[go: up one dir, main page]

TWI800024B - 半導體裝置及其操作方法 - Google Patents

半導體裝置及其操作方法 Download PDF

Info

Publication number
TWI800024B
TWI800024B TW110137321A TW110137321A TWI800024B TW I800024 B TWI800024 B TW I800024B TW 110137321 A TW110137321 A TW 110137321A TW 110137321 A TW110137321 A TW 110137321A TW I800024 B TWI800024 B TW I800024B
Authority
TW
Taiwan
Prior art keywords
semiconductor device
operation method
semiconductor
Prior art date
Application number
TW110137321A
Other languages
English (en)
Other versions
TW202232738A (zh
Inventor
呂函庭
宋政霖
陳威臣
Original Assignee
旺宏電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 旺宏電子股份有限公司 filed Critical 旺宏電子股份有限公司
Publication of TW202232738A publication Critical patent/TW202232738A/zh
Application granted granted Critical
Publication of TWI800024B publication Critical patent/TWI800024B/zh

Links

TW110137321A 2021-02-05 2021-10-07 半導體裝置及其操作方法 TWI800024B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202163145989P 2021-02-05 2021-02-05
US63/145,989 2021-02-05

Publications (2)

Publication Number Publication Date
TW202232738A TW202232738A (zh) 2022-08-16
TWI800024B true TWI800024B (zh) 2023-04-21

Family

ID=83782512

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110137321A TWI800024B (zh) 2021-02-05 2021-10-07 半導體裝置及其操作方法

Country Status (1)

Country Link
TW (1) TWI800024B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240251550A1 (en) * 2023-01-19 2024-07-25 Winbond Electronics Corp. Three-dimensional flash memory device and method for forming the same
US20250220882A1 (en) * 2023-12-29 2025-07-03 Nanya Technology Corporation Semiconductor device including vertical transistor and method of manufacturing the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201939721A (zh) * 2018-03-14 2019-10-01 日商東芝記憶體股份有限公司 半導體裝置
US20200168623A1 (en) * 2018-11-28 2020-05-28 Sandisk Technologies Llc Three-dimensional memory device with locally modulated threshold voltages at drain select levels and methods of making the same
CN111211130A (zh) * 2020-01-16 2020-05-29 长江存储科技有限责任公司 3d存储器件及其制造方法
TW202101738A (zh) * 2019-06-27 2021-01-01 大陸商長江存儲科技有限責任公司 半導體元件及其製造方法
CN112185980A (zh) * 2020-09-09 2021-01-05 长江存储科技有限责任公司 一种三维存储器及其制作方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201939721A (zh) * 2018-03-14 2019-10-01 日商東芝記憶體股份有限公司 半導體裝置
US20200168623A1 (en) * 2018-11-28 2020-05-28 Sandisk Technologies Llc Three-dimensional memory device with locally modulated threshold voltages at drain select levels and methods of making the same
TW202101738A (zh) * 2019-06-27 2021-01-01 大陸商長江存儲科技有限責任公司 半導體元件及其製造方法
CN111211130A (zh) * 2020-01-16 2020-05-29 长江存储科技有限责任公司 3d存储器件及其制造方法
CN112185980A (zh) * 2020-09-09 2021-01-05 长江存储科技有限责任公司 一种三维存储器及其制作方法

Also Published As

Publication number Publication date
TW202232738A (zh) 2022-08-16

Similar Documents

Publication Publication Date Title
TWI799936B (zh) 半導體裝置及形成半導體裝置之方法
EP4102548A4 (en) SEMICONDUCTOR DEFECT ANALYSIS DEVICE AND SEMICONDUCTOR DEFECT ANALYSIS METHOD
TWI799777B (zh) 半導體裝置和其製造方法
TWI800821B (zh) 半導體元件及其製造方法
TWI799859B (zh) 半導體裝置及其形成方法
EP4098781A4 (en) SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT
EP4239624A4 (en) ELECTRONIC DEVICE AND METHOD FOR OPERATING ELECTRONIC DEVICE
EP3944340A4 (en) FIN-SHAPED SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD AND ITS USE
TWI800175B (zh) 半導體元件及其製造方法
TWI800024B (zh) 半導體裝置及其操作方法
TWI800879B (zh) 半導體元件及其製作方法
EP4383346A4 (en) SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR
EP4207289A4 (en) SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT
EP4155009A4 (en) AM DEVICE AND AM PROCESS
EP4033519A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
EP4113424A4 (en) DESIGN MODEL GENERATION APPARATUS AND DESIGN MODEL GENERATION METHOD
EP3979301A4 (en) Semiconductor device examination method and semiconductor device examination device
EP4160662A4 (en) SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
AU2022297769A1 (en) Semiconductor structure, semiconductor device, and method
EP4300730A4 (en) SEMICONDUCTOR COMPONENT MANUFACTURING METHOD, SEMICONDUCTOR COMPONENT AND SEMICONDUCTOR COMPONENT
EP4322182A4 (en) SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREFOR
TWI800797B (zh) 半導體裝置及其製造方法
EP4425547A4 (en) SEMICONDUCTOR COMPONENT, DEVICE AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT
TWI799775B (zh) 半導體元件及其製造方法
EP4390619A4 (en) ELECTRONIC DEVICE AND OPERATING METHOD THEREFOR