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DE60102457D1 - Paste zum Befestigen eines Halbleiterchips und Halbleiteranordnung - Google Patents

Paste zum Befestigen eines Halbleiterchips und Halbleiteranordnung

Info

Publication number
DE60102457D1
DE60102457D1 DE60102457T DE60102457T DE60102457D1 DE 60102457 D1 DE60102457 D1 DE 60102457D1 DE 60102457 T DE60102457 T DE 60102457T DE 60102457 T DE60102457 T DE 60102457T DE 60102457 D1 DE60102457 D1 DE 60102457D1
Authority
DE
Germany
Prior art keywords
paste
attaching
semiconductor device
semiconductor
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60102457T
Other languages
English (en)
Other versions
DE60102457T2 (de
Inventor
Nobuki Tanaka
Hikaru Okubo
Ryuichi Murayama
Kazuto Onami
Tomohiro Kagimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Application granted granted Critical
Publication of DE60102457D1 publication Critical patent/DE60102457D1/de
Publication of DE60102457T2 publication Critical patent/DE60102457T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
    • C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/12—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/04—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to rubbers
    • H10W72/30—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • H10W74/012—
    • H10W74/15—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Polymerisation Methods In General (AREA)
DE60102457T 2000-04-10 2001-04-09 Paste zum Befestigen eines Halbleiterchips und Halbleiteranordnung Expired - Fee Related DE60102457T2 (de)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
JP2000107637 2000-04-10
JP2000107637 2000-04-10
JP2000257734 2000-08-28
JP2000257734 2000-08-28
JP2000281109 2000-09-18
JP2000281109 2000-09-18
JP2000296899 2000-09-28
JP2000296899 2000-09-28
JP2000306227 2000-10-05
JP2000306227 2000-10-05
PCT/JP2001/003040 WO2001077243A1 (en) 2000-04-10 2001-04-09 Die-attaching paste and semiconductor device

Publications (2)

Publication Number Publication Date
DE60102457D1 true DE60102457D1 (de) 2004-04-29
DE60102457T2 DE60102457T2 (de) 2005-03-03

Family

ID=27531486

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60102457T Expired - Fee Related DE60102457T2 (de) 2000-04-10 2001-04-09 Paste zum Befestigen eines Halbleiterchips und Halbleiteranordnung

Country Status (8)

Country Link
US (1) US6861013B2 (de)
EP (1) EP1274808B1 (de)
KR (1) KR100804889B1 (de)
CN (1) CN1232601C (de)
DE (1) DE60102457T2 (de)
MY (1) MY127199A (de)
TW (1) TWI282811B (de)
WO (1) WO2001077243A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6716992B2 (en) * 2002-07-22 2004-04-06 National Starch And Chemical Investment Holding Corporation Cycloaliphatic epoxy compounds containing styrenic, cinnamyl, or maleimide functionality
US6809155B2 (en) * 2002-11-20 2004-10-26 National Starch And Chemical Investment Holding Corporation Unsaturated compounds containing silane, electron donor and electron acceptor functionality
US6784025B2 (en) 2002-11-20 2004-08-31 National Starch And Chemical Investment Holding Corporation Semiconductor package with a die attach adhesive having silane functionality
US7910223B2 (en) 2003-07-17 2011-03-22 Honeywell International Inc. Planarization films for advanced microelectronic applications and devices and methods of production thereof
CN102604591A (zh) * 2004-03-19 2012-07-25 住友电木株式会社 树脂组合物及采用该树脂组合物制作的半导体装置
US7763188B2 (en) * 2005-03-04 2010-07-27 International Business Machines Corporation Electrically stable copper filled electrically conductive adhesive
ATE397647T1 (de) * 2006-03-06 2008-06-15 Umicore Ag & Co Kg Zusammensetzung zur befestigung von hochleistungshalbleiter
US20070236542A1 (en) * 2006-03-29 2007-10-11 Graham David C Adhesive Compositions, Micro-Fluid Ejection Devices, and Methods for Attaching Micro-Fluid Ejection Heads
US20110014354A1 (en) * 2009-07-20 2011-01-20 David Christopher Graham Adhesive compositions and methods for use in failure analysis
JP5767971B2 (ja) * 2009-09-29 2015-08-26 電気化学工業株式会社 硬化性樹脂組成物
JP6207348B2 (ja) * 2013-11-08 2017-10-04 ナミックス株式会社 樹脂組成物、先供給型半導体封止剤および半導体装置
US11331888B2 (en) 2016-07-20 2022-05-17 Showa Denko Materials Co., Ltd. Composite film for electronic devices using high frequency band signals, printed wiring board and manufacturing method therefor

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3461023B2 (ja) * 1994-02-28 2003-10-27 日立化成工業株式会社 接着剤および半導体装置
JP4055215B2 (ja) 1996-10-21 2008-03-05 日立化成工業株式会社 接着剤組成物
JP3356987B2 (ja) * 1998-02-12 2002-12-16 日立化成工業株式会社 接着剤ペースト組成物及びこれを用いた半導体装置
JPH11269452A (ja) * 1998-03-25 1999-10-05 Sumitomo Bakelite Co Ltd ダイアタッチペースト
JP3511129B2 (ja) * 1998-09-28 2004-03-29 日立化成工業株式会社 樹脂ぺースト組成物及びこれを用いた半導体装置
JP2000234043A (ja) * 1999-02-16 2000-08-29 Hitachi Chem Co Ltd 樹脂ぺースト組成物及びこれを用いた半導体装置
JP3929220B2 (ja) * 2000-01-26 2007-06-13 住友ベークライト株式会社 ダイアタッチペースト及び半導体装置

Also Published As

Publication number Publication date
EP1274808A1 (de) 2003-01-15
DE60102457T2 (de) 2005-03-03
KR100804889B1 (ko) 2008-02-20
KR20040029940A (ko) 2004-04-08
CN1422315A (zh) 2003-06-04
WO2001077243B1 (en) 2001-12-13
MY127199A (en) 2006-11-30
US20030146521A1 (en) 2003-08-07
TWI282811B (en) 2007-06-21
CN1232601C (zh) 2005-12-21
US6861013B2 (en) 2005-03-01
WO2001077243A1 (en) 2001-10-18
EP1274808B1 (de) 2004-03-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee