TWM633940U - Decontamination sheet - Google Patents

Abstract

A decontamination sheet including a release layer or composite plate, an adhesive layer, a substrate layer, a cleaning layer, and a polishing layer is provided. The adhesive layer is disposed on the release layer or composite plate. The substrate layer is disposed on the adhesive layer. The cleaning layer is disposed on the substrate layer. The polishing layer is disposed on the cleaning layer.

Description

Stain remover

The present invention relates to a decontamination sheet, and in particular to a decontamination sheet which can be used for probe cleaning.

In the testing of electronic components (such as: final test (final test; FT) or wafer needle testing (chip probing; CP), but not limited to the above), it is often necessary to conduct electrical measurements through probe pins. Measurement. However, if there are impurities or scratches on the probes, it may affect the test results of the electronic components.

The present novel creation provides a stain removal sheet which can be adapted for cleaning or removing stains from probes.

The decontamination sheet created by the invention includes a release layer or a composite material, an adhesive layer, a base material, a cleaning layer and an abrasive layer. The adhesive layer is on the release liner or composite. The substrate is on the adhesive layer. The cleaning layer is on the substrate. The abrasive layer is located on the cleaning layer.

In an embodiment of the new creation, the release layer or composite material, the adhesive layer, the base material, the cleaning layer and the grinding layer are stacked in sequence.

In one embodiment of the new creation, the opposite surfaces of the cleaning layer are in direct contact with the substrate and the abrasive layer, and during the process of cleaning the object with the decontamination sheet, the abrasive layer is the film layer on which the object contacts the decontamination sheet the first of .

In an embodiment of the present invention, the Mohs hardness of the cleaning layer is less than 7, or the Young's modulus of the cleaning layer is less than or equal to 100 kg/cm ² .

In an embodiment of the present invention, the material of the cleaning layer includes organic silicon resin with a cross-linked network structure and organic particles.

In an embodiment of the present invention, the Mohs hardness of the organic particles is less than 7.

In one embodiment of the present invention, the organic particles are not used as catalysts during the formation of the silicone resin having a cross-linked network structure.

In an embodiment of the present invention, the grinding layer is made of resin and inorganic particles.

In an embodiment of the present invention, the Mohs hardness of the inorganic particles is greater than or equal to 7.

In one embodiment of the novel creation, the Young's modulus of the abrasive layer is greater than the Young's modulus of the cleaning layer.

Based on the above, in the decontamination sheet created by the present invention, since the cleaning layer can be suitable for pasting and coating the substance on the probe, it can be suitable for cleaning the probe or removing stains on the probe, and can reduce the pressure of the probe. scratches.

In the drawings, the dimensions of some elements or layers are exaggerated or reduced for clarity. Moreover, for the sake of clarity, some film layers or components may be omitted in the illustrations.

Directional terms (eg, up, down, right, left, front, back, top, bottom) as used herein are used pictorially with reference only and are not intended to imply absolute orientation.

The numerical values expressed in the specification may include the stated numerical values and deviations within the range of deviations acceptable to those skilled in the art. The above-mentioned deviation value can be one or more standard deviations (Standard Deviation) in the manufacturing process or measurement process, or other factors such as the number of digits used, rounding, or error propagation (Error Propagation) in the calculation or conversion process resulting calculation error.

Fig. 1 is a schematic cross-sectional view of a decontamination sheet according to the first embodiment of the invention.

Referring to FIG. 1 , the decontamination sheet 100 may include a release layer 110 , an adhesive layer 120 , a substrate 130 , a cleaning layer 140 and an abrasive layer 150 . The release layer 110 is located under the adhesive layer 120 (below in FIG. 1 ). The adhesive layer 120 is located under the substrate 130 (at the bottom in FIG. 1 ). The cleaning layer 140 is located on the substrate 130 (above in FIG. 1 ). The abrasive layer 150 is located on the cleaning layer 140 (above in FIG. 1 ). That is to say, the adhesive layer 120 and the cleaning layer 140 are respectively located on two opposite sides of the base material 130 .

