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JP1743011S - polishing pad - Google Patents

polishing pad

Info

Publication number
JP1743011S
JP1743011S JP2022014209F JP2022014209F JP1743011S JP 1743011 S JP1743011 S JP 1743011S JP 2022014209 F JP2022014209 F JP 2022014209F JP 2022014209 F JP2022014209 F JP 2022014209F JP 1743011 S JP1743011 S JP 1743011S
Authority
JP
Japan
Prior art keywords
polishing pad
article
silicon wafers
polishing silicon
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022014209F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2022014209F priority Critical patent/JP1743011S/en
Application granted granted Critical
Publication of JP1743011S publication Critical patent/JP1743011S/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

本物品は、シリコンウエハ等の研磨に使用するものである。This article is used for polishing silicon wafers and the like.

JP2022014209F 2022-07-01 2022-07-01 polishing pad Active JP1743011S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022014209F JP1743011S (en) 2022-07-01 2022-07-01 polishing pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022014209F JP1743011S (en) 2022-07-01 2022-07-01 polishing pad

Publications (1)

Publication Number Publication Date
JP1743011S true JP1743011S (en) 2023-04-27

Family

ID=86055112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022014209F Active JP1743011S (en) 2022-07-01 2022-07-01 polishing pad

Country Status (1)

Country Link
JP (1) JP1743011S (en)

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