TWI763088B - Probe pin clean pad and clean method for probe pin - Google Patents

Abstract

A probe pin clean pad including a release layer or composite plate, an adhesive layer, a buffer layer, and a cleaning layer is provided. The adhesive layer is disposed on the release layer or composite plate. The buffer layer is disposed on the adhesive layer. The cleaning layer is disposed on the buffer layer. A clean method for a probe pin is also provided.

Description

Probe cleaning sheet and probe cleaning method

The present invention relates to a cleaning sheet and a method for cleaning probes, and more particularly, to a cleaning sheet for probes and a cleaning method for cleaning probes using the aforementioned cleaning sheet for probes.

In the test of electronic components (such as: final test (FT) or wafer probe test (chip probing; CP), but not limited to the above), it is often necessary to use probe pins to conduct electrical measurements. Measurement. Then, if there are impurities or scratches on the probe, it may affect the test results of the electronic components.

The present invention provides a probe cleaning sheet and a cleaning method for probe cleaning by the aforementioned probe cleaning sheet, which can be suitable for probe cleaning.

The probe cleaning sheet of the present invention includes a release layer or composite material, an adhesive layer, a substrate and a cleaning layer. The adhesive layer is on the release layer or composite material. The substrate is on the adhesive layer. The cleaning layer is on the substrate.

In an embodiment of the present invention, the release layer or composite material, the adhesive layer, the substrate and the cleaning layer are stacked in sequence.

In an embodiment of the present invention, the thickness of the adhesive layer is greater than or equal to 5 microns and less than or equal to 100 microns.

In an embodiment of the present invention, the thickness of the substrate is greater than or equal to 6 microns and less than or equal to 300 microns.

In an embodiment of the present invention, the Mohs hardness of the cleaning layer is less than 7, or the Young's modulus of the cleaning layer is less than or equal to 70 kg/cm ² .

In an embodiment of the present invention, the thickness of the cleaning layer is greater than or equal to 50 microns and less than or equal to 500 microns.

In an embodiment of the present invention, the material of the cleaning layer includes resin and organic particles.

In an embodiment of the present invention, the resin includes silicone, polyurethane, or a combination thereof.

In an embodiment of the present invention, the hardness of the organic particles is less than or equal to 7.

In an embodiment of the present invention, the material of the cleaning layer is composed of organic materials.

The cleaning method of the probe of the present invention includes the following steps. Step 1: Test electronic components with probes. Step 2: After Step 1, use the probe cleaning sheet of any of the foregoing embodiments to clean the probes.

In an embodiment of the present invention, step 1 and step 2 are performed in-situ or performed on-line.

Based on the above, in the probe cleaning sheet of the present invention and the cleaning method for probe cleaning by the aforementioned probe cleaning sheet, since the cleaning layer can be suitable for sticking and covering the substances on the probe, it can be suitable for probing Needle cleaning, and can reduce probe scratches.

100, 200, 300: Probe cleaning sheet

110: release layer

210: Composite Materials

120, 220: Adhesive layer

130, 230, 330: substrate

140, 240, 340: cleaning layer

80: Pick and place device

81: Pick and place head

70: Electronic Components

71: Tested surface

90: Test device

91: Probe

99: Substance

FIG. 1 is a schematic cross-sectional view of a probe cleaning sheet according to a first embodiment of the present invention.

2 is a schematic cross-sectional view of a probe cleaning sheet according to a second embodiment of the present invention.

3A to 3F are schematic diagrams of a cleaning method of a probe according to an embodiment of the present invention.

4A and 4B are partial cross-sectional enlarged schematic views of a method for cleaning a probe according to an embodiment of the present invention.

5A and 5B are enlarged partial surface views of probes according to [Experimental Example 1] and [Comparative Example 1] after cleaning.

6A and 6B are enlarged partial cross-sectional views after use of the probe cleaning sheet according to [Experimental Example 2] and [Comparative Example 2].

7A and 7B are partial surface enlarged views after use of the probe cleaning sheet according to [Comparative Example 3].

8A and 8B show the probe cleaning sheet according to [Experimental Example 3] after use Local surface magnification.

In the drawings, the dimensions of some elements or layers are exaggerated or reduced for clarity. In addition, for the sake of clarity, some of the film layers or components may be omitted from the drawings.