In this embodiment, the decontamination sheet 100 may include a release layer 110 , an adhesive layer 120 , a substrate 130 , a cleaning layer 140 and an abrasive layer 150 which are stacked. For example, the opposite two surfaces of the adhesive layer 120 can directly contact the release layer 110 and the substrate 130, the opposite two surfaces of the substrate 130 can directly contact the adhesive layer 120 and the cleaning layer 140, and the opposite two surfaces of the cleaning layer 140 The surface may directly contact the substrate 130 and the abrasive layer 150 .

In this embodiment, the release layer 110 may include a release film or release paper, but the present invention is not limited thereto. In an embodiment, the material of the release film used as the release layer 110 may include polyethylene terephthalate (PET). In one embodiment, the thickness of the release film may be 25 micrometers (µm) to 175 micrometers, but the present invention is not limited thereto. In one embodiment, the release force of the release film can be 2-200 gf/25mm, but the present invention is not limited thereto.

In this embodiment, the thickness of the adhesive layer 120 is greater than or equal to 10 microns and less than or equal to 50 microns. For example, the thickness of the adhesive layer 120 is substantially 25 microns.

If the thickness of the adhesive layer 120 is less than 10 microns, the adhesive force of the adhesive layer 120 may be reduced.

If the thickness of the adhesive layer 120 is greater than 50 microns, the thickness of the adhesive layer 120 may correspondingly increase the overall thickness of the decontamination sheet 100 , thereby increasing the material cost or affecting the functions of other film layers.

In this embodiment, the thickness of the substrate 130 is greater than or equal to 12 microns and less than or equal to 200 microns. For example, the thickness of the substrate 130 is substantially 100 microns to 125 microns.

If the thickness of the substrate (such as: the same or similar to the substrate 130, but different thickness) is less than 12 microns, the support is not good; and/or, the object to be cleaned (such as: FIG. 3C, FIG. 3F, FIG. 4A, or The probe 91) in Figure 4B may pierce substrates with a thickness less than 12 microns.

If the thickness of the substrate (such as: the same or similar to the substrate 130, but different in thickness) is greater than 200 microns, it may increase the overall thickness of the decontamination sheet including the substrate with a thickness greater than 200 microns, and the material cost Add or affect the function of other layers.

In this embodiment, the material of the substrate 130 may include polyethylene terephthalate (polyethylene terephthalate, PET), polyimide (polyimide, PI), polyether ether ketone (polyether ether ketone, PEEK) , polyethyleneimine (polyethyleneimine, PEI), polyamide (polyamide, PA), polyethersulfone (polyethersulfone, PES), polyethylene naphthalate (polyethylene naphthalate, PEN), a stack of the above or a combination of the above .

In this embodiment, the material of the abrasive layer 150 may include a plurality of inorganic particles 151 and a resin encapsulating them. In addition, for the sake of clarity, not all the inorganic particles are marked one by one in the corresponding drawings (eg, FIG. 1 or FIG. 2 ).

In this embodiment, the material of the resin of the abrasive layer 150 may include silicone, polyurethane (PU), poly(methyl methacrylate), PMMA; may be called: acrylic force), a stack of the above, or a combination of the above.

The aforementioned inorganic particles 151 may include spherical or polygonal alumina (aluminum oxide) particles, spherical or polygonal silicon carbide (silicon carbide) particles, spherical or polygonal diamond particles, spherical or polygonal quartz particles, spherical or polygonal oxide Zirconia (zirconia, ZrO ₂ ) particles, spherical or polygonal ceria (CeO ₂ ) particles or a combination of the above. The particle size of the aforementioned inorganic particles is about 0.02 μm to 50 μm, and the Mohs hardness of the aforementioned inorganic particles is greater than or equal to 7.

In one embodiment, the particles contained in the polishing layer 150 may not include organic particles.

In this embodiment, the thickness of the abrasive layer 150 is greater than or equal to 5 microns and less than or equal to 200 microns.

