[go: up one dir, main page]

FI20040827A0 - Förfarande för tillverkning av en elektronikmodul - Google Patents

Förfarande för tillverkning av en elektronikmodul

Info

Publication number
FI20040827A0
FI20040827A0 FI20040827A FI20040827A FI20040827A0 FI 20040827 A0 FI20040827 A0 FI 20040827A0 FI 20040827 A FI20040827 A FI 20040827A FI 20040827 A FI20040827 A FI 20040827A FI 20040827 A0 FI20040827 A0 FI 20040827A0
Authority
FI
Finland
Prior art keywords
procedure
manufacturing
electronics module
electronics
module
Prior art date
Application number
FI20040827A
Other languages
English (en)
Finnish (fi)
Other versions
FI117814B (sv
FI20040827L (sv
Inventor
Antti Iihola
Timo Jokela
Petteri Palm
Risto Tuominen
Original Assignee
Imbera Electronics Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imbera Electronics Oy filed Critical Imbera Electronics Oy
Priority to FI20040827A priority Critical patent/FI117814B/sv
Publication of FI20040827A0 publication Critical patent/FI20040827A0/sv
Priority to PCT/FI2005/000274 priority patent/WO2005125298A2/en
Priority to KR1020067026627A priority patent/KR101034279B1/ko
Priority to CN2005800196162A priority patent/CN101010994B/zh
Priority to US11/570,673 priority patent/US8240032B2/en
Priority to DE112005001414T priority patent/DE112005001414T5/de
Priority to JP2007515973A priority patent/JP4796057B2/ja
Publication of FI20040827L publication Critical patent/FI20040827L/sv
Application granted granted Critical
Publication of FI117814B publication Critical patent/FI117814B/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H10W70/614—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H10W70/093—
    • H10W72/073—
    • H10W72/07307—
    • H10W72/07323—
    • H10W72/931—
    • H10W90/00—
    • H10W90/736—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Wire Bonding (AREA)
FI20040827A 2004-06-15 2004-06-15 Förfarande för tillverkning av en elektronikmodul FI117814B (sv)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FI20040827A FI117814B (sv) 2004-06-15 2004-06-15 Förfarande för tillverkning av en elektronikmodul
PCT/FI2005/000274 WO2005125298A2 (en) 2004-06-15 2005-06-13 Method for manufacturing an electronics module comprising a component electrically connected to a conductor- pattern layer
KR1020067026627A KR101034279B1 (ko) 2004-06-15 2005-06-13 도체 패턴층에 전기적으로 연결된 부품을 포함하는 전자모듈 제조방법
CN2005800196162A CN101010994B (zh) 2004-06-15 2005-06-13 制造电子模块的方法
US11/570,673 US8240032B2 (en) 2004-06-15 2005-06-13 Method for manufacturing an electronics module comprising a component electrically connected to a conductor-pattern layer
DE112005001414T DE112005001414T5 (de) 2004-06-15 2005-06-13 Verfahren zur Herstellung eines Elektronikmoduls
JP2007515973A JP4796057B2 (ja) 2004-06-15 2005-06-13 電子モジュールの製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20040827A FI117814B (sv) 2004-06-15 2004-06-15 Förfarande för tillverkning av en elektronikmodul
FI20040827 2004-06-15

Publications (3)

Publication Number Publication Date
FI20040827A0 true FI20040827A0 (sv) 2004-06-15
FI20040827L FI20040827L (sv) 2005-12-16
FI117814B FI117814B (sv) 2007-02-28

Family

ID=32524502

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20040827A FI117814B (sv) 2004-06-15 2004-06-15 Förfarande för tillverkning av en elektronikmodul

Country Status (7)