Directional terms (eg, top, bottom, right, left, front, back, top, bottom) as used herein are used only with reference to the drawings and are not intended to imply absolute orientation.

Numerical values expressed in the specification may include the stated numerical values as well as deviations within a range of deviations acceptable to those of ordinary knowledge in the art. The above deviation value can be one or more standard deviations (Standard Deviation) in the manufacturing process or the measurement process, or other factors such as the number of digits used in the calculation or conversion process, rounding or error propagation (Error Propagation) the resulting calculation error.

FIG. 1 is a schematic cross-sectional view of a probe cleaning sheet according to a first embodiment of the present invention.

Referring to FIG. 1 , the probe cleaning sheet 100 may include a release layer 110 , an adhesive layer 120 , a substrate 130 and a cleaning layer 140 . The release layer 110 is located under the adhesive layer 120 (lower in FIG. 1 ). The adhesive layer 120 is located under the substrate 130 (lower in FIG. 1 ). The cleaning layer 140 is located on the substrate 130 (above in FIG. 1 ). That is to say, the adhesive layer 120 and the cleaning layer 140 are respectively located on two opposite sides of the substrate 130 .

In this embodiment, the probe cleaning sheet 100 may include the The mold layer 110 , the adhesive layer 120 , the substrate 130 and the cleaning layer 140 . For example, two opposite surfaces of the adhesive layer 120 may directly contact the release layer 110 and the substrate 130 , and two opposite surfaces of the substrate 130 may directly contact the adhesive layer 120 and the cleaning layer 140 .

In this embodiment, the release layer 110 may include a release film or a release paper, but the present invention is not limited thereto. In one embodiment, the material of the aforementioned release film used as the release layer 110 may include polyethylene terephthalate (PET). In one embodiment, the thickness of the release film may be 25 micrometers (micrometer; μm) to 175 micrometers, but the invention is not limited thereto. In one embodiment, the release force of the release film may be 2˜200 gf/25mm, but the present invention is not limited thereto.

In this embodiment, the thickness of the adhesive layer 120 is greater than or equal to 5 microns and less than or equal to 100 microns. For example, the thickness of the adhesive layer 120 is substantially 25 microns.

If the thickness of the adhesive layer 120 is less than 5 μm, the adhesive force of the adhesive layer 120 may be reduced.

If the thickness of the adhesive layer 120 is greater than 100 μm, the overall thickness of the probe cleaning sheet 100 may be correspondingly increased due to the excessively thick adhesive layer 120 , thereby increasing the material cost or affecting the use of other film layers.

In this embodiment, the thickness of the substrate 130 is greater than or equal to 6 micrometers and less than or equal to 300 micrometers. For example, the thickness of the substrate 130 is substantially 100 microns.

If the thickness of the substrate 130 is less than 6 microns, the supportability is poor; and/or, The object to be cleaned (eg, the probe 91 in FIG. 3C , FIG. 3F , FIG. 4A , or FIG. 4B ) may pierce the substrate 130 .

If the thickness of the substrate 130 is greater than 300 μm, the overall thickness of the probe cleaning sheet 100 may be increased, which may increase the material cost or affect other film layers.

In this embodiment, the Moh's hardness of the cleaning layer 140 is less than 7. If the Mohs hardness of the cleaning layer 140 is greater than 7, it may cause scratches on the object to be cleaned (eg, the probe 91 in FIG. 3C , FIG. 3F , FIG. 4A , or FIG. 4B ).

In one embodiment, if the hardness of the cleaning layer 140 is 4-7, it may improve the peeling of the debris on the object to be cleaned (eg, the probe 91 in FIG. 3C , FIG. 3F , FIG. 4A , or FIG. 4B ). or fall off.

In this embodiment, the Young's modulus of the cleaning layer 140 is less than or equal to 100 kg/cm ² . If the Young's modulus of the cleaning layer 140 is greater than 100 kg/cm ² , when the object to be cleaned (eg, the probe 91 in FIG. 3C , FIG. 3F , FIG. 4A , or FIG. 4B ) is in contact with the probe cleaning sheet 100 , the cleaning ability of the cleaning layer 140 may be reduced.

In one embodiment, the Young's modulus of the cleaning layer 140 is greater than or equal to 30 kg/cm ² . If the Young's modulus of the cleaning layer 140 is less than 30 kg/cm ² , the cleaning ability of the cleaning layer 140 may be reduced.

