KR20140117491A - 융합된 유리 장치 하우징 - Google Patents
융합된 유리 장치 하우징 Download PDFInfo
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- KR20140117491A KR20140117491A KR1020147021917A KR20147021917A KR20140117491A KR 20140117491 A KR20140117491 A KR 20140117491A KR 1020147021917 A KR1020147021917 A KR 1020147021917A KR 20147021917 A KR20147021917 A KR 20147021917A KR 20140117491 A KR20140117491 A KR 20140117491A
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- H—ELECTRICITY
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- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
- H05K5/0018—Casings, cabinets or drawers for electric apparatus with operator interface units having an electronic display
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
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- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/20—Uniting glass pieces by fusing without substantial reshaping
- C03B23/24—Making hollow glass sheets or bricks
- C03B23/245—Hollow glass sheets
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
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- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
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- H04—ELECTRIC COMMUNICATION TECHNIQUE
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- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0234—Feet; Stands; Pedestals, e.g. wheels for moving casing on floor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/10—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
- H04M1/0268—Details of the structure or mounting of specific components for a display module assembly including a flexible display panel
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
- H04M1/0268—Details of the structure or mounting of specific components for a display module assembly including a flexible display panel
- H04M1/0269—Details of the structure or mounting of specific components for a display module assembly including a flexible display panel mounted in a fixed curved configuration, e.g. display curved around the edges of the telephone housing
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Abstract
Description
도 2는 본 발명의 일 실시예에 따른, 태블릿 컴퓨터와 같은 예시적인 전자 장치의 사시도이다.
도 3은 본 발명의 일 실시예에 따른, 미디어 플레이어와 같은 예시적인 전자 장치의 사시도이다.
도 4는 본 발명의 일 실시예에 따른, 셀룰러 전화 또는 기타 핸드헬드 장치와 같은 예시적인 휴대용 전자 장치의 사시도이다.
도 5는 커버링 유리 구조들 내의 리세스(recess) 내에 수납되는 디스플레이 구조들로 형성되는 디스플레이를 갖는 본 발명의 일 실시예에 따른 예시적인 전자 장치의 측단면도이다.
도 6은 곡선의 후방 하우징에 설치된 두꺼운 주변 에지들 및 중앙 리세스를 갖는 유리 구조들을 구비하는 본 발명의 일 실시예에 따른 예시적인 전자 장치의 측단면도이다.
도 7은 짝을 이루는 후방 유리 하우징 구조들에 설치된 두꺼운 주변 에지들 및 중앙 리세스를 갖는 유리 구조들을 구비하는 본 발명의 일 실시예에 따른 예시적인 전자 장치의 측단면도이다.
도 8은 삽입 하우징 부재를 이용하여 짝을 이루는 후방 유리 하우징 구조들에 설치된 두꺼운 주변 에지들 및 중앙 리세스를 갖는 유리 구조들을 구비하는 본 발명의 일 실시예에 따른 예시적인 전자 장치의 측단면도이다.
도 9는 유리 전자 장치 하우징 구조들의 형성에 수반되는 본 발명의 일 실시예에 따른 장비 및 동작들을 나타낸다.
도 10은 본 발명의 일 실시예에 따른 유리 장치 하우징 구조의 예시적인 코너 부분의 사시도이다.
도 11은 평면 유리 하우징 부재에 유리의 리브들을 융합함으로써 구현된 지지 구조들을 갖는 본 발명의 일 실시예에 따른 예시적인 평면 유리 하우징 부재의 내부 사시도이다.
도 12는 평면 유리 하우징 부재 내의 스피커 포트 개구 및 버튼 개구를 둘러싸는 상승 융합된 유리 구조들을 갖는 본 발명의 일 실시예에 따른 예시적인 평면 유리 하우징 부재의 내부 사시도이다.
도 13은 어떻게 장치 내의 유리 하우징 구조들이 버튼용 개구를 둘러싸는 외면 상에 상승 융합된 유리 부분들을 구비할 수 있는지를 보여주는 본 발명의 일 실시예에 따른 예시적인 장치의 측단면도이다.
도 14는 평면 유리 부재의 에지 부분에 유색 주변 유리 부재를 융합함으로써 형성된 본 발명의 일 실시예에 따른 유리 구조들의 측단면도이다.
