CN111801808A - 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 - Google Patents
一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 Download PDFInfo
- Publication number
- CN111801808A CN111801808A CN201980016674.1A CN201980016674A CN111801808A CN 111801808 A CN111801808 A CN 111801808A CN 201980016674 A CN201980016674 A CN 201980016674A CN 111801808 A CN111801808 A CN 111801808A
- Authority
- CN
- China
- Prior art keywords
- spherical
- angular
- powder filler
- angular powder
- units
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/12—Powdering or granulating
- C08J3/128—Polymer particles coated by inorganic and non-macromolecular organic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- H10W74/40—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/07—Parts immersed or impregnated in a matrix
- B32B2305/076—Prepregs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Silicon Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
本发明涉及一种球形或角形粉体填料的制备方法,提供包括T单位的球形或角形硅氧烷,其中,T单位=R1SiO3‑,R1为氢原子或可独立选择的碳原子1至18的有机基;以及在惰性气体氛围或大气氛围条件下,对该球形或角形硅氧烷进行热处理,热处理温度为250度以上至650度以下,以使得球形或角形硅氧烷中的硅羟基发生缩合以得到球形或角形粉体填料,在该球形或角形粉体填料的T单位中,不含羟基的单位在总单位中的含量≥95%,含有一个羟基的单位在总单位中的含量≤5%。本发明还提供一种根据上述的制备方法得到的球形或角形粉体填料。本发明又提供一种根据上述的球形或角形粉体填料的应用。本发明提供的球形或角形粉体填料具有低诱电率,低吸水率和低放射性。
Description
PCT国内申请,说明书已公开。
Claims (8)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNPCT/CN2019/075831 | 2019-02-22 | ||
| PCT/CN2019/075831 WO2020168542A1 (zh) | 2019-02-22 | 2019-02-22 | 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 |
| CNPCT/CN2019/109108 | 2019-09-29 | ||
| PCT/CN2019/109108 WO2020168719A1 (zh) | 2019-02-22 | 2019-09-29 | 一种聚硅氧烷粉体填料的制备方法、由此得到的聚硅氧烷粉体填料及其应用 |
| PCT/CN2019/123337 WO2020168784A1 (zh) | 2019-02-22 | 2019-12-05 | 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111801808A true CN111801808A (zh) | 2020-10-20 |
| CN111801808B CN111801808B (zh) | 2021-04-23 |
Family
ID=72144224
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980016658.2A Pending CN111819247A (zh) | 2019-02-22 | 2019-02-22 | 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 |
| CN201980016661.4A Active CN111819248B (zh) | 2019-02-22 | 2019-09-29 | 一种聚硅氧烷粉体填料的制备方法、由此得到的聚硅氧烷粉体填料及其应用 |
| CN201980016674.1A Active CN111801808B (zh) | 2019-02-22 | 2019-12-05 | 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 |
| CN202080001766.5A Pending CN111801296A (zh) | 2019-02-22 | 2020-01-13 | 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980016658.2A Pending CN111819247A (zh) | 2019-02-22 | 2019-02-22 | 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 |
| CN201980016661.4A Active CN111819248B (zh) | 2019-02-22 | 2019-09-29 | 一种聚硅氧烷粉体填料的制备方法、由此得到的聚硅氧烷粉体填料及其应用 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080001766.5A Pending CN111801296A (zh) | 2019-02-22 | 2020-01-13 | 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 |
Country Status (3)
| Country | Link |
|---|---|
| KR (2) | KR102774001B1 (zh) |
| CN (4) | CN111819247A (zh) |
| WO (2) | WO2020168542A1 (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111393855A (zh) * | 2020-03-18 | 2020-07-10 | 平湖阿莱德实业有限公司 | 一种具有优异耐候性的高导热凝胶组合物 |
| CN118420910A (zh) * | 2024-04-15 | 2024-08-02 | 衢州三时纪新材料有限公司 | 一种聚硅氧烷颗粒及其制备方法与应用 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020168542A1 (zh) * | 2019-02-22 | 2020-08-27 | 湖州五爻硅基材料研究院有限公司 | 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 |
