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FI20041524A0 - Förfarande för tillverkning av en elektronikmodul - Google Patents

Förfarande för tillverkning av en elektronikmodul

Info

Publication number
FI20041524A0
FI20041524A0 FI20041524A FI20041524A FI20041524A0 FI 20041524 A0 FI20041524 A0 FI 20041524A0 FI 20041524 A FI20041524 A FI 20041524A FI 20041524 A FI20041524 A FI 20041524A FI 20041524 A0 FI20041524 A0 FI 20041524A0
Authority
FI
Finland
Prior art keywords
procedure
manufacturing
electronics module
electronics
module
Prior art date
Application number
FI20041524A
Other languages
English (en)
Finnish (fi)
Other versions
FI117369B (sv
FI20041524L (sv
Inventor
Risto Tuominen
Antti Iihola
Original Assignee
Imbera Electronics Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imbera Electronics Oy filed Critical Imbera Electronics Oy
Priority to FI20041524A priority Critical patent/FI117369B/sv
Publication of FI20041524A0 publication Critical patent/FI20041524A0/sv
Priority to US11/667,429 priority patent/US8062537B2/en
Priority to KR1020077014479A priority patent/KR101101603B1/ko
Priority to CN2005800402916A priority patent/CN101065843B/zh
Priority to PCT/FI2005/000499 priority patent/WO2006056643A2/en
Priority to JP2007542017A priority patent/JP5160895B2/ja
Publication of FI20041524L publication Critical patent/FI20041524L/sv
Application granted granted Critical
Publication of FI117369B publication Critical patent/FI117369B/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
    • H10W70/05—
    • H10W70/09—
    • H10W70/60—
    • H10W70/611—
    • H10W70/614—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H10P72/74—
    • H10W70/093—
    • H10W70/635—
    • H10W72/073—
    • H10W72/07323—
    • H10W72/9413—
    • H10W90/734—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
FI20041524A 2004-11-26 2004-11-26 Förfarande för tillverkning av en elektronikmodul FI117369B (sv)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FI20041524A FI117369B (sv) 2004-11-26 2004-11-26 Förfarande för tillverkning av en elektronikmodul
US11/667,429 US8062537B2 (en) 2004-11-26 2005-11-23 Method for manufacturing an electronics module
KR1020077014479A KR101101603B1 (ko) 2004-11-26 2005-11-23 전자 모듈 제조 방법
CN2005800402916A CN101065843B (zh) 2004-11-26 2005-11-23 制造电子模块的方法
PCT/FI2005/000499 WO2006056643A2 (en) 2004-11-26 2005-11-23 Method for manufacturing an electronics module
JP2007542017A JP5160895B2 (ja) 2004-11-26 2005-11-23 電子モジュールの製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20041524A FI117369B (sv) 2004-11-26 2004-11-26 Förfarande för tillverkning av en elektronikmodul
FI20041524 2004-11-26

Publications (3)

Publication Number Publication Date
FI20041524A0 true FI20041524A0 (sv) 2004-11-26
FI20041524L FI20041524L (sv) 2006-03-17
FI117369B FI117369B (sv) 2006-09-15

Family

ID=33515276

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20041524A FI117369B (sv) 2004-11-26 2004-11-26 Förfarande för tillverkning av en elektronikmodul

Country Status (6)

Country Link
US (1) US8062537B2 (sv)
JP (1) JP5160895B2 (sv)
KR (1) KR101101603B1 (sv)
CN (1) CN101065843B (sv)
FI (1) FI117369B (sv)
WO (1) WO2006056643A2 (sv)

