TWM679210U - Cleaning material - Google Patents

Abstract

A cleaning material including a support layer, a cleaning layer, and a dust-adhesive layer is provided. The cleaning layer is disposed on a first side of the support layer. The dust-adhesive layer is disposed on a side of the cleaning layer away from the support layer. A Young’s modulus of the dust-adhesive layer is greater than a Young’s modulus of the cleaning layer. For the cleaning material of the new utility model, the thoroughness and efficiency of probe cleaning could be improved by the corresponding materials and configurations of the cleaning layer and the dust-adhesive layer, and the complexity of the operation could be reduced.

Description

Cleaning materials

This invention relates to a cleaning material, and more particularly to a cleaning material that can be used for probe cleaning.

During semiconductor wafer probing (CP) or final test (FT), the probe pin repeatedly contacts conductive terminals (such as solder balls or contact pads) on the wafer or chip to perform electrical measurements. During these repeated contacts, some material from the conductive terminals (such as solder, gold, aluminum, copper, or their oxides) may peel off and adhere to the probe tip, causing the probe's contact resistance (CRES) to increase or become unstable, severely affecting the accuracy and reliability of the test. To address this, the industry has developed various cleaning pads, cleaning mats, or cleaning sheets (i.e., cleaning materials) for cleaning the probes. Early cleaning materials likely involved mixing hard microparticles into a resin base and using abrasive grinding to achieve a cleaning effect. However, these designs were prone to damaging probes. Therefore, developing a cleaning material with a simpler structure that could simultaneously achieve efficient abrasion and pollutant capture in a single interface, while effectively protecting the probe, has become a continuous focus in this field.

This invention provides a cleaning material that can be used for probe cleaning.

The cleaning material of this invention includes a support layer, a cleaning layer, and a dust-adhesive layer. The cleaning layer is disposed on the first side of the support layer. The dust-adhesive layer is disposed on the side of the cleaning layer away from the support layer. The Young's coefficient of the dust-adhesive layer is greater than that of the cleaning layer.

In one embodiment of this invention, the cleaning layer material includes a first resin, a plurality of abrasive particles, and a plurality of first cleaning particles.

In one embodiment of this novel invention, the Mohs hardness of the abrasive particles is greater than that of the first cleaning particles.

In one embodiment of this invention, the abrasive particles have a Mohs hardness greater than or equal to 7, and the first cleaning particles have a Mohs hardness less than 7.

In one embodiment of this novel invention, the material of the abrasive particles is selected from the group consisting of alumina, silicon carbide, diamond and quartz.

In one embodiment of this invention, the first cleaning particle is an organic compound particle comprising a functional group selected from the group consisting of alkenyl, ether, amide, amino, carboxyl, ester, alcohol, silyl, alkoxy, and alkoxysilyl groups.

In one embodiment of this invention, the material of the sticky layer includes a second resin and a plurality of second cleaning particles, and the sticky layer does not substantially contain abrasive particles.

In one embodiment of this novel invention, the Shore A hardness of the cleaning layer is between 60A and 90A.

In one embodiment of this novel invention, the adhesive force of the adhesive layer is between 1 gf/25 mm and 50 gf/25 mm.

In one embodiment of this invention, the cleaning material further includes an adhesive layer and a release layer. The adhesive layer is disposed on a second side of the support layer, wherein the first side and the second side are opposite sides of the support layer. The release layer covers the adhesive layer on the side away from the support layer.

In summary, the cleaning material of this invention improves the thoroughness and efficiency of probe cleaning by using the materials and configuration of the cleaning layer and the adhesive layer, while reducing the complexity of operation.

In the accompanying figures, for clarity, the dimensions of some components or films have been enlarged or reduced. Furthermore, for clarity, some films or components may be omitted from the illustrations.

The directional terms used in this article (e.g., up, down, right, left, top, bottom) are for reference only and are not intended to imply absolute orientation.

Non-limiting terms in the specification (e.g., approximately, substantially, roughly, may, possibly, can) may be used as an example of representation, and the content or values they represent may be within the acceptable range of deviation for a person skilled in the art. For example, the represented values may include the stated values as well as deviation values within the acceptable range of deviation for a person skilled in the art. The aforementioned deviation values may be one or more standard deviations in the manufacturing or measurement process, or calculation errors arising in the calculation or conversion process due to the number of decimal places used, rounding, or other factors such as error propagation.

Figure 1 is a partial cross-sectional schematic diagram of a cleaning material according to an embodiment of the present invention.

Referring to Figure 1, the cleaning material 100 may include a layered structure, which may include a support layer 110, an adhesive layer 120, a cleaning layer 130, and a dust-adhesive layer 140. In this embodiment, the support layer 110 serves as the main structure of the cleaning material 100, providing sufficient mechanical strength and stability to support the membrane layers on both sides. The adhesive layer 120 and the stacked cleaning layer 130 and dust-adhesive layer 140 are located on opposite sides of the support layer 110.