| CN112624126A (zh) * | 2020-11-26 | 2021-04-09 | 浙江三时纪新材科技有限公司 | 一种中空二氧化硅粉体填料的制备方法、由此得到的粉体填料及其应用 |
| CN113603103A (zh) * | 2021-08-13 | 2021-11-05 | 浙江三时纪新材科技有限公司 | 半导体封装材料,基板材料的制备方法,由此得到的半导体封装材料,基板材料及其应用 |
| CN115368754A (zh) * | 2022-08-12 | 2022-11-22 | 吉安豫顺新材料有限公司 | 一种球形低密度氧化硅填料 |
| CN116178992B (zh) * | 2022-12-26 | 2025-09-30 | 江苏联瑞新材料股份有限公司 | 底部填充胶用低黏度高流动表面改性硅微粉的制备方法 |
| CN118530510B (zh) * | 2024-05-27 | 2025-12-12 | 衢州三时纪新材料有限公司 | 一种低含水量壳层及其包覆方法与应用 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1295905A1 (en) * | 2001-09-25 | 2003-03-26 | Shin-Etsu Chemical Co., Ltd. | Silicone rubber compositions for the sealing and encapsulation of electric and electronic parts |
| CN103205125A (zh) * | 2012-01-16 | 2013-07-17 | 信越化学工业株式会社 | 用于半导体封装的热固性树脂组合物和封装的半导体器件 |
| CN103771423A (zh) * | 2013-12-11 | 2014-05-07 | 天津泽希矿产加工有限公司 | 电子封装用球形填料及制造方法 |
| CN104449550A (zh) * | 2013-12-31 | 2015-03-25 | 弗洛里光电材料(苏州)有限公司 | 有机硅组合物及其应用 |
| CN105153992A (zh) * | 2015-08-26 | 2015-12-16 | 中国科学院化学研究所 | 一种采用聚硅氧烷改性的填料及其制备方法与应用 |
| CN111801296A (zh) * | 2019-02-22 | 2020-10-20 | 浙江三时纪新材科技有限公司 | 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5323899A (en) * | 1976-08-18 | 1978-03-04 | Inst Fuizuichiesukoi Himii Im | Process for preparing aminized silicate compound |
| KR940004144B1 (ko) * | 1990-11-30 | 1994-05-13 | 삼성전기 주식회사 | 유전체 자기조성물 |
| US5426168A (en) * | 1994-04-29 | 1995-06-20 | Dow Corning Corporation | Method of preparing an organically-modified, heat-curable silicone resin and the resin produced thereby |
| JP3846667B2 (ja) * | 1998-12-25 | 2006-11-15 | 竹本油脂株式会社 | 有機シリコーン微粒子、その製造方法、有機シリコーン微粒子から成る高分子材料用改質剤及び化粧品原料 |
| EP1292973B1 (en) * | 2000-06-23 | 2015-09-09 | Honeywell International, Inc. | Method to restore hydrophobicity in dielectric films and materials |
| US7790316B2 (en) * | 2004-03-26 | 2010-09-07 | Shin-Etsu Chemical Co., Ltd. | Silicon composite particles, preparation thereof, and negative electrode material for non-aqueous electrolyte secondary cell |
| US20080072794A1 (en) * | 2004-07-26 | 2008-03-27 | Holger Hoppe | Reactive Silicon Suboxide Flakes |
| JP4460468B2 (ja) * | 2005-02-04 | 2010-05-12 | 信越化学工業株式会社 | アミノ基含有オルガノポリシロキサンの製造方法 |
| CN101627043A (zh) * | 2007-02-09 | 2010-01-13 | 株式会社日本触媒 | 硅烷化合物、其生产方法以及包含硅烷化合物的树脂组合物 |
| JP2009062472A (ja) * | 2007-09-07 | 2009-03-26 | Toray Ind Inc | ポリフェニレンスルフィドフィルムおよびそれからなるコンデンサ |
| KR100962936B1 (ko) * | 2007-12-20 | 2010-06-09 | 제일모직주식회사 | 반도체 조립용 접착 필름 조성물 및 접착 필름 |
| CN101555018B (zh) * | 2009-05-15 | 2012-05-02 | 中国科学院广州能源研究所 | 一种有机改性制备高机械性能纳米多孔材料的方法 |
| JP5549568B2 (ja) * | 2009-12-15 | 2014-07-16 | 信越化学工業株式会社 | 光半導体素子封止用樹脂組成物及び当該組成物で封止した光半導体装置 |
| JP5163912B2 (ja) * | 2010-02-16 | 2013-03-13 | 信越化学工業株式会社 | エポキシ樹脂組成物及び半導体装置 |
| JP6063197B2 (ja) * | 2012-10-02 | 2017-01-18 | 東レ・ダウコーニング株式会社 | 新規な共変性オルガノポリシロキサン、それを含有してなる粉体処理剤および粉体組成物 |
| CN106459482A (zh) * | 2014-02-28 | 2017-02-22 | Az电子材料(卢森堡)责任有限公司 | 用于光电应用的混杂材料 |
| CN104558689B (zh) * | 2014-12-26 | 2017-08-29 | 广东生益科技股份有限公司 | 一种填料组合物及其应用 |
| CN106609039B (zh) * | 2015-10-21 | 2019-09-13 | 广东生益科技股份有限公司 | 一种聚苯醚树脂组合物及其在高频电路基板中的应用 |
| WO2018065058A1 (de) * | 2016-10-06 | 2018-04-12 | Wacker Chemie Ag | Verfahren zur herstellung sphärischer polysilsesquioxanpartikel |
| CN107128935A (zh) * | 2017-05-23 | 2017-09-05 | 苏州纳迪微电子有限公司 | 一种高纯度球形二氧化硅微粉的制备方法 |
| CN107140654B (zh) * | 2017-06-26 | 2020-05-19 | 兰陵县益新矿业科技有限公司 | 一种改性石英砂制备方法 |
