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CN111819247A - 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 - Google Patents

一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 Download PDF

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Publication number
CN111819247A
CN111819247A CN201980016658.2A CN201980016658A CN111819247A CN 111819247 A CN111819247 A CN 111819247A CN 201980016658 A CN201980016658 A CN 201980016658A CN 111819247 A CN111819247 A CN 111819247A
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spherical
angular
powder filler
siloxane
units
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陈树真
李锐
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Zhejiang Sanshi New Material Technology Co ltd
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Zhejiang Sanshi New Material Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C08J3/128—Polymer particles coated by inorganic and non-macromolecular organic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
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    • H05K1/02—Details
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    • B32B2305/07—Parts immersed or impregnated in a matrix
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

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  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Silicon Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

本发明涉及一种球形或角形粉体填料的制备方法，提供包括T单位的球形或角形硅氧烷，其中，T单位＝R1SiO3‑，R1为氢原子或可独立选择的碳原子1至18的有机基；以及在惰性气体氛围或真空条件下，对该球形或角形硅氧烷进行热处理，热处理温度为250度以上至750度以下，以使得球形或角形硅氧烷中的硅羟基发生缩合以得到缩合硅氧烷，最终获得球形或角形粉体填料。本发明还提供一种根据上述的制备方法得到的球形或角形粉体填料。本发明又提供一种根据上述的球形或角形粉体填料的应用。本发明提供的填料具有低诱电率、低诱电损失、无导电异物、无粗大颗粒和低放射性。

Description

PCT国内申请，说明书已公开。

Claims (11)

  1. PCT国内申请，权利要求书已公开。
CN201980016658.2A 2019-02-22 2019-02-22 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用 Pending CN111819247A (zh)

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PCT/CN2019/075831 WO2020168542A1 (zh) 2019-02-22 2019-02-22 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用

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CN201980016661.4A Active CN111819248B (zh) 2019-02-22 2019-09-29 一种聚硅氧烷粉体填料的制备方法、由此得到的聚硅氧烷粉体填料及其应用
CN201980016674.1A Active CN111801808B (zh) 2019-02-22 2019-12-05 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用
CN202080001766.5A Pending CN111801296A (zh) 2019-02-22 2020-01-13 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用

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CN201980016674.1A Active CN111801808B (zh) 2019-02-22 2019-12-05 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用
CN202080001766.5A Pending CN111801296A (zh) 2019-02-22 2020-01-13 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用

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WO2020168542A1 (zh) * 2019-02-22 2020-08-27 湖州五爻硅基材料研究院有限公司 一种球形或角形粉体填料的制备方法、由此得到的球形或角形粉体填料及其应用
CN111393855A (zh) * 2020-03-18 2020-07-10 平湖阿莱德实业有限公司 一种具有优异耐候性的高导热凝胶组合物
CN112624126A (zh) * 2020-11-26 2021-04-09 浙江三时纪新材科技有限公司 一种中空二氧化硅粉体填料的制备方法、由此得到的粉体填料及其应用
CN113603103A (zh) * 2021-08-13 2021-11-05 浙江三时纪新材科技有限公司 半导体封装材料，基板材料的制备方法，由此得到的半导体封装材料，基板材料及其应用
CN115368754A (zh) * 2022-08-12 2022-11-22 吉安豫顺新材料有限公司 一种球形低密度氧化硅填料
CN116178992B (zh) * 2022-12-26 2025-09-30 江苏联瑞新材料股份有限公司 底部填充胶用低黏度高流动表面改性硅微粉的制备方法
CN118420910A (zh) * 2024-04-15 2024-08-02 衢州三时纪新材料有限公司 一种聚硅氧烷颗粒及其制备方法与应用
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KR102774001B1 (ko) 2025-02-26
KR20210125546A (ko) 2021-10-18
CN111801808A (zh) 2020-10-20
WO2020168542A1 (zh) 2020-08-27
WO2020168719A1 (zh) 2020-08-27
KR102695717B1 (ko) 2024-08-16
KR20210127198A (ko) 2021-10-21
CN111801808B (zh) 2021-04-23
CN111819248B (zh) 2021-08-20
CN111819248A (zh) 2020-10-23
CN111801296A (zh) 2020-10-20

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