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CN111801808A - 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 - Google Patents

一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 Download PDF

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CN111801808A
CN111801808A CN201980016674.1A CN201980016674A CN111801808A CN 111801808 A CN111801808 A CN 111801808A CN 201980016674 A CN201980016674 A CN 201980016674A CN 111801808 A CN111801808 A CN 111801808A
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spherical
angular
powder filler
angular powder
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CN111801808B (zh
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陈树真
李锐
唐成
丁烈平
陈晨
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Zhejiang Sanshi New Material Technology Co ltd
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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    • B32LAYERED PRODUCTS
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Abstract

本发明涉及一种球形或角形粉体填料的制备方法,提供包括T单位的球形或角形硅氧烷,其中,T单位=R1SiO3‑,R1为氢原子或可独立选择的碳原子1至18的有机基;以及在惰性气体氛围或大气氛围条件下,对该球形或角形硅氧烷进行热处理,热处理温度为250度以上至650度以下,以使得球形或角形硅氧烷中的硅羟基发生缩合以得到球形或角形粉体填料,在该球形或角形粉体填料的T单位中,不含羟基的单位在总单位中的含量≥95%,含有一个羟基的单位在总单位中的含量≤5%。本发明还提供一种根据上述的制备方法得到的球形或角形粉体填料。本发明又提供一种根据上述的球形或角形粉体填料的应用。本发明提供的球形或角形粉体填料具有低诱电率,低吸水率和低放射性。

Description

PCT国内申请,说明书已公开。

Claims (8)

  1. PCT国内申请,权利要求书已公开。
CN201980016674.1A 2019-02-22 2019-12-05 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 Active CN111801808B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
CNPCT/CN2019/075831 2019-02-22
PCT/CN2019/075831 WO2020168542A1 (zh) 2019-02-22 2019-02-22 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用
CNPCT/CN2019/109108 2019-09-29
PCT/CN2019/109108 WO2020168719A1 (zh) 2019-02-22 2019-09-29 一种聚硅氧烷粉体填料的制备方法、由此得到的聚硅氧烷粉体填料及其应用
PCT/CN2019/123337 WO2020168784A1 (zh) 2019-02-22 2019-12-05 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用

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CN201980016661.4A Active CN111819248B (zh) 2019-02-22 2019-09-29 一种聚硅氧烷粉体填料的制备方法、由此得到的聚硅氧烷粉体填料及其应用
CN201980016674.1A Active CN111801808B (zh) 2019-02-22 2019-12-05 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用
CN202080001766.5A Pending CN111801296A (zh) 2019-02-22 2020-01-13 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用

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CN201980016661.4A Active CN111819248B (zh) 2019-02-22 2019-09-29 一种聚硅氧烷粉体填料的制备方法、由此得到的聚硅氧烷粉体填料及其应用

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111393855A (zh) * 2020-03-18 2020-07-10 平湖阿莱德实业有限公司 一种具有优异耐候性的高导热凝胶组合物
CN118420910A (zh) * 2024-04-15 2024-08-02 衢州三时纪新材料有限公司 一种聚硅氧烷颗粒及其制备方法与应用

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020168542A1 (zh) * 2019-02-22 2020-08-27 湖州五爻硅基材料研究院有限公司 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用
CN112624126A (zh) * 2020-11-26 2021-04-09 浙江三时纪新材科技有限公司 一种中空二氧化硅粉体填料的制备方法、由此得到的粉体填料及其应用
CN113603103A (zh) * 2021-08-13 2021-11-05 浙江三时纪新材科技有限公司 半导体封装材料,基板材料的制备方法,由此得到的半导体封装材料,基板材料及其应用
CN115368754A (zh) * 2022-08-12 2022-11-22 吉安豫顺新材料有限公司 一种球形低密度氧化硅填料
CN116178992B (zh) * 2022-12-26 2025-09-30 江苏联瑞新材料股份有限公司 底部填充胶用低黏度高流动表面改性硅微粉的制备方法
CN118530510B (zh) * 2024-05-27 2025-12-12 衢州三时纪新材料有限公司 一种低含水量壳层及其包覆方法与应用