도 15는 평면 유리 부재의 에지 부분에 주변 유리 부재를 융합하고, 불투명한 마스킹 재료로 주변 유리 부재의 바닥 및 내면들을 커버함으로써 형성된 본 발명의 일 실시예에 따른 유리 구조들의 측단면도이다.
도 16은 평면 유리 부재의 에지 부분에 주변 유리 부재를 융합하고, 불투명한 마스킹 재료로 주변 유리 부재의 내면을 커버함으로써 형성된 본 발명의 일 실시예에 따른 유리 구조들의 측단면도이다.
도 17은 유색 평면 유리 부재의 에지 부분에 유색 주변 유리 부재를 융합함으로써 형성된 본 발명의 일 실시예에 따른 유리 구조들의 측단면도이다.
도 18은 평면 유리 부재의 에지 부분에 주변 유리 부재를 융합하고, 불투명한 마스킹 재료로 유리 구조들의 내면을 코팅함으로써 형성된 본 발명의 일 실시예에 따른 유리 구조들의 측단면도이다.
도 19는 본 발명의 일 실시예에 따라, 어떻게 유리 전자 장치 하우징 구조들이 둥근 에지 및 적층형의 플렉시블 디스플레이 구조를 구비할 수 있는지를 보여주는 도면이다.
도 20은 평면 유리 부재에 각진 에지를 갖는 주변 유리 부재를 융합함으로써 형성된 본 발명의 일 실시예에 따른 유리 구조들의 측단면도이다.
도 21은 평면 유리 부재에 곡선의 에지를 갖는 주변 유리 부재를 융합함으로써 형성된 본 발명의 일 실시예에 따른 유리 구조들의 측단면도이다.
도 22는 본 발명의 일 실시예에 따라, 어떻게 전자 장치 하우징용의 돌출된 유리 구조들이 융합된 단부 캡을 구비할 수 있는지를 보여주는 도면이다.
도 23은 본 발명의 일 실시예에 따라, 융합 유리 부재들의 5면 박스로 형성된 유리 하우징 구조들이 어떻게 내부 컴포넌트들을 구비할 수 있는지를 보여주는 도면이다.
도 24는 본 발명의 일 실시예에 따라, 내부 컴포넌트들이 융합된 유리 부재들의 5면 박스로 형성된 유리 하우징 구조들 내의 공동 내로 어떻게 슬라이딩될 수 있는지를 보여주는 도면이다.
도 25는 본 발명의 일 실시예에 따른, 내부 컴포넌트들 및 둥근 에지를 구비한 예시적인 5면 박스 유리 융합 유리 구조들의 측단면도이다.
도 26은 평면 유리 부재에 주변 유리 부재를 융합하여 형성되고, 광원을 이용하여 에지를 따라 조명되도록 구성된 본 발명의 일 실시예에 따른 유리 구조들의 측단면도이다.
도 27은 본 발명의 일 실시예에 따른, 유리 하우징 구조들을 형성하는 데 수반되는 예시적인 단계들의 흐름도이다.
