JP2010210349A - Probe cleaning sheet and probe cleaning material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe cleaning sheet capable of carrying out a sufficient cleaning performance for a probe without wearing the probe easily, in a wide temperature range of an inspection environment. <P>SOLUTION: The probe cleaning sheet 10 for removing foreign substances attached to the head part of the probe includes: a base material sheet 25; and a cleaning layer 20 which is formed on the base material sheet 25 and made up of an elastic base material 21 consisting of a silicone elastomer and/or silicone resin having abrasive particles 22 mixed therein. The probe cleaning sheet 10 is characterized in that a period for which a ball No.5 passes through a measurement distance is in a range of 0.5 s or more and 4.0 s or less in an inclined ball tack test for evaluating adhesion based on JIS Z0237 to be carried out under such the condition that an inclining angle is 20°, and a ball to be used is the ball No.5 (ϕ3.9 mm), and an entrance length is 100 mm, and the measurement distance of an adhesive plane having a surface of the cleaning layer 20 is 100 mm. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a probe cleaning sheet and a probe cleaning material used for removing foreign matter adhering to a probe of a probe card used for electrical property inspection, and particularly suitable for use in a wide inspection temperature range from low temperature to high temperature. The present invention relates to a probe cleaning sheet and a probe cleaning material.

  In the manufacturing process of a semiconductor device, the probe of the inspection apparatus is brought into contact with the electrode pad of the chip, and the electrical characteristics of each chip are inspected by applying and detecting a test signal through the probe.

  In general, the probe is made of a hard material such as tungsten or beryllium. On the other hand, the electrode pad is formed from a relatively soft material such as aluminum, and when the probe is brought into contact with the electrode pad, the electrode pad surface aluminum oxide is formed on the tip portion (tip and side surface near the tip). As a result, foreign matter such as adheres, a conduction failure occurs between the probe and the pad, leading to a decrease in inspection accuracy. Moreover, when a large foreign substance adheres to the probe, adjacent probes may be short-circuited to destroy the chip. For this reason, in the test of the electrode pad of the chip, the tip portion of the probe is cleaned to remove the adhered foreign matter.

  For cleaning the probe tip, a probe cleaning sheet having a cleaning layer formed on the surface of a base sheet is used. In cleaning using this probe cleaning sheet, the probe cleaning sheet is attached to the surface of the inspection table, the tip of the probe is stabbed into the inside from the surface of this cleaning layer (also referred to as a polishing layer), and then pulled out, Foreign matter adhering to the tip portion is removed.

  As such a probe cleaning sheet, conventionally, a cleaning member made of an elastic material such as silicone rubber or urethane rubber mixed with abrasive particles (hard particles made of aluminum oxide, silicon carbide, diamond, etc.) has been proposed (for example, , See Patent Document 1). Further, there has been proposed a cleaning member in which a foreign substance removing film not containing abrasive particles is further provided on an abrasive member containing abrasive particles, and the foreign substance is effectively wiped off with the foreign substance removing film when the probe tip is pulled out (for example, , See Patent Document 2). Furthermore, a polishing layer having elasticity is formed on the surface of the substrate having a roughened surface, and the polishing layer is recessed by the pressing force of the tip of the probe, and polishing that enters between the recessed portion and the rough surface. A cleaning member that cleans the tip of the probe with particles has been proposed (see, for example, Patent Document 3).

Japanese Patent Laid-Open No. 7-244074 JP-A-11-87438 JP 2004-271389 A

  In recent years, as the chip size of semiconductor devices has been reduced, the size of the electrode pads formed on the chip has been reduced, and the electrode pads have been provided close to each other. Therefore, the diameter of the probe is further reduced, and the probes are provided closer to each other on the probe card. On the other hand, in addition to maintaining the current inspection accuracy, there is a demand for further improvement in inspection accuracy. As a result, probes have been made from relatively soft materials with high electrical properties, such as beryllium-copper alloys.

  In addition, the electrical characteristic inspection of the chip is performed in almost the same environment as the environment in which the chip is used in consideration of actual usage conditions. For example, when a chip is mounted on an automobile, electrical characteristic inspection is performed in a wide range of low temperature (−40 ° C.) to high temperature (150 ° C.), more preferably in a range of −40 ° C. to 200 ° C. Requested. Therefore, the cleaning sheet for cleaning the probe is also required to exhibit sufficient cleaning performance in an environment having the same temperature range corresponding to the use environment of the chip.

  However, when a conventional probe cleaning sheet is used in the temperature range of the above-mentioned usage environment of the chip, depending on the configuration of the cleaning member, the tip of the probe is greatly scraped and worn by multiple cleanings, and the life of the probe is shortened. The problem of shortening occurs. Also, this wear causes a problem that an error occurs in the electrical characteristic inspection of the chip.

  The present invention provides a probe cleaning sheet and a probe cleaning material capable of exhibiting a sufficient cleaning performance for a probe under a wide inspection temperature range corresponding to the use environment of the chip and not easily abrading the probe. With the goal.