If the thickness of the abrasive layer (e.g., of the same or similar material as abrasive layer 150, but different thickness) is less than 5 microns, the cleaning ability of the probe cleaning pad (including the abrasive layer with a thickness of 5 microns) may be reduced; and And/or, if the abrasive layer (e.g., of the same or similar material as abrasive layer 150, but with a different thickness) is less than 5 microns thick, then attached to the object (e.g., as shown in FIGS. 3C, 3F, 4A, or 4B) Probe 91 as shown) (such as: solder used to form conductive terminals, or aluminum, zinc, copper, carbon, or eutectic materials that form connection pads) may be difficult to pass through the probe Cleaning pads are separated from each other.

If the abrasive layer (e.g., of the same or similar material as the abrasive layer 150, but with a different thickness) has a thickness greater than 200 micrometers, then the object (e.g., as shown in FIG. 3C, FIG. 3F, FIG. 4A, or FIG. 4B During the cleaning process of the probe 91 ), it may be easily scratched, broken and/or deformed.

In one embodiment, during cleaning of an object (such as the probe 91 shown in FIG. 3C , FIG. 3F , FIG. 4A or FIG. 4B ) by the probe cleaning pad 100 , the abrasive layer 150 is the probe The first film layer of the layers of the cleaning pad 100 that is in contact with the aforementioned objects.

In this embodiment, the material of the cleaning layer 140 may include a plurality of organic particles 141 and silicone resin encapsulating them. In addition, for the sake of clarity, not all organic particles are marked one by one in the corresponding drawings (eg, FIG. 1 or FIG. 2 ).

The aforementioned organic particles 141 include alkenyl groups, ether groups, amide groups, amine groups, carboxyl groups, ester groups, alcohol groups Spherical or polygonal particles formed by organic compounds of alcohol group, silyl group, alkoxy group, alkoxysilyl group, or a combination of the above. The particle size of the organic particles is about 0.05 microns to 30 microns.

The aforementioned silicone resin is, for example, an organic polymer formed of organosiloxane with a highly cross-linked network structure. The aforementioned organosiloxane may include polydimethylsiloxane, polymethylphenylsiloxane, methylpolysilxane or a combination thereof. The glass-transition temperature (Tg) of the aforementioned silicone resin is lower than room temperature, for example, the glass-transition temperature of the aforementioned silicone resin is about -60° C.˜-20° C. The weight average molecular weight of the above silicone resin is, for example, about 20,000 g/mol˜200,000 g/mol.

The cleaning layer 140 may be formed as follows. Chlorosilane (such as: methyltrichlorosilane (methyltrichlorosilane), dimethyldichlorosilane (dimethyldichlorosilane), phenyltrichlorosilane (phenyltrichlorosilane), diphenyldichlorosilane (diphenyldichlorosilane), methylphenyldichlorosilane Chlorine groups of methylphenyldichlorosilane (or a combination of the above) can be replaced by hydroxyl groups through reactions (such as hydrolysis) to generate corresponding acidic hydrolyzates (such as acidic hydrolyzate). The initial product of the hydrolysis reaction (eg, the acidic hydrolyzate described above) can be a mixture of cyclic, linear and crosslinked polymers containing hydroxyl groups. Then, the aforementioned acidic hydrolyzate can be basically washed with water to remove the acid, thereby producing a substantially neutral (eg, pH = 7±1) primary polycondensate (eg, primary polycondensate). The above polycondensate can be thermally oxidized in air and/or further condensed and polymerized under the action of a catalyst (which can be called dehydration polymerization), and then, a silicone resin with a highly cross-linked network structure can be formed by dehydration polymerization. Silicone resins with a highly cross-linked network can take the form of colloids, gels, or pastes. Then, predetermined organic particles 141 can be added into the silicone resin having a highly cross-linked network structure. With the accompanying stirring step during the mixing process, the organic particles 141 can be more uniformly distributed in the silicone resin with a highly cross-linked network structure. There is basically no chemical reaction between the organosilicon resin with a highly cross-linked network structure and the above-mentioned organic particles. That is, the above-mentioned organic particles 141 are not catalysts during the dehydration polymerization reaction or any reaction used to form the silicone resin. In other words, under the same or similar reaction conditions (eg, at the same or similar reaction temperature), the reaction rate constant for forming the silicone resin is basically the same whether or not the above-mentioned organic particles are added.