| CN108329692B (zh) * | 2018-02-07 | 2021-01-29 | 深圳华力兴新材料股份有限公司 | 一种低介电常数的聚苯硫醚树脂组合物及制备方法 |
-
2019
- 2019-02-22 WO PCT/CN2019/075831 patent/WO2020168542A1/zh not_active Ceased
- 2019-02-22 CN CN201980016658.2A patent/CN111819247A/zh active Pending
- 2019-09-29 CN CN201980016661.4A patent/CN111819248B/zh active Active
- 2019-09-29 KR KR1020217029021A patent/KR102774001B1/ko active Active
- 2019-09-29 WO PCT/CN2019/109108 patent/WO2020168719A1/zh not_active Ceased
- 2019-12-05 KR KR1020217029022A patent/KR102695717B1/ko active Active
- 2019-12-05 CN CN201980016674.1A patent/CN111801808B/zh active Active
-
2020
- 2020-01-13 CN CN202080001766.5A patent/CN111801296A/zh active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1295905A1 (en) * | 2001-09-25 | 2003-03-26 | Shin-Etsu Chemical Co., Ltd. | Silicone rubber compositions for the sealing and encapsulation of electric and electronic parts |
| CN103205125A (zh) * | 2012-01-16 | 2013-07-17 | 信越化学工业株式会社 | 用于半导体封装的热固性树脂组合物和封装的半导体器件 |
| CN103771423A (zh) * | 2013-12-11 | 2014-05-07 | 天津泽希矿产加工有限公司 | 电子封装用球形填料及制造方法 |
| CN104449550A (zh) * | 2013-12-31 | 2015-03-25 | 弗洛里光电材料(苏州)有限公司 | 有机硅组合物及其应用 |
| CN105153992A (zh) * | 2015-08-26 | 2015-12-16 | 中国科学院化学研究所 | 一种采用聚硅氧烷改性的填料及其制备方法与应用 |
| CN111801296A (zh) * | 2019-02-22 | 2020-10-20 | 浙江三时纪新材科技有限公司 | 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111393855A (zh) * | 2020-03-18 | 2020-07-10 | 平湖阿莱德实业有限公司 | 一种具有优异耐候性的高导热凝胶组合物 |
| CN118420910A (zh) * | 2024-04-15 | 2024-08-02 | 衢州三时纪新材料有限公司 | 一种聚硅氧烷颗粒及其制备方法与应用 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111801296A (zh) | 2020-10-20 |
| KR102774001B1 (ko) | 2025-02-26 |
| CN111819248A (zh) | 2020-10-23 |
| WO2020168719A1 (zh) | 2020-08-27 |
| CN111819247A (zh) | 2020-10-23 |
| KR20210127198A (ko) | 2021-10-21 |
| KR20210125546A (ko) | 2021-10-18 |
| KR102695717B1 (ko) | 2024-08-16 |
| CN111819248B (zh) | 2021-08-20 |
| CN111801808B (zh) | 2021-04-23 |
| WO2020168542A1 (zh) | 2020-08-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111801808A (zh) | 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 | |
| CN104673063B (zh) | 一种耐高温防腐隔热涂料及其制备工艺 | |
| CN104910632B (zh) | 一种低温硫化导热硅橡胶及其制备方法 | |
| CN103265813B (zh) | 发泡型灌封硅胶组合物 | |
| JP2007506484A5 (zh) | ||
| CN105524279A (zh) | 一种甲基苯基导热硅油的制备方法 | |
| CN102167831B (zh) | 一种官能化梯形聚倍半硅氧烷及其制备方法 | |
| JP2010161355A5 (zh) | ||
| US9862869B2 (en) | Siloxane mixtures | |
| CN110563955A (zh) | 一种液态可固化金属基聚碳硅烷及其制备方法 | |
| CN105218825A (zh) | 一种有机硅无溶剂浸渍树脂及其合成方法 | |
| WO2008035820A1 (en) | Silicone resin composition and method for forming trench isolation | |
| CN111819266A (zh) | 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 | |
| US20170087508A1 (en) | Separation membrane for treating acid gas-containing gas, and method for manufacturing separation membrane for treating acid gas-containing gas | |
| CN103881094B (zh) | 一种大环状硅氧烷的合成方法 | |
| CN103525358B (zh) | 一种含梯形聚倍半硅氧烷的透明硅橡胶的制备方法与应用 | |
| CN112537961B (zh) | 一种聚合物前驱体陶瓷气凝胶的制备方法 | |
| CN106433146A (zh) | 一种带有活性氢基笼形结构的室温硫化耐热硅橡胶及其制备方法 | |
| CN107674621A (zh) | 一种耐高温环氧树脂胶黏剂的制备方法 | |
| CN111936421A (zh) | 一种球形二氧化硅粉体填料的制备方法和由此得到的球形二氧化硅粉体填料及其应用 | |
| JP2010278121A5 (ja) | 半導体装置の製造方法 | |
| CN107324339B (zh) | 一种碳化硅气凝胶及其制备方法 | |
| CN103113399B (zh) | 一种制备二甲基乙烯基氯硅烷的方法 | |
| CN108083835A (zh) | 一种抗菌抗热辐射气凝胶的制备方法 | |
| JP2016204685A5 (zh) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |