TWI679626B - Display device - Google Patents
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- TWI679626B TWI679626B TW108105694A TW108105694A TWI679626B TW I679626 B TWI679626 B TW I679626B TW 108105694 A TW108105694 A TW 108105694A TW 108105694 A TW108105694 A TW 108105694A TW I679626 B TWI679626 B TW I679626B
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- 239000003990 capacitor Substances 0.000 claims abstract description 187
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 238000002161 passivation Methods 0.000 claims abstract description 14
- 239000003989 dielectric material Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 16
- 239000011159 matrix material Substances 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 102
- 238000006243 chemical reaction Methods 0.000 description 11
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- 101100382379 Rattus norvegicus Cap1 gene Proteins 0.000 description 7
- 101100073352 Streptomyces halstedii sch1 gene Proteins 0.000 description 7
- 101100073357 Streptomyces halstedii sch2 gene Proteins 0.000 description 7
- 101100054666 Streptomyces halstedii sch3 gene Proteins 0.000 description 7
- 239000010409 thin film Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
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- 150000002739 metals Chemical class 0.000 description 4
- 238000000034 method Methods 0.000 description 4
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- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
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Landscapes
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal Display Device Control (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Electroluminescent Light Sources (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
一種顯示裝置,包括基板、第一資料線、掃描線、第一子畫素、鈍化層以及共用電極。第一子畫素包括第一主驅動元件、第一副驅動元件、第一電容電極以及第一畫素電極。第一主驅動元件包括第一主閘極、第一主通道層、第一主源極與第一主汲極。第一副驅動元件包括第一副閘極、第一副通道層、第一副源極與第一副汲極。第一電容電極電性連接第一主汲極以及第一副源極。第一畫素電極電性連接第一副汲極。共用電極與第一電容電極之間具有第一主電容。共用電極與第一畫素電極之間具有第一副電容。A display device includes a substrate, a first data line, a scan line, a first sub-pixel, a passivation layer, and a common electrode. The first sub-pixel includes a first main driving element, a first sub-driving element, a first capacitor electrode, and a first pixel electrode. The first main driving element includes a first main gate, a first main channel layer, a first main source, and a first main drain. The first auxiliary driving element includes a first auxiliary gate, a first auxiliary channel layer, a first auxiliary source, and a first auxiliary drain. The first capacitor electrode is electrically connected to the first main drain and the first secondary source. The first pixel electrode is electrically connected to the first secondary drain electrode. A first main capacitor is provided between the common electrode and the first capacitor electrode. A first auxiliary capacitor is provided between the common electrode and the first pixel electrode.
Description
本發明是有關於一種顯示裝置,且特別是有關於一種共用電極重疊於電容電極以及畫素電極的顯示裝置。 The present invention relates to a display device, and more particularly to a display device with a common electrode overlapping a capacitor electrode and a pixel electrode.
近年來,隨著顯示技術的不斷進步,觀賞者對於顯示裝置之解析度的要求也越來越高。為了提高顯示裝置之解析度,顯示裝置中各個子畫素的尺寸必須被縮小。然而,小尺寸的子畫素通常儲存電容也相對較小,容易有饋通(feed through)電壓大或串擾(Crosstalk)的問題產生,有時甚至會有漏電的情況產生。 In recent years, with the continuous advancement of display technology, viewers' requirements for the resolution of display devices have become higher and higher. In order to improve the resolution of the display device, the size of each sub-pixel in the display device must be reduced. However, small-sized sub-pixels usually have relatively small storage capacitors, which are prone to problems such as large feed-through voltage or crosstalk, and sometimes even leakage.
降低幀數(frame rate)能使顯示裝置的耗電量下降,藉此能增加顯示裝置的使用時間。然而,若顯示裝置中的儲存電容太小或顯示裝置漏電,則容易因為儲存電容維持電壓的能力不足而使幀數難以降低。因此,為了增加高解析度之顯示裝置的使用時間,目前亟需改善小尺寸的子畫素漏電的問題。 Reducing the frame rate can reduce the power consumption of the display device, thereby increasing the usage time of the display device. However, if the storage capacitor in the display device is too small or the display device leaks electricity, it is easy to reduce the number of frames due to insufficient storage capacitor capacity to maintain the voltage. Therefore, in order to increase the use time of a high-resolution display device, there is an urgent need to improve the problem of leakage of small-sized sub-pixels.
本發明提供一種顯示裝置,可以改善漏電的問題。 The invention provides a display device, which can improve the problem of leakage.
本發明的一實施方式提供一種顯示裝置,包括基板、第一資料線、掃描線、第一子畫素、鈍化層以及共用電極。第一資料線以及掃描線位於基板上。第一子畫素位於基板上。第一子畫素包括第一主驅動元件、第一副驅動元件、第一電容電極以及第一畫素電極。第一主驅動元件包括第一主閘極、第一主通道層、第一主源極與第一主汲極。第一主閘極電性連接掃描線。第一主通道層重疊於第一主閘極。第一主源極與第一主汲極電性連接第一主通道層。第一主源極電性連接第一資料線。第一副驅動元件包括第一副閘極、第一副通道層、第一副源極與第一副汲極。第一副閘極電性連接掃描線。第一副通道層重疊於第一副閘極。第一副源極與第一副汲極電性連接第一副通道層。第一主汲極電性連接第一副源極。第一電容電極電性連接第一主汲極以及第一副源極。第一畫素電極電性連接第一副汲極。鈍化層位於第一主源極、第一主汲極、第一副源極以及第一副汲極上。第一電容電極以及第一畫素電極位於鈍化層上。共用電極重疊於第一電容電極以及第一畫素電極。共用電極與第一電容電極之間具有第一主電容。共用電極與第一畫素電極之間具有第一副電容。第一電容電極、第一畫素電極以及共用電極的材料包括透明導電材料。 An embodiment of the present invention provides a display device including a substrate, a first data line, a scan line, a first sub-pixel, a passivation layer, and a common electrode. The first data line and the scan line are located on the substrate. The first sub-pixel is located on the substrate. The first sub-pixel includes a first main driving element, a first sub-driving element, a first capacitor electrode, and a first pixel electrode. The first main driving element includes a first main gate, a first main channel layer, a first main source, and a first main drain. The first main gate is electrically connected to the scan line. The first main channel layer overlaps the first main gate. The first main source and the first main drain are electrically connected to the first main channel layer. The first main source is electrically connected to the first data line. The first auxiliary driving element includes a first auxiliary gate, a first auxiliary channel layer, a first auxiliary source, and a first auxiliary drain. The first auxiliary gate is electrically connected to the scanning line. The first secondary channel layer overlaps the first secondary gate. The first secondary source and the first secondary drain are electrically connected to the first secondary channel layer. The first main drain is electrically connected to the first secondary source. The first capacitor electrode is electrically connected to the first main drain and the first secondary source. The first pixel electrode is electrically connected to the first secondary drain electrode. The passivation layer is located on the first main source, the first main drain, the first sub-source, and the first sub-drain. The first capacitor electrode and the first pixel electrode are located on the passivation layer. The common electrode overlaps the first capacitor electrode and the first pixel electrode. A first main capacitor is provided between the common electrode and the first capacitor electrode. A first auxiliary capacitor is provided between the common electrode and the first pixel electrode. The materials of the first capacitor electrode, the first pixel electrode, and the common electrode include a transparent conductive material.
基於上述,第一副驅動元件的第一副源極電性連接至第一電容電極,且第一副汲極電性連接至第一畫素電極,藉此共用電極與第一電容電極之間的第一主電容能減少第一副汲極與第一 副源極之間的電壓差而改善漏電的問題,使得即使停止對掃描線施加電壓(即關閉第一主驅動元件以及第一副驅動元件),第一畫素電極上的電壓能仍能維持一段時間。如此一來,能藉由調降顯示裝置的幀數來降低能量損耗。 Based on the above, the first sub-source of the first sub-driving element is electrically connected to the first capacitor electrode, and the first sub-drain is electrically connected to the first pixel electrode, whereby the common electrode and the first capacitor electrode The first main capacitor can reduce the first secondary drain and the first The voltage difference between the sub-sources improves the leakage problem, so that the voltage on the first pixel electrode can be maintained even if the voltage is not applied to the scan line (ie, the first main driving element and the first sub driving element are turned off). a period of time. In this way, the energy consumption can be reduced by reducing the number of frames of the display device.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施方式,並配合所附圖式作詳細說明如下。 In order to make the above features and advantages of the present invention more comprehensible, embodiments are hereinafter described in detail with reference to the accompanying drawings.