Specifically, the adhesive layer 120 is located on one side of the support layer 110 (as shown in the lower part of the figure), and its main function is to provide stable adhesion to secure the cleaning material 100 to a work surface or the surface of a particular piece of equipment. In one embodiment, the cleaning material 100 may optionally further include a release layer 150, which covers the side of the adhesive layer 120 away from the support layer 110, to protect the adhesive layer 120 from dust accumulation or loss of adhesion when not in use.

On the opposite side of the support layer 110 (as shown at the top in the diagram), a cleaning layer 130 and a dust-adhesive layer 140 are sequentially disposed. The cleaning layer 130 is disposed on top of the support layer 110, while the dust-adhesive layer 140 is disposed on top of the cleaning layer 130. Through this stacking structure, the cleaning material 100 integrates two different functional layers on a single sheet, providing a two-stage cleaning mechanism. For example, users can first use the sticky layer 140 to perform preliminary cleaning of the object to be cleaned, and then use the cleaning layer 130 below to perform further dust removal or contaminant removal. In the subsequent operation, the dust or contaminants are encapsulated or trapped within the cleaning material 100. In this way, not only can the convenience and efficiency of operation be improved, but more complex cleaning needs can also be met, and the frequency of changing different cleaning consumables can be reduced.

[ Support layer ]

The support layer 110 is the main structure of the cleaning material 100, and its function is to provide sufficient mechanical strength and stability to support the film layers on both sides. In one embodiment, the support layer 110 may also be referred to as the substrate. In order to balance structural support and application flexibility, the thickness of the support layer 110 can be appropriately selected, for example, between 50 micrometers (µm) and 1800 micrometers; for example, the thickness of the support layer 110 can be approximately 100 micrometers. If the thickness of the support layer 110 is insufficient, the support it provides may be poor, and it may be easily damaged by external forces or punctured by the object to be cleaned during operation. On the other hand, if the thickness of the support layer 110 is too large, it may cause the overall thickness of the cleaning material 100 to be excessively thick, thereby increasing the material cost and potentially affecting the function of other membrane layers or reducing the applicability of the product.

To achieve the desired physical properties, the material of the support layer 110 can be selected from materials with good stability. In this embodiment, the material of the support layer 110 may include polyethylene terephthalate (PET), polyimide (PI), polyetheretherketone (PEEK), polyetherimide (PEI), polyamide (PA), polyether ether (PES), polyethylene naphthalate (PEN), wafers, glass, metal plates, fiberglass plates, ceramic plates, or stacks or combinations of the above materials.

[ Adhesive layer ]

An adhesive layer 120 is disposed on the side of the support layer 110 away from the cleaning layer 130 and the dust-adhesive layer 140, and is adapted to provide stable adhesion to fix the cleaning material 100 to the surface of a workbench or a particular piece of equipment or object, ensuring stability during cleaning operations.

In this embodiment, the thickness of the adhesive layer 120 can be greater than or equal to 10 micrometers (µm) and less than or equal to 50 micrometers; for example, the thickness of the adhesive layer 120 is approximately 25 micrometers. If the thickness of the adhesive layer 120 is less than 10 micrometers, its adhesive force may be reduced, resulting in poor fixation. On the other hand, if the thickness of the adhesive layer 120 is greater than 50 micrometers, the overall thickness of the cleaning material 100 may increase accordingly due to the excessive thickness of the adhesive layer, thereby increasing material costs or affecting the function of other film layers.

In one embodiment, the adhesive layer 120 may be made of acrylic resin or silicone resin. To ensure stable adhesion and ease of removal, the adhesive strength of the adhesive layer 120 can be appropriately selected. For example, the adhesive strength may range from 100 gf/25mm to 2000 gf/25mm. If the adhesive strength is too low, the cleaning material 100 may easily slip or detach during use; while if the adhesive strength is too high, it may become difficult to replace or remove the cleaning material 100, and may even leave residue on the object surface, causing inconvenience in use.

[ Release layer ]

In the cleaning material 100, a release layer 150 may be selectively provided, covering the adhesive layer 120 on the side away from the support layer 110. This release layer protects the surface of the adhesive layer 120 from dust accumulation or loss of adhesion when the cleaning material 100 is not in use. During use, the release layer 150 can be peeled off to expose the adhesive layer 120 for attachment and fixation. The release layer 150 may include a release film or release paper. In one embodiment, the material of the release film serving as the release layer 150 may include polyethylene terephthalate (PET).

To strike a balance between protective effectiveness and ease of use, the thickness of the release layer 150 can be appropriately selected, for example, between 25 micrometers and 175 micrometers. If the release layer 150 is too thin, it may be easily damaged when peeled off, and the protective effect on the adhesive layer 120 will be poor; on the other hand, if the thickness is too thick, it may unnecessarily increase material costs and overall thickness. In addition, the release force of the release layer 150 is also an adjustable feature; in one embodiment, its release force can be from 2 gf/25mm to 200 gf/25mm. If the release force is too small, the release layer 150 may fall off too easily, thus losing the function of protecting the adhesive layer 120; conversely, if the release force is too large, it will be relatively difficult for the user to peel it off, causing inconvenience in use.