Country Link
US (1) US8240032B2 (sv)
JP (1) JP4796057B2 (sv)
KR (1) KR101034279B1 (sv)
CN (1) CN101010994B (sv)
DE (1) DE112005001414T5 (sv)
FI (1) FI117814B (sv)
WO (1) WO2005125298A2 (sv)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100736635B1 (ko) 2006-02-09 2007-07-06 삼성전기주식회사 베어칩 내장형 인쇄회로기판 및 그 제조 방법
FI20060256A7 (sv) 2006-03-17 2006-03-20 Imbera Electronics Oy Tillverkning av ett kretskort och ett kretskort innehållande en komponent
DE102007010731A1 (de) * 2007-02-26 2008-08-28 Würth Elektronik GmbH & Co. KG Verfahren zum Einbetten von Chips und Leiterplatte
DE102008009220A1 (de) * 2008-02-06 2009-08-13 Robert Bosch Gmbh Verfahren zum Herstellen einer Leiterplatte
US8225503B2 (en) * 2008-02-11 2012-07-24 Ibiden Co., Ltd. Method for manufacturing board with built-in electronic elements
US8264085B2 (en) 2008-05-05 2012-09-11 Infineon Technologies Ag Semiconductor device package interconnections
KR101013994B1 (ko) * 2008-10-15 2011-02-14 삼성전기주식회사 전자 소자 내장 인쇄회로기판 및 그 제조 방법
AT12316U1 (de) 2008-10-30 2012-03-15 Austria Tech & System Tech Verfahren zur integration eines elektronischen bauteils in eine leiterplatte
KR101047484B1 (ko) * 2008-11-07 2011-07-08 삼성전기주식회사 전자 소자 내장 인쇄회로기판 및 그 제조 방법
US8124449B2 (en) 2008-12-02 2012-02-28 Infineon Technologies Ag Device including a semiconductor chip and metal foils
FI122216B (sv) 2009-01-05 2011-10-14 Imbera Electronics Oy Rigid-flex modul
FI20095110A0 (sv) 2009-02-06 2009-02-06 Imbera Electronics Oy Elektronisk modul med EMI-skydd
DE102009058764A1 (de) * 2009-12-15 2011-06-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung einer elektronischen Baugruppe und elektronische Baugruppe
US8735735B2 (en) 2010-07-23 2014-05-27 Ge Embedded Electronics Oy Electronic module with embedded jumper conductor
TWI446495B (zh) * 2011-01-19 2014-07-21 旭德科技股份有限公司 封裝載板及其製作方法
AT13055U1 (de) * 2011-01-26 2013-05-15 Austria Tech & System Tech Verfahren zur integration eines elektronischen bauteils in eine leiterplatte oder ein leiterplatten-zwischenprodukt sowie leiterplatte oder leiterplatten-zwischenprodukt
DE102011089927A1 (de) * 2011-12-27 2013-06-27 Robert Bosch Gmbh Kontaktsystem mit einem Verbindungsmittel und Verfahren
JP2013211519A (ja) * 2012-02-29 2013-10-10 Ngk Spark Plug Co Ltd 多層配線基板の製造方法
JP6033872B2 (ja) * 2012-09-11 2016-11-30 株式会社メイコー 部品内蔵基板の製造方法
WO2014041627A1 (ja) * 2012-09-12 2014-03-20 株式会社メイコー 部品内蔵基板の製造方法
KR101420526B1 (ko) * 2012-11-29 2014-07-17 삼성전기주식회사 전자부품 내장기판 및 그 제조방법
WO2014097641A1 (ja) 2012-12-21 2014-06-26 パナソニック株式会社 電子部品パッケージおよびその製造方法
US9825209B2 (en) 2012-12-21 2017-11-21 Panasonic Intellectual Property Management Co., Ltd. Electronic component package and method for manufacturing the same
JP5624696B1 (ja) 2012-12-21 2014-11-12 パナソニック株式会社 電子部品パッケージおよびその製造方法
WO2014097643A1 (ja) 2012-12-21 2014-06-26 パナソニック株式会社 電子部品パッケージおよびその製造方法
US20150041993A1 (en) * 2013-08-06 2015-02-12 Infineon Technologies Ag Method for manufacturing a chip arrangement, and a chip arrangement
DE102013016697B4 (de) * 2013-08-19 2023-12-21 Oechsler Aktiengesellschaft Oberflächenmontiertes Bauelement und Verwendung davon
JP2015050309A (ja) * 2013-08-31 2015-03-16 京セラサーキットソリューションズ株式会社 配線基板の製造方法
US9941229B2 (en) 2013-10-31 2018-04-10 Infineon Technologies Ag Device including semiconductor chips and method for producing such device
DE102014101366B3 (de) * 2014-02-04 2015-05-13 Infineon Technologies Ag Chip-Montage an über Chip hinausstehender Adhäsions- bzw. Dielektrikumsschicht auf Substrat
US9806051B2 (en) * 2014-03-04 2017-10-31 General Electric Company Ultra-thin embedded semiconductor device package and method of manufacturing thereof
US10649497B2 (en) * 2014-07-23 2020-05-12 Apple Inc. Adaptive processes for improving integrity of surfaces
US9653438B2 (en) * 2014-08-21 2017-05-16 General Electric Company Electrical interconnect structure for an embedded semiconductor device package and method of manufacturing thereof
US9613843B2 (en) 2014-10-13 2017-04-04 General Electric Company Power overlay structure having wirebonds and method of manufacturing same
US9999136B2 (en) * 2014-12-15 2018-06-12 Ge Embedded Electronics Oy Method for fabrication of an electronic module and electronic module
US10615053B2 (en) * 2018-06-07 2020-04-07 Texas Instruments Incorporated Pre-cut plating lines on lead frames and laminate substrates for saw singulation