10、20、30、40‧‧‧顯示裝置 10, 20, 30, 40‧‧‧ display devices
AA‧‧‧顯示區 AA‧‧‧Display Area
BM‧‧‧黑矩陣 BM‧‧‧ Black Matrix
CE1‧‧‧第一電容電極 CE1‧‧‧first capacitor electrode
CE2‧‧‧第二電容電極 CE2‧‧‧Second capacitor electrode
CE3‧‧‧第三電容電極 CE3‧‧‧Third capacitor electrode
CF‧‧‧色彩轉換元件 CF‧‧‧ color conversion element
CM‧‧‧共用電極 CM‧‧‧Common electrode
DD‧‧‧源極驅動電路 DD‧‧‧Source driving circuit
DL‧‧‧資料線 DL‧‧‧Data Line
DL1‧‧‧第一資料線 DL1‧‧‧The first data line
DL2‧‧‧第二資料線 DL2‧‧‧Second Data Line
DL3‧‧‧第三資料線 DL3‧‧‧Third Data Line
I1‧‧‧第一介電材料層 I1‧‧‧first dielectric material layer
I2‧‧‧第二介電材料層 I2‧‧‧Second dielectric material layer
N‧‧‧方向 N‧‧‧ direction
M‧‧‧顯示介質層 M‧‧‧Display media layer
MCH1‧‧‧第一主通道層 MCH1‧‧‧The first main channel layer
MCH2‧‧‧第二主通道層 MCH2‧‧‧Second main channel layer
MCH3‧‧‧第三主通道層 MCH3‧‧‧ Third main channel layer
MD1‧‧‧第一主汲極 MD1‧‧‧First main drain
MD2‧‧‧第二主汲極 MD2‧‧‧Second main drain
MD3‧‧‧第三主汲極 MD3‧‧‧ third main drain
MG1‧‧‧第一主閘極 MG1‧‧‧First main gate
MG2‧‧‧第二主閘極 MG2‧‧‧Second main gate
MG3‧‧‧第三主閘極 MG3‧‧‧Third main gate
MS1‧‧‧第一主源極 MS1‧‧‧first main source
MS2‧‧‧第二主源極 MS2‧‧‧Second main source
MS3‧‧‧第三主源極 MS3‧‧‧ Third Primary Source
GD‧‧‧閘極驅動電路 GD‧‧‧Gate driving circuit
GI‧‧‧閘極絕緣層 GI‧‧‧Gate insulation
O‧‧‧開口 O‧‧‧ opening
PE1‧‧‧第一畫素電極 PE1‧‧‧first pixel electrode
PE2‧‧‧第二畫素電極 PE2‧‧‧second pixel electrode
PE3‧‧‧第三畫素電極 PE3‧‧‧third pixel electrode
PV‧‧‧鈍化層 PV‧‧‧ passivation layer
PX1‧‧‧第二子畫素 PX1‧‧‧Second Sub Pixel
PX2‧‧‧第一子畫素 PX2‧‧‧The first sub pixel
PX3‧‧‧第三子畫素 PX3‧‧‧ Third Sub Pixel
SB1‧‧‧基板 SB1‧‧‧ substrate
SB2‧‧‧對向基板 SB2‧‧‧ Opposite substrate
SCH1‧‧‧第一副通道層 SCH1‧‧‧The first secondary channel layer
SCH2‧‧‧第二副通道層 SCH2‧‧‧Secondary secondary channel layer
SCH3‧‧‧第三副通道層 SCH3‧‧‧ third sub-channel level
SD1‧‧‧第一副汲極 SD1‧‧‧ First Drain
SD2‧‧‧第二副汲極 SD2‧‧‧Second secondary drain
SD3‧‧‧第三副汲極 SD3‧‧‧ Third Drain
SG1‧‧‧第一副閘極 SG1‧‧‧First secondary gate
SG2‧‧‧第二副閘極 SG2‧‧‧Secondary secondary gate
SG3‧‧‧第三副閘極 SG3‧‧‧Third secondary gate
SL‧‧‧掃描線 SL‧‧‧scan line
SS1‧‧‧第一副源極 SS1‧‧‧First secondary source
SS2‧‧‧第二副源極 SS2‧‧‧Second secondary source
SS3‧‧‧第三副源極 SS3‧‧‧ Third Secondary Source
TH1‧‧‧第一通孔 TH1‧‧‧First through hole
TH2‧‧‧第二通孔 TH2‧‧‧Second through hole
TH3‧‧‧第三通孔 TH3‧‧‧Third through hole
TH4‧‧‧第四通孔 TH4‧‧‧Fourth through hole
TH5‧‧‧第五通孔 TH5‧‧‧Fifth through hole
TH6‧‧‧第六通孔 TH6‧‧‧Sixth through hole
U‧‧‧絕緣層 U‧‧‧ Insulation
圖1A是依照本發明的一實施方式的一種顯示裝置的上視示意圖。 FIG. 1A is a schematic top view of a display device according to an embodiment of the invention.
圖1B是沿著圖1A線aa’的剖面示意圖。 Fig. 1B is a schematic cross-sectional view taken along the line aa 'of Fig. 1A.
圖1C是沿著圖1A線bb’的剖面示意圖。 Fig. 1C is a schematic cross-sectional view taken along the line bb 'of Fig. 1A.
圖2是依照本發明的一實施方式的一種顯示裝置的上視示意圖。 FIG. 2 is a schematic top view of a display device according to an embodiment of the invention.
圖3A是依照本發明的一實施方式的一種顯示裝置的上視示意圖。 3A is a schematic top view of a display device according to an embodiment of the invention.
圖3B是沿著圖3A線aa’的剖面示意圖。 Fig. 3B is a schematic cross-sectional view taken along the line aa 'in Fig. 3A.
圖3C是沿著圖3A線bb’的剖面示意圖。 Fig. 3C is a schematic cross-sectional view taken along the line bb 'of Fig. 3A.
圖4是依照本發明的一實施方式的一種顯示裝置的上視示意圖。 FIG. 4 is a schematic top view of a display device according to an embodiment of the invention.
圖1A是依照本發明的一實施方式的一種顯示裝置的上視示意圖。圖1B是沿著圖1A線aa’的剖面示意圖。圖1C是沿著圖1A線bb’的剖面示意圖。為了方便說明,圖1A省略了顯示顯示裝置中的部分構件。 FIG. 1A is a schematic top view of a display device according to an embodiment of the invention. Fig. 1B is a schematic cross-sectional view taken along the line aa 'of Fig. 1A. Fig. 1C is a schematic cross-sectional view taken along the line bb 'of Fig. 1A. For convenience of explanation, FIG. 1A omits some components in the display device.
顯示裝置10包括基板SB1、第一資料線DL1、掃描線SL、第一主閘極MG1、第一副閘極SG1、第一主通道層MCH1、第一副通道層SCH1、閘極絕緣層GI、第一主源極MS1、第一主汲極MD1、第一副源極SS1、第一副汲極SD1、鈍化層PV、第一電容電極CE1、第一畫素電極PE1以及共用電極CM。在本實施方式中,顯示裝置10還包括第二資料線DL2、第三資料線DL3、第二主閘極MG2、第二副閘極SG2、第二主通道層MCH2、第二副通道層SCH2、第二主源極MS2、第二主汲極MD2、第二副源極SS2、第二副汲極SD2、第二電容電極CE2、第二畫素電極PE2、第三主閘極MG3、第三副閘極SG3、第三主通道層MCH3、第三副通道層SCH3、第三主源極MS3、第三主汲極MD3、第三副源極SS3、第三副汲極SD3、第三電容電極CE3、第三畫素電極PE3、絕緣層U、第一介電材料層I1、顯示介質層M、對向基板SB2、黑矩陣BM以及色彩轉換元件CF。 The display device 10 includes a substrate SB1, a first data line DL1, a scan line SL, a first main gate MG1, a first subgate SG1, a first main channel layer MCH1, a first subchannel layer SCH1, and a gate insulating layer GI A first main source MS1, a first main drain MD1, a first sub-source SS1, a first sub-drain SD1, a passivation layer PV, a first capacitor electrode CE1, a first pixel electrode PE1, and a common electrode CM. In this embodiment, the display device 10 further includes a second data line DL2, a third data line DL3, a second main gate MG2, a second sub-gate SG2, a second main channel layer MCH2, and a second sub-channel layer SCH2. , Second main source MS2, second main drain MD2, second secondary source SS2, second secondary drain SD2, second capacitor electrode CE2, second pixel electrode PE2, third main gate electrode MG3, first Three secondary gates SG3, third primary channel layer MCH3, third secondary channel layer SCH3, third primary source MS3, third primary drain MD3, third secondary source SS3, third secondary drain SD3, third The capacitor electrode CE3, the third pixel electrode PE3, the insulating layer U, the first dielectric material layer I1, the display medium layer M, the counter substrate SB2, the black matrix BM, and the color conversion element CF.
在本實施方式中,以顯示裝置10的其中三個子畫素為例進行說明,其中第一子畫素PX1、第二子畫素PX2以及第三子畫 素PX3位於基板SB1上。第一子畫素PX1包括第一主驅動元件MT1、第一副驅動元件ST1、第一電容電極CE1以及第一畫素電極PE1,第二子畫素PX2包括第二主驅動元件MT2、第二副驅動元件ST2、第二電容電極CE2以及第二畫素電極PE2,且第三子畫素PX3包括第三主驅動元件MT3、第三副驅動元件ST3、第三電容電極CE3以及第三畫素電極PE3。 In this embodiment, three sub-pixels of the display device 10 are used as an example for description, in which the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel The element PX3 is located on the substrate SB1. The first sub-pixel PX1 includes a first main driving element MT1, a first sub-driving element ST1, a first capacitor electrode CE1, and a first pixel electrode PE1, and the second sub-pixel PX2 includes a second main driving element MT2, a second The sub driving element ST2, the second capacitor electrode CE2, and the second pixel electrode PE2, and the third sub pixel PX3 includes a third main driving element MT3, a third sub driving element ST3, a third capacitor electrode CE3, and a third pixel Electrode PE3.