  In order to achieve the above object, the present invention provides a probe cleaning sheet having a cleaning layer for removing foreign matter adhering to the tip portion of the probe, the base sheet, and the base sheet In addition, the cleaning layer formed of an elastic base material made of a silicone resin and / or a silicone elastomer mixed with abrasive particles, and an inclined ball tack test for evaluating the adhesiveness according to JIS Z0237, Inclination angle 20 degrees, ball no. No. 5 (φ 3.9 mm), a run-up distance of 100 mm, and a measurement distance of the adhesive surface with the cleaning layer as a surface is 100 mm. Reference numeral 5 denotes a probe cleaning sheet in which the time passing through the measurement distance is in the range of 0.5 seconds to 4.0 seconds.

  By using a probe cleaning sheet with such a material and an adhesive cleaning layer, foreign substances adhering to the tip of the probe can be efficiently removed in electrical characteristic inspections in a wide temperature range from low to high. The foreign matter can be removed, and the foreign matter can be held in the cleaning layer without being removed from the cleaning layer while adhering to the probe again. In addition, since the adhesiveness of the elastic base material is in the above range, the problem that the elastic base material of the cleaning layer adheres (transfers) to the probe and contaminates the needle tip does not occur.

  The elastic base material preferably has a compression rate of 0.7% or more and 1.5% or less in a measurement test based on JIS L1096. By setting the compression rate within the above range, the cleaning layer can be pierced with a needle pressure lower than the needle pressure at the probe tip in the test of the chip of the semiconductor wafer, so that the probe is not damaged. In addition, at the time of piercing and withdrawing the cleaning layer, the adhesion with the probe tip and the slidability are good, and the cleaning effect can be enhanced.

The abrasive particles are at least one element selected from the group consisting of diamond particles, carbides such as SiC, boron compounds such as B ₄ C or cBN, Si, Al, Ti, Ce, Mn, Fe, Cr, and Zr. And one or more types selected from a group of nitrides containing at least one element selected from the group consisting of Si, Al and Ti, and the average particle size of the abrasive particles is 0 It can be in the range of 0.05 μm to 20 μm. By using such abrasive particles, foreign matters attached to the probe can be efficiently removed.

  Further, the abrasive particles are composed of composite particles composed of mother particles and a plurality of child particles attached or bonded around the mother particles, and the average particle diameter of the mother particles is in the range of 1 μm to 20 μm. The average particle diameter of the child particles can be in the range of 1/10 to 1/1000 of the average particle diameter of the mother particles. By using such composite particles as abrasive particles, the number of contact points with fine child particles around the mother particles increases, so that damage to the probe is suppressed, and the polishing efficiency is increased to improve the efficiency of removing foreign substances. be able to.

  Furthermore, the mother particles are preferably organic particles having elasticity, and the child particles are preferably inorganic particles. By using organic particles having elasticity, damage to the probe can be further suppressed.

  Further, the blending ratio of the abrasive particles mixed in the cleaning layer can be 40 wt% or more and 85 wt% or less. By setting it as such a mixture rate, the foreign material adhering to the probe front-end | tip part can be removed efficiently.

  Furthermore, it is preferable that the base sheet is a sheet composed of one or more kinds selected from the group of polyimide resin, silicone rubber, polyethylene naphthalate, and polyacrylacrylketone (PEEK). By using a base material sheet of such a material, it can be used stably in the region from low temperature to high temperature, like the cleaning layer, so that wrinkles and peeling caused by the difference in thermal expansion from the cleaning layer Occurrence can be suppressed. The base sheet may be a woven fabric made of fibers of the above materials.

  Furthermore, the present invention proposes a probe cleaning material for forming a cleaning layer for removing foreign matter adhering to the tip portion of the probe, comprising abrasive particles and a silicone resin mixed with the abrasive particles And / or an elastic base material made of a silicone elastomer. In an inclined ball tack test for evaluating tackiness according to JIS Z0237, an inclination angle of 20 degrees, ball no. No. 5 (φ 3.9 mm), a run-up distance of 100 mm, and a measurement distance of the adhesive surface with the cleaning layer as a surface is 100 mm. 5 is a probe cleaning material in which the time passing through the measurement distance 5 is in the range of 0.5 seconds to 4.0 seconds.

  According to such a probe cleaning material, a cleaning layer can be directly formed on the metal plate of the inspection table of the inspection apparatus instead of the base sheet. A cleaning layer may be formed directly on the surface of the recycled silicon wafer.

  According to the present invention, in a wide temperature range from a low temperature to a high temperature under the usage environment of the chip, a probe cleaning sheet that can sufficiently perform cleaning for removing foreign matter adhering to the tip of the probe and further suppresses probe wear. Can be provided.

FIG. 1 is a partial schematic cross-sectional view of a first embodiment of a probe cleaning sheet according to the present invention. FIG. 2A is a schematic partial sectional view of a second embodiment of the probe cleaning sheet according to the present invention, and FIGS. 2B and 2C are enlarged schematic views of the composite particles shown in FIG. It is. FIG. 3 is a partial schematic cross-sectional view of a third embodiment of the probe cleaning sheet according to the present invention. FIG. 4 is a partial cross-sectional schematic diagram of the probe cleaning device. FIG. 5 is a schematic explanatory diagram of the adhesion test of the cleaning layer. FIGS. 6A, 6B, and 6C are schematic partial cross-sectional views of a conventional probe cleaning sheet, respectively.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.
<First Embodiment>
1st Embodiment of the probe cleaning sheet which concerns on this invention is described with reference to FIG. 1 which shows the partial cross section schematic diagram.

