substances on the probe, and can be suitable for cleaning the probe, and can reduce the possibility of scratches on the probe or reduce the size of the scratches. Moreover, when the needle is punctured multiple times in a short time (e.g., 0.2 seconds/time), it can still have good cleaning ability and cleaning efficiency.

In addition, when the cleaning layer with obvious pores as shown in FIG. 5A is actually used on a decontamination sheet having a structure similar to that described in the aforementioned embodiment, when or after the probe is brought into contact with the decontamination sheet for multiple times, the cleaning layer is too soft and the probe cannot be effectively cleaned, and the cleaning ability and cleaning efficiency are poor.

In summary, in the decontamination sheet of the present invention and the cleaning method of the probe by using the aforementioned decontamination sheet, since the cleaning layer can be suitable for sticking to the material on the probe, it can be suitable for cleaning the probe, and can reduce the possibility of scratches on the probe or reduce the size of the scratches; and/or, the decontamination sheet of the present invention can have more effective usage times.

100, 200, 300: Decontamination sheet 110: Release layer 210: Composite material 120, 220: Adhesive layer 130, 230, 330: Substrate 140, 240, 340: Cleaning layer 141: Organic particles 150, 250, 350: Polishing layer 151: Inorganic particles 80: Pick-and-place device 81: Pick-and-place head 70: Electronic component 71: Test surface 90: Test device 91: Probe 99: Substance

FIG. 1 is a schematic cross-sectional view of a decontamination sheet according to a first embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of a decontamination sheet according to a second embodiment of the present invention. FIG. 3A to FIG. 3F are schematic views of a probe cleaning or decontamination method according to an embodiment of the present invention. FIG. 4A to FIG. 4D are partially enlarged schematic cross-sectional views of a probe cleaning or decontamination method according to an embodiment of the present invention. FIG. 5A is a partially enlarged cross-sectional view of a cleaning layer according to a comparative example of the present invention. FIG. 5B is a partially enlarged cross-sectional view of a cleaning layer according to an experimental example of the present invention.

100: Decontamination tablets

110: Release layer

120: Adhesive layer

130: Base material

140: Cleaning layer

141: Organic particles

150: Grinding layer

151: Inorganic particles

Claims (7)

A decontamination sheet comprises: a release layer or a composite material; an adhesive layer located on the release layer or the composite material; a substrate located on the adhesive layer; a cleaning layer located on the substrate, wherein the material of the cleaning layer comprises an organic silicone resin with a high crosslinking degree and organic particles; and an abrasive layer located on the cleaning layer, wherein: the porosity of the organic silicone resin with a high crosslinking degree is less than 3%; the Shore hardness of the cleaning layer is between 40A and 80A, and the Young's modulus of the cleaning layer is between 130kg/ ^cm2 and 200kg/ ^cm2 ; and the organic particles do not act as a catalyst in the formation process of the organic silicone resin with a high crosslinking degree. A decontamination sheet as described in claim 1, wherein the release layer or composite material, the adhesive layer, the substrate, the cleaning layer and the polishing layer are stacked in sequence. A decontamination sheet as described in claim 1, wherein the two opposite surfaces of the cleaning layer directly contact the substrate and the polishing layer, and in the process of cleaning an object by using the decontamination sheet, the polishing layer is the first of the film layers of the object that contacts the decontamination sheet. A decontamination sheet as described in claim 1, wherein the Mohs hardness of the organic particles is less than 7. The decontamination sheet as described in claim 1, wherein the material of the abrasive layer includes: resin; and inorganic particles. A decontamination sheet as described in claim 5, wherein the Mohs hardness of the inorganic particles is greater than or equal to 7. A decontamination sheet as described in claim 1, wherein the Young's modulus of the abrasive layer is greater than the Young's modulus of the cleaning layer.

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