JP1743011S - 研磨パッド - Google Patents
研磨パッドInfo
- Publication number
- JP1743011S JP1743011S JP2022014209F JP2022014209F JP1743011S JP 1743011 S JP1743011 S JP 1743011S JP 2022014209 F JP2022014209 F JP 2022014209F JP 2022014209 F JP2022014209 F JP 2022014209F JP 1743011 S JP1743011 S JP 1743011S
- Authority
- JP
- Japan
- Prior art keywords
- polishing pad
- article
- silicon wafers
- polishing silicon
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
本物品は、シリコンウエハ等の研磨に使用するものである。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022014209F JP1743011S (ja) | 2022-07-01 | 2022-07-01 | 研磨パッド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022014209F JP1743011S (ja) | 2022-07-01 | 2022-07-01 | 研磨パッド |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1743011S true JP1743011S (ja) | 2023-04-27 |
Family
ID=86055112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022014209F Active JP1743011S (ja) | 2022-07-01 | 2022-07-01 | 研磨パッド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP1743011S (ja) |
-
2022
- 2022-07-01 JP JP2022014209F patent/JP1743011S/ja active Active
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