As shown in FIG. 1, the probe cleaning sheet 10 includes a base sheet 25 and a cleaning layer 20 formed on the surface of the base sheet 25. The cleaning layer 20 is formed of an elastic base material 21 and a plurality of abrasive particles 22 mixed in the elastic base material 21. Below, the cleaning layer 20 and the base material sheet 25 of this embodiment are demonstrated.
(1) Cleaning Layer a) Elastic Base Material As shown in FIG. 1, the elastic base material 21 constituting the cleaning layer is made of a silicone resin and / or a silicone elastomer. This silicone resin and / or silicone elastomer is stable with no change in physical properties in the environment of chip electrical property inspection according to the operating environment temperature range of the chip (-40 ° C to 150 ° C, preferably -50 ° C to 200 ° C). It is provided as a new material.

  The silicone resin and / or silicone elastomer used for the elastic base material 21 is obtained by crosslinking an organopolysiloxane having a siloxane skeleton represented by the formula 1 below. In addition to polydimethylsiloxane in which all of “R” in the formula of Chemical Formula 1 is a methyl group, a part of the methyl group may be another alkyl group, vinyl group, phenyl group, fluoroalkyl group, or the like. Or the simple substance of the various organ poly siloxane substituted with 2 or more types, or what blended 2 or more types is contained.

b) Abrasive Particles The material and shape of the abrasive particles 22 mixed into the cleaning layer 20 are not particularly limited as long as the material and shape can clean the probe. For example, diamond particles, carbides such as SiC, boron compounds such as B ₄ C and cBN, oxides containing at least one element selected from Si, Al, Ti, Ce, Mn, Fe, Cr, Zr, etc., Si And nitride containing at least one element selected from Al, Ti and the like. In the present invention, only one type of abrasive particles may be used, or two or more types of abrasive particles having different materials and shapes may be used. Aggregated particles in which a plurality of primary particles are bonded can also be used.

The average particle size of the abrasive particles 22 is preferably in the range of 0.05 μm to 20 μm. In the case of agglomerated particles, it means the average particle size of the agglomerated particles. When the average particle size is less than 0.05 μm, the cleaning effect for removing foreign matter is lowered. On the other hand, if the thickness exceeds 20 μm, the tip of the probe becomes extremely worn, and if it collides with abrasive particles, the risk of the probe tip being deformed or damaged increases.
c) Formation of Cleaning Layer The cleaning layer 20 is obtained by kneading the elastic base material 21 and the abrasive particles 22 and applying a dispersion-adjusted material on the base sheet, followed by drying at a predetermined temperature. At this time, the weight ratio of the abrasive particles 22 mixed in the cleaning layer 20 is preferably 40 to 85% by weight when the cleaning layer is 100% by weight. By setting the content of the abrasive particles 22 in the above range, good polishing characteristics can be maintained, and excellent cleaning characteristics can be exhibited without excessively cutting the probe tip.

  The cleaning layer 20 is required to have a thickness capable of removing the attached matter on the needle tip by piercing and pulling out the probe needle, and is preferably in the range of 50 to 1000 μm, for example.

  Furthermore, the elastic base material 21 of the cleaning layer 20 may be a foam of silicone resin and / or silicone elastomer. When the base material is a foam, the flexibility of the cleaning layer can be increased. As a result, not only foreign matter removal but also wear of the probe needle tip can be reduced.

  The degree of adhesiveness of the cleaning layer 20 of the present invention was determined by the inclination angle of 20 degrees in the inclination type ball tack tester test for adhesion evaluation based on JIS Z0237, the ball no. No. 5 (φ 3.9 mm), a run-up distance of 100 mm, and a measurement distance of 100 mm on the adhesive surface with the cleaning layer as the surface, ball No. 5 (φ3.9 mm) is a range in which the time passing through the measurement distance is in the range of 0.5 seconds to 4.0 seconds.

  In the cleaning layer in which the time passing through the measurement distance exceeds 4.0 seconds, the adhesiveness becomes too high, and the probe may be pulled out with the adhesive of the elastic base material 21 attached to the tip of the probe. This is because foreign matter reattaches to the object and sufficient cleaning cannot be performed. On the other hand, if the time for passing through the measurement distance is less than 0.5 seconds, the adhesiveness is too low, and the effect of wiping off foreign matter adhering to the probe is reduced.

  The ball tack tester standardized by JIS Z0237 uses an inclination angle of 20 degrees, 30 degrees, 40 degrees, and a high carbon chrome bearing steel material (steel ball) defined in JIS G4805. Various ball numbers representing the diameter of the ball can be selected. Since the cleaning layer 20 of the probe cleaning sheet 10 of the present invention is suitable to have a relatively low adhesive value, the inclination angle is set to 20 degrees, and the ball no. 5 (φ3.9 mm) and ball no. 3 (φ2.3 mm) is selected and the test is performed. According to the result of the test of No. 5, the adhesiveness of a suitable cleaning layer is specified.