[ Cleaning layer ]

A cleaning layer 130 is disposed on the support layer 110 and can physically abrade and wipe the surface of the object to be cleaned to remove contaminants or adhering substances. To achieve effective cleaning, the thickness of the cleaning layer 130 can be appropriately selected, for example, between 10 micrometers (µm) and 300 micrometers; in one embodiment, the thickness of the cleaning layer 130 can be approximately 225 micrometers. In this embodiment, the cleaning layer 130 can be a composite material comprising a resin material 131 as a base, and a plurality of cleaning particles 132 and a plurality of abrasive particles 133 uniformly mixed and encapsulated therein. This design, which combines particles of different hardness, is suitable for providing a cleaning effect that balances abrasiveness and protection, wherein the Mohs hardness of abrasive particles 133 is greater than that of cleaning particles 132.

The aforementioned resin material 131 can be an organosilicone resin, which can serve as a carrier for encapsulating microparticles. In one embodiment, the organosilicone resin used in the resin material 131 is, for example, an organic polymer formed from a polyorganosiloxane with a highly cross-linked network structure. Such polymers can be prepared by hydrolysis-condensation reactions of various mixtures of monomers such as methyltrichlorosilane, dimethyldichlorosilane, phenyltrichlorosilane, diphenyldichlorosilane, or methylphenyldichlorosilane. Appropriate molecular weight and glass transition temperature help to endow the cleaning layer 130 with good elasticity and cohesion, making it less prone to cracking or residue during the cleaning process. In one embodiment, the weight-average molecular weight of resin material 131 may be between 20,000 g/mol and 1,500,000 g/mol, and the glass transition temperature (Tg) may be between -60°C and -20°C.

The abrasive particles 133 primarily function as abrasives to scrape away or loosen contaminants or deposits adhering to the surface of an object. In one embodiment, the abrasive particles 133 have a Mohs hardness greater than or equal to 7, and their shape can be spherical or polygonal, with a particle size distribution ranging from 0.02 micrometers to 50 micrometers. Their material can be selected from the group consisting of alumina, silicon carbide, diamond, and quartz.

Compared to abrasive particles 133, cleaning particles 132 provide a gentler cleaning action and help adsorb fine debris scraped off by abrasive particles 133, while reducing or avoiding scratches on the surface of the object to be cleaned. In one embodiment, the cleaning particles 132 have a Mohs hardness of less than 7, and their morphology can be spherical or polygonal, with a particle size distribution ranging from 0.05 micrometers to 30 micrometers. The cleaning particles 132 may be organic compound particles containing functional groups such as alkenyl, ether, amide, amino, carboxyl, ester, alcohol, silyl, alkoxy, or alkoxysilyl, which help improve the affinity between the particles and the resin substrate and the pollutants.

By combining abrasive particles 133 and cleaning particles 132, a more stable and precise cleaning effect can be achieved. Relying solely on a single high-hardness abrasive may result in excessive hardness, leading to debris buildup during frequent use or causing microscopic damage to the object's surface. In this novel structure, the uniformly dispersed cleaning particles 132 effectively adsorb and encapsulate tiny foreign objects loosened by the abrasive particles 133, trapping and fixing them within the cleaning layer 130 as much as possible to reduce the risk of secondary contamination. Furthermore, the presence of cleaning particles 132 effectively reduces the overall hardness and brittleness of the cleaning layer 130, thereby significantly reducing the risk of debris shedding from the cleaning layer 130 itself. Through the coordinated operation of high-hardness microparticles (such as abrasive particles 133) and low-hardness microparticles (such as cleaning particles 132), the cleaning layer 130 can improve the stability and precision of cleaning while having a strong detergency.

The material properties of organosilicon resins stem from their unique molecular structure, which combines the advantages of both organic polymers and inorganic materials. Their main molecular chain is primarily composed of silicon (Si) and oxygen (O) linked by alternating high-energy silicon-oxygen bonds (Si-O). This structure, similar to inorganic materials such as quartz and glass, endows the resin with excellent thermal stability and weather resistance. Simultaneously, the side chains attached to the silicon atoms are organic _functional groups such as methyl ( _-CH3 ), ethyl ( _-C2H5 ), vinyl (-CH= _CH2 ), phenyl ( _-C6H5 ), or _{tolyl (-C6H4CH3 ) . These} groups endow the material with the flexibility, elasticity, and processability of traditional organic materials. This chemical structure, which combines organic and inorganic properties, gives organosilicone resins a lower glass transition temperature and a higher decomposition temperature, resulting in a wide operating temperature range and ensuring that they maintain stable physical and chemical properties at different process temperatures.