In one embodiment, the Young's modulus of the cleaning layer 140 may be greater than or equal to 30 kg/cm ² and less than or equal to 100 kg/cm ² .

In one embodiment, the Young's modulus of the cleaning layer 140 may be less than or equal to 70 kg/cm ² . In one embodiment, the Young's modulus of the cleaning layer 140 may be greater than or equal to 30 kg/cm ² and less than or equal to 70 kg/cm ² .

In one embodiment, the Young's modulus of the cleaning layer 140 may be greater than or equal to 50 kg/cm ² . In one embodiment, the Young's modulus of the cleaning layer 140 may be greater than or equal to 50 kg/cm ² and less than or equal to 100 kg/cm ² .

In one embodiment, the Young's modulus of the cleaning layer 140 may be greater than or equal to 50 kg/cm ² and less than or equal to 70 kg/cm ² . When the object to be cleaned (eg, the probes 91 in FIG. 3C , FIG. 3F , FIG. 4A , or FIG. 4B ) is in contact with the probe cleaning sheet 100 , the cleaning ability and usage times of the cleaning layer 140 may be further improved.

In one embodiment, the Mohs hardness of the cleaning layer 140 may be less than 7, and the Young's modulus of the cleaning layer 140 may be less than or equal to 100 kg/cm ² ; or less than or equal to 70 kg/cm ² .

In one embodiment, the Mohs hardness of the cleaning layer 140 may be less than 7, and the Young's modulus of the cleaning layer 140 may be greater than or equal to 30 kg/cm ² ; or greater than or equal to 50 kg/cm ² .

In one embodiment, the Mohs hardness of the cleaning layer 140 is less than 7. Also, the Young's modulus of the cleaning layer 140 may be greater than or equal to 30 kg/cm ² and less than or equal to 100 kg/cm ² .

In one embodiment, the Mohs hardness of the cleaning layer 140 is less than 7. Also, the Young's modulus of the cleaning layer 140 may be greater than or equal to 30 kg/cm ² and less than or equal to 70 kg/cm ² .

In one embodiment, the Mohs hardness of the cleaning layer 140 is less than 7. Also, the Young's modulus of the cleaning layer 140 may be greater than or equal to 50 kg/cm ² and less than or equal to 100 kg/cm ² .

In one embodiment, the Mohs hardness of the cleaning layer 140 is less than 7. Also, the Young's modulus of the cleaning layer 140 may be greater than or equal to 70 kg/cm ² and less than or equal to 70 kg/cm ² . When the object to be cleaned (eg, the probe 91 in FIG. 3C , FIG. 3F , FIG. 4A , or FIG. 4B ) is in contact with the probe cleaning sheet 100 , the cleaning ability and the number of uses of the cleaning layer 140 may be further improved, and The wear (eg, scratches) of the object to be cleaned (eg, the probe 91 in FIG. 3C , FIG. 3F , FIG. 4A , or FIG. 4B ) can be reduced.

In this embodiment, the material of the substrate 130 may include polyethylene terephthalate (PET), polyimide (PI), or a stack of the above or a combination of the above, but the present invention does not limited to this.

In this embodiment, the material of the cleaning layer 140 includes resin and organic particles.

In one embodiment, the resin constituting the cleaning layer 140 may include silicone resin (Silicone resin), polyurethane resin (PU resin), acrylic resin (Acrylic resin) or a combination thereof, but the present invention is not limited to this.

In one embodiment, the organic particles may be adapted to adhere or interface with a metallic material (eg, solder).

In one embodiment, the organic particles may include nitrogen-containing aromatic heterocyclic compounds, aliphatic amine compounds, or a combination thereof, but the present invention is not limited thereto.

In one embodiment, the aforementioned nitrogen-containing aromatic heterocyclic compounds include, for example, pyrazole, imidazole, triazole, and benz pyrazole), benzimidazole (benzimidazole), benzotriazole (benzotriazole), purine (purine), imidazo[4,5-b]pyridine (imidazo[4,5-b]pyridine), compounds similar to the above (For example: one of the hydrogens of the above compounds is replaced by halogen, C1-C6 alkyl or other suitable substituents), a combination of the above compounds.