  Furthermore, it is preferable that the elastic base material has a compression rate in a range of 0.7% to 1.5% in a measurement test based on JIS L1096. By setting this range, the cleaning layer can be pierced with a needle pressure lower than the probe pressure at the probe tip in the semiconductor wafer test, and damage to the probe can be suppressed. In addition, when piercing / pulling out the cleaning layer, the adhesion between the probe tip and the cleaning layer and the slidability are good, and the cleaning effect can be enhanced. If the compression ratio is less than 0.7%, the probe needle wear increases, and the probe life is shortened. On the other hand, when the compression ratio exceeds 1.5%, the cleaning effect is lowered.

  The cleaning layer 20 of the probe cleaning sheet 10 of the present invention is formed by mixing abrasive particles 22 in an elastic base material 21. By mixing the abrasive particles 22, the probe is pierced into the cleaning layer 20 and pulled out, so that the foreign matter firmly attached to the probe tip or the like can be removed. The cleaning layer 20 of the present invention can be pierced through the cleaning layer with a needle pressure less than or equal to the needle pressure at the tip of the probe at the time of tip inspection. In this case, it is preferable that the probe tip is not damaged.

  Since the performance test of the chip using the probe cleaning sheet 10 of the present invention is performed in a wide temperature range from a low temperature to a high temperature according to the use environment of the chip, the cleaning layer 20 has excellent elasticity even in the above temperature range. A material having a small amount of modification is preferred.

Furthermore, a colorant can be added to the elastic base material 21 when the cleaning layer 20 of the present invention is formed. In the probe cleaning device, the probe cleaning sheet is arranged on the stage of the probe cleaning device, and the distance between the cleaning sheet surface and the tip of the probe is adjusted to an appropriate value by autofocusing by a detector using a laser beam or the like. . However, a silicone resin that transmits light may have poor autofocus accuracy and may cause a malfunction. Therefore, by adding a colorant, the light reflection efficiency can be increased and the alignment between the cleaning sheet surface and the probe tip can be made accurate.
(2) Substrate Sheet As with the cleaning layer 20, the substrate sheet 25 of the present invention is preferably made of a material with little change in physical properties in the temperature range of the electrical property inspection adapted to the usage environment of the chip from low temperature to high temperature. In addition, a material that does not cause wrinkles or peeling due to a difference in thermal expansion coefficient between the base sheet 25 and the cleaning layer 20 or thermal deformation is selected.

  Specifically, a heat resistant resin such as polyimide (PI), silicone rubber, polyethylene naphthalate (PEN), polyetheretherketone (PEEK) is used as the material of the base sheet 25. In order to fix the probe cleaning sheet 10 to the probe cleaning device, an adhesive layer (not shown) is provided below the base material sheet 25. This adhesive layer is made of a silicone adhesive that can withstand high temperatures.

Further, the cleaning layer 20 may be directly formed on a metal plate having a shape that can be fixed to the stage of the probe cleaning device, a recycled silicon wafer, or the like without using the base sheet 25. For example, a cleaning layer 20 is formed in advance on a metal plate having the same shape as a silicon wafer for inspection or a recycled silicon wafer by a cleaning material for forming the cleaning layer 20, and a double-sided adhesive film or an adhesive is placed on the stage of the probe cleaning device. An agent can be applied and pasted. Depending on the stage, vacuum suction can be performed.
<Second Embodiment>
Next, a probe cleaning sheet according to a second embodiment of the present invention will be described with reference to FIG. 2 showing a partial schematic sectional view and a partially enlarged view thereof. In addition, the thing of the same name as 1st Embodiment is shown with the same code | symbol.

  As shown in FIG. 2A, the cleaning sheet 10 of this embodiment includes a base sheet 25 and a cleaning layer 20 formed on the surface of the base sheet 25. In the cleaning layer 20, composite particles 23 mixed in the elastic base material 21 are dispersedly arranged.

  As shown in FIGS. 2B and 2C, which are schematic cross-sectional views showing an example of the composite particle 23, the composite particle 23 includes a mother particle 23a and a plurality of child particles 23b located around the mother particle. And a plurality of child particles 23b are attached or bonded to the surface of the mother particle 23a.

  The composite particle 23 shown in FIG. 2B is an example in which the base particle 23a is solid, and the composite particle 23 shown in FIG. 2C is an example in which the base particle 23a is hollow. Any composite particle 23 can be used in the present embodiment, and can be appropriately selected according to the material and particle size of the mother particle.

  The average particle diameter of the mother particles 23a is preferably in the range of 1 μm to 20 μm, and the child particles 23b are preferably in the range of 1/10 to 1/1000 of the mother particles 23a. Examples of the composite particles 23 include inorganic particles, organic particles, and organic / inorganic composite particles. As the inorganic particles, those described in the first embodiment can be used.

  As the composite particles 23 used in the present embodiment, it is preferable that the mother particles 23a are elastic organic particles and the child particles 23b are made of inorganic particles. This is because if the mother particle 23a has elasticity, damage to the probe needle can be suppressed and the number of contact points with the fine child particles 23b around the mother particle 23a can be increased, so that the polishing efficiency can be increased. . Moreover, as said organic substance particle, what has heat resistance is preferable, for example, a silicone elastomer, silicone, ethylene propylene, an acryl, etc. are mentioned. Moreover, the shape of the said organic substance particle can use spherical solid particles, such as silicone and an acryl, or spherical hollow particles, for example. The mother particles 23a and the child particles 23b of the composite particles 23 may be integrated so that they are not easily separated during cleaning. On the other hand, the shape of the child particles 23b is not particularly limited, and polygonal, spherical, and needle-shaped (crystal particles) are used according to the purpose and application.