The preparation process of organosilicon resins typically involves steps such as hydrolysis and condensation. In one exemplary preparation method, a chlorosilane monomer, such as methyltrichlorosilane or dimethyldichlorosilane, is first hydrolyzed, causing its chlorine groups to be replaced by hydroxyl groups, thereby generating the corresponding acidic hydrolysate. Subsequently, acidic substances in the acidic hydrolysate can be removed by washing with water to produce a substantially neutral primary condensate. Finally, this condensate can be further dehydrated and condensed in air under the action of a catalyst or by heating in air to ultimately form an organosilicon resin with a highly cross-linked network structure. The resin in this state can be in the form of a gel, gel, or paste, and is suitable for subsequent mixing with additives such as cleaning particles 132 or abrasive particles 133 to form a coatable coating.

The material, particle size, and morphology of the abrasive particles 133 directly affect the overall wear characteristics of the cleaning layer. Their selection and combination are similar to the design principles of sandpaper or abrasive materials. For example, alumina particles, due to their excellent toughness and durability, are suitable for continuous abrasive operations; while silicon carbide particles, known for their high hardness and sharp particle edges, can provide highly efficient cutting capabilities, but are relatively brittle. Diamond particles possess the highest hardness and are suitable for the most demanding abrasive requirements. Furthermore, the particle size distribution is also an important consideration. Similar to sandpaper grit, larger grit provides stronger scraping power, while smaller grit helps achieve a more refined surface cleaning effect. By blending different grit combinations, the cleaning layer can achieve both initial scraping and subsequent fine cleaning in a single operation. Therefore, the most suitable microparticle material or combination thereof can be selected based on the type and hardness of the contaminants to be removed, achieving a balance between cleaning efficiency and surface protection of the object being cleaned.

The material and surface properties of the cleaning particles 132 are suitable for enhancing the contaminant capture ability of the cleaning layer and reducing the risk of scratches. In one embodiment, such cleaning particles may be composed of polymer particles, such as polymethyl methacrylate (PMMA) particles, polystyrene (PS) particles, or polysiloxane particles. In terms of manufacturing method, the base polymer particles constituting the cleaning particles can be prepared by means of suspension polymerization or emulsion polymerization. After the base particles are formed, a further surface treatment step can be performed, by performing appropriate reactions to graft specific functional groups (such as: the aforementioned alkenyl, ether, amide, amino, carboxyl, ester, alcohol, silyl, alkoxy, or alkoxysilyl) onto the surface of the polymer particles. These functional groups enhance the compatibility and bonding between the microparticles and the resin substrate, ensuring that the microparticles are uniformly and stably distributed in the cleaning layer 130. Simultaneously, these functional groups increase the physical adsorption and chemical affinity for contaminant particles such as metals, solder, or oxides, effectively "adhering" and encapsulating the scraped debris to reduce or prevent recontamination of the surface of the object to be cleaned. Through this manufacturing and modification technology, the surface chemical properties of the cleaning particles 132 can be precisely controlled, enabling them to more effectively perform their functions of assisting cleaning, adsorbing contaminants, and protecting the surface of the object to be cleaned.

The overall hardness of the cleaning layer 130 may affect its cleaning performance and service life. The hardness referred to here refers to the overall macroscopic physical properties of the composite material, including the resin material 131, cleaning particles 132, and abrasive particles 133. In one embodiment, this hardness can be measured using Shore hardness, which can be determined using standard test methods such as ASTM D2240 or ISO 868. To achieve the desired cleaning effect, the Shore hardness A of the cleaning layer 130 can be appropriately selected, for example, in the range of 60A to 90A. If the Shore hardness of a cleaning layer is less than 60A, it indicates that the material is relatively soft. This usually means that the cross-linking degree of the resin base is low, which may result in poor resilience due to excessive softness, thus reducing cleaning ability. On the other hand, if the Shore hardness is higher than 90A, it indicates that the material is too hard. The excessive cross-linking degree may lead to increased brittleness. When subjected to high-frequency punctures or friction, it may easily produce debris or flakes, which not only reduces its own cleaning ability but may also cause secondary contamination of the object being cleaned.

The hardness of the 130-level clean layer can be controlled by several factors, primarily the molecular structure and crosslinking density of the resin. First, the molecular structure of the resin can affect its inherent rigidity. For example, silicone resins with a higher proportion of long carbon chains tend to be softer; conversely, resins containing aromatic hydrocarbons, cyclic structures, or groups with larger steric hindrances tend to be harder. Second, crosslinking density is another control factor, which can be altered by adjusting the proportion of crosslinker added. In one embodiment, the crosslinker's weight percentage relative to the resin can range from 10% to 60%. If the addition ratio is less than 10%, it may result in an excessively low cross-linking density, making the cleaning layer 130 too soft and lacking resilience; if the addition ratio is more than 60%, it may result in an excessively high cross-linking density, making the cleaning layer 130 too rigid or even brittle, easily causing secondary pollution by shedding debris during the cleaning process.