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1295905A1 (en) * 2001-09-25 2003-03-26 Shin-Etsu Chemical Co., Ltd. Silicone rubber compositions for the sealing and encapsulation of electric and electronic parts
CN103205125A (zh) * 2012-01-16 2013-07-17 信越化学工业株式会社 用于半导体封装的热固性树脂组合物和封装的半导体器件
CN103771423A (zh) * 2013-12-11 2014-05-07 天津泽希矿产加工有限公司 电子封装用球形填料及制造方法
CN104449550A (zh) * 2013-12-31 2015-03-25 弗洛里光电材料(苏州)有限公司 有机硅组合物及其应用
CN105153992A (zh) * 2015-08-26 2015-12-16 中国科学院化学研究所 一种采用聚硅氧烷改性的填料及其制备方法与应用
CN111801296A (zh) * 2019-02-22 2020-10-20 浙江三时纪新材科技有限公司 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5323899A (en) * 1976-08-18 1978-03-04 Inst Fuizuichiesukoi Himii Im Process for preparing aminized silicate compound
KR940004144B1 (ko) * 1990-11-30 1994-05-13 삼성전기 주식회사 유전체 자기조성물
US5426168A (en) * 1994-04-29 1995-06-20 Dow Corning Corporation Method of preparing an organically-modified, heat-curable silicone resin and the resin produced thereby
JP3846667B2 (ja) * 1998-12-25 2006-11-15 竹本油脂株式会社 有機シリコーン微粒子、その製造方法、有機シリコーン微粒子から成る高分子材料用改質剤及び化粧品原料
EP1292973B1 (en) * 2000-06-23 2015-09-09 Honeywell International, Inc. Method to restore hydrophobicity in dielectric films and materials
US7790316B2 (en) * 2004-03-26 2010-09-07 Shin-Etsu Chemical Co., Ltd. Silicon composite particles, preparation thereof, and negative electrode material for non-aqueous electrolyte secondary cell
US20080072794A1 (en) * 2004-07-26 2008-03-27 Holger Hoppe Reactive Silicon Suboxide Flakes
JP4460468B2 (ja) * 2005-02-04 2010-05-12 信越化学工業株式会社 アミノ基含有オルガノポリシロキサンの製造方法
CN101627043A (zh) * 2007-02-09 2010-01-13 株式会社日本触媒 硅烷化合物、其生产方法以及包含硅烷化合物的树脂组合物
JP2009062472A (ja) * 2007-09-07 2009-03-26 Toray Ind Inc ポリフェニレンスルフィドフィルムおよびそれからなるコンデンサ
KR100962936B1 (ko) * 2007-12-20 2010-06-09 제일모직주식회사 반도체 조립용 접착 필름 조성물 및 접착 필름
CN101555018B (zh) * 2009-05-15 2012-05-02 中国科学院广州能源研究所 一种有机改性制备高机械性能纳米多孔材料的方法
JP5549568B2 (ja) * 2009-12-15 2014-07-16 信越化学工業株式会社 光半導体素子封止用樹脂組成物及び当該組成物で封止した光半導体装置
JP5163912B2 (ja) * 2010-02-16 2013-03-13 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JP6063197B2 (ja) * 2012-10-02 2017-01-18 東レ・ダウコーニング株式会社 新規な共変性オルガノポリシロキサン、それを含有してなる粉体処理剤および粉体組成物
CN106459482A (zh) * 2014-02-28 2017-02-22 Az电子材料(卢森堡)责任有限公司 用于光电应用的混杂材料
CN104558689B (zh) * 2014-12-26 2017-08-29 广东生益科技股份有限公司 一种填料组合物及其应用
CN106609039B (zh) * 2015-10-21 2019-09-13 广东生益科技股份有限公司 一种聚苯醚树脂组合物及其在高频电路基板中的应用
WO2018065058A1 (de) * 2016-10-06 2018-04-12 Wacker Chemie Ag Verfahren zur herstellung sphärischer polysilsesquioxanpartikel
CN107128935A (zh) * 2017-05-23 2017-09-05 苏州纳迪微电子有限公司 一种高纯度球形二氧化硅微粉的制备方法
CN107140654B (zh) * 2017-06-26 2020-05-19 兰陵县益新矿业科技有限公司 一种改性石英砂制备方法
CN108329692B (zh) * 2018-02-07 2021-01-29 深圳华力兴新材料股份有限公司 一种低介电常数的聚苯硫醚树脂组合物及制备方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1295905A1 (en) * 2001-09-25 2003-03-26 Shin-Etsu Chemical Co., Ltd. Silicone rubber compositions for the sealing and encapsulation of electric and electronic parts
CN103205125A (zh) * 2012-01-16 2013-07-17 信越化学工业株式会社 用于半导体封装的热固性树脂组合物和封装的半导体器件
CN103771423A (zh) * 2013-12-11 2014-05-07 天津泽希矿产加工有限公司 电子封装用球形填料及制造方法
CN104449550A (zh) * 2013-12-31 2015-03-25 弗洛里光电材料(苏州)有限公司 有机硅组合物及其应用
CN105153992A (zh) * 2015-08-26 2015-12-16 中国科学院化学研究所 一种采用聚硅氧烷改性的填料及其制备方法与应用
CN111801296A (zh) * 2019-02-22 2020-10-20 浙江三时纪新材科技有限公司 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111393855A (zh) * 2020-03-18 2020-07-10 平湖阿莱德实业有限公司 一种具有优异耐候性的高导热凝胶组合物
CN118420910A (zh) * 2024-04-15 2024-08-02 衢州三时纪新材料有限公司 一种聚硅氧烷颗粒及其制备方法与应用

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KR102774001B1 (ko) 2025-02-26
CN111819248A (zh) 2020-10-23
WO2020168719A1 (zh) 2020-08-27
CN111819247A (zh) 2020-10-23
KR20210127198A (ko) 2021-10-21
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