In one embodiment, the aforementioned fatty amine compound may include at least one of primary amine, secondary amine or tertiary amine. Primary amines include, for example, aminoethane, 1-aminopropane, 2-aminopropane, 1-aminobutane, 2-aminobutane, 1-amino-2-methylpropane, 2-aminobutane -2-methylpropane, 1-aminopentane, 2-aminopentane, 3-aminopentane, neopentylamine, 1-aminohexane, 1-aminoheptane, 2-aminopentane Heptane, 1-aminooctane, 2-aminooctane, 1-aminononane, 1-aminodecane, 1-aminododecane, 1-aminotridecane, 1-amine at least one of tetradecane, 1-aminopentadecane, 1-aminohexadecane, 1-aminoheptadecane, or 1-aminooctadecane. Secondary amines include, for example, diethylamine, dipropylamine, dibutylamine, dipentylamine, dihexylamine, diheptylamine, dioctylamine, dinonylamine, didecylamine, di-undecylamine, di-decylamine At least one of diamine, di-tridecylamine, di-tetradecylamine, di-pentadecanamine, di-hexadecylamine, di-heptadecaamine and di-octadecylamine. Tertiary amines include, for example, triethylamine, tripropylamine, tributylamine, tripentylamine, trihexylamine, triheptylamine, trioctylamine, trinonylamine, tridecylamine, tri-undecylamine, tri-dodecylamine At least one of amine, tri-tridecylamine, tri-tetradecylamine, tri-pentadecanamine, tri-hexadecylamine, tri-heptadecaamine, and tri-octadecylamine. In one embodiment, the fatty amine compound may include one or more amine groups.

In one embodiment, the organic particles may be further adapted to be adhered or bonded with organopolysiloxane, polyurethane or acrylate resin. For example, the compound constituting the organic particles may further include an alkenyl group, an ether group, an amide group, an amine group, a carboxyl group, an ester group, an alcohol group, At least one of a silyl group, an alkoxy group, and an alkoxysilyl group.

In one embodiment, the Moh's hardness of the organic particles is less than 7. If the Mohs hardness of the organic particles is greater than 7, it may cause scratches on the object to be cleaned (eg, the probe 91 in FIG. 3C , FIG. 3F , FIG. 4A , or FIG. 4B ).

In one embodiment, the material of the cleaning layer 140 is composed of organic materials. That is, the material of the cleaning layer 140 may not include inorganic materials.

In this embodiment, the thickness of the cleaning layer 140 is greater than or equal to 50 microns and less than or equal to 500 microns. If the thickness of the cleaning layer 140 is less than 50 μm, the cleaning ability of the probe cleaning sheet 100 may be reduced. If the thickness of the cleaning layer 140 is greater than 500 μm, there is a possibility of increasing its own peeling.

In one embodiment, the thickness of the cleaning layer 140 is greater than or equal to 100 microns and less than or equal to 300 microns. For example, in this embodiment, the thickness of the cleaning layer 140 may be substantially 225 microns.

In this embodiment, the probe cleaning sheet 100 can be used as a probe card clean pad, but the present invention is not limited thereto.

2 is a schematic cross-sectional view of a probe cleaning sheet according to a second embodiment of the present invention.

Referring to FIG. 2 , the probe cleaning sheet 200 may include a composite material 210 , an adhesive layer 220 , a substrate 230 and a cleaning layer 240 . The adhesive layer 220 is located under the composite material 210 (lower in FIG. 2). The substrate 230 is located under the adhesive layer 220 (lower in FIG. 2). The cleaning layer 240 is located under the substrate 230 (lower in FIG. 2).

In this embodiment, the probe cleaning sheet 200 may include multiple The bonding material 210 , the adhesive layer 220 , the substrate 230 and the cleaning layer 240 are formed. For example, two opposite surfaces of the adhesive layer 220 may directly contact the composite material 210 and the substrate 230 , and two opposite surfaces of the substrate 230 may directly contact the adhesive layer 220 and the cleaning layer 240 .

In this embodiment, the composite material 210 may include a rigid plate-like body, but the present invention is not limited thereto. In one embodiment, the material of the rigid plate-like body used as the composite material 210 may include a silicon substrate, a glass fiber plate (eg, FR4 plate), a rigid plastic substrate (eg, an acrylic plate), or the above-mentioned composite plate ( composite plate). In one embodiment, the thickness of the aforementioned composite plate may be 100 μm to 2000 μm, but the present invention is not limited thereto. For example, the thickness of the aforementioned composite sheet is substantially 750 microns.