Further, as the composite particles 23, particles obtained by attaching inorganic particles such as silica, alumina, diamond particles to the surface of the organic particles with a functional group such as organic polymer particles and a silane coupling agent can also be used. . These may be held by electrostatic force, or may be chemically bonded to organic particles by a functional group such as a hydroxyl group having inorganic fine particles and a silane coupling agent. Furthermore, as the composite particles 23, in a dispersion (elastic matrix forming liquid) including organic particles and inorganic particles having zeta potentials having different polarities, particles in which these particles are bonded by electrostatic force are used. You can also.
<Third Embodiment>
Next, a third embodiment of the probe cleaning sheet according to the present invention will be described with reference to FIG. In addition, the thing of the same name as 1st Embodiment is shown with the same code | symbol.

  A probe cleaning sheet 10 shown in FIG. 3 is a probe cleaning sheet as a product form. An adhesive layer 28 is provided on the back side of the base material sheet 25 in the probe cleaning sheets of the first and second embodiments, and the adhesive layer 28. And a release sheet 26 for covering the film.

  Generally, the cleaning sheet 10 used in the probe inspection apparatus is provided with a release sheet (release film) 26 having an adhesive layer 28 on the back side of the base sheet 25 for fixing to the inspection apparatus. The release sheet 26 is peeled off from the surface of the adhesive layer 28, and is attached via the adhesive layer 28 on the stage 43 of the probe cleaning device 40 shown in FIG.

  As the material of the adhesive layer 28, it is preferable to use a silicone-based adhesive that can withstand high temperatures in an environment for electrical property inspection. The material of the adhesive layer 28 may have a two-layer structure with an acrylic adhesive in order to maintain the adhesive force depending on the material forming the stage of the probe cleaning device. The release sheet 26 is peeled off from the substrate sheet 25, and the probe cleaning sheet 10 is fixed to the probe cleaning device.

  Further, the base sheet 25 may be vacuum-adsorbed on the table without providing the adhesive layer 28 on the probe cleaning sheet 10.

  The cleaning layer 20 can also be formed directly on a metal plate shaped to be fixed to the table of the probe cleaning device or on the surface of the recycled silicon wafer. In this way, wrinkles and peeling problems that occur in the cleaning layer 20 due to a difference in thermal expansion coefficient from the base sheet can be avoided even at high temperatures.

Furthermore, a protective sheet 27 (for example, a resin film such as PET or PP) for avoiding adhesion of dust in the air may be attached on the cleaning layer 20. Since the release sheet 26 and the protective sheet 27 are peeled off during use, they do not require heat resistance.
(Cleaning method)
A probe cleaning method using the probe cleaning sheet 10 according to the present invention will be exemplified below.

  Probe cleaning can be performed manually, but is generally performed using a probe cleaning device 40 shown in FIG. The probe cleaning device 40 shown in FIG. 4 is a device that removes foreign matter adhering to the tip of the probe 42 of the probe card 41, and is set on the stage 43 and a stage 43 that is moved relative to the probe card 41. The probe cleaning sheet 44 and an autofocus mechanism (not shown) for moving the stage 43 relative to the probe 42 are provided. The probe 42 relative to the stage 43 is positioned by the autofocus mechanism. Thereafter, the probe 42 is pierced by applying a certain pressure to the cleaning sheet 44, scraping off foreign matter adhered to the tip of the probe with the abrasive particles of the cleaning layer, and by a cycle operation of wiping off the foreign matter scraped off when being pulled out with the cleaning layer, The attached foreign matter is removed without damaging the tip of the probe 42. The amount of piercing of the needle tip of the probe 42 in this probe cleaning is usually about 20 μm to 100 μm, although it varies depending on the type of probe.

  In the probe card used for the chip performance test, when the number of times of use and the time of use increase, foreign matter adheres to the tip of the probe arranged on the probe card. The stuck foreign matter is removed by repeatedly piercing and pulling up the probe with the foreign matter attached to the distal end portion of the probe cleaning sheet of the present invention. When the tip of the probe pierces the inside of the cleaning layer constituting the probe cleaning of the present invention, the impurities that come into contact with the abrasive particles and adhere firmly to the probe can be removed. Then, when pulling out the probe, the probe is cleaned by capturing the scraped impurities inside the cleaning layer by restoring the shape of the base material of the elastic body and appropriate tackiness. At this time, since the base material has an appropriate compressive elastic modulus (repulsion elastic modulus), excessive pressure is not applied to the probe, and wear of the probe can be suppressed. Further, the tip can be prevented from being deformed even with respect to a relatively soft probe.

  The degree of contact of the probe with the cleaning layer in the probe cleaning may be adjusted by the amount of dirt, the degree of fixation, etc., and further examples include a method of pressing and holding for a certain period of time, and a method of applying a necessary amount of heating. . Further, there is a method in which the probe or the probe cleaning sheet is rotated or vibrated without excessively sticking the tip of the probe into the cleaning layer of the probe cleaning sheet.