The elastic properties of Cleaner Coating 130 are a key indicator of its cleaning effectiveness. The elastic coefficient (or Young's modulus) is used to represent the stiffness of a material. Young's modulus is defined as the ratio of normal stress to normal strain without exceeding a certain elastic limit of the corresponding material; it is a physical quantity that measures a material's resistance to elastic deformation. For example, a higher elastic coefficient means greater resistance to deformation, requiring a larger force to produce a deformation per unit length. Here, the elastic coefficient refers to the measurement of the Cleaner Coating 130 composite material as a whole, not just the resin substrate. In one embodiment, the elastic coefficient can be tested and estimated using standard test methods such as ASTM D882 or ISO 527. To achieve effective cleaning of objects such as probes, the elasticity coefficient of the cleaning layer 130 can be between 30 kg/ ^cm² and 200 kg/ ^cm² . If the elasticity coefficient of the cleaning layer 130 is less than 30 kg/ ^cm² , it indicates that the material may be too soft and its recovery after deformation by external force is too poor, which will reduce its ability to clean multiple times. On the other hand, if the elasticity coefficient is greater than 200 kg/ ^cm² , it indicates that the material is too rigid and not easily deformed. During the cleaning process, the overly hard surface may easily shed debris due to its high brittleness, which not only reduces the cleaning ability but may even cause secondary contamination of the object to be cleaned.

The elasticity of the cleaning layer 130 can be controlled by several factors, such as the molecular weight of the resin, the glass transition temperature (Tg) of the resin, and/or the ratio of cleaning material to resin. Regarding the molecular weight of the resin, a lower molecular weight is detrimental to the material's cohesion, resulting in a relatively lower elasticity; a higher molecular weight is beneficial to cohesion, thus increasing the elasticity. In this embodiment, the molecular weight of the resin can be selected in the range of 20,000 g/mol to 1,500,000 g/mol. Regarding the glass transition temperature (Tg) of a resin, a lower Tg typically corresponds to poorer cohesion and temperature resistance, resulting in a lower elastic modulus; while a higher Tg helps to improve cohesion and temperature resistance, thus increasing the elastic modulus. In this embodiment, the Tg of the resin can be selected in the range of -60°C to -20°C. Furthermore, the elastic modulus can also be adjusted by changing the ratio of the cleaning material added to the resin (e.g., the sum of cleaning particles 132 and abrasive particles 133) to the resin. In this embodiment, the weight percentage of the cleaning material relative to the resin can range from 5% to 200%.

[ Dust layer ]

The adhesive layer 140 is disposed on top of the cleaning layer 130 and can play a second-stage or final cleaning role. The primary function of the adhesive layer 140 is not (but, to a small extent, possible) physical abrasion, but rather, during the cleaning process in conjunction with the cleaning layer 130 (e.g., before or after penetration of the cleaning layer 130), it utilizes its surface properties to adsorb and coat micro-dust and fine particles on the object being cleaned, thereby enhancing the cleaning power. The thickness of the adhesive layer 140 can be appropriately selected, for example, between 10 micrometers and 300 micrometers; in one embodiment, its thickness may be approximately 25 micrometers.

In one embodiment, provided the total thickness of the adhesive layer 140 and the cleaning layer 130 is between 100 micrometers and 400 micrometers, the ratio of the thickness of the adhesive layer 140 to the thickness of the cleaning layer 130 can be approximately 20:80 to 80:20. This ratio range provides better cleaning power and efficiency for the synergistic effect of the adhesive layer 140 and the cleaning layer 130 in cleaning the probe. In one embodiment, the ratio of the thickness of the adhesive layer 140 to the thickness of the cleaning layer 130 can be approximately 20:80; for example, 15:85 to 25:75. In one embodiment, the ratio of the thickness of the sticky layer 140 to the thickness of the cleaning layer 130 may be approximately 80:20; for example, 75:25 to 85:15.

In this embodiment, the material of the sticky layer 140 may include a resin material 141 and a plurality of cleaning particles 142 uniformly mixed and encapsulated therein. It is noteworthy that the composition of the sticky layer 140 intentionally excludes high-hardness abrasive particles. This non-abrasive design aims to avoid microscopic scratches on the surface of the object to be cleaned during the final cleaning stage, while effectively removing fine contaminants. In one embodiment, the resin material 141 and/or cleaning particles 142 used in the sticky layer 140 may be the same as or similar in material to the corresponding materials used in the cleaning layer 130 (e.g., resin material 131 and/or cleaning particles 132). For example, the resin material 141 can be an organosilicone resin with a highly cross-linked network structure, which is suitable for effectively "trapping" the adhered substances within it. The addition of cleaning particles 142 can further enhance the affinity and capture ability of pollutants through the functional groups on their surface.

The hardness of the sticky layer 140 is crucial to its effectiveness in adhering to and coating microparticles. The hardness referred to here is a macroscopic measurement of the sticky layer 140 as a whole, which can be tested using commonly used standard methods, such as ASTM D2240 or ISO 868. Because the cleaning layer 130 complex contains high-hardness inorganic abrasive particles, while the sticky layer 140 does not, the overall hardness of the cleaning layer 130 is typically greater than that of the sticky layer 140. To achieve a suitable level of hardness for optimal adhesion, the Shore Hardness A of the sticky layer 140 can be between 30A and 60A. If the Shore A hardness of the adhesive layer 140 is lower than 30A, it indicates that the material may be too soft and easily damaged during use due to insufficient structural strength, thus reducing its reusability. On the other hand, if the Shore A hardness is higher than 60A, it indicates that the material may be too hard. An overly hard surface is not conducive to the effective adhesion of fine particles and may reduce its dust-adhesive ability.