In this embodiment, the material of the base material 230 of the probe cleaning sheet 200 can be the same or similar to the material of the base material 130 of the previous embodiment, and has the same or similar uses or properties, so it is not repeated here.

In this embodiment, the material of the cleaning layer 240 of the probe cleaning sheet 200 can be the same or similar to the material of the cleaning layer 140 of the previous embodiment, and has the same or similar purpose or properties, so it is not repeated here.

In this embodiment, the thickness of the cleaning layer 240 may be substantially 150 microns.

In this embodiment, the probe cleaning sheet 200 can be used as a test socket clean pad, but the present invention is not limited thereto.

In the present invention, the probe cleaning sheet of any of the foregoing embodiments can be used 100, 200 to clean the probe pins. However, it should be noted that the present invention does not limit the application of the probe cleaning sheets 100 and 200 of any of the foregoing embodiments.

The cleaning method of the probe may include the following steps. Step 1: Test electronic components with probes. Step 2: After the aforementioned Step 1, use the probe cleaning sheets 100 and 200 of any of the aforementioned embodiments to clean the probes.

Examples of probe cleaning methods are as follows. Please refer to FIGS. 3A to 4B , wherein FIGS. 3A to 3F are schematic diagrams of a cleaning method of a probe according to an embodiment of the present invention, and FIGS. 4A and 4B are a cleaning method of a probe according to an embodiment of the present invention. Schematic magnification of a partial cross-section of the method.

Referring to FIG. 3A to FIG. 3C , the electronic device 70 can be electrically tested by the probes 91 by a commonly used test method.

Taking FIG. 3A as an example, an electronic component 70 and a probe cleaning sheet 300 are provided.

In this embodiment, the electronic component 70 is, for example, a bare die or a chip package, but the invention is not limited thereto.

In this embodiment, the probe cleaning sheet 300 may be the same or similar to the probe cleaning sheet 200 of the previous embodiment. That is, the material of the base material 330 of the probe cleaning sheet 300 can be the same or similar to the material of the base material 230 of the foregoing embodiments, and has the same or similar uses or properties, so it is not repeated here. Or; in this embodiment, the material of the cleaning layer 340 of the probe cleaning sheet 300 may be the same or similar to the material of the cleaning layer 240 of the previous embodiment, and have the same or similar uses or properties (eg, Mohs hardness). ), so it is not repeated here. In addition, in the drawings, the adhesive layer of the probe cleaning sheet 300 (eg, the same or similar to the above-mentioned adhesive layer) is omitted. 240 ) and composite materials (eg, the same or similar composite materials as the aforementioned composite material 210 ).

In a not-shown embodiment, the probe cleaning sheet 300 may be the same as or similar to the probe cleaning sheet 100 of the foregoing embodiment.

Then, as shown in FIG. 3B , the electronic component 70 to be tested can be picked up by the pick-and-place head 81 of the pick-up and place device 80 .

Then, as shown in FIG. 3C , the electronic component 70 to be tested can be placed on the testing device 90 by the pick-and-place device 80 .

The test apparatus 90 has, for example, a plurality of probe pins 91 . The probes 91 can contact conductive terminals (eg, solder balls) (not shown) or contact pads (not shown) on the tested surface 71 of the electronic device 70 to test the electronic device 70 . For example, pressure may be applied to the electronic component 70 to be tested and/or the probes 91 to make the conductive terminals or contact pads on the tested surface 71 of the electronic component 70 to be tested contact the probes 91 .

In one embodiment, during the process of contacting the electronic component 70 with the probes 91, some substances on the electronic component 70 (eg, solder for forming the conductive terminals or aluminum, zinc or copper for forming the contact pads) may will stick to the probe 91.

In this embodiment, the test method is, for example, a final test (final test; FT), but the present invention is not limited thereto. In one embodiment, the testing method may be wafer probing (chip probing; CP).

After the aforementioned exemplary tests in FIGS. 3A to 3C , the probes 91 can be cleaned by the probe cleaning sheet 300 in a similar manner.