第一主閘極MG1、第一主通道層MCH1、第一主源極MS1以及第一主汲極MD1構成第一主驅動元件MT1。第一副閘極SG1、第一副通道層SCH1、第一副源極SS1以及第一副汲極SD1構成第一副驅動元件ST1。第二主閘極MG2、第二主通道層MCH2、第二主源極MS2以及第二主汲極MD2構成第二主驅動元件MT2。第二副閘極SG2、第二副通道層SCH2、第二副源極SS2以及第二副汲極SD2構成第二副驅動元件ST2。第三主閘極MG3、第三主通道層MCH3、第三主源極MS3以及第三主汲極MD3構成第三主驅動元件MT3。第三副閘極SG3、第三副通道層SCH3、第三副源極SS3以及第三副汲極SD3構成第三副驅動元件ST3。 The first main gate MG1, the first main channel layer MCH1, the first main source MS1, and the first main drain MD1 constitute a first main driving element MT1. The first sub-gate SG1, the first sub-channel layer SCH1, the first sub-source SS1, and the first sub-drain SD1 constitute a first sub-driving element ST1. The second main gate MG2, the second main channel layer MCH2, the second main source MS2, and the second main drain MD2 constitute a second main driving element MT2. The second sub-gate SG2, the second sub-channel layer SCH2, the second sub-source SS2, and the second sub-drain SD2 constitute a second sub-driving element ST2. The third main gate MG3, the third main channel layer MCH3, the third main source MS3, and the third main drain MD3 constitute a third main driving element MT3. The third sub-gate SG3, the third sub-channel layer SCH3, the third sub-source SS3, and the third sub-drain SD3 constitute a third sub-driving element ST3.
第一主驅動元件MT1、第一副驅動元件ST1、第二主驅動元件MT2、第二副驅動元件ST2、第三主驅動元件MT3、第三副驅動元件ST3、第一資料線DL1、第二資料線DL2、第三資料線DL3以及掃描線SL位於基板SB1上。 First main driving element MT1, first sub driving element ST1, second main driving element MT2, second sub driving element ST2, third main driving element MT3, third sub driving element ST3, first data line DL1, second The data line DL2, the third data line DL3, and the scan line SL are located on the substrate SB1.
第一主閘極MG1以及第一副閘極SG1電性連接掃描線SL。第一主通道層MCH1以及第一副通道層SCH1分別於垂直基板SB1的方向N上重疊於第一主閘極MG1以及第一副閘極SG1。閘極絕緣層GI位於第一主閘極MG1與第一主通道層MCH1之間以及第一副閘極SG1與第一副通道層SCH1之間。第一主源極MS1以及第一主汲極MD1電性連接第一主通道層MCH1。第一主源極MS1電性連接第一資料線DL1。第一副源極SS1以及第一副汲極SD1電性連接第一副通道層SCH1。第一主汲極MD1電性連接第一副源極SD1。在本實施方式中,第一主汲極MD1與第一副源極SD1實質上連成一體。 The first main gate MG1 and the first sub-gate SG1 are electrically connected to the scan line SL. The first main channel layer MCH1 and the first sub-channel layer SCH1 overlap the first main gate MG1 and the first sub-gate SG1 in the direction N of the vertical substrate SB1, respectively. The gate insulating layer GI is located between the first main gate MG1 and the first main channel layer MCH1 and between the first sub-gate SG1 and the first sub-channel layer SCH1. The first main source MS1 and the first main drain MD1 are electrically connected to the first main channel layer MCH1. The first main source MS1 is electrically connected to the first data line DL1. The first secondary source SS1 and the first secondary drain SD1 are electrically connected to the first secondary channel layer SCH1. The first main drain MD1 is electrically connected to the first sub-source SD1. In this embodiment, the first main drain MD1 and the first sub-source SD1 are substantially integrally integrated.
第二主閘極MG2以及第二副閘極SG2電性連接掃描線SL。第二主通道層MCH2以及第二副通道層SCH2分別於垂直基板SB1的方向N上重疊於第二主閘極MG2以及第二副閘極SG2。閘極絕緣層GI位於第二主閘極MG2與第二主通道層MCH2之間以及第二副閘極SG2與第二副通道層SCH2之間。第二主源極MS2以及第二主汲極MD2電性連接第二主通道層MCH2。第二主源極MS2電性連接第二資料線DL2。第二副源極SS2以及第二副汲極SD2電性連接第二副通道層SCH2。第二主汲極MD2電性連接第二副源極SD2。在本實施方式中,第二主汲極MD2與第二副源極SD2實質上連成一體。 The second main gate MG2 and the second sub-gate SG2 are electrically connected to the scan line SL. The second main channel layer MCH2 and the second sub-channel layer SCH2 overlap the second main gate MG2 and the second sub-gate SG2 in the direction N of the vertical substrate SB1, respectively. The gate insulating layer GI is located between the second main gate MG2 and the second main channel layer MCH2 and between the second sub-gate SG2 and the second sub-channel layer SCH2. The second main source MS2 and the second main drain MD2 are electrically connected to the second main channel layer MCH2. The second main source MS2 is electrically connected to the second data line DL2. The second secondary source SS2 and the second secondary drain SD2 are electrically connected to the second secondary channel layer SCH2. The second main drain MD2 is electrically connected to the second sub-source SD2. In this embodiment, the second main drain MD2 and the second sub-source SD2 are substantially integrally integrated.
第三主閘極MG3以及第三副閘極SG3電性連接掃描線 SL。第三主通道層MCH3以及第三副通道層SCH3分別於垂直基板SB1的方向N上重疊於第三主閘極MG3以及第三副閘極SG3。閘極絕緣層GI位於第三主閘極MG3與第三主通道層MCH3之間以及第三副閘極SG3與第三副通道層SCH3之間。第三主源極MS3以及第三主汲極MD3電性連接第三主通道層MCH3。第三主源極MS3電性連接第三資料線DL3。第三副源極SS3以及第三副汲極SD3電性連接第三副通道層SCH3。第三主汲極MD3電性連接第三副源極SD3。在本實施方式中,第三主汲極MD3與第三副源極SD3實質上連成一體。 The third main gate MG3 and the third sub-gate SG3 are electrically connected to the scanning line SL. The third main channel layer MCH3 and the third sub-channel layer SCH3 overlap the third main gate MG3 and the third sub-gate SG3 in the direction N of the vertical substrate SB1, respectively. The gate insulating layer GI is located between the third main gate MG3 and the third main channel layer MCH3, and between the third sub-gate SG3 and the third sub-channel layer SCH3. The third main source MS3 and the third main drain MD3 are electrically connected to the third main channel layer MCH3. The third main source MS3 is electrically connected to the third data line DL3. The third secondary source SS3 and the third secondary drain SD3 are electrically connected to the third secondary channel layer SCH3. The third main drain MD3 is electrically connected to the third sub-source SD3. In this embodiment, the third main drain MD3 and the third sub-source SD3 are substantially integrally integrated.
第一主通道層MCH1、第一副通道層SCH1、第二主通道層MCH2以及第二副通道層SCH2、第三主通道層MCH3以及第三副通道層SCH3各自為單層或多層結構,其材料例如包括非晶矽、多晶矽、微晶矽、單晶矽、有機半導體材料、氧化物半導體材料(例如:銦鋅氧化物、銦鎵鋅氧化物或其它合適的材料或上述之組合)或其它合適的材料或含有摻雜物(dopant)於上述材料中或上述之組合。 The first main channel layer MCH1, the first sub channel layer SCH1, the second main channel layer MCH2, the second sub channel layer SCH2, the third main channel layer MCH3, and the third sub channel layer SCH3 are each a single-layer or multi-layer structure, Materials include, for example, amorphous silicon, polycrystalline silicon, microcrystalline silicon, single crystal silicon, organic semiconductor materials, oxide semiconductor materials (such as indium zinc oxide, indium gallium zinc oxide, or other suitable materials or combinations thereof) or other Suitable materials may contain dopants in the above materials or a combination thereof.
第一資料線DL1、第二資料線DL2、第三資料線DL3、掃描線SL、第一主閘極MG1、第一副閘極SG1、第二主閘極MG2、第二副閘極SG2、第三主閘極MG1、第三副閘極SG3、第一主源極MS1、第一主汲極MD1、第一副源極SS1、第一副汲極SD1、第二主源極MS2、第二主汲極MD2、第二副源極SS2、第二副汲 極SD2、第三主源極MS3、第三主汲極MD3、第三副源極SS3以及第三副汲極SD3各自為單層或多層結構,其材料例如包括鉻、金、銀、銅、錫、鉛、鉿、鎢、鉬、釹、鈦、鉭、鋁、鋅等金屬、上述金屬的合金、上述金屬的氧化物、上述金屬的氮化物或上述材料之組合或其他導電材料。 First data line DL1, second data line DL2, third data line DL3, scan line SL, first main gate MG1, first sub-gate SG1, second main-gate MG2, second sub-gate SG2, Third main gate MG1, third sub-gate SG3, first main source MS1, first main drain MD1, first sub-source SS1, first sub-drain SD1, second main source MS2, first Two main drain MD2, second secondary source SS2, second secondary drain The electrode SD2, the third main source MS3, the third main drain MD3, the third sub-source SS3, and the third sub-drain SD3 each have a single-layer or multi-layer structure, and materials thereof include, for example, chromium, gold, silver, copper, Metals such as tin, lead, thorium, tungsten, molybdenum, neodymium, titanium, tantalum, aluminum, zinc, alloys of the metals, oxides of the metals, nitrides of the metals, combinations of the materials, or other conductive materials.