The hardness control method for the sticky layer 140 is similar to that for the cleaning layer 130, and can be adjusted by several factors, primarily the molecular structure and crosslinking density of the resin. By selecting the resin molecular chain and precisely controlling the proportion of the crosslinking agent, the hardness of the sticky layer 140 can be adjusted to an ideal range, balancing structural stability and excellent stickiness.

The elasticity coefficient of the sticky layer 140 is a physical quantity describing the rigidity of its material, and its magnitude can affect the behavior and effectiveness of the sticky layer when in contact with the object to be cleaned. Here, the elasticity coefficient refers to a macroscopic measurement of the sticky layer 140 as a whole, which can be determined using common standard test methods (such as ASTM D882). Because the sticky layer 140 does not contain high-hardness inorganic particles, its texture is generally softer and more elastic than the cleaning layer 130. In one embodiment, to achieve a better balance between the sticky layer's adhesion capacity and the number of uses, its elasticity coefficient can be in the range of 50 kg/ ^cm² to 300 kg/ ^cm² . An appropriate elasticity coefficient ensures that the material adheres effectively to the object being cleaned, while also having sufficient resilience after separation to facilitate repeated use.

The elasticity coefficient of the sticky layer 140 can be adjusted in a manner similar to that of the cleaning layer 130. This can be comprehensively controlled through several factors, such as the choice of resin, the molecular weight of the resin, the glass transition temperature (Tg) of the resin, and the crosslinking density. By precisely controlling these factors, the elasticity of the sticky layer 140 can be achieved within an ideal range, striking a balance between effective stickiness and structural stability.

The adhesive strength of the sticky layer 140 may affect its ability to successfully adsorb and remove fine contaminants. Here, adhesive strength refers to the surface properties of the sticky layer 140, which can be tested using commonly used standard methods, such as JIS Z 0237 or ISO 29862:2007. To strike a balance between effective adhesiveness and ease of operation, the adhesive strength of the sticky layer 140 can be appropriately selected, for example, within the range of 1 gf/25 mm to 50 gf/25 mm. If the adhesive strength is lower than 1 gf/25 mm, the surface tack of the sticky layer 140 may be too low, and it will not be able to effectively adsorb and fix the fine particles initially loosened by the cleaning layer 130. On the other hand, if the adhesion is higher than 50 gf/25mm, the stickiness may be too high. When the object to be cleaned (such as a probe) comes into contact with it, it may be difficult to pull out or separate due to excessive adhesion. This not only affects the smoothness of operation, but may also damage the structure of the sticky layer during the separation process, affecting its service life.

The adhesive strength of the sticky layer 140 can be achieved by controlling several key factors of the silicone resin, primarily including the resin's molecular weight, glass transition temperature (Tg), and/or crosslinking density. These factors are in balance; for example, an excessively high molecular weight, while beneficial to cohesion, may be detrimental to adhesive strength, while an excessively low molecular weight will result in poor cohesion, rendering the material ineffective at attracting dust. Through precise control of these factors, the adhesive strength of the sticky layer can be adjusted to an ideal range.

[ Methods of making cleaning materials ]

The manufacturing method of the cleaning material 100 of this invention may include the following steps. First, a support layer 110 is prepared as a substrate. Subsequently, a cleaning layer 130 and a dust-adhesive layer 140 may be sequentially formed on a predetermined area of the support layer 110. In an exemplary manufacturing method, the cleaning layer 130 may be formed on one side of the support layer 110 first. The formation method may be as follows: the material used to form the cleaning layer 130, including silicone resin, crosslinking agent, cleaning particles 132 and abrasive particles 133, etc., is uniformly mixed into a gel-like, paste-like or liquid coating. Next, the coating is uniformly applied to the surface of the support layer 110 using an appropriate method (e.g., by scraping or screen printing). After coating, the coating can be cured, for example, by heat curing (e.g., infrared heating) and/or light curing (e.g., ultraviolet irradiation in an oxygen-free environment) to form a structurally stable cleaning layer 130. After the cleaning layer 130 is formed, a coating for forming the adhesive layer 140 can be applied to and cured on the surface of the cleaning layer 130 in a similar manner.

As for the adhesive layer 120 located on the other side of the support layer 110, its formation time can be adjusted as needed. The adhesive layer 120 can be formed on the lower surface of the support layer 110 by coating, which can be performed before or after the formation of the cleaning layer 130 or the adhesive layer 140. In another embodiment, the cleaning layer 130 and/or the adhesive layer 140 can also be pre-formed independently on other carriers (such as release film). After they have cured, the pre-made cleaning layer 130 and adhesive layer 140 are transferred and disposed on the support layer 110 and the cleaning layer 130 respectively by lamination, bonding or other suitable methods. This method helps improve process flexibility and yield.