Hereinafter, the probe cleaning sheet according to the present invention will be described more specifically with reference to examples. As a base material sheet, a 75-μm thick polyimide sheet (Kapton: manufactured by Toray DuPont Co., Ltd.) and a double-sided adhesive tape having a silicone pressure-sensitive adhesive layer were used. Next, after applying a solution in which a silicone resin and abrasive particles were mixed and dispersed on the surface of the base sheet, it was dried to form a cleaning layer having a thickness of 200 μm to obtain a probe cleaning sheet.
(1) Adjustment of elastic base material A mixture solution in which an abrasive was added to and mixed with a liquid in which the following silicone resin composition and crosslinking aid were added was used.
(2) Abrasive particles The abrasive particles used were SiC particles (average particle size of 1 μm, 3 μm indefinite shape), Al ₂ O ₃ particles (spherical particle having an average particle size of 1 μm), composite particles: mother particles (average particle size: 3 μm) Composite spherical silicone rubber particles) and child particles (average particle diameter; 0.1 μm spherical Al ₂ O ₃ particles) were used.
(3) Preparation of probe cleaning sheet The mixing ratio of the mixture solution, which is a silicone elastomer adjusting liquid, and abrasive particles was adjusted in the range of 55 wt% to 70% of abrasive particles. The above mixed solution in which the abrasive particles were mixed was applied on a polyimide substrate film (sheet) having a thickness of 75 μm, and then dried at 120 ° C. to obtain a cleaning layer having a thickness of 200 μm. Next, a double-sided adhesive tape (about 50 μm silicone adhesive layer on a PET film) was used to obtain a cleaning sheet. The cleaning sheet of Example 1 is provided on a recycled silicon wafer and has a configuration in which a recycled silicon wafer / adhesive layer / base film / cleaning layer / PET protective layer is laminated in this order.
(Probe cleaning sheet performance evaluation)
(1) Evaluation of cleaning layer adhesiveness The cleaning layer adhesiveness test was conducted by an inclined ball tack method in accordance with JIS Z0237. As a measuring device, a ball tack tester A092 manufactured by Imoto Seisakusho Co., Ltd. was used. An outline of the measuring device 30 is shown in FIG. The inclined surface 31 can adjust the movable range of the inclination angle θ to 20 °, 30 and 40 degrees.

  A sheet (probe cleaning sheet) 32 of the object to be measured is placed on this slope, a standardized steel ball 33 is placed at the start point A, a running distance of 100 mm (point A to point B) is taken, and a measurement range of 100 mm ( The time required to pass from the measurement start point B to the measurement end point C was measured. When the passing time of the ball reaching point C from point B is short, the tackiness is low, and when it is long, the tackiness is high. In addition, a 25 μm-thick polyethylene terephthalate (PET) film 34 is laid on the sheet to be measured based on the standard in the run-up distance range from point A to point B.

  The probe cleaning sheet 32 is attached to the inclined surface 31 of the measuring apparatus, the inclination angle θ is set to 20 degrees, and the ball no. 5 (steel ball of φ3.9 mm) and No. 5 3 (steel balls of 2.3 mm in diameter), a PET film 34 is laid on the probe cleaning sheet 32, placed on the surface of point A, the running distance is 100 mm, and the time for passing the measurement range 100 mm is measured did.

The measurement environment was a room temperature of 27 ° C. and a humidity of 40%. The number of measurements was 5, and the average value was taken as the measurement value.
(2) Evaluation of Compressibility and Compressive Elastic Modulus The actual thickness of the cleaning layer is as thin as 200 μm to 400 μm. Seiki Seisakusho, No. 129-E type) was used. A pressure plate made of a disk having a diameter of 10 mm was placed on the probe cleaning sheet, and the compression rate and compression elastic modulus were calculated from the following equations. Compression rate (%) = (t ₀ −t ₁ ) / t ₀ × 100
Compression elastic modulus (%) = (t ₂ −t ₁ ) / (t ₀ −t ₁ ) × 100
1) t ₀ is the value of the thickness after pressing for 30 seconds with an initial load of 80 g.
2) t ₁ is a thickness value after 5 minutes with a load (880 g) placed thereon.
3) t ₂ is a value obtained by measuring the thickness at the initial load (80 g) again after 1 minute after removing all loads and making no load.
4) Calculate the compressibility and the compressive modulus by the above formula.

  The number of times of measurement was 3, and the average value was defined as the compression rate and the compression modulus.

  Next, the probe cleaning evaluation was performed using the apparatus shown in FIG. 4 under the cleaning conditions shown in Table 1 below.