Claims (23)
- 전자 장치로서,
디스플레이; 및
하우징
을 포함하고,
상기 하우징 내에는 상기 디스플레이가 설치되고, 상기 하우징은 상기 디스플레이의 적어도 일부를 수용하는 리세스(recess)를 갖는 유리 구조들을 포함하고, 상기 유리 하우징 구조들은 평면 유리 부재를 포함하고, 상기 평면 유리 부재는 상기 리세스를 형성하기 위해 상기 평면 유리 부재의 적어도 일부 주변 에지 부분들 주위에 연장하는 주변 유리 부재와 융합(fused)되는 전자 장치. - 제1항에 있어서,
상기 주변 유리 부재는 투명하지 않은(non-clear) 유리를 포함하는 전자 장치. - 제1항에 있어서,
상기 평면 유리 부재는 표면 법선(surface normal)에 의해 특성화되고, 상기 주변 유리 부재는 상기 표면 법선에 대해 0이 아닌 각도로 경사진 내부 에지를 갖는 전자 장치. - 제1항에 있어서,
상기 주변 유리 부재는 곡면(curved surface)을 갖는 내부 에지를 구비하는 전자 장치. - 제1항 내지 제4항 중 어느 한 항에 있어서,
상기 주변 유리 부재는 내부 에지를 구비하고, 상기 전자 장치는 상기 내부 에지의 적어도 일부를 코팅하는 불투명한 마스킹 재료를 더 포함하는 전자 장치. - 제1항에 있어서,
상기 평면 유리 부재 및 상기 주변 유리 부재는 상기 하우징을 위한 둥근 에지를 형성하는 곡선의 부분들을 갖는 전자 장치. - 제1항 내지 제4항 중 어느 한 항에 있어서,
상기 하우징은 상기 유리 구조들이 설치되는 하우징 구조를 포함하고, 상기 전자 장치는 상기 하우징 구조와 상기 유리 구조들 사이에 설치된 내부 전기 컴포넌트들을 더 포함하는 전자 장치. - 제7항에 있어서,
상기 하우징 구조는 금속 구조를 포함하는 전자 장치. - 제7항에 있어서,
상기 하우징 구조는 유리를 포함하는 전자 장치. - 제1항 내지 제4항 중 어느 한 항에 있어서,
상기 유리 구조들은 곡선의 내면을 갖고, 상기 디스플레이는 플렉시블 디스플레이를 포함하고, 상기 플렉시블 디스플레이는 상기 곡선의 내면에 부착되는 전자 장치. - 전자 장치로서,
갭에 의해 분리된 적어도 제1 및 제2 대향 평면 유리 부재들을 포함하는 융합된 유리 부재들로 형성된 전자 장치 하우징; 및
상기 갭 안에 삽입된 디스플레이 구조들
을 포함하는 전자 장치. - 제11항에 있어서,
상기 전자 장치 하우징은 상기 디스플레이 구조들을 볼 수 있는 투명한 부분을 포함하는 전자 장치. - 제12항에 있어서,
상기 갭에 의해 분리된 제3 및 제4 대향 평면 유리 부재들을 더 포함하는 전자 장치. - 제11항 내지 제13항 중 어느 한 항에 있어서,
상기 제1 평면 유리 부재 상에 융합된 유리 리브(rib) 지지 구조들을 더 포함하는 전자 장치. - 전자 장치로서,
개구를 갖는 적어도 하나의 유리 하우징 부재를 구비하고, 상기 개구를 둘러싸고 상기 유리 하우징 부재에 융합된 상승된 유리 구조들을 구비하는 유리 하우징 구조들
을 포함하는 전자 장치. - 제15항에 있어서,
상기 개구는 스피커 포트 개구를 포함하는 전자 장치. - 제15항에 있어서,
상기 개구는 버튼 개구를 포함하는 전자 장치. - 제15항에 있어서,
상기 상승된 유리 구조들을 조명하도록 구성된 광원을 더 포함하는 전자 장치. - 제15항 내지 제18항 중 어느 한 항에 있어서,
상기 유리 하우징 부재 아래에 설치된 디스플레이를 더 포함하는 전자 장치. - 전자 장치를 형성하는 방법으로서,
평면 유리 부재를 폴리싱하는 단계;
주변 유리 부재를 상기 평면 유리 부재의 에지 부분의 적어도 일부에 융합하여 상기 에지 부분에서 상기 평면 유리 부재를 두껍게 하는 단계; 및
상기 평면 유리 부재 및 융합된 주변 유리 부재를 하우징 구조에 부착하는 단계
를 포함하는 방법. - 제20항에 있어서,
상기 하우징 구조는 유리 하우징 구조, 플라스틱 하우징 구조 및 금속 하우징 구조로 구성되는 그룹으로부터 선택된 하우징 구조를 포함하고, 상기 평면 유리 부재 및 융합된 주변 유리 부재를 상기 하우징 구조에 부착하는 단계는 상기 전자 장치용 전자 컴포넌트들을 포함하는 내부를 갖는 하우징을 형성하는 단계를 포함하는 방법. - 제20항 또는 제21항에 있어서,
상기 평면 유리 부재 및 상기 융합된 주변 유리 부재를 화학적으로 강화하는 단계를 더 포함하는 방법. - 제22항에 있어서,
상기 평면 유리 부재 및 상기 융합된 주변 유리 부재를 화학적으로 강화하기 전에 상기 평면 유리 부재 상에 둥근 에지 표면을 형성하는 단계를 더 포함하는 방법.
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