Family Cites Families (104)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB342995A (en) 1929-08-03 1931-02-12 Carba Ab Improvements in or relating to gas analysis
US4246595A (en) 1977-03-08 1981-01-20 Matsushita Electric Industrial Co., Ltd. Electronics circuit device and method of making the same
FR2527036A1 (fr) * 1982-05-14 1983-11-18 Radiotechnique Compelec Procede pour connecter un semiconducteur a des elements d'un support, notamment d'une carte portative
FR2599893B1 (fr) * 1986-05-23 1996-08-02 Ricoh Kk Procede de montage d'un module electronique sur un substrat et carte a circuit integre
US4993148A (en) * 1987-05-19 1991-02-19 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a circuit board
US5354695A (en) * 1992-04-08 1994-10-11 Leedy Glenn J Membrane dielectric isolation IC fabrication
BE1002529A6 (nl) * 1988-09-27 1991-03-12 Bell Telephone Mfg Methode om een elektronische component te monteren en geheugen kaart waarin deze wordt toegepast.
JPH0744320B2 (ja) * 1989-10-20 1995-05-15 松下電器産業株式会社 樹脂回路基板及びその製造方法
US5355102A (en) * 1990-04-05 1994-10-11 General Electric Company HDI impedance matched microwave circuit assembly
US5227338A (en) * 1990-04-30 1993-07-13 International Business Machines Corporation Three-dimensional memory card structure with internal direct chip attachment
JP3094481B2 (ja) 1991-03-13 2000-10-03 松下電器産業株式会社 電子回路装置とその製造方法
US5985693A (en) * 1994-09-30 1999-11-16 Elm Technology Corporation High density three-dimensional IC interconnection
KR950012658B1 (ko) * 1992-07-24 1995-10-19 삼성전자주식회사 반도체 칩 실장방법 및 기판 구조체
US5216806A (en) * 1992-09-01 1993-06-08 Atmel Corporation Method of forming a chip package and package interconnects
US5353498A (en) * 1993-02-08 1994-10-11 General Electric Company Method for fabricating an integrated circuit module
US5306670A (en) * 1993-02-09 1994-04-26 Texas Instruments Incorporated Multi-chip integrated circuit module and method for fabrication thereof
US5353195A (en) * 1993-07-09 1994-10-04 General Electric Company Integral power and ground structure for multi-chip modules
EP0637070B1 (en) * 1993-07-28 1997-09-24 The Whitaker Corporation Perimeter independent precision locating member for a semiconductor chip and method of making said member
JP2757748B2 (ja) 1993-07-30 1998-05-25 日立エーアイシー株式会社 プリント配線板
US5508561A (en) * 1993-11-15 1996-04-16 Nec Corporation Apparatus for forming a double-bump structure used for flip-chip mounting
US5510580A (en) * 1993-12-07 1996-04-23 International Business Machines Corporation Printed circuit board with landless blind hole for connecting an upper wiring pattern to a lower wiring pattern
JPH08167630A (ja) * 1994-12-15 1996-06-25 Hitachi Ltd チップ接続構造
US5552633A (en) * 1995-06-06 1996-09-03 Martin Marietta Corporation Three-dimensional multimodule HDI arrays with heat spreading
JPH0913567A (ja) 1995-06-30 1997-01-14 Mikio Yoshimatsu 床版及びその成形方法並びに床版の施工方法
EP0774888B1 (en) 1995-11-16 2003-03-19 Matsushita Electric Industrial Co., Ltd Printed wiring board and assembly of the same
JPH09199824A (ja) * 1995-11-16 1997-07-31 Matsushita Electric Ind Co Ltd プリント配線板とその実装体
US5729049A (en) * 1996-03-19 1998-03-17 Micron Technology, Inc. Tape under frame for conventional-type IC package assembly
US5936847A (en) * 1996-05-02 1999-08-10 Hei, Inc. Low profile electronic circuit modules
US5838545A (en) * 1996-10-17 1998-11-17 International Business Machines Corporation High performance, low cost multi-chip modle package
US5796590A (en) * 1996-11-05 1998-08-18 Micron Electronics, Inc. Assembly aid for mounting packaged integrated circuit devices to printed circuit boards
JP3176307B2 (ja) * 1997-03-03 2001-06-18 日本電気株式会社 集積回路装置の実装構造およびその製造方法
US6710614B1 (en) * 1997-03-04 2004-03-23 Micron Technology, Inc. Methods for using an interposer/converter to allow single-sided contact to circuit modules
US5882957A (en) * 1997-06-09 1999-03-16 Compeq Manufacturing Company Limited Ball grid array packaging method for an integrated circuit and structure realized by the method