[ How to use cleaning materials ]

The cleaning material 100 of this invention can be integrated into semiconductor testing equipment (such as a probe tester) in an in-situ or online manner to clean probes or probe cards without removing the probe cards from the testing equipment. The probe cleaning method may include the following steps: first, testing electronic components with the probes; then, after the aforementioned testing, cleaning the probes with the cleaning material 100 of this invention. In an exemplary cleaning process, the testing equipment may place the cleaning material 100 on the testing device and apply a preset compression (overdrive) to the cleaning material 100 and/or the probes, causing the probe tips to penetrate and sequentially contact the functional layers disposed thereon.

When the probe penetrates the cleaning material 100, its tip first pierces the upper adhesive layer 140, and then further contacts the lower cleaning layer 130. During the initial contact with the adhesive layer 140, the adhesive layer 140 performs preliminary cleaning on the probe surface. Furthermore, during further contact with the cleaning layer 130, the abrasive particles 133 therein effectively loosen or peel off contaminants such as solder and oxide layers adhering to the probe surface through physical friction and scraping. Simultaneously, the cleaning particles 132 in the cleaning layer 130 assist in loosening and initially adsorbing fine debris. When the probe is pulled back and comes into contact with or separates from the sticky layer 140 again, the sticky layer 140 can utilize its surface properties to encapsulate or trap the tiny particles and dust that were loosened in the previous stage but still remained on the probe. In other words, through the cleaning layer 130 and the sticky layer 140 directly attached to it, a multi-stage cleaning mechanism can be performed on the probe (e.g., a two-stage process mainly consisting of "pressing down" and "pulling back"; or a three-stage process that can be regarded as "insertion", "pressing down", and "pulling back").

This multi-stage cleaning mechanism, combining "friction loosening" and "adhesive coating," significantly improves probe cleaning efficiency and surface quality. This cleaning method is applicable to all types of probes used in semiconductor testing, including but not limited to crown probes, pointed probes, vertical probe pins, and cantilever probe pins.

[ Experimental examples and comparative examples ]

The following examples and comparative examples illustrate the present invention in detail. The embodiments of the present invention may include the following examples 1 and 2, but the embodiments of the present invention are not limited to the following examples.

The purpose of the following experimental and comparative examples is to explore the possible impact of different thickness ratios of the cleaning layer and the sticky layer on the degree of damage to the object to be cleaned and the cleaning effect. To this end, several cleaning material samples with different thickness ratios were prepared.

The main difference between the various experimental and comparative examples lies in the thickness ratio of the adhesive layer to the cleaning layer. Apart from this variable, all other conditions constituting the cleaning material, such as the type of resin, the type, ratio, and particle size distribution of high-hardness and low-hardness microparticles, the material and thickness of the support layer and adhesive layer, the total thickness of the adhesive layer and cleaning layer, and the overall manufacturing process, remain essentially the same or similar to effectively observe the differences in effect caused by variations in the particle ratio. The specific formulations and test results described below are used to illustrate the technical principles and efficacy of this invention and are not intended to limit the scope of this invention in any way.

In the cleaning material of [Comparative Example 1], the thickness ratio of the adhesive layer to the cleaning layer is 100:0, that is, the cleaning layer is not included.

In the cleaning material of [Example 1], the thickness ratio of the adhesive layer to the cleaning layer is approximately 80:20.

In the cleaning material of [Experimental Example 2], the thickness ratio of the adhesive layer to the cleaning layer is approximately 20:80.

In the cleaning material of [Comparative Example 2], the thickness ratio of the sticky layer to the cleaning layer is 0:100, that is, it does not contain a sticky layer.

[Cleaning Effectiveness Test]

To evaluate the cleaning efficiency of each sample, a simulated testing and packaging facility's actual testing process was used. The test conditions were set such that after testing 50 identical ICs, the cleaning material sample underwent 10 cleaning cycles with a probe, and this testing and cleaning process was continued until a total of 300 cleaning cycles were completed for each sample. Crown probes were used throughout the testing process, and effectiveness was evaluated using two key online electrical testing metrics: yield rate and open/short circuit rate (O/S rate).

Yield is a core metric in semiconductor manufacturing, defined as the percentage of ICs that pass electrical testing and are deemed functional out of the total number of ICs. Probe testing is a crucial step in determining this initial yield, and its accuracy is paramount. If the probes become contaminated due to incomplete cleaning, it can lead to unstable contact resistance, causing functional ICs to be misclassified as defective, resulting in yield loss. Therefore, the ability of cleaning materials to consistently help maintain a high and stable yield of cleaned probes during long-term testing is another important criterion for evaluating their cleaning effectiveness.

The open/short circuit ratio represents the percentage of open or short circuit electrical errors that occur during chip testing. These errors typically stem from poor contact between the probe tip and the contact pad of the bare die due to contamination (such as oxides or test residue). For a stable and reliable testing environment, the open/short circuit ratio is generally required to be below 0.5%. For example, in the final test (FT) of an IC, for general logic ICs and consumer ICs, the O/S rate is recommended/needs to be controlled below 0.5%; while for automotive ICs or ICs requiring high reliability, it is recommended/needs to be strictly controlled below 0.1%, or even more strictly below 0.05%, to ensure product stability and reliability. Therefore, the ability of cleaning materials to clean probes and maintain a low open/short circuit rate directly reflects the effectiveness of the cleaning materials in removing probe contaminants and ensuring contact quality.