In this embodiment, the Mohs hardness of the cleaning layer 140 is less than 7. If the Mohs hardness of the cleaning layer (such as: having the same or similar thickness as the cleaning layer 140, but different in hardness) is greater than 7, it may cause the object to be cleaned (such as: in Fig. 3C, Fig. 3F, or Fig. 4A to Fig. 4D scratches on the probe 91).

In this embodiment, the Young's modulus of the cleaning layer 140 is less than or equal to 100 kg/cm ² . If the Young's modulus of the cleaning layer (such as: having the same or similar thickness as the cleaning layer 140, but different in tensile or compressive modulus of elasticity (modulus of elasticity in tension or compression)) is greater than 100 kg/cm ² , then in When the object to be cleaned (such as: FIG. 3C , FIG. 3F , or the probe 91 in FIG. 4A to FIG. 4D ) comes into contact with the decontamination sheet, the cleaning ability of the cleaning layer may be reduced.

In one embodiment, the Young's modulus of the cleaning layer 140 is greater than or equal to 30 kg/cm ² . If the Young's modulus of the cleaning layer (eg, having the same or similar thickness as the cleaning layer 140 but different tensile or compressive elastic modulus) is less than 30 kg/cm ² , the cleaning ability of the cleaning layer may be reduced.

In one embodiment, the Young's modulus of the cleaning layer 140 may be greater than or equal to 30 kg/cm ² and less than or equal to 100 kg/cm ² .

In one embodiment, the Young's modulus of the cleaning layer 140 may be less than or equal to 70 kg/cm ² . In one embodiment, the Young's modulus of the cleaning layer 140 may be greater than or equal to 30 kg/cm ² and less than or equal to 70 kg/cm ² .

In one embodiment, the Young's modulus of the cleaning layer 140 may be greater than or equal to 50 kg/cm ² . In one embodiment, the Young's modulus of the cleaning layer 140 may be greater than or equal to 50 kg/cm ² and less than or equal to 100 kg/cm ² .

In one embodiment, the Young's modulus of the cleaning layer 140 may be greater than or equal to 50 kg/cm ² and less than or equal to 70 kg/cm ² . When the object to be cleaned (such as: FIG. 3C , FIG. 3F , or the probe 91 in FIG. 4A to FIG. 4D ) is in contact with the decontamination sheet 100 , the cleaning ability and usage times of the cleaning layer 140 may be further improved.

In one embodiment, the Mohs hardness of the cleaning layer 140 may be less than 7, and the Young's modulus of the cleaning layer 140 may be less than or equal to 100 kg/cm ² ; or less than or equal to 70 kg/cm ² .

In an embodiment, the Mohs hardness of the cleaning layer 140 may be less than 7, and the Young's modulus of the cleaning layer 140 may be greater than or equal to 30 kg/cm ² ; or greater than or equal to 50 kg/cm ² .

In one embodiment, the Mohs hardness of the cleaning layer 140 is less than 7. And, the Young's modulus of the cleaning layer 140 may be greater than or equal to 30 kg/cm ² and less than or equal to 100 kg/cm ² .

In one embodiment, the Mohs hardness of the cleaning layer 140 is less than 7. And, the Young's modulus of the cleaning layer 140 may be greater than or equal to 30 kg/cm ² and less than or equal to 70 kg/cm ² .

In one embodiment, the Mohs hardness of the cleaning layer 140 is less than 7. And, the Young's modulus of the cleaning layer 140 may be greater than or equal to 50 kg/cm ² and less than or equal to 100 kg/cm ² .

In one embodiment, the Mohs hardness of the cleaning layer 140 is less than 7. And, the Young's modulus of the cleaning layer 140 may be greater than or equal to 70 kg/cm ² and less than or equal to 70 kg/cm ² . When the object to be cleaned (such as: the probe 91 in FIG. 3C, FIG. 3F, FIG. 4A, or FIG. 4B) is in contact with the decontamination sheet 100, the cleaning ability and the number of times of use of the cleaning layer 140 may be improved, and may Reduce the abrasion (such as: scratches) of the object to be cleaned (such as: FIG. 3C, FIG. 3F, or the probe 91 in FIG. 4A to FIG. 4D ).