Taking FIGS. 3C to 3D as an example, after the electronic component 70 is tested, the electronic component 70 can be separated from the probe 91 , and the electronic component 70 can be placed by the pick-and-place device 80 .

In one embodiment, during the process of separating the electronic component 70 from the probes 91, some substances on the electronic component 70 (eg, solder for forming the conductive terminals or aluminum, zinc or copper for forming the contact pads) may It peels off and sticks to the probe 91 .

Then, as shown in FIG. 3E , the probe cleaning sheet 300 can be picked up by the pick-and-place head 81 of the pick-and-place device 80 .

Then, as shown in FIG. 3F , the electronic components 70 to be tested can be placed on the testing device 90 by the pick-and-place device 80 to clean the probes 91 by the probe cleaning sheet 300 .

For example, pressure may be applied to the probe cleaning sheet 300 and/or the probes 91 to make the probe cleaning sheet 300 contact the probes 91, so that the substance 99 (eg, solder) adhering to the probes 91 , aluminum material, zinc material or copper material; marked or shown in FIG. 4A or FIG. 4B ) is pasted by the cleaning layer 340 of the probe cleaning sheet 300 . After that, the probe cleaning sheet 300 can be separated from the probes 91 , and the substances 99 adhering to the probes 91 can be reduced by the probe cleaning sheet 300 .

For details, please refer to FIG. 4A and FIG. 4B . As shown in FIG. 4A , one end of the probe 91 for testing (ie, the end for contacting the electronic component 70 ) penetrates at least the cleaning layer 340 of the probe cleaning sheet 300 . Then, as shown in FIG. 4B, after the probe cleaning sheet 300 is separated from the probes 91, the amount of the substance 99 adhering to and/or coating the probes 91 can be reduced.

In the manner or step of cleaning the probes 91 by the probe cleaning sheets 100 , 200 and 300 of any of the foregoing embodiments of the present invention, the probes 91 may not be disassembled or separated from the testing device 90 . Also, the cleaning of the probes 91 may be performed by the same or similar operating parameters as the electronic components 70 are tested. That is, the steps of the cleaning method of the probe 91 may be performed in-situ or performed on-line.

It is worth noting that FIG. 3A to FIG. 4B only exemplarily introduce a cleaning method of the probe 91 , and the present invention does not limit the type of the probe 91 . For example, in FIGS. 3A to 4B , the illustrated probe 91 is a vertical probe pin, but the present invention is not limited thereto. In a not-shown embodiment, the probe cleaning sheets 100 , 200 , and 300 of any of the foregoing embodiments of the present invention can also be used for cantilever probe pins in a manner similar to a general test. ) cleaning.

Experimental example and comparative example

An experimental example and a comparative example are shown below, and this invention is demonstrated concretely. The embodiments of the present invention may include the following experimental examples, but the embodiments of the present invention are not limited to the following experimental examples. In addition, in the comparative example to be described later, the description of the "film layer similar to the cleaning layer" may be different from the cleaning layer of the present invention. For example, in a "cleaning layer-like film", the composition may differ from the cleaning layer of the present invention. For example, in a "cleaning layer-like layer", a portion of the composition may be similar to the cleaning layer of the present invention, but its thickness, Mohs hardness and/or Young's modulus may be different from the cleaning layer of the present invention Layer thickness, Mohs hardness and/or Young's modulus.

[Experimental Example 1] and [Comparative Example 1]

In [Experimental Example 1] and [Comparative Example 1], in order to use the same cleaning method to clean the probe, the difference is: in [Experimental example 1], the probe cleaning sheet of the present invention is used; in [ In Comparative Example 1], the probe cleaning sheet of the present invention was not used, and the probe cleaning sheet used in [Comparative Example 1] was similar to the probe cleaning sheet used in [Experimental Example 1], with the difference In [Comparative Example 1], the composition of the film layer similar to the cleaning layer (however, not the cleaning layer of the present invention) is different from that of the cleaning layer of the present invention.

