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CN111801296A - 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 - Google Patents

一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 Download PDF

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Publication number
CN111801296A
CN111801296A CN202080001766.5A CN202080001766A CN111801296A CN 111801296 A CN111801296 A CN 111801296A CN 202080001766 A CN202080001766 A CN 202080001766A CN 111801296 A CN111801296 A CN 111801296A
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spherical
angular
powder filler
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angular powder
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陈树真
李锐
王珂
丁烈平
陈晨
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Zhejiang Sanshi New Material Technology Co ltd
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Zhejiang Sanshi New Material Technology Co ltd
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Priority claimed from PCT/CN2019/123337 external-priority patent/WO2020168784A1/zh
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Priority claimed from PCT/CN2020/071640 external-priority patent/WO2020168856A1/zh
Publication of CN111801296A publication Critical patent/CN111801296A/zh
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    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
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    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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    • B32—LAYERED PRODUCTS
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    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B32B2457/08—PCBs, i.e. printed circuit boards

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  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Silicon Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

本发明涉及一种球形或角形粉体填料的制备方法，提供包括T单位的球形或角形硅氧烷，其中，T单位＝R1SiO3‑，R1为氢原子或可独立选择的碳原子1至18的有机基；以及在惰性气体氛围或大气氛围条件下，对该球形或角形硅氧烷进行热处理，热处理温度为250度以上至650度以下，以使得球形或角形硅氧烷中的硅羟基发生缩合以得到球形或角形粉体填料，在该球形或角形粉体填料的T单位中，不含羟基的单位在总单位中的含量≥95％，含有一个羟基的单位在总单位中的含量≤5％。本发明还提供一种根据上述的制备方法得到的球形或角形粉体填料。本发明又提供一种根据上述的球形或角形粉体填料的应用。本发明提供的球形或角形粉体填料具有低诱电率，低吸水率和低放射性。

Description

PCT国内申请，说明书已公开。

Claims (8)

  1. PCT国内申请，权利要求书已公开。
CN202080001766.5A 2019-02-22 2020-01-13 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 Pending CN111801296A (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
CNPCT/CN2019/075831 2019-02-22
PCT/CN2019/075831 WO2020168542A1 (zh) 2019-02-22 2019-02-22 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用
CNPCT/CN2019/109108 2019-09-29
PCT/CN2019/109108 WO2020168719A1 (zh) 2019-02-22 2019-09-29 一种聚硅氧烷粉体填料的制备方法、由此得到的聚硅氧烷粉体填料及其应用
CNPCT/CN2019/123337 2019-12-05
PCT/CN2019/123337 WO2020168784A1 (zh) 2019-02-22 2019-12-05 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用
PCT/CN2020/071640 WO2020168856A1 (zh) 2019-02-22 2020-01-13 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用

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CN111801296A true CN111801296A (zh) 2020-10-20

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CN201980016658.2A Pending CN111819247A (zh) 2019-02-22 2019-02-22 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用
CN201980016661.4A Active CN111819248B (zh) 2019-02-22 2019-09-29 一种聚硅氧烷粉体填料的制备方法、由此得到的聚硅氧烷粉体填料及其应用
CN201980016674.1A Active CN111801808B (zh) 2019-02-22 2019-12-05 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用
CN202080001766.5A Pending CN111801296A (zh) 2019-02-22 2020-01-13 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用

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CN201980016661.4A Active CN111819248B (zh) 2019-02-22 2019-09-29 一种聚硅氧烷粉体填料的制备方法、由此得到的聚硅氧烷粉体填料及其应用
CN201980016674.1A Active CN111801808B (zh) 2019-02-22 2019-12-05 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用

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CN111801808A (zh) * 2019-02-22 2020-10-20 浙江三时纪新材科技有限公司 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用
CN113603103A (zh) * 2021-08-13 2021-11-05 浙江三时纪新材科技有限公司 半导体封装材料，基板材料的制备方法，由此得到的半导体封装材料，基板材料及其应用
WO2022111610A1 (zh) * 2020-11-26 2022-06-02 浙江三时纪新材科技有限公司 一种中空二氧化硅粉体填料的制备方法、由此得到的粉体填料及其应用
CN116178992A (zh) * 2022-12-26 2023-05-30 江苏联瑞新材料股份有限公司 底部填充胶用低黏度高流动表面改性硅微粉的制备方法

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CN115368754A (zh) * 2022-08-12 2022-11-22 吉安豫顺新材料有限公司 一种球形低密度氧化硅填料
CN118420910A (zh) * 2024-04-15 2024-08-02 衢州三时纪新材料有限公司 一种聚硅氧烷颗粒及其制备方法与应用
CN118530510B (zh) * 2024-05-27 2025-12-12 衢州三时纪新材料有限公司 一种低含水量壳层及其包覆方法与应用

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CN111801808A (zh) * 2019-02-22 2020-10-20 浙江三时纪新材科技有限公司 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用
CN111801808B (zh) * 2019-02-22 2021-04-23 浙江三时纪新材科技有限公司 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用
WO2022111610A1 (zh) * 2020-11-26 2022-06-02 浙江三时纪新材科技有限公司 一种中空二氧化硅粉体填料的制备方法、由此得到的粉体填料及其应用
CN113603103A (zh) * 2021-08-13 2021-11-05 浙江三时纪新材科技有限公司 半导体封装材料，基板材料的制备方法，由此得到的半导体封装材料，基板材料及其应用
CN116178992A (zh) * 2022-12-26 2023-05-30 江苏联瑞新材料股份有限公司 底部填充胶用低黏度高流动表面改性硅微粉的制备方法

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