In one embodiment, the organic particles may be suitable for sticking or connecting with metal materials (eg, solder) and/or metal oxide materials.

In one embodiment, the organic particles are more suitable for bonding or bonding with the silicone resin having a highly cross-linked network structure (eg, by Van der Waals bonding). For example, among the organic compounds forming the organic particles 141, the functional groups (such as: alkenyl, ether, amido, amine, carboxyl, ester, alcohol, silyl, alkoxy, Alkoxysilyl) can be suitable for bonding or interfacing with silicone resins with a highly cross-linked network structure.

In one embodiment, the organic particles 141 may include spherical or polygonal polymethyl methacrylate (PMMA) particles that have been surface-treated, polystyrene (polystyrene, polystyrene) particles that have been surface-treated spherical or polygonal PS) particles, spherical or polygonal polysiloxane particles that have been surface-treated, or a combination of the above. The above-mentioned treatment may include: by performing an appropriate reaction, the hydrogen on the surface of the polymer particle (such as: polymethyl methacrylate particle, polystyrene particle or polysiloxane particle) is replaced by a functional group (such as : Substituted by alkenyl, ether, amido, amine, carboxyl, ester, alcohol, silyl, alkoxy or alkoxysilyl).

In one embodiment, the Mohs hardness of the organic particles 141 is less than 7. If the Mohs hardness of the organic particles (such as: the same or similar size as the organic particles 141, but different hardness) is greater than 7, it may cause the object to be cleaned (such as: FIG. 3C, FIG. 3F, or FIG. scratches on the probe 91).

In an embodiment, the material of the cleaning layer 140 may not include inorganic materials.

In this embodiment, the thickness of the cleaning layer 140 is greater than or equal to 150 microns and less than or equal to 500 microns. If the thickness of the cleaning layer (eg, the same or similar material as the cleaning layer 140 but different thickness) is less than 150 μm, the cleaning ability of the decontamination sheet 100 may be reduced. If the thickness of the cleaning layer (eg, the same or similar material as the cleaning layer 140 , but different in thickness) is greater than 500 μm, it may increase its own peeling.

In one embodiment, the thickness of the cleaning layer 140 is greater than or equal to 230 microns and less than or equal to 300 microns. For example, in this embodiment, the thickness of the cleaning layer 140 may be substantially 265 microns.

In this embodiment, the decontamination sheet 100 can be used as a probe card clean pad, but the present invention is not limited thereto.

Fig. 2 is a schematic cross-sectional view of a decontamination sheet according to the second embodiment of the invention.

Referring to FIG. 2 , the decontamination sheet 200 may include a composite material 210 , an adhesive layer 220 , a substrate 230 , a cleaning layer 240 and an abrasive layer 250 . The adhesive layer 220 is located under the composite material 210 (below in FIG. 2 ). The substrate 230 is located under the adhesive layer 220 (at the bottom in FIG. 2 ). The cleaning layer 240 is located under the substrate 230 (below in FIG. 2 ). The abrasive layer 250 is located under the cleaning layer 240 (below in FIG. 2 ).

In this embodiment, the decontamination sheet 200 may include a laminated composite material 210 , an adhesive layer 220 , a substrate 230 , a cleaning layer 240 and an abrasive layer 250 . For example, the opposite two surfaces of the adhesive layer 220 can directly contact the composite material 210 and the substrate 230, the opposite two surfaces of the substrate 230 can directly contact the adhesive layer 220 and the cleaning layer 240, and the opposite two surfaces of the cleaning layer 240 The surface may directly contact substrate 230 and abrasive layer 250 .

In this embodiment, the composite material 210 may include a rigid plate-shaped body, but the present invention is not limited thereto. In one embodiment, the material of the rigid plate-shaped body as the composite material 210 may include a silicon substrate, a glass fiber board (such as: FR4 board), a hard plastic substrate (such as: acrylic board) or the above-mentioned composite board ( composite plate). In one embodiment, the thickness of the aforementioned composite plate may be 100 microns to 2000 microns, but the present invention is not limited thereto. For example, the aforementioned composite board has a thickness of substantially 750 microns.