The test results of the cleaning effect are shown in [Table 1].

[Table 1] Comparative example 1 Experimental Example 1 Experimental Example 2 Comparative example 2 Yield 88.92% 93.68% 96.73% 90.37% Open circuit/short circuit rate 0.06% 0.05% 0.05% 0.06%

As shown in the results of the above experimental and comparative examples, the cleaning materials of Comparative Example 1, Experimental Example 1, Experimental Example 2 and Comparative Example 2 can all have a considerable cleaning effect on the probe.

Based on the results of the above experimental and comparative examples, if the yield test results are further considered, the cleaning materials of Experimental Example 1, Experimental Example 2 and Comparative Example 2 may be better.

Based on the results of the above experimental and comparative examples, if the open/short circuit rate test results are further considered, the cleaning materials of Experimental Example 1 and Experimental Example 2 may be better.

As shown in the above experimental and comparative examples, structures that include both a cleaning layer and a sticky layer (Experimental Example 1, Experimental Example 2) outperform structures with only a single functional layer (Comparative Example 1, Comparative Example 2) in maintaining high yield and low error rate. In particular, when the cleaning layer occupies a higher proportion of thickness (as in Experimental Example 2), a better balance can be achieved between powerful cleaning and final dust removal, thus obtaining the most ideal test yield. This result verifies the technical superiority of this novel invention in achieving synergistic cleaning effects by stacking different functional layers.

In summary, in this novel cleaning material, a cleaning layer containing abrasive particles and a non-abrasive dust-adhesive layer are sequentially placed on a support layer. Therefore, during the cleaning process of the probe using this novel cleaning material, the probe only needs to perform one vertical piercing motion. When the probe tip is pressed down, it first passes through the dust-adhesive layer, and the powerful cleaning of contaminants is mainly achieved by friction and loosening from the lower cleaning layer. When the probe is pulled back, it passes through the upper dust-adhesive layer again, at which point the dust-adhesive layer can effectively adhere to and encapsulate the tiny residues that were loosened in the previous stage. This two-stage cleaning mechanism, which sequentially completes "friction loosening" and "adhesion coating" within a single probe path, not only significantly improves the thoroughness and efficiency of cleaning but also reduces the complexity of operation, thus demonstrating superior probe cleaning results.

100: Cleaning material; 110: Support layer; 120: Adhesive layer; 130: Cleaning layer; 131: Resin material; 132: Cleaning particles; 133: Abrasive particles; 140: Adhesive layer; 141: Resin material; 142: Cleaning particles; 150: Release layer.

Figure 1 is a partial cross-sectional schematic diagram of a cleaning material according to an embodiment of the present invention.

100: Cleaning materials

110: Support layer

120: Adhesive layer

130: Cleanroom Layer

131: Resin Material

132: Cleaning Particles

133: Grinding particles

140: Dust layer

141: Resin Material

142: Cleaning Particles

150: Release Layer

Claims (10)

A cleaning material includes: a support layer; a cleaning layer disposed on a first side of the support layer; and a dust-adhesive layer disposed on a side of the cleaning layer away from the support layer, wherein the Young's coefficient of the dust-adhesive layer is greater than the Young's coefficient of the cleaning layer. The cleaning material as described in claim 1, wherein the cleaning layer comprises a first resin, a plurality of abrasive particles, and a plurality of first cleaning particles. The cleaning material as described in claim 2, wherein the Mohs hardness of the abrasive particles is greater than that of the first cleaning particles. The cleaning material as described in claim 3, wherein the abrasive particles have a Mohs hardness greater than or equal to 7, and the first cleaning particle has a Mohs hardness less than 7. The cleaning material as described in claim 2, wherein the abrasive particles are selected from the group consisting of alumina, silicon carbide, diamond and quartz. The cleaning material as described in claim 2, wherein the first cleaning particle is an organic compound particle comprising a functional group selected from the group consisting of alkenyl, ether, amide, amino, carboxyl, ester, alcohol, silyl, alkoxy, and alkoxysilyl groups. The cleaning material as described in claim 1, wherein the material of the sticky layer includes a second resin and a plurality of second cleaning particles, and the sticky layer does not substantially contain abrasive particles. The cleaning material as described in claim 1, wherein the Shore A hardness of the cleaning layer is between 60A and 90A. The cleaning material as described in claim 1, wherein the adhesive force of the adhesive layer is between 1 gf/25 mm and 50 gf/25 mm. The cleaning material as described in claim 1 further comprises: an adhesive layer disposed on a second side of the support layer, wherein the first side and the second side are opposite sides of the support layer; and a release layer covering the adhesive layer on the side of the support layer away from the support layer.