JP3623639B2 (ja) 1997-09-29 2005-02-23 京セラ株式会社 多層配線基板の製造方法
US6038133A (en) 1997-11-25 2000-03-14 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module and method for producing the same
US6172419B1 (en) * 1998-02-24 2001-01-09 Micron Technology, Inc. Low profile ball grid array package
US6430569B1 (en) * 1998-08-14 2002-08-06 Sun Microsystems, Inc. Methods and apparatus for type safe, lazy, user-defined class loading
US6232666B1 (en) * 1998-12-04 2001-05-15 Mciron Technology, Inc. Interconnect for packaging semiconductor dice and fabricating BGA packages
JP3619421B2 (ja) 1999-03-30 2005-02-09 京セラ株式会社 多層配線基板の製造方法
EP1098368B1 (en) * 1999-04-16 2011-12-21 Panasonic Corporation Module component and method of manufacturing the same
JP2000311229A (ja) * 1999-04-27 2000-11-07 Hitachi Ltd Ｉｃカード及びその製造方法
JP3575001B2 (ja) * 1999-05-07 2004-10-06 アムコー テクノロジー コリア インコーポレーティド 半導体パッケージ及びその製造方法
US6393148B1 (en) * 1999-05-13 2002-05-21 Hewlett-Packard Company Contrast enhancement of an image using luminance and RGB statistical metrics
KR100298828B1 (ko) * 1999-07-12 2001-11-01 윤종용 재배선 필름과 솔더 접합을 이용한 웨이퍼 레벨 칩 스케일 패키지 제조방법
JP2001053447A (ja) 1999-08-05 2001-02-23 Iwaki Denshi Kk 部品内蔵型多層配線基板およびその製造方法
DE19940480C2 (de) * 1999-08-26 2001-06-13 Orga Kartensysteme Gmbh Leiterbahnträgerschicht zur Einlaminierung in eine Chipkarte, Chipkarte mit einer Leiterbahnträgerschicht und Verfahren zur Herstellung einer Chipkarte
US6284564B1 (en) 1999-09-20 2001-09-04 Lockheed Martin Corp. HDI chip attachment method for reduced processing
US6242282B1 (en) * 1999-10-04 2001-06-05 General Electric Company Circuit chip package and fabrication method
US6271469B1 (en) * 1999-11-12 2001-08-07 Intel Corporation Direct build-up layer on an encapsulated die package
US6154366A (en) * 1999-11-23 2000-11-28 Intel Corporation Structures and processes for fabricating moisture resistant chip-on-flex packages
TW512653B (en) 1999-11-26 2002-12-01 Ibiden Co Ltd Multilayer circuit board and semiconductor device
US6538210B2 (en) * 1999-12-20 2003-03-25 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module, radio device having the same, and method for producing the same
US6475877B1 (en) * 1999-12-22 2002-11-05 General Electric Company Method for aligning die to interconnect metal on flex substrate
JP3809053B2 (ja) 2000-01-20 2006-08-16 新光電気工業株式会社 電子部品パッケージ
JP4685251B2 (ja) 2000-02-09 2011-05-18 日本特殊陶業株式会社 配線基板の製造方法
US6396148B1 (en) * 2000-02-10 2002-05-28 Epic Technologies, Inc. Electroless metal connection structures and methods
EP1143509A3 (en) * 2000-03-08 2004-04-07 Sanyo Electric Co., Ltd. Method of manufacturing the circuit device and circuit device
JP2002016327A (ja) 2000-04-24 2002-01-18 Ngk Spark Plug Co Ltd 配線基板およびその製造方法
US6292366B1 (en) * 2000-06-26 2001-09-18 Intel Corporation Printed circuit board with embedded integrated circuit
US6402970B1 (en) * 2000-08-22 2002-06-11 Charles W. C. Lin Method of making a support circuit for a semiconductor chip assembly
US6551861B1 (en) * 2000-08-22 2003-04-22 Charles W. C. Lin Method of making a semiconductor chip assembly by joining the chip to a support circuit with an adhesive
US6713859B1 (en) * 2000-09-13 2004-03-30 Intel Corporation Direct build-up layer on an encapsulated die package having a moisture barrier structure
US6489185B1 (en) * 2000-09-13 2002-12-03 Intel Corporation Protective film for the fabrication of direct build-up layers on an encapsulated die package
JP2002094200A (ja) * 2000-09-18 2002-03-29 Matsushita Electric Ind Co Ltd 回路基板用電気絶縁材と回路基板およびその製造方法
JP3554533B2 (ja) * 2000-10-13 2004-08-18 シャープ株式会社 チップオンフィルム用テープおよび半導体装置
US6876072B1 (en) * 2000-10-13 2005-04-05 Bridge Semiconductor Corporation Semiconductor chip assembly with chip in substrate cavity
US6576493B1 (en) * 2000-10-13 2003-06-10 Bridge Semiconductor Corporation Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
JP2002158307A (ja) 2000-11-22 2002-05-31 Toshiba Corp 半導体装置及びその製造方法