In this embodiment, the material of the adhesive layer 220 of the decontamination sheet 200 may be the same or similar to the material of the adhesive layer 120 of the foregoing embodiments, and has the same or similar purpose or property, so details are not repeated here.

In this embodiment, the material of the substrate 230 of the decontamination sheet 200 may be the same or similar to the material of the substrate 130 of the foregoing embodiments, and has the same or similar purpose or property, so details are not repeated here.

In this embodiment, the material of the cleaning layer 240 of the decontamination sheet 200 may be the same or similar to that of the cleaning layer 140 of the previous embodiments, and has the same or similar purpose or property, so details are not repeated here.

In this embodiment, the material of the abrasive layer 250 of the decontamination sheet 200 may be the same or similar to the material of the abrasive layer 150 in the foregoing embodiments, and has the same or similar purpose or property, so details are not repeated here.

In this embodiment, the thickness of the cleaning layer 240 may be substantially 150 microns.

In this embodiment, the decontamination sheet 200 can be used as a test socket clean pad, but the present invention is not limited thereto.

In the present invention, the probe pin can be cleaned by using the decontamination sheet 100 , 200 of any one of the aforementioned embodiments. However, it should be noted that this new creation does not limit the application of the decontamination sheet 100, 200 of any of the aforementioned embodiments.

The cleaning method of the probe may include the following steps. Step 1: Test the electronic components with probes. Step 2: After the aforementioned step 1, use the decontamination sheet 100, 200 of any of the aforementioned embodiments to clean the probe.

Examples of cleaning methods for probes are as follows. Please refer to Fig. 3A to Fig. 4D, wherein Fig. 3A to Fig. 3F are schematic diagrams of a cleaning method of a probe according to an embodiment of the present invention, and Fig. 4A to Fig. 4D are a kind of cleaning method according to an embodiment of the present invention Schematic enlarged partial cross-section of the probe cleaning method.

Referring to FIG. 3A to FIG. 3C , the electronic component 70 can be electrically tested by the probe 91 in a commonly used testing method.

Taking FIG. 3A as an example, an electronic component 70 and a decontamination sheet 300 are provided.

In this embodiment, the electronic component 70 is, for example, a bare die or a chip package, but the present invention is not limited thereto.

In this embodiment, the decontamination sheet 300 may be the same or similar to the decontamination sheet 200 of the previous embodiment. That is to say, the material of the base material 330 of the decontamination sheet 300 may be the same or similar to the material of the base material 230 of the foregoing embodiment, and has the same or similar purpose or property, so details are not repeated here. Or; in this embodiment, the material of the cleaning layer 340 of the decontamination sheet 300 can be the same or similar to the material of the cleaning layer 240 of the previous embodiment, and have the same or similar purpose or property (such as: Mohs hardness) . In addition, for clarity, the organic particles (eg, the same as or similar to the organic particles 141 ) in the cleaning layer 340 are omitted, and the description is omitted. Or; the material of the abrasive layer 350 of the probe cleaning pad 300 may be the same or similar to that of the abrasive layer 150 in the foregoing embodiment, and have the same or similar purpose or property. In addition, for clarity, the illustration of the inorganic particles (eg, the same as or similar to the inorganic particles 151 ) in the polishing layer 350 is omitted, and the description is omitted. In addition, in the drawings, the adhesive layer (such as: the same or similar to the adhesive layer of the aforementioned adhesive layer 120 or 220) and the composite material (such as: the same or similar to the aforementioned composite material 210) of the decontamination sheet 300 are omitted. composite materials).

In an unillustrated embodiment, the decontamination sheet 300 may be the same or similar to the decontamination sheet 100 of the foregoing embodiment.

Then, as shown in FIG. 3B , the electronic component 70 to be tested can be picked up by a pick-up and place head 81 of a pick-up and place device 80 .

Then, as shown in FIG. 3C , the electronic component 70 to be tested can be placed on the testing device 90 by the pick-and-place device 80 .