<Example 1>
(1) Abrasive particles: SiC, average particle size 3 μm (indefinite shape), blending ratio 60%,
(2) Ball tack test:
1) 0.74 seconds {Ball No. 5 (diameter 3.9 mm)}
2) 2.61 seconds {Ball No. 3 (diameter 2.3 mm)}
<Example 2>
(1) Abrasive particles: SiC, average particle size 1 μm (indefinite shape), 70% blending rate
(2) Ball tack test:
1) 0.91 seconds {Ball No. 5 (diameter 3.9 mm)}
2) 2.94 seconds {Ball No. 3 (diameter 2.3 mm)}
<Example 3>
(1) Abrasive particles: SiC, average particle size 1 μm (indefinite shape), blending ratio 60%
(2) Ball tack test:
1) 1.50 seconds {Ball No. 5 (diameter 3.9 mm)}
2) 12.6 seconds {Ball No. 3 (diameter 2.3 mm)}
<Example 4>
(1) Abrasive particles: SiC, average particle size 1 μm (indefinite shape), 50% blending rate
(2) Ball tack test:
1) 3.55 seconds {Ball No. 5 (diameter 3.9 mm)}
2) 25.2 seconds {Ball No. 3 (diameter 2.3 mm)}
<Example 5>
(1) Abrasive particles: Al 2 O 3, average particle size 1 μm (spherical), blending ratio 60%
(2) Ball tack test:
1) 1.02 seconds {Ball No. 5 (diameter 3.9 mm)}
2) 3.11 seconds {Ball No. 3 (diameter 2.3 mm)}
<Example 6>
(1) Abrasive particles: Composite particles: Average particle size of mother particles 3 μm (silicone rubber, spherical), average particle size of child particles 0.1 μm, blending ratio 60%
(2) Ball tack test:
1) 0.88 seconds {Ball No. 5 (diameter 3.9 mm)}
2) 2.85 seconds {Ball No. 3 (diameter 2.3 mm)}
<Comparative Example 1>
As Comparative Example 1, a probe cleaning test was performed using a probe cleaning sheet having the configuration shown in FIG.

  As shown in FIG. 6A, the probe cleaning sheet 12a includes a first cleaning layer 20a in which an elastic base material 21a and abrasive particles 22 are dispersed as a cleaning layer 20 on a substrate sheet 25, and a top thereof. And a second cleaning layer 20b made of a silicone gel layer 21b that does not contain abrasive particles.

When the probe is pierced into the cleaning layer 20, it passes through the second cleaning layer 20b, scrapes off the probe needle tip with the first cleaning layer 20a, and scrapes off with the first cleaning layer 20a when removing the probe. The deposited matter is captured and cleaned in the second cleaning layer 20b.
(1) Abrasive particles: 1) Upper layer: No abrasive particles
2) Lower layer: SiC, average particle size 1 μm (spherical), blending ratio 60%
(2) Ball tack test:
1) 5.50 seconds {Ball No. 5 (diameter 3.9 mm)}
2) 30.23 seconds {Ball No. 3 (diameter 2.3 mm)}
<Comparative example 2>
As Comparative Example 2, the probe was subjected to a cleaning test using a probe cleaning sheet having the configuration shown in FIG.

As shown in FIG. 6B, the probe cleaning sheet 12b is formed with a cleaning layer 20 in which only an elastic base material 21b made of silicone gel (excluding abrasive particles) is applied on a base sheet 25. It has been made.
(1) Abrasive particles: no abrasive particles (2) Ball tack test:
1) 6.90 seconds {Ball No. 5 (diameter 3.9 mm)}
2) 38.41 seconds {Ball No. 3 (diameter 2.3 mm)}
<Comparative Example 3>
As Comparative Example 3, the probe was subjected to a cleaning test using a probe cleaning sheet having the configuration shown in FIG.

As shown in FIG. 6 (c), the probe cleaning sheet 12 c is formed by forming a cleaning layer 20 using a polyurethane foam resin as the elastic base material 21 on the base sheet 25. The cleaning layer 20 is made of a foam having air bubbles 29 on the surface and inside, and has a configuration in which a plurality of abrasive particles 22 are attached to the surface irregularities of the cleaning layer 20.
(1) Abrasive particles: SiC, average particle size 1 μm (spherical), blending ratio 60%
(2) Ball tack test:
1) 0.48 seconds {Ball No. 5 (diameter 3.9 mm)}
2) 1.50 seconds {Ball No. 3 (diameter 2.3 mm)}
<Test results>
The test results are shown in Table 2 below.

“Cleanability” shown in Table 2 above indicates “◯: no polishing residue and deposits, Δ: little polishing residue”, and “adhesion of elastic base material of cleaning layer (adhesive base material transferred to probe)” "Represents" O: None, X: Present ".
<Result>
Using the probe cleaning sheet having the configuration shown in Examples 1 to 6, 10,000 cleaning operations shown in Table 1 were performed. Thereafter, as a result of observing the probe tip with a microscope, both the fixed matter and adhered matter on the probe needle tip were removed, and neither re-adhesion after removal nor transfer phenomenon of the sticky matter on the elastic base material was observed. Also, the wear amount of the probe needle tip was as low as 3 μm or less.

  On the other hand, when the probe cleaning sheet of Comparative Example 1 is used, the sticking matter and the attached matter are removed, but the sticking matter of the elastic base material is attached (transferred) around the needle tip, and the wafer performance test In some cases, probe contact failure occurred.

  Further, when the probe cleaning sheet of Comparative Example 2 was used, the adhered matter was removed, but the adhered needle tip had a polishing residue and was not sufficiently removed.

  In addition, when the probe cleaning sheet of Comparative Example 3 was used, the sticking matter of the needle tip was completely removed, but the tip of the needle was worn very much, and there was a problem with the probe life. Further, the deposit remained on the side surface of the needle and was not completely removed.