As shown in [Table 1], FIG. 5A, and FIG. 5B, after the probes were cleaned by the probe cleaning sheet of [Experimental Example 1] and the probe cleaning sheet of [Comparative Example 1], the probe surface was flattened Figure 5A is an enlarged view of the partial surface of the probe after the probe is cleaned by the probe cleaning sheet of [Experimental Example 1], and Figure 5B is the probe cleaning sheet of [Comparative Example 1]. A magnified view of a part of the probe surface after the probe is cleaned, and FIGS. 5A and 5B have the same or similar image capturing conditions (eg, magnification and/or electron beam energy of an electron microscope). In [Table 1], the symbol "○" indicates that the result at least meets expectations or exceeds expectations, and the symbol "x" indicates that the result at least meets expectations or is unacceptable.

As shown in [Table 1], FIG. 5A, and FIG. 5B, compared with [Comparative Example 1], the probe after cleaning the probe with the probe cleaning sheet of [Experimental Example 1] has a better surface surface flatness. That is, the probes after the probes are cleaned by the probe cleaning sheet of [Experimental Example 1] may have less scratches and/or less debris thereon.

[Experimental Example 2] and [Comparative Example 2]

In [Experimental Example 2] and [Comparative Example 2], in order to use the same cleaning method to clean the probe, the difference is: in [Experimental example 2], the probe cleaning sheet of the present invention is used; in [ In Comparative Example 2], the probe cleaning sheet of the present invention was not used, and the probe cleaning sheet used in [Comparative Example 2] was similar to the probe cleaning sheet used in [Experimental Example 2], with the difference In [Comparative Example 2], the composition of the film layer similar to the cleaning layer (however, not the cleaning layer of the present invention) is different from the composition of the cleaning layer of the present invention.

As shown in [Table 2], FIGS. 6A and 6B , after the probes were cleaned by the probe cleaning sheet of [Experimental Example 2] and the probe cleaning sheet of [Comparative Example 2], the probe cleaning sheet was The impurity adhesion ability was evaluated, wherein FIG. 6A is an enlarged partial cross-sectional view after use of the probe cleaning sheet of [Experimental Example 2], and FIG. 6B is the probe cleaning sheet of [Comparative Example 2]. An enlarged view of a partial cross-section after use, and FIGS. 6A and 6B have the same or similar image capturing conditions (eg, magnification and/or electron beam energy of an electron microscope). In [Table 2], the symbol "○" indicates that the result at least meets expectations or exceeds expectations, and the symbol "x" indicates that the result at least meets expectations or is unacceptable.

As shown in [Table 2], FIG. 6A, and FIG. 6B, compared with [Comparative Example 1], the The cleaning layer of the probe cleaning sheet in [Experimental Example 1] has better elasticity or viscosity. Therefore, after the probe cleaning sheet is separated from the probe, the cleaning layer of the probe cleaning sheet of [Experimental Example 1] has a smaller puncture hole because of better elasticity or viscosity.

[Experimental Example 3] and [Comparative Example 3]

In [Experimental Example 3] and [Comparative Example 3], a four-jaw probe pin (a type of vertical probe) commonly used in the market was used and the same cleaning method (eg: the same The difference is: in [Experimental Example 3], the probe cleaning sheet of the present invention was used; in [Comparative Example 3], the probe cleaning sheet of the present invention was not used. The probe cleaning sheet used in [Comparative Example 3] was similar to the probe cleaning sheet used in [Experimental Example 3], except that in [Comparative Example 3] a film layer similar to the cleaning layer (but , the Young's modulus of the non-cleaning layer of the present invention) is less than 30kg/cm ² . Specifically, the Young's modulus of the cleaning layer of the probe cleaning sheet used in [Experimental Example 3] was greater than or equal to 50 kg/cm ² and less than or equal to 70 kg/cm ² .

As shown in FIGS. 7A , 7B, 8A, and 8B, after the probes were cleaned by the probe cleaning sheet of [Experimental Example 3] and the probe cleaning sheet of [Comparative Example 3], the probes were cleaned The surface of the sheet was evaluated, wherein FIGS. 7A and 8A have the same or similar image capturing conditions (eg, magnification, imaging light quantity and/or imaging angle). In addition, FIG. 7A shows that the same position of the probe cleaning sheet of [Comparative Example 3] (ie, corresponds to one hole in FIG. 7A ; there are three holes in total in FIG. 7A ) for less than 300 times of poking, and FIG. 7B It is an enlarged view corresponding to one of the holes in FIG. 7A . In addition, FIG. 8A shows that the probe cleaning sheet of [Experimental Example 3] is performed more than 1500 times at the same position (ie, corresponding to one hole in FIG. 8A ; there are three holes in total in FIG. 8A ). Poke the needle, and FIG. 8B is an enlarged view corresponding to one of the holes in FIG. 8A .