在本實施方式中,主驅動元件以及副驅動元件以底部閘極型薄膜電晶體為例,但本發明不以此為限。在其他實施方式中,主驅動元件以及副驅動元件為頂部閘極型薄膜電晶體、雙閘極型薄膜電晶體或其他類型的薄膜電晶體。在其他實施方式中,每個主驅動元件並不限定為單個薄膜電晶體,每個主驅動元件可以由兩個以上的薄膜電晶體串聯而成。類似地,每個副驅動元件並不限定為單個薄膜電晶體,每個副驅動元件可以由兩個以上的薄膜電晶體串聯而成。 In this embodiment, the main driving element and the auxiliary driving element are exemplified by a bottom gate thin film transistor, but the present invention is not limited thereto. In other embodiments, the main driving element and the auxiliary driving element are top-gate thin-film transistors, double-gate thin-film transistors, or other types of thin-film transistors. In other embodiments, each main driving element is not limited to a single thin film transistor, and each main driving element may be formed by connecting more than two thin film transistors in series. Similarly, each auxiliary driving element is not limited to a single thin film transistor, and each auxiliary driving element may be formed by connecting more than two thin film transistors in series.
鈍化層PV位於第一主源極MS1、第一主汲極MD1、第一副源極SS1、第一副汲極SD1、第二主源極MS2、第二主汲極MD2、第二副源極SS2、第二副汲極SD2、第三主源極MS3、第三主汲極MD3、第三副源極SS3以及第三副汲極SD3上。 The passivation layer PV is located at the first main source MS1, the first main drain MD1, the first sub-source SS1, the first sub-drain SD1, the second main source MS2, the second main drain MD2, and the second sub-source SS2, second secondary drain SD2, third main source MS3, third main drain MD3, third secondary source SS3, and third secondary drain SD3.
絕緣層U位於鈍化層PV上。絕緣層U例如為有機絕緣層,但本發明不以此為限。 The insulating layer U is located on the passivation layer PV. The insulating layer U is, for example, an organic insulating layer, but the invention is not limited thereto.
共用電極CM位於絕緣層U上。共用電極CM具有多個開口O,開口O對應第一主汲極MD1、第一副源極SS1、第一副 汲極SD1、第二主汲極MD2、第二副源極SS2、第二副汲極SD2、第三主汲極MD3、第三副源極SS3以及第三副汲極SD3的位置設置。 The common electrode CM is located on the insulating layer U. The common electrode CM has a plurality of openings O, and the openings O correspond to the first main drain MD1, the first sub-source SS1, and the first sub-source The positions of the drain SD1, the second main drain MD2, the second secondary source SS2, the second secondary drain SD2, the third main drain MD3, the third secondary source SS3, and the third secondary drain SD3 are set.
第一介電材料層I1位於共用電極CM上。第一電容電極CE1、第一畫素電極PE1、第二電容電極CE2、第二畫素電極PE2、第三電容電極CE3以及第三畫素電極PE3位於鈍化層PV上。在本實施方式中,第一電容電極CE1、第一畫素電極PE1、第二電容電極CE2、第二畫素電極PE2、第三電容電極CE3以及第三畫素電極PE3與鈍化層PV之間還夾有絕緣層U、第一介電材料層I1以及共用電極CM。在本實施方式中,第一電容電極CE1、第一畫素電極PE1、第二電容電極CE2、第二畫素電極PE2、第三電容電極CE3以及第三畫素電極PE3屬於同一膜層,也可以說是於同一道光罩製程中形成,藉此能減少製程偏移對光學性質的影響。在本實施方式中,第一電容電極CE1、第一畫素電極PE1、第二電容電極CE2、第二畫素電極PE2、第三電容電極CE3、第三畫素電極PE3以及共用電極CM的材料包括透明導電材料,舉例來說,銦錫氧化物、銦鋅氧化物或其他金屬氧化物或上述材料的組合。 The first dielectric material layer I1 is located on the common electrode CM. The first capacitor electrode CE1, the first pixel electrode PE1, the second capacitor electrode CE2, the second pixel electrode PE2, the third capacitor electrode CE3, and the third pixel electrode PE3 are located on the passivation layer PV. In this embodiment, between the first capacitor electrode CE1, the first pixel electrode PE1, the second capacitor electrode CE2, the second pixel electrode PE2, the third capacitor electrode CE3, and the third pixel electrode PE3 and the passivation layer PV An insulating layer U, a first dielectric material layer I1, and a common electrode CM are also sandwiched. In this embodiment, the first capacitor electrode CE1, the first pixel electrode PE1, the second capacitor electrode CE2, the second pixel electrode PE2, the third capacitor electrode CE3, and the third pixel electrode PE3 belong to the same film layer. It can be said that it is formed in the same mask process, thereby reducing the influence of process deviation on optical properties. In this embodiment, the materials of the first capacitor electrode CE1, the first pixel electrode PE1, the second capacitor electrode CE2, the second pixel electrode PE2, the third capacitor electrode CE3, the third pixel electrode PE3, and the common electrode CM Include transparent conductive materials, for example, indium tin oxide, indium zinc oxide, or other metal oxides or a combination of the foregoing materials.
在本實施方式中,第一畫素電極PE1、第二畫素電極PE2以及第三畫素電極PE3位於掃描線SL的其中一側,部分第一電容電極CE1、部分第二電容電極CE2以及部分第三電容電極CE3位 於掃描線SL的其中另外一側。 In this embodiment, the first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3 are located on one side of the scanning line SL, part of the first capacitor electrode CE1, part of the second capacitor electrode CE2, and part of Third capacitor electrode CE3 On the other side of the scan line SL.
第一電容電極CE1電性連接第一主汲極MD1以及第一副源極SS1。舉例來說,第一電容電極CE1透過第一通孔TH1電性連接第一主汲極MD1以及第一副源極SS1。第一畫素電極PE1電性連接第一副汲極SD1。舉例來說,第一畫素電極PE1透過第二通孔TH2電性連接第一副汲極SD1。 The first capacitor electrode CE1 is electrically connected to the first main drain MD1 and the first sub-source SS1. For example, the first capacitor electrode CE1 is electrically connected to the first main drain MD1 and the first sub-source SS1 through the first through hole TH1. The first pixel electrode PE1 is electrically connected to the first secondary drain electrode SD1. For example, the first pixel electrode PE1 is electrically connected to the first secondary drain electrode SD1 through the second through hole TH2.
第二電容電極CE2電性連接第二主汲極MD2以及第二副源極SS2。舉例來說,第二電容電極CE2透過第三通孔TH3電性連接第二主汲極MD2以及第二副源極SS2。第二畫素電極PE2電性連接第二副汲極SD2。舉例來說,第二畫素電極PE2透過第四通孔TH4電性連接第二副汲極SD2。 The second capacitor electrode CE2 is electrically connected to the second main drain MD2 and the second sub-source SS2. For example, the second capacitor electrode CE2 is electrically connected to the second main drain electrode MD2 and the second sub-source electrode SS2 through the third through hole TH3. The second pixel electrode PE2 is electrically connected to the second secondary drain electrode SD2. For example, the second pixel electrode PE2 is electrically connected to the second secondary drain electrode SD2 through the fourth through hole TH4.
第三電容電極CE3電性連接第三主汲極MD3以及第三副源極SS3。舉例來說,第三電容電極CE3透過第五通孔TH5電性連接第三主汲極MD3以及第三副源極SS3。第三畫素電極PE3電性連接第三副汲極SD3。舉例來說,第三畫素電極PE3透過第六通孔TH6電性連接第三副汲極SD3。 The third capacitor electrode CE3 is electrically connected to the third main drain MD3 and the third sub-source SS3. For example, the third capacitor electrode CE3 is electrically connected to the third main drain MD3 and the third sub-source SS3 through the fifth through hole TH5. The third pixel electrode PE3 is electrically connected to the third secondary drain electrode SD3. For example, the third pixel electrode PE3 is electrically connected to the third auxiliary drain electrode SD3 through the sixth through hole TH6.
在本實施方式中,第一通孔TH1、第二通孔TH2、第三通孔TH3、第四通孔TH4、第五通孔TH5以及第六通孔TH6貫穿鈍化層PV、絕緣層U以及第一介電材料層I1。第一通孔TH1、第二通孔TH2、第三通孔TH3、第四通孔TH4、第五通孔TH5以及第六通孔TH6對應共用電極CM的多個開口O設置。在本實施方 式中,第一通孔TH1與第二通孔TH2沿著掃描線SL延伸方向並列,第三通孔TH3與第四通孔TH4沿著掃描線SL延伸方向並列,且第五通孔TH5與第六通孔TH6沿著掃描線SL延伸方向並列,藉此減少前述通孔對開口率造成的影響。 In this embodiment, the first through hole TH1, the second through hole TH2, the third through hole TH3, the fourth through hole TH4, the fifth through hole TH5, and the sixth through hole TH6 penetrate the passivation layer PV, the insulating layer U, and First dielectric material layer I1. The first through hole TH1, the second through hole TH2, the third through hole TH3, the fourth through hole TH4, the fifth through hole TH5, and the sixth through hole TH6 are provided corresponding to the multiple openings O of the common electrode CM. In this implementation In the formula, the first through hole TH1 and the second through hole TH2 are juxtaposed along the extending direction of the scanning line SL, the third through hole TH3 and the fourth through hole TH4 are juxtaposed along the extending direction of the scanning line SL, and the fifth through hole TH5 and The sixth through hole TH6 is juxtaposed along the extending direction of the scanning line SL, thereby reducing the influence of the aforementioned through hole on the aperture ratio.
