JP1639752S - 基板保持リング - Google Patents
基板保持リングInfo
- Publication number
- JP1639752S JP1639752S JP2018020948F JP2018020948F JP1639752S JP 1639752 S JP1639752 S JP 1639752S JP 2018020948 F JP2018020948 F JP 2018020948F JP 2018020948 F JP2018020948 F JP 2018020948F JP 1639752 S JP1639752 S JP 1639752S
- Authority
- JP
- Japan
- Prior art keywords
- retaining ring
- substrate retaining
- substrate
- polishing
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title abstract 4
- 238000005498 polishing Methods 0.000 abstract 2
Abstract
本物品は、ウエハ等の基板の面を研磨するために用いる基板研磨装置に用いられる基板保持リングである。
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018020948F JP1639752S (ja) | 2018-09-26 | 2018-09-26 | 基板保持リング |
| TW108301320F TWD202849S (zh) | 2018-09-26 | 2019-03-08 | 基板保持環 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018020948F JP1639752S (ja) | 2018-09-26 | 2018-09-26 | 基板保持リング |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1639752S true JP1639752S (ja) | 2019-08-26 |
Family
ID=82750119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018020948F Active JP1639752S (ja) | 2018-09-26 | 2018-09-26 | 基板保持リング |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1639752S (ja) |
| TW (1) | TWD202849S (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1063595S1 (en) | 2023-03-30 | 2025-02-25 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
| USD1086087S1 (en) | 2023-03-30 | 2025-07-29 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
| USD1103131S1 (en) * | 2023-07-17 | 2025-11-25 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
| USD1103949S1 (en) * | 2023-07-17 | 2025-12-02 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1717341S (ja) | 2020-12-18 | 2022-06-14 | 基板保持リング |
-
2018
- 2018-09-26 JP JP2018020948F patent/JP1639752S/ja active Active
-
2019
- 2019-03-08 TW TW108301320F patent/TWD202849S/zh unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1063595S1 (en) | 2023-03-30 | 2025-02-25 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
| USD1086087S1 (en) | 2023-03-30 | 2025-07-29 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
| USD1103131S1 (en) * | 2023-07-17 | 2025-11-25 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
| USD1103949S1 (en) * | 2023-07-17 | 2025-12-02 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD202849S (zh) | 2020-02-21 |
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