JP3407737B2 (ja) * 2000-12-14 2003-05-19 株式会社デンソー 多層基板の製造方法およびその製造方法によって形成される多層基板
TW511405B (en) * 2000-12-27 2002-11-21 Matsushita Electric Industrial Co Ltd Device built-in module and manufacturing method thereof
JP3553043B2 (ja) 2001-01-19 2004-08-11 松下電器産業株式会社 部品内蔵モジュールとその製造方法
TW511415B (en) 2001-01-19 2002-11-21 Matsushita Electric Industrial Co Ltd Component built-in module and its manufacturing method
US6512182B2 (en) * 2001-03-12 2003-01-28 Ngk Spark Plug Co., Ltd. Wiring circuit board and method for producing same
JP4863563B2 (ja) * 2001-03-13 2012-01-25 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
TW579581B (en) * 2001-03-21 2004-03-11 Ultratera Corp Semiconductor device with chip separated from substrate and its manufacturing method
JP3609737B2 (ja) * 2001-03-22 2005-01-12 三洋電機株式会社 回路装置の製造方法
US6537848B2 (en) * 2001-05-30 2003-03-25 St. Assembly Test Services Ltd. Super thin/super thermal ball grid array package
JP2003037205A (ja) 2001-07-23 2003-02-07 Sony Corp Ｉｃチップ内蔵多層基板及びその製造方法
US7183658B2 (en) * 2001-09-05 2007-02-27 Intel Corporation Low cost microelectronic circuit package
US6774486B2 (en) * 2001-10-10 2004-08-10 Micron Technology, Inc. Circuit boards containing vias and methods for producing same
JP3870778B2 (ja) * 2001-12-20 2007-01-24 ソニー株式会社 素子内蔵基板の製造方法および素子内蔵基板
TW200302685A (en) * 2002-01-23 2003-08-01 Matsushita Electric Industrial Co Ltd Circuit component built-in module and method of manufacturing the same
FI115285B (sv) 2002-01-31 2005-03-31 Imbera Electronics Oy Förfarande för insänkning av en komponent i ett basmaterial och för bildning av en kontakt
FI119215B (sv) * 2002-01-31 2008-08-29 Imbera Electronics Oy Förfarande för insättning av en komponent i ett basmaterial och elektronikmodul
JP2003249763A (ja) * 2002-02-25 2003-09-05 Fujitsu Ltd 多層配線基板及びその製造方法
JP2004031651A (ja) * 2002-06-26 2004-01-29 Sony Corp 素子実装基板及びその製造方法
US7874066B2 (en) * 2002-07-31 2011-01-25 Sony Corporation Method of manufacturing a device-incorporated substrate
JP4052915B2 (ja) * 2002-09-26 2008-02-27 三洋電機株式会社 回路装置の製造方法
JP2004146634A (ja) 2002-10-25 2004-05-20 Murata Mfg Co Ltd 樹脂基板の製造方法、および樹脂多層基板の製造方法
FI119583B (sv) 2003-02-26 2008-12-31 Imbera Electronics Oy Förfarande för tillverkning av en elektronikmodul
FI20030293L (sv) 2003-02-26 2004-08-27 Imbera Electronics Oy Förfarande för tillverkning av en elektronikmodul och en elektronikmodul
FI115601B (sv) 2003-04-01 2005-05-31 Imbera Electronics Oy Förfarande för tillverkning av en elektronikmodul och en elektronikmodul
TW200507131A (en) * 2003-07-02 2005-02-16 North Corp Multi-layer circuit board for electronic device
US7141884B2 (en) * 2003-07-03 2006-11-28 Matsushita Electric Industrial Co., Ltd. Module with a built-in semiconductor and method for producing the same
FI20031201A7 (sv) 2003-08-26 2005-02-27 Imbera Electronics Oy Förfarande för tillverkning av en elektronikmodul och en elektronikmodul
FI20031341A7 (sv) * 2003-09-18 2005-03-19 Imbera Electronics Oy Förfarande för tillverkning av en elektronikmodul
CN100485913C (zh) * 2004-02-24 2009-05-06 揖斐电株式会社 半导体搭载用基板
TWI237883B (en) * 2004-05-11 2005-08-11 Via Tech Inc Chip embedded package structure and process thereof
TWI251910B (en) * 2004-06-29 2006-03-21 Phoenix Prec Technology Corp Semiconductor device buried in a carrier and a method for fabricating the same
US7150090B2 (en) * 2004-07-16 2006-12-19 General Electric Company Method for matching a collector to replace a brushless exciter in a turbine generator drive train
FI117812B (sv) * 2004-08-05 2007-02-28 Imbera Electronics Oy Tillverkning av ett skikt innehållande en komponent
US8487194B2 (en) * 2004-08-05 2013-07-16 Imbera Electronics Oy Circuit board including an embedded component
FI117369B (sv) * 2004-11-26 2006-09-15 Imbera Electronics Oy Förfarande för tillverkning av en elektronikmodul
FI119714B (sv) * 2005-06-16 2009-02-13 Imbera Electronics Oy Kretskortskonstruktion och förfarande för tillverkning av kretskortskonstruktion

