TWI799955B - 半導體裝置及形成半導體裝置的方法 - Google Patents
半導體裝置及形成半導體裝置的方法 Download PDFInfo
- Publication number
- TWI799955B TWI799955B TW110130588A TW110130588A TWI799955B TW I799955 B TWI799955 B TW I799955B TW 110130588 A TW110130588 A TW 110130588A TW 110130588 A TW110130588 A TW 110130588A TW I799955 B TWI799955 B TW I799955B
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- TW
- Taiwan
- Prior art keywords
- forming
- same
- semiconductor device
- semiconductor
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/201—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
- H10D86/215—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI comprising FinFETs
-
- H10W40/226—
-
- H10W40/25—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/024—Manufacture or treatment of FETs having insulated gates [IGFET] of fin field-effect transistors [FinFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/62—Fin field-effect transistors [FinFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/201—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
-
- H10P72/74—
-
- H10W20/01—
-
- H10W40/259—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/62—Fin field-effect transistors [FinFET]
- H10D30/6219—Fin field-effect transistors [FinFET] characterised by the source or drain electrodes
-
- H10P72/7416—
-
- H10W40/254—
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202063067901P | 2020-08-20 | 2020-08-20 | |
| US63/067,901 | 2020-08-20 | ||
| US17/133,896 | 2020-12-24 | ||
| US17/133,896 US11587846B2 (en) | 2020-08-20 | 2020-12-24 | Semiconductor device and method of forming the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202226455A TW202226455A (zh) | 2022-07-01 |
| TWI799955B true TWI799955B (zh) | 2023-04-21 |
Family
ID=80269795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110130588A TWI799955B (zh) | 2020-08-20 | 2021-08-19 | 半導體裝置及形成半導體裝置的方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US11587846B2 (zh) |
| CN (1) | CN114078791A (zh) |
| TW (1) | TWI799955B (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11587846B2 (en) * | 2020-08-20 | 2023-02-21 | Mediatek Inc. | Semiconductor device and method of forming the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200836596A (en) * | 2006-12-13 | 2008-09-01 | Chien-Min Sung | Methods and devices for cooling printed circuit boards |
| US20150311138A1 (en) * | 2014-04-29 | 2015-10-29 | Qualcomm Incorporated | Transistors with improved thermal conductivity |
| TW201826482A (zh) * | 2016-08-10 | 2018-07-16 | 台灣積體電路製造股份有限公司 | 經封裝裝置 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6153536A (en) * | 1999-03-04 | 2000-11-28 | International Business Machines Corporation | Method for mounting wafer frame at back side grinding (BSG) tool |
| US7011134B2 (en) * | 2000-10-13 | 2006-03-14 | Chien-Min Sung | Casting method for producing surface acoustic wave devices |
| CN100559576C (zh) * | 2006-10-24 | 2009-11-11 | 株式会社电装 | 半导体器件 |
| US8617927B1 (en) * | 2011-11-29 | 2013-12-31 | Hrl Laboratories, Llc | Method of mounting electronic chips |
| US9685513B2 (en) * | 2012-10-24 | 2017-06-20 | The United States Of America, As Represented By The Secretary Of The Navy | Semiconductor structure or device integrated with diamond |
| US9029949B2 (en) * | 2013-09-25 | 2015-05-12 | International Business Machines Corporation | Semiconductor-on-insulator (SOI) structures with local heat dissipater(s) and methods |
| US9735043B2 (en) * | 2013-12-20 | 2017-08-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor packaging structure and process |
| CN106299071A (zh) * | 2016-05-09 | 2017-01-04 | 苏州能讯高能半导体有限公司 | 氮化镓芯片及其制备方法 |
| CN108878385B (zh) * | 2017-05-09 | 2021-07-02 | 中芯集成电路（宁波）有限公司 | 射频集成电路器件及其制造方法 |
| EP3926669B1 (en) * | 2020-05-29 | 2024-11-13 | Google LLC | Methods and heat distribution devices for thermal management of chip assemblies |
| US11721639B2 (en) * | 2020-06-29 | 2023-08-08 | Qualcomm Incorporated | Multi-component modules (MCMs) including configurable electro-magnetic isolation (EMI) shield structures, and related methods |
| US11587846B2 (en) * | 2020-08-20 | 2023-02-21 | Mediatek Inc. | Semiconductor device and method of forming the same |
-
2020
- 2020-12-24 US US17/133,896 patent/US11587846B2/en active Active
-
2021
- 2021-06-04 CN CN202110626177.2A patent/CN114078791A/zh active Pending
- 2021-08-19 TW TW110130588A patent/TWI799955B/zh active
-
2023
- 2023-01-17 US US18/155,322 patent/US12191226B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200836596A (en) * | 2006-12-13 | 2008-09-01 | Chien-Min Sung | Methods and devices for cooling printed circuit boards |
| US20150311138A1 (en) * | 2014-04-29 | 2015-10-29 | Qualcomm Incorporated | Transistors with improved thermal conductivity |
| TW201826482A (zh) * | 2016-08-10 | 2018-07-16 | 台灣積體電路製造股份有限公司 | 經封裝裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20230154824A1 (en) | 2023-05-18 |
| CN114078791A (zh) | 2022-02-22 |
| US11587846B2 (en) | 2023-02-21 |
| US20220059429A1 (en) | 2022-02-24 |
| TW202226455A (zh) | 2022-07-01 |
| US12191226B2 (en) | 2025-01-07 |
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