在本實施方式中,共用電極CM於垂直基板SB1的方向N上重疊於第一電容電極CE1、第一畫素電極PE1、第二電容電極CE2、第二畫素電極PE2、第三電容電極CE3以及第三畫素電極PE3。共用電極CM與第一電容電極CE1之間具有第一主電容,電容值為M1。共用電極CM與第一畫素電極PE1之間具有第一副電容,電容值為S1。共用電極CM與第二電容電極CE2之間具有第二主電容,電容值為M2。共用電極CM與第二畫素電極PE2之間具有第二副電容,電容值為S2。共用電極CM與第三電容電極CE3之間具有第三主電容,電容值為M3。共用電極CM與第三畫素電極PE3之間具有第三副電容,電容值為S3。在本實施方式中,S1=S2=S3。 In this embodiment, the common electrode CM overlaps the first capacitor electrode CE1, the first pixel electrode PE1, the second capacitor electrode CE2, the second pixel electrode PE2, and the third capacitor electrode CE3 in the direction N of the vertical substrate SB1. And a third pixel electrode PE3. There is a first main capacitor between the common electrode CM and the first capacitor electrode CE1, and the capacitance value is M1. There is a first sub-capacitance between the common electrode CM and the first pixel electrode PE1, and the capacitance value is S1. There is a second main capacitor between the common electrode CM and the second capacitor electrode CE2, and the capacitance value is M2. There is a second auxiliary capacitor between the common electrode CM and the second pixel electrode PE2, and the capacitance value is S2. There is a third main capacitor between the common electrode CM and the third capacitor electrode CE3, and the capacitance value is M3. There is a third auxiliary capacitor between the common electrode CM and the third pixel electrode PE3, and the capacitance value is S3. In this embodiment, S1 = S2 = S3.
藉由第一主電容、第二主電容以及第三主電容的設置,能增加畫素電極上之電壓的維持能力。舉例來說,共用電極CM與第一電容電極CE1之間的第一主電容能減少第一副汲極SD1與第一副源極SS1之間的電壓差而改善漏電問題,使得即使停止對掃描線SL施加電壓(即關閉第一主驅動元件MT1以及第一副驅動元件ST1),第一畫素電極PE1上的電壓能仍能維持一段時間。 因此,能藉由調降顯示裝置10的幀數來降低能量損耗。 By setting the first main capacitor, the second main capacitor, and the third main capacitor, the ability to maintain the voltage on the pixel electrode can be increased. For example, the first main capacitor between the common electrode CM and the first capacitor electrode CE1 can reduce the voltage difference between the first sub-drain SD1 and the first sub-source SS1 and improve the leakage problem, so that even if the scan is stopped, A voltage is applied to the line SL (that is, the first main driving element MT1 and the first sub driving element ST1 are turned off), and the voltage on the first pixel electrode PE1 can be maintained for a period of time. Therefore, the energy consumption can be reduced by reducing the number of frames of the display device 10.
在一些實施方式中,為了同時兼顧畫素的防漏電效果、充電效果以及光學性質,S1、M1、S2、M2、S3、M3滿足以下關係式:10%的S1<M1≦60%的S1,10%的S2<M2≦60%的S2,且10%的S3<M3≦60%的S3。 In some embodiments, in order to simultaneously take into account the pixel's anti-leakage effect, charging effect, and optical properties, S1, M1, S2, M2, S3, and M3 satisfy the following relationship: S1 of 10% <S1 of M1 ≦ 60% of S1, 10% of S2 <M2 ≦ 60% of S2, and 10% of S3 <M3 ≦ 60% of S3.
對向基板SB2面對基板SB1設置。黑矩陣BM以及色彩轉換元件CF位於基板SB1上。黑矩陣BM以及色彩轉換元件CF設置於對向基板SB2上。對向基板SB2與基板SB1之間夾有顯示介質層M。顯示介質層M中例如包括液晶分子。 The opposing substrate SB2 is provided facing the substrate SB1. The black matrix BM and the color conversion element CF are located on a substrate SB1. The black matrix BM and the color conversion element CF are provided on the counter substrate SB2. A display medium layer M is interposed between the opposing substrate SB2 and the substrate SB1. The display medium layer M includes, for example, liquid crystal molecules.
在本實施方式中,黑矩陣BM於垂直基板SB1的方向N上重疊於掃描線SL、第一電容電極CE1、第一資料線DL1、第一主驅動元件MT1、第一副驅動元件ST1、第二電容電極CE2、第二資料線DL2、第二主驅動元件MT2、第二副驅動元件ST2、第三電容電極CE3、第三資料線DL3、第三主驅動元件MT3以及第三副驅動元件ST3。 In this embodiment, the black matrix BM overlaps the scan line SL, the first capacitor electrode CE1, the first data line DL1, the first main driving element MT1, the first sub driving element ST1, the first Two capacitor electrodes CE2, second data line DL2, second main driving element MT2, second sub driving element ST2, third capacitor electrode CE3, third data line DL3, third main driving element MT3, and third sub driving element ST3 .
在本實施方式中,由於部分第一電容電極CE1、部分第二電容電極CE2以及部分第三電容電極CE3平行於掃描線SL,且第一電容電極CE1、第二電容電極CE2以及第三電容電極CE3鄰近掃描線SL設置,因此,黑矩陣BM的面積不需要很大就可以遮住第一電容電極CE1、第二電容電極CE2、第三電容電極CE3以及掃描線SL,藉此減少電容電極對畫素開口率造成的影響。在 本實施方式中,平行於掃描線SL的部分第一電容電極CE1、部分第二電容電極CE2以及部分第三電容電極CE3於垂直基板SB1的方向N上不重疊於掃描線SL,但本發明並不限於此。在其他實施方式中,平行於掃描線SL的部分第一電容電極CE1、部分第二電容電極CE2以及部分第三電容電極CE3於垂直基板SB1的方向N上可重疊於掃描線SL,藉此,能進一步減少電容電極對開口率造成影響。在本實施方式中,第一畫素電極PE1、第二畫素電極PE2以及第三畫素電極PE3位置對應於黑矩陣BM的開口。 In this embodiment, part of the first capacitor electrode CE1, part of the second capacitor electrode CE2, and part of the third capacitor electrode CE3 are parallel to the scan line SL, and the first capacitor electrode CE1, the second capacitor electrode CE2, and the third capacitor electrode CE3 is disposed adjacent to the scan line SL. Therefore, the area of the black matrix BM does not need to be large to cover the first capacitor electrode CE1, the second capacitor electrode CE2, the third capacitor electrode CE3, and the scan line SL, thereby reducing the pair of capacitor electrodes. The effect of pixel aperture ratio. in In this embodiment, part of the first capacitor electrode CE1, part of the second capacitor electrode CE2, and part of the third capacitor electrode CE3 parallel to the scan line SL do not overlap the scan line SL in the direction N of the vertical substrate SB1. Not limited to this. In other embodiments, part of the first capacitor electrode CE1, part of the second capacitor electrode CE2, and part of the third capacitor electrode CE3 parallel to the scan line SL may overlap the scan line SL in the direction N of the vertical substrate SB1, thereby, It can further reduce the influence of the capacitor electrode on the aperture ratio. In this embodiment, the positions of the first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3 correspond to the openings of the black matrix BM.
色彩轉換層CF例如包括多種不同的顏色,舉例來說,包括紅色色彩轉換層、綠色色彩轉換層以及藍色色彩轉換層。在本實施方式中,第一子畫素PX1、第二子畫素PX2以及第三子畫素PX3分別對應紅色色彩轉換層、綠色色彩轉換層以及藍色色彩轉換層。換句話說,第一子畫素PX1為紅色子畫素,第二子畫素PX2為綠色子畫素,且第三子畫素PX3為藍色子畫素。 The color conversion layer CF includes a plurality of different colors, for example, including a red color conversion layer, a green color conversion layer, and a blue color conversion layer. In this embodiment, the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 correspond to a red color conversion layer, a green color conversion layer, and a blue color conversion layer, respectively. In other words, the first sub-pixel PX1 is a red sub-pixel, the second sub-pixel PX2 is a green sub-pixel, and the third sub-pixel PX3 is a blue sub-pixel.
在本實施方式中,藉由調整第一主電容的電容值MM1、第二主電容的電容值M2以及第三主電容的電容值M3,使不同顏色之子畫素有較佳的光學性質。舉例來說,電容值M1不等於電容值M2與電容值M3,電容值M2不等於電容值M3。在本實施方式中,於第一主電容、第二主電容以及第三主電容中,兩電極(電容電極與共用電極)之間的介電層(第一介電材料層I1)材料皆相同,可以藉由調整第一電容電極CE1、第二電容電極CE2以及第三電 容電極CE3的面積,或於第一電容電極CE1、第二電容電極CE2以及第三電容電極CE3上設置不同尺寸的開口,以調整電容值M1、電容值M2以及電容值M3。舉例來說,電容值M1、電容值M2以及電容值M3的比等於第一電容電極CE1、第二電容電極CE2以及第三電容電極CE3的面積比,但本發明不以此為限。 In this embodiment, by adjusting the capacitance value MM1 of the first main capacitor, the capacitance value M2 of the second main capacitor, and the capacitance value M3 of the third main capacitor, the child pixels of different colors have better optical properties. For example, the capacitance value M1 is not equal to the capacitance value M2 and the capacitance value M3, and the capacitance value M2 is not equal to the capacitance value M3. In this embodiment, in the first main capacitor, the second main capacitor, and the third main capacitor, the materials of the dielectric layer (the first dielectric material layer I1) between the two electrodes (the capacitor electrode and the common electrode) are the same. , The first capacitor electrode CE1, the second capacitor electrode CE2, and the third capacitor can be adjusted by adjusting The area of the capacitor electrode CE3, or openings of different sizes are provided on the first capacitor electrode CE1, the second capacitor electrode CE2, and the third capacitor electrode CE3 to adjust the capacitance value M1, the capacitance value M2, and the capacitance value M3. For example, the ratio of the capacitance value M1, the capacitance value M2, and the capacitance value M3 is equal to the area ratio of the first capacitance electrode CE1, the second capacitance electrode CE2, and the third capacitance electrode CE3, but the invention is not limited thereto.