Also Published As

Publication number Publication date
DE112005001414T5 (de) 2007-05-03
CN101010994B (zh) 2012-11-07
JP2008503076A (ja) 2008-01-31
JP4796057B2 (ja) 2011-10-19
US8240032B2 (en) 2012-08-14
WO2005125298A3 (en) 2006-10-26
US20080261338A1 (en) 2008-10-23
FI117814B (sv) 2007-02-28
KR101034279B1 (ko) 2011-05-16
KR20070030838A (ko) 2007-03-16
FI20040827L (sv) 2005-12-16
CN101010994A (zh) 2007-08-01
WO2005125298A2 (en) 2005-12-29

Similar Documents

Publication Publication Date Title
FI20041524A0 (sv) Förfarande för tillverkning av en elektronikmodul
FI20040827A0 (sv) Förfarande för tillverkning av en elektronikmodul
FI20031341A0 (sv) Förfarande för tillverkning av en elektronikmodul
EP1760895A4 (en) TRANSMITTER / RECEIVER MODULE
DE602004015021D1 (de) Elektronisches Bauelement-Modul
DE502007002763D1 (de) Schaltungsmodul
DE502005009385D1 (de) Steuermodul
EP1970955A4 (en) SEMICONDUCTOR MODULE
FI20041680L (sv) Elektronikmodul och förfarande för tillverkning därav
FI20041038A0 (sv) Objektivmodul och förfarande för montering densamma
FI20030293A0 (sv) Förfarande för tillverkning av en elektronikmodul och en elektronikmodul
ATE405903T1 (de) Sicherheitsmodul-komponente
DE112006002696A5 (de) Bauelement
FI20050287L (sv) Monteringshållare för elektronikdel
DE502006000019D1 (de) Integrieter Schaltkreis
FI20045312A0 (sv) Testförfarande för elektroniska anordningar
DE502006002657D1 (de) Ausgleichswellenmodul
DE502004010138D1 (de) Schaltungsmodul
DE202004002698U1 (de) Gassackmodul
SE0601889L (sv) En antennfiltermodul
DE502005010450D1 (de) Elektrische baugruppe
FI20041510L (sv) Förfarande för framställning av gjutna komponenter
DE502005010740D1 (de) Elektronikgehäuse
DE112005000543D2 (de) Radmodul
FR2894070B1 (fr) Module electronique 3d

Legal Events

Date Code Title Description
FG Patent granted

Ref document number: 117814

Country of ref document: FI

PC Transfer of assignment of patent

Owner name: GE EMBEDDED ELECTRONICS OY

PC Transfer of assignment of patent

Owner name: IMBERA TEK, LLC