  As described above, Examples 1 to 6 of the probe cleaning sheet according to the present invention can suppress the abrasion of the probe and can sufficiently remove the foreign matter attached to the tip portion of the probe. In addition, the probe cleaning sheets shown in Examples 1 to 6 are formed by forming a cleaning layer on a base sheet, but on the metal plate of the stage of the probe cleaning device or on the recycled silicon wafer by the probe cleaning material. A cleaning layer may be formed.

DESCRIPTION OF SYMBOLS 10 Probe cleaning sheet 20 Cleaning layer 21 Elastic base material 22 Abrasive particle 23 Composite particle 23a Base particle 23b Child particle 25 Base material sheet 26 Release sheet 27 Protection sheet 28 Adhesion layer

Claims (14)

A probe cleaning sheet having a cleaning layer for removing foreign matter adhering to the tip portion of the probe,
Comprising a base material sheet and the cleaning layer formed on the base material sheet with an elastic base material made of silicone resin and / or silicone elastomer mixed with abrasive particles,
In an inclined ball tack test for evaluation of adhesion according to JIS Z0237, an inclination angle of 20 degrees, a ball no. No. 5 (φ 3.9 mm), a run-up distance of 100 mm, and a measurement distance of the adhesive surface with the cleaning layer as a surface is 100 mm. 5. A probe cleaning sheet in which the time for passing the measurement distance of 5 is in the range of 0.5 seconds to 4.0 seconds.   2. The probe cleaning sheet according to claim 1, wherein the elastic base material has a compression rate in a measurement test based on JIS L1096 of 0.7% or more and 1.5% or less. The abrasive particles include at least one element selected from the group consisting of diamond particles, SiC carbide, boron compound of B ₄ C or cBN, Si, Al, Ti, Ce, Mn, Fe, Cr and Zr. And one or more types selected from the group of nitrides containing at least one element selected from the group of Si, Al and Ti, and the average particle size of the abrasive particles is 0.05 μm to 20 μm The probe cleaning sheet according to claim 1, wherein the probe cleaning sheet is in a range.   The abrasive particles are composed of composite particles composed of mother particles and a plurality of child particles attached or bonded around the mother particles, and the average particle diameter of the mother particles is in the range of 1 μm to 20 μm. The probe cleaning sheet according to claim 1 or 2, wherein the average particle diameter of the child particles is in the range of 1/10 to 1/1000 of the average particle diameter of the mother particles.   The probe cleaning sheet according to claim 4, wherein the mother particle is an organic particle having elasticity, and the child particle is an inorganic particle.   6. The probe cleaning sheet according to claim 1, wherein a blending ratio of the abrasive particles mixed in the cleaning layer is 40% by weight or more and 85% by weight or less.   The said base material sheet is a sheet | seat which consists of 1 or 2 or more types selected from the group of a polyimide resin, silicone rubber, polyethylene naphthalate, and polyacryl acryl ketone (PEEK), The 1 thru | or 6 characterized by the above-mentioned. The probe cleaning sheet according to item. A probe cleaning material for forming a cleaning layer for removing foreign matter adhering to the tip of the probe,
Comprising abrasive particles and an elastic base material made of silicone resin and / or silicone elastomer mixed with the abrasive particles,
In an inclined ball tack test for evaluation of adhesion according to JIS Z0237, an inclination angle of 20 degrees, a ball no. No. 5 (φ 3.9 mm), a run-up distance of 100 mm, and a measurement distance of the adhesive surface with the cleaning layer as a surface is 100 mm. 5. A probe cleaning material in which the time passing through the measurement distance of 5 is in the range of 0.5 seconds to 4.0 seconds.   The probe cleaning sheet material according to claim 8, wherein the elastic base material has a compression ratio in a measurement test based on JIS L1096 of 0.7% or more and 1.5% or less. The abrasive particles include at least one element selected from the group consisting of diamond particles, SiC carbide, boron compound of B ₄ C or cBN, Si, Al, Ti, Ce, Mn, Fe, Cr and Zr. And a group of nitrides containing at least one element selected from Si, Al and Ti, and the average particle size of the abrasive particles is in the range of 0.05 μm to 20 μm. The probe cleaning sheet material according to claim 8 or 9, wherein   The abrasive particles are composed of composite particles composed of mother particles and a plurality of child particles attached or bonded around the mother particles, and the average particle diameter of the mother particles is in the range of 1 μm to 20 μm. The probe cleaning sheet according to any one of claims 8 to 10, wherein the average particle diameter of the child particles is in a range of 1/10 to 1/1000 of the average particle diameter of the mother particles. Wood.   The probe cleaning sheet material according to claim 11, wherein the mother particles are organic particles, and the child particles are inorganic particles.   The probe cleaning sheet material according to any one of claims 8 to 11, wherein a blending ratio of the abrasive particles mixed in the cleaning layer is 40 wt% or more and 85 wt% or less. The said base material sheet consists of 1 or 2 or more types selected from the group of a polyimide resin, silicone rubber, a polyethylene naphthalate, and a polyacryl acryl ketone (PEEK), The any one of Claim 8 thru | or 13 characterized by the above-mentioned. The probe cleaning sheet material according to one item.

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