在一些實施方式中,由於第三子畫素PX3(藍色子畫素)的亮度較低,閃爍較不明顯,因此,藉由將第三主電容的電容值M3調整為小於第一主電容的電容值M1以及第二主電容的電容值M2,可以使第三子畫素PX3能有較好的充電率。舉例來說,S1、M1、S2、M2、S3、M3可滿足以下關係式:12%的S1<M1≦50%的S1,12%的S2<M2≦50%的S2,且10%的S3<M3<40%的S3。 In some embodiments, since the third sub-pixel PX3 (blue sub-pixel) has a lower brightness and less flicker, the capacitance value M3 of the third main capacitor is adjusted to be smaller than the first main capacitor. The capacitance value M1 and the capacitance value M2 of the second main capacitor can make the third sub-pixel PX3 have a better charging rate. For example, S1, M1, S2, M2, S3, and M3 can satisfy the following relations: S1 of 12% <M1 ≦ 50% of S1, 12% of S2 <M2 ≦ 50% of S2, and 10% of S3 <M3 <40% of S3.
在一些實施方式中,由於第二子畫素PX2(綠色子畫素)的亮度較高,閃爍較顯著,因此,藉由將第二主電容的電容值M2調整為大於第一主電容的電容值M1以及第三主電容的電容值M3,以改善第二子畫素PX2的閃爍問題。舉例來說,S1、M1、S2、M2、S3、M3可滿足以下關係式:10%的S1<M1≦50%的S1,12%的S2<M2≦60%的S2,且10%的S3<M3≦50%的S3。 In some implementations, since the second sub-pixel PX2 (green sub-pixel) has a higher brightness and more significant flicker, the capacitance value M2 of the second main capacitor is adjusted to be larger than the capacitance of the first main capacitor. The value M1 and the capacitance value M3 of the third main capacitor are used to improve the flicker problem of the second sub-pixel PX2. For example, S1, M1, S2, M2, S3, and M3 can satisfy the following relationships: 10% S1 <M1 ≦ 50% S1, 12% S2 <M2 ≦ 60% S2, and 10% S3 <M3 ≦ 50% of S3.
圖2是依照本發明的一實施方式的一種顯示裝置的上視示意圖。在此必須說明的是,圖2的實施方式沿用圖1A至圖1C 的實施方式的元件標號與部分內容,其中採用相同或近似的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施方式,在此不贅述。 FIG. 2 is a schematic top view of a display device according to an embodiment of the invention. It must be noted here that the embodiment of FIG. 2 follows FIGS. 1A to 1C. The component numbers and parts of the embodiments are the same, and the same or similar symbols are used to indicate the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, and details are not described herein.
圖2之顯示裝置20與圖1A之顯示裝置10的主要差異在於:顯示裝置20之第一電容電極CE1、第一畫素電極PE1、第二電容電極CE2、第二畫素電極PE2、第三電容電極CE3以及第三畫素電極PE3皆位於掃描線的同一側。 The main difference between the display device 20 in FIG. 2 and the display device 10 in FIG. 1A is that the display device 20 has a first capacitive electrode CE1, a first pixel electrode PE1, a second capacitive electrode CE2, a second pixel electrode PE2, and a third The capacitor electrode CE3 and the third pixel electrode PE3 are both located on the same side of the scan line.
在本實施方式中,第一主電容與第一副電容沿著掃描線SL的延伸方向並列,第二主電容與第二副電容沿著掃描線SL的延伸方向並列,第三主電容與第三副電容沿著掃描線SL的延伸方向並列。 In this embodiment, the first main capacitor and the first sub-capacitor are juxtaposed along the extension direction of the scan line SL, the second main capacitor and the second sub-capacitor are juxtaposed along the extension direction of the scan line SL, and the third main capacitor and the first The three pairs of capacitors are juxtaposed along the extending direction of the scanning line SL.
在顯示裝置20中,第一主電容的電容值M1、第一副電容的電容值S1、第二主電容的電容值M2、第二副電容的電容值S2、第三主電容的電容值M3以及第三副電容的電容值S3能夠調整的空間比顯示裝置10還要大。其餘部分請參考前述實施方式,在此不贅述。 In the display device 20, the capacitance value of the first main capacitor M1, the capacitance value of the first sub capacitor S1, the capacitance value of the second main capacitor M2, the capacitance value of the second sub capacitor S2, and the capacitance value of the third main capacitor M3 And the space in which the capacitance value S3 of the third auxiliary capacitor can be adjusted is larger than that of the display device 10. For the rest, please refer to the foregoing embodiments, and details are not described herein.
圖3A是依照本發明的一實施方式的一種顯示裝置的上視示意圖。圖3B是沿著圖3A線aa’的剖面示意圖。圖3C是沿著圖3A線bb’的剖面示意圖。在此必須說明的是,圖3A至圖3C的實施方式沿用圖1A至圖1C的實施方式的元件標號與部分內容,其中採用相同或近似的標號來表示相同或近似的元件,並且省略 了相同技術內容的說明。關於省略部分的說明可參考前述實施方式,在此不贅述。 3A is a schematic top view of a display device according to an embodiment of the invention. Fig. 3B is a schematic cross-sectional view taken along the line aa 'in Fig. 3A. Fig. 3C is a schematic cross-sectional view taken along the line bb 'of Fig. 3A. It must be noted here that the embodiment of FIGS. 3A to 3C follows the component numbers and parts of the embodiments of FIGS. 1A to 1C, and the same or similar reference numerals are used to indicate the same or similar components, and are omitted. A description of the same technical content. For the description of the omitted parts, reference may be made to the foregoing embodiments, and details are not described herein.
圖3A至圖3C之顯示裝置30與圖1A至圖1C之顯示裝置10的主要差異在於:顯示裝置30更包括第二介電材料層I2。 The main difference between the display device 30 of FIGS. 3A to 3C and the display device 10 of FIGS. 1A to 1C is that the display device 30 further includes a second dielectric material layer I2.
請參考圖3A至圖3C,第一電容電極CE1、第二電容電極CE2以及第三電容電極CE3位於絕緣層U上。第一介電材料層I1位於第一電容電極CE1、第二電容電極CE2以及第三電容電極CE3上。共用電極CM位於第一介電材料層I1上。第二介電材料層I2位於共用電極CM上。第一畫素電極PE1、第二畫素電極PE2以及第三畫素電極PE3位於第二介電材料層I2上。 Referring to FIGS. 3A to 3C, the first capacitor electrode CE1, the second capacitor electrode CE2, and the third capacitor electrode CE3 are located on the insulation layer U. The first dielectric material layer I1 is located on the first capacitor electrode CE1, the second capacitor electrode CE2, and the third capacitor electrode CE3. The common electrode CM is located on the first dielectric material layer I1. The second dielectric material layer I2 is located on the common electrode CM. The first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3 are located on the second dielectric material layer I2.
第一電容電極CE1、第二電容電極CE2以及第三電容電極CE3屬於同一膜層,也可以說是於同一道光罩製程中形成。在本實施方式中,第一畫素電極PE1、第二畫素電極PE2以及第三畫素電極PE3屬於另外一膜層,也可以說是於另一道光罩製程中形成。 The first capacitor electrode CE1, the second capacitor electrode CE2, and the third capacitor electrode CE3 belong to the same film layer, and it can be said that they are formed in the same mask process. In this embodiment, the first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3 belong to another film layer, which can also be said to be formed in another photomask process.
在本實施方式中,第一電容電極CE1於垂直基板SB1的方向N上重疊於共用電極CM以及第一畫素電極PE1,第二電容電極CE2於垂直基板SB1的方向N上重疊於共用電極CM以及第二畫素電極PE2,第三電容電極CE3於垂直基板SB1的方向N上重疊於共用電極CM以及第三畫素電極PE3。藉此,顯示裝置30具有高開口率的優點。在本實施方式中,第一電容電極CE1、第 二電容電極CE2以及第三電容電極CE3不容易影響第一畫素電極PE1、第二畫素電極PE2以及第三畫素電極PE3的設置空間。藉由增加第一電容電極CE1、第二電容電極CE2以及第三電容電極CE3的面積以提升第一主電容的電容值M1、第二主電容的電容值M2以及第三主電容的電容值M3,藉此改善顯示裝置30的漏電問題。 In this embodiment, the first capacitor electrode CE1 overlaps the common electrode CM and the first pixel electrode PE1 in the direction N of the vertical substrate SB1, and the second capacitor electrode CE2 overlaps the common electrode CM in the direction N of the vertical substrate SB1. And the second pixel electrode PE2 and the third capacitor electrode CE3 overlap the common electrode CM and the third pixel electrode PE3 in the direction N of the vertical substrate SB1. Thereby, the display device 30 has the advantage of a high aperture ratio. In this embodiment, the first capacitive electrode CE1, the first The two capacitor electrodes CE2 and the third capacitor electrode CE3 do not easily affect the installation space of the first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3. The capacitance of the first main capacitor M1, the capacitance of the second main capacitor M2, and the capacitance of the third main capacitor M3 are increased by increasing the area of the first capacitor electrode CE1, the second capacitor electrode CE2, and the third capacitor electrode CE3. Therefore, the leakage problem of the display device 30 is improved.