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FI20031341A7 (sv) 2003-09-18 2005-03-19 Imbera Electronics Oy Förfarande för tillverkning av en elektronikmodul
FI117814B (sv) * 2004-06-15 2007-02-28 Imbera Electronics Oy Förfarande för tillverkning av en elektronikmodul
DE102005003632A1 (de) 2005-01-20 2006-08-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Katheter für die transvaskuläre Implantation von Herzklappenprothesen
FI119714B (sv) 2005-06-16 2009-02-13 Imbera Electronics Oy Kretskortskonstruktion och förfarande för tillverkning av kretskortskonstruktion
FI122128B (sv) * 2005-06-16 2011-08-31 Imbera Electronics Oy Förfarande för tillverkning av kretskortskonstruktion
DE112006001506T5 (de) 2005-06-16 2008-04-30 Imbera Electronics Oy Platinenstruktur und Verfahren zu ihrer Herstellung
SG139594A1 (en) * 2006-08-04 2008-02-29 Micron Technology Inc Microelectronic devices and methods for manufacturing microelectronic devices
WO2008078899A1 (en) * 2006-12-23 2008-07-03 Lg Innotek Co., Ltd Semiconductor package and manufacturing method thereof
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US8914974B2 (en) 2008-10-30 2014-12-23 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Method for integrating an electronic component into a printed circuit board
US8124449B2 (en) 2008-12-02 2012-02-28 Infineon Technologies Ag Device including a semiconductor chip and metal foils
FI122216B (sv) 2009-01-05 2011-10-14 Imbera Electronics Oy Rigid-flex modul
FI20095110A0 (sv) 2009-02-06 2009-02-06 Imbera Electronics Oy Elektronisk modul med EMI-skydd
US10856978B2 (en) 2010-05-20 2020-12-08 Jenavalve Technology, Inc. Catheter system
BR112012029896A2 (pt) 2010-05-25 2017-06-20 Jenavalve Tech Inc válcula cardíaca protética para endoprótese e endoprótese
US8735735B2 (en) 2010-07-23 2014-05-27 Ge Embedded Electronics Oy Electronic module with embedded jumper conductor
AT13055U1 (de) * 2011-01-26 2013-05-15 Austria Tech & System Tech Verfahren zur integration eines elektronischen bauteils in eine leiterplatte oder ein leiterplatten-zwischenprodukt sowie leiterplatte oder leiterplatten-zwischenprodukt
JP5698377B2 (ja) 2011-10-31 2015-04-08 株式会社メイコー 部品内蔵基板の製造方法及びこの方法を用いて製造した部品内蔵基板
JP5688162B2 (ja) 2011-11-08 2015-03-25 株式会社メイコー 部品内蔵基板の製造方法及びこの方法を用いて製造した部品内蔵基板
KR101233640B1 (ko) * 2011-11-28 2013-02-15 대덕전자 주식회사 내장형 인쇄회로기판의 수율 향상방법
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CN104584210B (zh) 2012-12-21 2017-09-26 松下知识产权经营株式会社 电子部件封装件及其制造方法
WO2014097645A1 (ja) 2012-12-21 2014-06-26 パナソニック株式会社 電子部品パッケージおよびその製造方法
US9867694B2 (en) 2013-08-30 2018-01-16 Jenavalve Technology Inc. Radially collapsible frame for a prosthetic valve and method for manufacturing such a frame
US9380697B2 (en) 2014-01-28 2016-06-28 Panasonic Intellectual Property Management Co., Ltd. Electronic device and manufacturing method for same
US9373762B2 (en) 2014-06-17 2016-06-21 Panasonic Intellectual Property Management Co., Ltd. Electronic part package
JP6829692B2 (ja) 2015-03-20 2021-02-10 イェーナヴァルヴ テクノロジー インコーポレイテッド 心臓弁プロテーゼ送出システム及び導入体シースにより心臓弁プロテーゼを送出するための方法
JP6767388B2 (ja) 2015-05-01 2020-10-14 イェーナヴァルヴ テクノロジー インコーポレイテッド 心臓弁置換におけるペースメーカー割合を低減させるデバイス及び方法
JP6620989B2 (ja) 2015-05-25 2019-12-18 パナソニックＩｐマネジメント株式会社 電子部品パッケージ
CN109475419B (zh) 2016-05-13 2021-11-09 耶拿阀门科技股份有限公司 用于通过引导鞘和装载系统来递送心脏瓣膜假体的心脏瓣膜假体递送系统和方法
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Also Published As

Publication number Publication date
KR20070086645A (ko) 2007-08-27
CN101065843B (zh) 2010-08-18
WO2006056643A3 (en) 2006-11-09
FI117369B (sv) 2006-09-15
JP2008522396A (ja) 2008-06-26
FI20041524L (sv) 2006-03-17
KR101101603B1 (ko) 2012-01-02
WO2006056643A2 (en) 2006-06-01
US8062537B2 (en) 2011-11-22
JP5160895B2 (ja) 2013-03-13
CN101065843A (zh) 2007-10-31
US20070267136A1 (en) 2007-11-22

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