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TWI366072B - Photosensitive thermosetting resin composition, flattened and resist film coated printed wiring board and method of preparing the same - Google Patents

Photosensitive thermosetting resin composition, flattened and resist film coated printed wiring board and method of preparing the same

Info

Publication number
TWI366072B
TWI366072B TW096109202A TW96109202A TWI366072B TW I366072 B TWI366072 B TW I366072B TW 096109202 A TW096109202 A TW 096109202A TW 96109202 A TW96109202 A TW 96109202A TW I366072 B TWI366072 B TW I366072B
Authority
TW
Taiwan
Prior art keywords
flattened
preparing
resin composition
wiring board
printed wiring
Prior art date
Application number
TW096109202A
Other languages
English (en)
Other versions
TW200801817A (en
Inventor
Toshimitsu Kunou
Yasuhiro Kuroyanagi
Yukihiro Usui
Original Assignee
San Ei Kagaku Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by San Ei Kagaku Kabushiki Kaisha filed Critical San Ei Kagaku Kabushiki Kaisha
Publication of TW200801817A publication Critical patent/TW200801817A/zh
Application granted granted Critical
Publication of TWI366072B publication Critical patent/TWI366072B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • H10P14/6346—
    • H10P14/683—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW096109202A 2006-03-17 2007-03-16 Photosensitive thermosetting resin composition, flattened and resist film coated printed wiring board and method of preparing the same TWI366072B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006112677A JP4711208B2 (ja) 2006-03-17 2006-03-17 感光性熱硬化性樹脂組成物、並びにレジスト膜被覆平滑化プリント配線基板及びその製造法。

Publications (2)

Publication Number Publication Date
TW200801817A TW200801817A (en) 2008-01-01
TWI366072B true TWI366072B (en) 2012-06-11

Family

ID=38375044

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096109202A TWI366072B (en) 2006-03-17 2007-03-16 Photosensitive thermosetting resin composition, flattened and resist film coated printed wiring board and method of preparing the same

Country Status (5)

Country Link
JP (1) JP4711208B2 (zh)
KR (1) KR100894609B1 (zh)
CN (1) CN101037529B (zh)
DE (1) DE102006043357B4 (zh)
TW (1) TWI366072B (zh)

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US8042976B2 (en) 2007-11-30 2011-10-25 Taiyo Holdings Co., Ltd. White hardening resin composition, hardened material, printed-wiring board and reflection board for light emitting device
US8637593B2 (en) 2008-01-09 2014-01-28 Hitachi Chemical Company, Ltd. Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
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JP4657358B2 (ja) * 2008-12-12 2011-03-23 積水化学工業株式会社 感光性組成物及びソルダーレジスト組成物
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JP4897922B2 (ja) * 2009-09-10 2012-03-14 積水化学工業株式会社 ソルダーレジスト組成物及びプリント配線板
JP4855507B2 (ja) * 2009-09-18 2012-01-18 株式会社タムラ製作所 反射板機能を有するプリント配線板の製造方法
WO2011062053A1 (ja) * 2009-11-17 2011-05-26 株式会社タムラ製作所 難燃性ソルダーレジスト組成物及びそれを用いて得られるフレキシブル配線板
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JP5392724B2 (ja) * 2010-03-31 2014-01-22 京セラＳｌｃテクノロジー株式会社 配線基板の製造方法
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KR101708987B1 (ko) * 2010-03-31 2017-02-21 다이요 홀딩스 가부시키가이샤 솔더 레지스트 조성물 및 인쇄 배선판
KR101427445B1 (ko) * 2010-09-30 2014-08-11 코오롱인더스트리 주식회사 유기 절연막용 감광성 수지 조성물
CN102101935B (zh) * 2010-12-23 2012-06-27 广东生益科技股份有限公司 无卤环氧树脂组合物以及使用其制备的挠性覆铜板
CN102621811B (zh) * 2011-01-31 2017-03-01 新应材股份有限公司 一种应用于面板结构的可显影感光性树脂组成物
JP5640864B2 (ja) * 2011-03-31 2014-12-17 日本ゼオン株式会社 ネガ型感光性樹脂組成物および電子部品
KR20140029444A (ko) * 2011-06-01 2014-03-10 제온 코포레이션 수지 조성물 및 반도체 소자 기판
WO2013076972A1 (ja) * 2011-11-25 2013-05-30 住友ベークライト株式会社 プリプレグ、積層板、多層プリント配線板、および半導体装置
KR101895416B1 (ko) 2011-12-23 2018-09-06 엘지이노텍 주식회사 인쇄회로기판 및 그 제조방법
JP5663506B2 (ja) * 2012-02-06 2015-02-04 太陽ホールディングス株式会社 ソルダーレジスト組成物
JP5481536B2 (ja) * 2012-08-13 2014-04-23 太陽ホールディングス株式会社 熱硬化性ソルダーレジスト組成物、その硬化物からなるソルダーレジスト層及びプリント配線板
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KR102235156B1 (ko) * 2013-12-09 2021-04-05 롬엔드하스전자재료코리아유한회사 네거티브형 감광성 수지 조성물
JP6019065B2 (ja) * 2014-07-08 2016-11-02 太陽ホールディングス株式会社 ソルダーレジスト組成物およびプリント配線板
JP6438298B2 (ja) * 2014-12-25 2018-12-12 株式会社カネカ 新規感光性樹脂組成物とその応用
CN107407882B (zh) * 2015-02-26 2021-01-26 太阳控股株式会社 光固化性热固化性树脂组合物、其固化物和印刷电路板
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KR102625987B1 (ko) 2015-03-25 2024-01-18 다이요 홀딩스 가부시키가이샤 2액 혼합형의 제1, 제2 액 및 프린트 배선판의 제조 방법
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TWI677111B (zh) 2015-08-03 2019-11-11 日商創光科學股份有限公司 配線基板體及基台之製造方法
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WO2017217243A1 (ja) * 2016-06-16 2017-12-21 Dic株式会社 エポキシ（メタ）アクリレート樹脂及びレジスト部材
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Also Published As

Publication number Publication date
TW200801817A (en) 2008-01-01
DE102006043357B4 (de) 2011-04-21
JP2007249148A (ja) 2007-09-27
DE102006043357A1 (de) 2007-09-20
KR20070094456A (ko) 2007-09-20
JP4711208B2 (ja) 2011-06-29
CN101037529B (zh) 2011-05-25
KR100894609B1 (ko) 2009-04-24
CN101037529A (zh) 2007-09-19

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