在本實施方式中,可以藉由調整第一介電材料層I1與第二介電材料層I2的材料及/或厚度來調整第一主電容的電容值M1、第一副電容的電容值S1、第二主電容的電容值M2、第二副電容的電容值S2、第三主電容的電容值M3以及第三副電容的電容值S3。第一介電材料層I1與第二介電材料層I2的材料及/或厚度彼此相同或不同。其餘部分請參考前述實施方式,在此不贅述。 In this embodiment, the capacitance value M1 of the first main capacitor and the capacitance value S1 of the first sub capacitor can be adjusted by adjusting the materials and / or thicknesses of the first dielectric material layer I1 and the second dielectric material layer I2. , The capacitance value M2 of the second main capacitor, the capacitance value S2 of the second auxiliary capacitor, the capacitance value M3 of the third main capacitor, and the capacitance value S3 of the third auxiliary capacitor. The materials and / or thicknesses of the first dielectric material layer I1 and the second dielectric material layer I2 are the same or different from each other. For the rest, please refer to the foregoing embodiments, and details are not described herein.
圖4是依照本發明的一實施方式的一種顯示裝置的上視示意圖。在此必須說明的是,圖4的實施方式沿用圖1A至圖1C的實施方式的元件標號與部分內容,其中採用相同或近似的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施方式,在此不贅述。 FIG. 4 is a schematic top view of a display device according to an embodiment of the invention. It must be noted here that the embodiment of FIG. 4 follows the component numbers and parts of the embodiments of FIG. 1A to FIG. 1C. The same or similar reference numerals are used to indicate the same or similar components, and the same technical content is omitted. Instructions. For the description of the omitted parts, reference may be made to the foregoing embodiments, and details are not described herein.
圖4之顯示裝置40與圖1A至圖1C之顯示裝置10的主要差異在於:顯示裝置40更包括閘極驅動電路GD以及源極驅動電路DD。 The main difference between the display device 40 of FIG. 4 and the display device 10 of FIGS. 1A to 1C is that the display device 40 further includes a gate driving circuit GD and a source driving circuit DD.
閘極驅動電路GD電性連接掃描線SL。源極驅動電路DD 電性連接資料線DL(例如圖1A的第一資料線DL1、第二資料線DL2以及第三資料線DL3)。 The gate driving circuit GD is electrically connected to the scan line SL. Source drive circuit DD The data lines DL are electrically connected (for example, the first data line DL1, the second data line DL2, and the third data line DL3 in FIG. 1A).
在本實施方式中,第一子畫素PX1相較於第二子畫素PX2更靠近閘極驅動電路GD。換句話說,第一子畫素PX1的第一主驅動元件以及第一副驅動元件相較於第二子畫素PX2的第二主驅動元件以及第二副驅動元件更靠近閘極驅動電路GD,掃描線SL上的控制訊號在抵達第一子畫素PX1時的損耗小於抵達第二子畫素PX2時的損耗。一般而言,在習知技術中,因設置位置相對於閘極驅動電路GD不同,第一子畫素PX1出現閃爍問題的嚴重程度不同於第二子畫素PX2出現閃爍問題的嚴重程度。舉例來說,第二子畫素PX2的閃爍問題可能小於第一子畫素PX1的閃爍問題。 In this embodiment, the first sub-pixel PX1 is closer to the gate driving circuit GD than the second sub-pixel PX2. In other words, the first main driving element and the first sub driving element of the first sub pixel PX1 are closer to the gate driving circuit GD than the second main driving element and the second sub driving element of the second sub pixel PX2. The loss of the control signal on the scanning line SL when it reaches the first sub-pixel PX1 is smaller than the loss when it reaches the second sub-pixel PX2. Generally speaking, in the conventional technology, since the setting position is different from the gate driving circuit GD, the severity of the flicker problem in the first sub-pixel PX1 is different from the severity of the flicker problem in the second sub-pixel PX2. For example, the flicker problem of the second sub-pixel PX2 may be smaller than the flicker problem of the first sub-pixel PX1.
在本實施方式中,即使第二子畫素PX2較靠近顯示區AA的中心,藉由使第一主電容的電容值M1大於第二主電容之電容值M2,藉此改善顯示裝置40畫面不同位置亮度不均的問題。 In this embodiment, even if the second sub-pixel PX2 is closer to the center of the display area AA, the capacitance value M1 of the first main capacitor is greater than the capacitance value M2 of the second main capacitor, thereby improving the screen difference of the display device 40. The problem of uneven position brightness.
雖然在本實施方式中,顯示裝置40是以閘極雙邊驅動為例,但本發明不以此為限。在其他實施方式中,顯示裝置也可以是閘極單邊驅動。 Although in the present embodiment, the display device 40 is based on the bipolar gate driving as an example, the invention is not limited thereto. In other embodiments, the display device may be driven by a unilateral gate.
綜上所述,在本發明的顯示裝置中,副驅動元件的副源極電性連接至電容電極,且副汲極電性連接至畫素電極,藉此共用電極與電容電極之間的主電容能減少副汲極與副源極之間的電 壓差而改善漏電問題,使得即使停止對掃描線施加電壓(即關閉主驅動元件以及副驅動元件),畫素電極上的電壓仍能維持一段時間。如此一來,能藉由調降顯示裝置的幀數來降低能量損耗。 In summary, in the display device of the present invention, the sub-source of the sub-driving element is electrically connected to the capacitor electrode, and the sub-drain is electrically connected to the pixel electrode, so that the main between the common electrode and the capacitor electrode is Capacitance can reduce the electricity between the secondary drain and secondary source The voltage difference improves the leakage problem, so that the voltage on the pixel electrode can be maintained for a period of time even if the voltage is not applied to the scan line (ie, the main driving element and the sub driving element are turned off). In this way, the energy consumption can be reduced by reducing the number of frames of the display device.
雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed as above in the embodiments, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some modifications and retouches without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the attached patent application.
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202032226A (en) * | 2020-01-14 | 2020-09-01 | 友達光電股份有限公司 | Structure of flexible circuits |
| TWI729907B (en) * | 2020-08-14 | 2021-06-01 | 凌巨科技股份有限公司 | Display and multiplexer for display |
| TWI753737B (en) * | 2020-08-27 | 2022-01-21 | 友達光電股份有限公司 | Sensing device substrate and display apparatus having the same |
| TWI809367B (en) * | 2021-03-31 | 2023-07-21 | 陳金柱 | Fastening device |
| CN115424595B (en) * | 2022-09-29 | 2024-03-08 | 上海中航光电子有限公司 | Chroma adjusting device and method |
| TWI860627B (en) * | 2023-02-15 | 2024-11-01 | 友達光電股份有限公司 | Thin film transistor and manufacturing method thereof |
| TWI831614B (en) * | 2023-02-16 | 2024-02-01 | 友達光電股份有限公司 | Display device |
| TWI879454B (en) | 2024-02-26 | 2025-04-01 | 友達光電股份有限公司 | Display driving device and display driving method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201339693A (en) * | 2012-03-30 | 2013-10-01 | Au Optronics Corp | Pixel array and display panel |
| US20160064421A1 (en) * | 2014-08-29 | 2016-03-03 | Lg Display Co., Ltd. | Thin film transistor substrate and display device using the same |
| TW201719257A (en) * | 2015-11-19 | 2017-06-01 | 友達光電股份有限公司 | Pixel element and pixel array |
| TW201830109A (en) * | 2017-02-10 | 2018-08-16 | 友達光電股份有限公司 | Pixel element, pixel array structure and display panel |
Family Cites Families (62)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5124769A (en) * | 1990-03-02 | 1992-06-23 | Nippon Telegraph And Telephone Corporation | Thin film transistor |
| JP3403027B2 (en) * | 1996-10-18 | 2003-05-06 | キヤノン株式会社 | Video horizontal circuit |
| US6617644B1 (en) * | 1998-11-09 | 2003-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
| GB9925060D0 (en) * | 1999-10-23 | 1999-12-22 | Koninkl Philips Electronics Nv | Active matrix electroluminescent display device |
| KR100713882B1 (en) * | 2000-12-01 | 2007-05-07 | 비오이 하이디스 테크놀로지 주식회사 | FFS Mode Thin Film Transistor Liquid Crystal Display |
| CN100410786C (en) * | 2001-10-03 | 2008-08-13 | 夏普株式会社 | Active matrix display device, and data line switching circuit, switching section drive circuit, and scanning line drive circuit thereof |
| KR100884993B1 (en) * | 2002-04-20 | 2009-02-20 | 엘지디스플레이 주식회사 | LCD and its driving method |
| US7460696B2 (en) * | 2004-06-01 | 2008-12-02 | Lumidigm, Inc. | Multispectral imaging biometrics |
| DE602004030236D1 (en) * | 2003-06-02 | 2011-01-05 | Qualcomm Inc | GENERATE AND IMPLEMENT A SIGNAL PROTOCOL AND INTERFACE FOR HIGHER DATA RATES |
| TWI243936B (en) * | 2003-12-11 | 2005-11-21 | Hannstar Display Corp | Structure of a display panel with compensating electrode |
| JP4168339B2 (en) * | 2003-12-26 | 2008-10-22 | カシオ計算機株式会社 | Display drive device, drive control method thereof, and display device |
| JP2006313776A (en) * | 2005-05-06 | 2006-11-16 | Seiko Epson Corp | Thin film semiconductor device, electronic device, and method of manufacturing thin film semiconductor device |