The test device 90 has, for example, a plurality of probe pins 91 . The probes 91 can contact conductive terminals (such as solder balls) (not shown) or contact pads (not shown) on the tested surface 71 of the electronic component 70 to test the electronic component 70 . For example, pressure may be applied to the electronic component 70 to be tested and/or the probes 91 , so that the conductive terminals or contact pads on the tested surface 71 of the electronic component 70 to be tested are in contact with the probes 91 .

In one embodiment, during the contact process between the electronic component 70 and the probe 91, some substances on the electronic component 70 (such as: solder forming a conductive terminal or aluminum, zinc or copper material forming a contact pad) may Will adhere to the probe 91.

In this embodiment, the test method is, for example, final test (final test; FT), but the present invention is not limited thereto. In an embodiment, the testing method may be chip probing (CP).

After the aforementioned exemplary tests in FIGS. 3A to 3C , the probe 91 can be cleaned by the decontamination sheet 300 in a similar manner.

Taking FIG. 3C to FIG. 3D as an example, after the electronic component 70 is tested, the electronic component 70 can be separated from the probe 91 , and the electronic component 70 can be placed by the pick-and-place device 80 .

In one embodiment, during the process of separating the electronic component 70 from the probe 91, some substances on the electronic component 70 (such as: solder forming a conductive terminal or aluminum, zinc or copper material forming a contact pad) may Will be peeled off and attached to the probe 91.

Then, as shown in FIG. 3E , the decontamination sheet 300 can be picked up by the pick-and-place head 81 of the pick-and-place device 80 .

Then, as shown in FIG. 3F , the decontamination sheet 300 can be placed on the test device 90 by the pick-and-place device 80 , so that the probe 91 can be cleaned by the decontamination sheet 300 .

For example, pressure can be applied to the decontamination sheet 300 and/or the probe 91 so that the decontamination sheet 300 is in contact with the probe 91 so that the substance 99 (such as: solder, aluminum, etc.) material, zinc material, copper material or possible stains; marked or shown in FIGS. 4A to 4D ) are pasted by the cleaning layer 340 of the decontamination sheet 300 . Afterwards, the decontamination sheet 300 can be separated from the probe 91 , and the substance 99 adhering to the probe 91 can be reduced by the decontamination sheet 300 .

For details, please refer to FIG. 4A to FIG. 4D .

As shown in FIGS. 4A-4B , one end of the probe 91 used for testing (ie, the end used to contact the electronic component 70 ) may penetrate into the abrasive layer 350 of the probe cleaning pad 300 . The substance 99 attached to the probe 91 may be loosened from the probe 91 by the inorganic particles in the grinding layer 350 . For example, when the probe 91 penetrates the abrasive layer 350 , the substance 99 on the probe 91 may rub against the inorganic particles in the abrasive layer 350 .

As shown in FIGS. 4B to 4C , during the process of the probe 91 penetrating into the abrasive layer 350 , the end of the probe 91 can further penetrate into the cleaning layer 340 of the probe cleaning pad 300 .

As shown in Figure 4C, since the substance 99 attached to the probe 91 may have been loosened from the probe 91 during the process of the probe 91 penetrating into the abrasive layer 350, when the probe 91 penetrates into the cleaning layer 340 , the organic particles of the cleaning layer 340 can more easily remove the substance 99 from the probe 91 .

As shown in FIGS. 4C to 4D , during the separation of the probes 91 from the abrasive layer 350 , a large portion of the material 99 removed from the probes 91 may be embedded in the cross-linked network of silicone resin. middle. In addition, since the Young's modulus of the cleaning layer 340 is smaller than that of the abrasive layer 350, a large part of the substance 99 removed from the probe 91 may be retained and embedded in the silicone resin. In the cross-network structure. In this way, therefore, the possibility of the substance 99 re-attaching and re-adhering to the probe 91 can be reduced during the separation process described above. It should be noted that the Young's modulus of a certain layer mentioned above is determined by standardized measurement (such as: ASTM D882) and corresponding calculation of the entire layer (such as: the entire cleaning layer 340 may include silicone with a cross-linked network structure resin and organic particles, and/or the entire abrasive layer 350 may include resin and inorganic particles).