As shown in FIGS. 7A and 7B , the probe cleaning sheet of [Comparative Example 3] caused corresponding puncture holes to the probe cleaning sheet after puncturing less than 300 times. As shown in FIGS. 7A and 8A , the puncture hole of the probe cleaning sheet of [Comparative Example 3] was significantly deep. That is to say, the probe cleaning sheet of [Comparative Example 3] obviously produced more serious puncture injury (eg, the obvious cross image in FIG. 7B ) after the needle poking was performed less than 300 times. The cause of the aforementioned puncture injury may be that the Young's modulus of the probe cleaning sheet of [Comparative Example 3] is less than 30 kg/cm ² , resulting in poor recovery of the material. As shown in FIG. 7B , if the same image processing method is used for judgment (that is, the same image processing method is used for FIG. 7B and FIG. 8B ), the probe cleaning sheet of [Comparative Example 3] has been poked for less than 300 times after poking the needles for less than 300 times. , the corresponding hole size is about 0.076mm.

As shown in FIGS. 8A and 8B , the probe cleaning sheet of [Experimental Example 3] may still cause corresponding puncture holes to the probe cleaning sheet after more than 1500 poking times. However, as shown in FIG. 7A and FIG. 8A , the puncture holes of the probe cleaning sheet of [Experimental Example 3] were significantly less conspicuous or shallow. That is to say, the probe cleaning sheet of [Experimental Example 3] may have less obvious puncture damage after more than 1500 needle poking times (eg, no obvious cross image in FIG. 8B ). The reason for this may be that the Young's modulus of the probe cleaning sheet of [Experimental Example 3] is greater than or equal to 30 kg/cm ² (or: further greater than or equal to 50 kg/cm ² ), so that the material has a better recovery. Elasticity. As shown in FIG. 8B , if the same image processing method is used for judgment (that is, the same image processing method is used for FIG. 7B and FIG. 8B ), the probe cleaning sheet of [Experimental Example 3] has been poked more than 1500 times after poking. , the corresponding hole size is about 0.0683mm.

As shown in FIGS. 7A , 7B, 8A, and 8B, compared with [Comparative Example 3], the probe cleaning sheet of [Experimental Example 3] can have more effective usage times.

To sum up, in the probe cleaning sheet of the present invention and the cleaning method for probe cleaning by the aforementioned probe cleaning sheet, since the cleaning layer can be suitable for sticking substances on the probe, it can be suitable for the probe clean, and can reduce probe scratches.

100: Probe cleaning sheet

110: release layer

120: Adhesive layer

130: Substrate

140: Cleaning Layer

Claims (9)

A probe cleaning sheet, comprising: a release layer or a composite material; an adhesive layer on the release layer or the composite material; a substrate on the adhesive layer; and a cleaning layer on the substrate, Wherein: the release layer or composite material, the adhesive layer, the substrate and the cleaning layer are stacked in sequence; and the material of the cleaning layer includes: resin; and organic particles, wherein the organic particles are Mohs hardness is less than 7. The probe cleaning sheet according to claim 1, wherein the thickness of the adhesive layer is greater than or equal to 5 microns and less than or equal to 100 microns. The probe cleaning sheet of claim 1, wherein the thickness of the substrate is greater than or equal to 6 microns and less than or equal to 300 microns. The probe cleaning sheet of claim 1, wherein the Mohs hardness of the cleaning layer is less than 7, or the Young's modulus of the cleaning layer is less than or equal to 100 kg/cm ² . The probe cleaning sheet of claim 1, wherein the thickness of the cleaning layer is greater than or equal to 50 microns and less than or equal to 500 microns. The probe cleaning sheet of claim 1, wherein the resin comprises silicone, polyurethane, or a combination thereof. The probe cleaning sheet according to claim 1, wherein the material of the cleaning layer is composed of organic materials. A method for cleaning a probe, comprising: step 1: testing electronic components with a probe; and step 2: after the step 1, using the probe cleaning sheet according to any one of claims 1 to 7 to The probe is cleaned. The probe cleaning method according to claim 8, wherein the step 1 and the step 2 are performed in-situ or on-line.

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