| JP4550696B2 (en) * | 2005-08-31 | 2010-09-22 | 株式会社東芝 | Liquid crystal display control apparatus and liquid crystal display control method |
| TWI328128B (en) * | 2006-03-17 | 2010-08-01 | Au Optronics Corp | Liquid crystal display |
| US8441424B2 (en) * | 2006-06-29 | 2013-05-14 | Lg Display Co., Ltd. | Liquid crystal display device and method of driving the same |
| TWI375198B (en) * | 2007-05-17 | 2012-10-21 | Tpo Displays Corp | A system for displaying images |
| US7830346B2 (en) * | 2007-07-12 | 2010-11-09 | Au Optronics Corporation | Liquid crystal display panel with color washout improvement by scanning line coupling and applications of same |
| TWI379280B (en) * | 2007-11-30 | 2012-12-11 | Au Optronics Corp | Liquid crystal display device and method for decaying residual image thereof |
| TWI389092B (en) * | 2008-03-26 | 2013-03-11 | Au Optronics Corp | A driving module and method for slowing down aging of driving module of display device |
| JP4844598B2 (en) * | 2008-07-14 | 2011-12-28 | ソニー株式会社 | Scan driver circuit |
| KR101491714B1 (en) * | 2008-09-16 | 2015-02-16 | 삼성전자주식회사 | Semiconductor devices and method of fabricating the same |
| CN101852953B (en) * | 2009-03-30 | 2013-05-22 | 北京京东方光电科技有限公司 | TFT-LCD array substrate, manufacturing method thereof, and liquid crystal display panel |
| TWI430223B (en) * | 2009-04-30 | 2014-03-11 | Chunghwa Picture Tubes Ltd | Frame rate adjuster and method thereof |
| TWI416231B (en) * | 2010-02-09 | 2013-11-21 | Century Display Shenzhen Co | Pixel array substrate |
| US9081237B2 (en) * | 2010-04-02 | 2015-07-14 | Samsung Display Co., Ltd. | Pixel electrode panel, a liquid crystal display panel assembly and methods for manufacturing the same |
| CN102269900B (en) * | 2010-06-03 | 2013-04-24 | 北京京东方光电科技有限公司 | Thin film transistor (TFT) array substrate and making method thereof |
| US8823624B2 (en) * | 2010-08-13 | 2014-09-02 | Au Optronics Corporation | Display device having memory in pixels |
| WO2012063830A1 (en) * | 2010-11-09 | 2012-05-18 | シャープ株式会社 | Liquid crystal display device, display device, and gate signal line drive method |
| CN102566156B (en) * | 2010-12-29 | 2014-12-24 | 京东方科技集团股份有限公司 | Array substrate of TFT-LCD (Thin Film Transistor-Liquid Crystal Display) and manufacturing method thereof |
| TWI440004B (en) * | 2011-03-04 | 2014-06-01 | Chunghwa Picture Tubes Ltd | Liquid crystal display device and method for driving the same |
| US9208714B2 (en) * | 2011-08-04 | 2015-12-08 | Innolux Corporation | Display panel for refreshing image data and operating method thereof |
| TWI460709B (en) * | 2012-07-03 | 2014-11-11 | Au Optronics Corp | Liquid crystal display and related alignment method |
| TWI486695B (en) * | 2012-07-05 | 2015-06-01 | Au Optronics Corp | Liquid crystal display panel and display driving method |
| TWI499828B (en) * | 2012-08-03 | 2015-09-11 | Au Optronics Corp | Display with sensing capability and operating method thereof |
| TWI467562B (en) * | 2012-10-17 | 2015-01-01 | Au Optronics Corp | Driving device and display device |
| TWI513003B (en) * | 2013-02-08 | 2015-12-11 | Innolux Corp | Liquid crystal display panel and liquid crystal display apparatus |
| CN103926765B (en) * | 2013-04-22 | 2017-02-08 | 上海中航光电子有限公司 | Pixel structure driven by bigrid scanning line and manufacturing method for pixel structure |
| KR20240033151A (en) * | 2013-09-13 | 2024-03-12 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Display device |
| TW201517010A (en) * | 2013-10-31 | 2015-05-01 | Pegatron Corp | Electronic device and screen control method thereof |
| US9240152B2 (en) * | 2013-12-25 | 2016-01-19 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Array substrate and liquid crystal display panel and driving method thereof |
| CN103943082B (en) * | 2014-03-25 | 2016-03-16 | 京东方科技集团股份有限公司 | A kind of display device and driving method thereof |
| TWI517123B (en) * | 2014-03-31 | 2016-01-11 | 友達光電股份有限公司 | Pixel circuit and method for adjusting pixel voltage of the pixel circuit |
| TWI526763B (en) * | 2014-05-13 | 2016-03-21 | 友達光電股份有限公司 | Pixel structure, pixel array, and display panel |
| US9952642B2 (en) * | 2014-09-29 | 2018-04-24 | Apple Inc. | Content dependent display variable refresh rate |
| CN104299523A (en) * | 2014-10-14 | 2015-01-21 | 京东方科技集团股份有限公司 | Pixel structure, display substrate and display device |
| TWI552129B (en) * | 2014-11-26 | 2016-10-01 | 群創光電股份有限公司 | Scan driver and display using the same |
| CN104503173B (en) * | 2014-12-24 | 2017-06-13 | 深圳市华星光电技术有限公司 | Display panel, display device and control method with touch controllable function |
| TWI529696B (en) * | 2014-12-25 | 2016-04-11 | 聯詠科技股份有限公司 | Display apparatus and method for controlling refresh frequency thereof |
| TW201624447A (en) * | 2014-12-30 | 2016-07-01 | 中華映管股份有限公司 | Display panel |
| CN107533828B (en) * | 2015-04-07 | 2020-05-05 | 夏普株式会社 | Active matrix display device and method of driving the same |
| US9678371B2 (en) * | 2015-06-01 | 2017-06-13 | Apple Inc. | Display with delay compensation to prevent block dimming |
| CN105390451B (en) * | 2015-12-03 | 2018-03-30 | 深圳市华星光电技术有限公司 | The preparation method of low temperature polycrystalline silicon TFT substrate |
| CN105469765B (en) * | 2016-01-04 | 2018-03-30 | 武汉华星光电技术有限公司 | Multiplexing display driver circuit |
| EP3254235B1 (en) * | 2016-01-31 | 2023-07-12 | Shenzhen Goodix Technology Co., Ltd. | Under-screen optical sensor module for on-screen fingerprint sensing |
| TWI609214B (en) * | 2017-01-06 | 2017-12-21 | 友達光電股份有限公司 | Pixel structure |
| CN106504722B (en) * | 2017-01-12 | 2019-10-01 | 京东方科技集团股份有限公司 | A kind of GOA subregion driving method and device, GOA unit |
| CN106875896B (en) * | 2017-04-28 | 2019-04-05 | 京东方科技集团股份有限公司 | A source driver IC, a display device and a driving method thereof |
| TWI609220B (en) * | 2017-05-09 | 2017-12-21 | 友達光電股份有限公司 | Pixel array |
| DE102017129795B4 (en) * | 2017-06-30 | 2024-08-08 | Lg Display Co., Ltd. | DISPLAY DEVICE AND GATE DRIVER CIRCUIT THEREOF, DRIVING METHOD AND VIRTUAL REALITY DEVICE |
| TWI632538B (en) * | 2017-09-05 | 2018-08-11 | 友達光電股份有限公司 | Displaying device and driving method |
| CN108037630A (en) * | 2017-11-22 | 2018-05-15 | 上海天马微电子有限公司 | Display panel and display device |
| CN108109593B (en) * | 2017-12-01 | 2020-11-03 | 昆山龙腾光电股份有限公司 | Gate drive circuit and display device |
-
2018
- 2018-11-30 TW TW107143146A patent/TWI695205B/en active
-
2019
- 2019-01-16 TW TW108101612A patent/TWI689770B/en active
- 2019-01-16 TW TW108101700A patent/TWI683304B/en active
- 2019-01-16 TW TW108101701A patent/TWI680450B/en active
- 2019-01-28 TW TW108103140A patent/TWI691950B/en active
- 2019-01-29 TW TW108103331A patent/TWI689908B/en active
- 2019-02-01 TW TW108104020A patent/TWI697881B/en active
- 2019-02-15 TW TW108105134A patent/TWI744600B/en active
- 2019-02-20 TW TW108105694A patent/TWI679626B/en active
- 2019-02-22 TW TW108106100A patent/TWI690755B/en active
- 2019-02-25 TW TW108106217A patent/TWI695360B/en active
- 2019-03-06 TW TW108107484A patent/TWI692015B/en active
- 2019-03-26 TW TW108110490A patent/TWI697882B/en active
- 2019-03-28 TW TW108111006A patent/TWI695214B/en active
- 2019-06-04 TW TW108119367A patent/TWI720502B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201339693A (en) * | 2012-03-30 | 2013-10-01 | Au Optronics Corp | Pixel array and display panel |
| US20160064421A1 (en) * | 2014-08-29 | 2016-03-03 | Lg Display Co., Ltd. | Thin film transistor substrate and display device using the same |
| TW201719257A (en) * | 2015-11-19 | 2017-06-01 | 友達光電股份有限公司 | Pixel element and pixel array |
| TW201830109A (en) * | 2017-02-10 | 2018-08-16 | 友達光電股份有限公司 | Pixel element, pixel array structure and display panel |
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| TWI680450B (en) | 2019-12-21 |
| TWI689770B (en) | 2020-04-01 |
| TW202009914A (en) | 2020-03-01 |
| TW202009994A (en) | 2020-03-01 |
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| TWI695360B (en) | 2020-06-01 |
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| TW202009899A (en) | 2020-03-01 |
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| TWI697882B (en) | 2020-07-01 |
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| TW202009916A (en) | 2020-03-01 |
| TW202009903A (en) | 2020-03-01 |
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