As shown in FIG. 4D , after the decontamination sheet 300 is separated from the probes 91 , the amount of the substance 99 attached to and/or coated on the probes 91 can be reduced.

In the manner or step of cleaning the probe 91 by using the decontamination sheet 100 , 200 , 300 of any of the aforementioned embodiments of the present invention, the probe 91 may not be disassembled or separated from the testing device 90 . Also, the probe 91 can be cleaned by the same or similar recipe as that used for testing the electronic component 70 . That is, the steps of the cleaning method for the probe 91 may be performed in-situ or on-line.

It should be noted that, in FIG. 3A to FIG. 4D , only one cleaning method of the probe 91 is introduced exemplarily, and the type of the probe 91 is not limited in the present invention. For example, in FIGS. 3A to 4D , the illustrated probe 91 is a vertical probe pin, but the present invention is not limited thereto. In an unillustrated embodiment, the decontamination sheet 100, 200, 300 of any of the aforementioned embodiments of the present invention can also be used for a cantilever probe pin by a similar general test method. ) for cleaning.

To sum up, in the new creation of the decontamination sheet and the cleaning method for cleaning the probe by the aforementioned decontamination sheet, since the cleaning layer can be suitable for sticking the substance on the probe, it can be suitable for the surface of the probe. Clean, and can reduce the scratches of the probe; and/or, the decontamination sheet created by the present invention can have more effective use times.

100, 200, 300: decontamination sheet 110: release layer 210: Composite materials 120, 220: Adhesive layer 130, 230, 330: Substrate 140, 240, 340: cleaning layer 141: Organic particles 150, 250, 350: grinding layer 151: Inorganic particles 80: pick and place device 81: pick and place head 70: Electronic components 71: Tested surface 90: Test device 91: Probe 99: Matter

Fig. 1 is a schematic cross-sectional view of a decontamination sheet according to the first embodiment of the invention. Fig. 2 is a schematic cross-sectional view of a decontamination sheet according to the second embodiment of the invention. 3A to 3F are schematic diagrams of a method for cleaning or decontaminating a probe according to an embodiment of the present invention. 4A to 4D are enlarged schematic diagrams of partial sections of a method for cleaning or decontaminating a probe according to an embodiment of the present invention.

100: decontamination sheet

110: release layer

120: Adhesive layer

130: Substrate

140: cleaning layer

141: Organic particles

150: grinding layer

151: Inorganic particles

Claims (10)

A stain removal tablet, comprising: Release layer or composite material; Adhesive layer, located on the release layer or composite material; a substrate located on the adhesive layer; a cleaning layer on the substrate; and The grinding layer is located on the cleaning layer. The decontamination sheet according to claim 1, wherein the release layer or composite material, the adhesive layer, the substrate, the cleaning layer and the grinding layer are stacked in sequence. The decontamination sheet according to claim 1, wherein the opposite surfaces of the cleaning layer are in direct contact with the substrate and the grinding layer, and during the cleaning process of the object by the decontamination sheet, the The abrasive layer is the first of the film layers of the article that contacts the stain release sheet. The decontamination sheet according to claim 1, wherein the Mohs hardness of the cleaning layer is less than 7, or the Young's modulus of the cleaning layer is less than or equal to 100 kg/cm ² . The decontamination sheet as described in claim 1, wherein the material of the cleaning layer comprises: Silicone resins with a cross-linked network structure; and organic particles. The decontamination sheet according to claim 5, wherein the Mohs hardness of the organic particles is less than 7. The decontamination sheet according to claim 5, wherein the organic particles are not used as catalysts in the formation process of the silicone resin having a cross-linked network structure. The decontamination sheet as claimed in item 1, wherein the material of the abrasive layer comprises: resin; and Inorganic particles. The decontamination sheet according to claim 8, wherein the Mohs hardness of the inorganic particles is greater than or equal to 7. The decontamination sheet according to claim 1, wherein the Young's modulus of the abrasive layer is greater than the Young's modulus of the cleaning layer.

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